CN104640413A - Soft heat transfer module - Google Patents
Soft heat transfer module Download PDFInfo
- Publication number
- CN104640413A CN104640413A CN201310550398.1A CN201310550398A CN104640413A CN 104640413 A CN104640413 A CN 104640413A CN 201310550398 A CN201310550398 A CN 201310550398A CN 104640413 A CN104640413 A CN 104640413A
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- CN
- China
- Prior art keywords
- soft heat
- heat trnasfer
- top layer
- assembly
- trnasfer assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a soft heat transfer module, which comprises a covering surface layer and a functional filler, wherein the covering surface layer forms a sealing accommodating cavity in a surrounding mode; the covering surface layer is made of rubber, or silica gel or a resin; the functional filler fills the sealing accommodating cavity; the functional filler comprises at least one selected from silica gel, high-viscosity silicone oil, silicone gel and paraffin and at least one selected from ceramic powder, metal powder, metal oxide powder and graphene. The soft heat transfer module can be tightly attached to a heating body via the covering surface layer, and heat energy generated by the heating body can be absorbed or taken away due to transfer of the functional filler.
Description
Technical field
The present invention has about heat absorbing element, espespecially a kind of soft heat trnasfer assembly.
Background technology
General electronic apparatus (such as notebook computer or intelligent mobile phone), comprises the active members such as electric crystal in IC integrated circuit set in it, can produce heat energy when those active members perform operation program.Along with the increase of electronic apparatus performance requirement, also must arrange many electric crystals in IC integrated circuit, therefore caloric value is also increasing, but the corresponding increase of chip area, it causes the heat generation density of electronic component to increase, and namely overheated problem is supervened to generate heat parts.According to 10 DEG C of theories, when the temperature of heating parts often raises 10 DEG C, its useful life then can reduce by half relatively, the importance of electric product temperature control as can be seen here.
According to statistics, because the damage caused by heat accounts for the more than half of electronic component failure factor.Temperature is too high except causing the damage of semiconductor element, electronic component reliability also can be caused to reduce and operational effectiveness decline.Particularly electronic product is constantly towards the trend development of high performance, high speedization and compactization in recent years, and the heat dissipation problem of electronic product more becomes the technical bottleneck of Related product and an indispensable ring.Therefore the overall thermal issue-resolution encapsulating level, printed circuit board (PCB) level and systemic hierarchial must be sought.
Because heater element (such as CPU) and metal heat sink are all solid, with the angle of microcosmic, there is considerable hole, defect and scratch in the surface of the two, therefore easily cause air to retain wherein when assembling, because the hot transfer efficiency of air is not good, therefore overall hot transfer efficiency can fall.
Electronic apparatus is now constantly towards the future development of compactization, and various mechanism element is also.In the process of assembling, if the compressibility of soft heat absorbing element is not good, it may cause mechanism element to be out of shape because of unbalance stress between mechanism element.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of soft heat trnasfer assembly.
Soft heat trnasfer assembly provided by the invention, it comprises a coated top layer and a functional filler.Coated top layer surrounds formation one sealed volume, and the material on coated top layer is one of them of rubber, silica gel or resin.Functional filler is filled within sealed volume, and functional filler comprises one of them kind of silica gel, viscous silicone fluid, Silica hydrogel and paraffin and one of them kind of ceramic powders, metal dust, metal oxide powder and Graphene (powder or compressing tablet).
Preferably, aforesaid soft heat trnasfer assembly, its resin is one of them of polyethylene, polypropylene, polyethylene terephthalate, Merlon, polyurethane or silicones.
Preferably, this polyethylene is low density polyethylene (LDPE).
Preferably, this polyurethane is thermoplastic polyurethane.
Preferably, aforesaid soft heat trnasfer assembly, its rubber be natural rubber or elastomeric one of them.
Preferably, aforesaid soft heat trnasfer assembly, its resin is one of them of hexenoic acid resinoid, acrylic resin, silicone based resin or polyurethane based resin.
Preferably, aforesaid soft heat trnasfer assembly, its metal dust comprises one of them powder of planting of copper, aluminium, gold, silver and iron.
Preferably, aforesaid soft heat trnasfer assembly, its ceramic powders comprises one of them powder of planting of alundum (Al2O3), boron nitride, calcium carbonate and aluminium nitride.
Preferably, aforesaid soft heat trnasfer assembly, its metal oxide powder comprises one of them kind of croci, magnesium oxide powder and lime powder.
Preferably, aforesaid soft heat trnasfer assembly, the thickness on its coated top layer is 0.02 to 5mm.
Preferably, aforesaid soft heat trnasfer assembly, the thickness of its functional filler is 0.01 to 6mm.
Preferably, aforesaid soft heat trnasfer assembly more comprises a miniature shock element, and this miniature shock element depends on coated top layer.
Preferably, aforesaid soft heat trnasfer assembly more comprises a miniature pressurizing member, and this miniature shock element depends on coated top layer.
Soft heat trnasfer assembly of the present invention can adhere well to heating parts by its coated top layer, and can take away the heat energy that produces of heating parts by the functional filler in its coated top layer and keep the operational effectiveness of heating parts to reduce the temperature of heating surface of the work.Moreover, can by the mobility of miniature shock element or miniature pressurizing member enhanced feature filler with the thermal convection efficiency of enhanced feature filler.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the soft heat trnasfer assembly of first embodiment of the invention.
Fig. 2 is the schematic diagram of the soft heat trnasfer assembly of second embodiment of the invention.
Fig. 3 is the schematic diagram of another pattern of the soft heat trnasfer assembly of second embodiment of the invention.
Fig. 4 is the schematic diagram of the another pattern of the soft heat trnasfer assembly of second embodiment of the invention.
Fig. 5 is the schematic diagram of a pattern again of the soft heat trnasfer assembly of second embodiment of the invention.
Fig. 6 is the schematic diagram of the soft heat trnasfer assembly of third embodiment of the invention.
Description of reference numerals:
100, coated top layer;
110, sealed volume;
200, functional filler;
310, micro-vibration element;
320, miniature pressurizing member.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, can better understand the present invention and can be implemented, but illustrated embodiment is not as a limitation of the invention to make those skilled in the art.
Consult the first figure, of the present invention first implements to provide a kind of soft heat trnasfer assembly, and it includes coated top layer 100 and a functional filler 200.Coated top layer surrounds formation one sealed volume 110, and functional filler 200 is filled within sealed volume 110.
Coated top layer 100 be there is elasticity, toughness, recovery and telescopic material make, the thickness on coated top layer 100 is preferably between 0.02 to 5mm.The material on coated top layer 100 can be preferably the wherein a kind of of rubber (Rubber), silica gel (Silica Rubber) and resin (resin, or title plastics plastic).Its rubber can be one of them of natural rubber and synthetic rubber (Synthetic Rubber).Its resin can be hexenoic acid resinoid, acrylic resin, silicone based resin and polyurethane based resin, polyethylene terephthalate (PET) or Merlon (PC), wherein hexenoic acid resinoid can be polyethylene (PE, and one of them of low density polyethylene (LDPE) (LDPE, Low Density Polyethylene) Polyethylene); Acrylic resin is polypropylene (PP, Polypropylene) such as; Silicone based resin is silicones (silicone) such as; One of them of polyurethane based resin such as polyurethane (PU, Polyurethane) and thermoplastic polyurethane (TPU, Thermoplastic polyurethane).
Functional filler 200 is for including the mixture of carrier and additive, and its carrier can be preferably wherein one or more the mixture of silica gel, viscous silicone fluid (Silicone Oil), Silica hydrogel (Silica Gel) and paraffin (Paraffin).Additive can be one of them kind of ceramic powders (ceramic powders), metal dust (metal powders), metal oxide powder and Graphene (Graphene).Ceramic powders is alundum (Al2O3) (Al such as
2o
3), boron nitride (BN), aluminium nitride (AlN), calcium carbonate (CaCO
3)wherein one or more mixture.Wherein one or more the mixture of metal dust such as copper, aluminium, gold, silver, iron.Wherein one or more the mixture of metal oxide powder such as croci, magnesium oxide powder, lime powder.The thickness of functional filler 200 is preferably between 0.01 to 6mm, and soft its integral thickness of heat trnasfer assembly of the present invention is preferably between 0.15 to 10mm.
Consult Fig. 2, of the present invention second implements to provide a kind of soft heat trnasfer assembly, and it includes coated top layer 100, functional filler 200 and a micro-vibration element 310.Its coated top layer 100 is with functional filler 200 as aforementioned first embodiment, and the present embodiment and the first embodiment something in common repeat no more in this, the present embodiment and the first embodiment difference then describe in detail as after.This micro-vibration element 310 depends on coated top layer 100, in the present embodiment, it preferably can attach or embedded install at coated top layer 100 outer surface, but the present invention is not limited thereto, such as it also can attach or embedded install at coated top layer 100 inner surface as shown in Figure 3, and micro-vibration element 310 also can be embedded in coated top layer 100 as shown in Figure 4 in addition.Moreover soft heat trnasfer assembly of the present invention also can be provided with multiple micro-vibration element 310 as shown in Figure 5.Micro-vibration element 310 produce vibration can increase further functional filler 200 mobility, to accelerate the thermal convection of functional filler 200.
Consult Fig. 6, the of the present invention 3rd implements to provide a kind of soft heat trnasfer assembly, and it includes coated top layer 100, functional filler 200 and a miniature pressurizing member 320.Its coated top layer 100 is with functional filler 200 as aforementioned first embodiment, and the present embodiment and the first embodiment something in common repeat no more in this, the present embodiment and the first embodiment difference then describe in detail as after.This miniature pressurizing member 320 depends on coated top layer 100, and in the present embodiment, its mode that preferably can attach or be embedded into is arranged on the outer surface on coated top layer 100, but the present invention is not limited to this.Such as, the mode that miniature pressurizing member 320 also can attach or be embedded into is arranged on the inner surface on coated top layer 100, also can be embedded in coated top layer 100, also can be provided with multiple miniature pressurizing member 320 in addition, its set-up mode is identical with the micro-vibration element 310 described in aforementioned second embodiment.Miniature pressurizing member 320 produces the mobility that pressure differential can increase functional filler 200 further, to accelerate the thermal convection of functional filler 200.
Under the practical application pressurized environment of soft heat absorbing element, soft heat trnasfer assembly of the present invention can to generate heat in the hole of parts, defect and scratch and deaeration, closely paste the irregular surface of heating parts, so as to promoting overall hot transfer efficiency, it can absorb, it is isolated to conduct and slowly distribute the heat energy that heating parts produce, more effectively reduce the temperature of heating surface of the work whereby, make heating parts to maintain long time running.
Soft heat trnasfer assembly of the present invention can have the functional filling material of different qualities for different demand choice for uses, make soft heat trnasfer assembly of the present invention have applicability widely whereby.
Soft heat trnasfer assembly of the present invention, its coated top layer has elasticity, toughness and tool scalability, and therefore its profile can adjust with different using states.And its generation case is in an assembling process wrongly installed mistakes, still can removes heavy industry and not damage structure itself, therefore, it is possible to reduce the spillage of material of heavy industry and reduce heavy industry cost.
The above embodiment is only that protection scope of the present invention is not limited thereto in order to absolutely prove the preferred embodiment that the present invention lifts.The equivalent alternative or conversion that those skilled in the art do on basis of the present invention, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (13)
1. a soft heat trnasfer assembly, is characterized in that, comprise:
One coated top layer, this coated top layer surrounds formation one sealed volume, and the material on this coated top layer is one of them of rubber, silica gel or resin; And
One functional filler, is filled within sealing cavity volume, and this functional filler comprises one of them kind of silica gel, viscous silicone fluid, Silica hydrogel and paraffin and one of them kind of ceramic powders, metal dust, metal oxide powder and Graphene.
2. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this resin is one of them of polyethylene, polypropylene, polyethylene terephthalate, Merlon, polyurethane or silicones.
3. soft heat trnasfer assembly as claimed in claim 2, is characterized in that, this polyethylene is low density polyethylene (LDPE).
4. soft heat trnasfer assembly as claimed in claim 2, is characterized in that, this polyurethane is thermoplastic polyurethane.
5. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this rubber be natural rubber or elastomeric one of them.
6. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this resin is one of them of hexenoic acid resinoid, acrylic resin, silicone based resin or polyurethane based resin.
7. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this metal dust comprises one of them powder of planting of copper, aluminium, gold, silver and iron.
8. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this ceramic powders comprises one of them powder of planting of alundum (Al2O3), boron nitride, calcium carbonate and aluminium nitride.
9. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, this metal oxide powder comprises one of them kind of croci, magnesium oxide powder and lime powder.
10. soft heat trnasfer assembly as claimed in claim 1, is characterized in that, the thickness on this coated top layer is 0.02 to 5mm.
11. soft heat trnasfer assemblies as claimed in claim 1, it is characterized in that, the thickness of this functional filler is 0.01 to 6mm.
12. soft heat trnasfer assemblies as claimed in claim 1, is characterized in that, this soft heat trnasfer assembly more comprises a miniature shock element, and this miniature shock element depends on this coated top layer.
13. soft heat trnasfer assemblies as claimed in claim 1, is characterized in that, this soft heat trnasfer assembly more comprises a miniature pressurizing member, and this miniature shock element depends on this coated top layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550398.1A CN104640413A (en) | 2013-11-08 | 2013-11-08 | Soft heat transfer module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310550398.1A CN104640413A (en) | 2013-11-08 | 2013-11-08 | Soft heat transfer module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640413A true CN104640413A (en) | 2015-05-20 |
Family
ID=53218573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310550398.1A Pending CN104640413A (en) | 2013-11-08 | 2013-11-08 | Soft heat transfer module |
Country Status (1)
| Country | Link |
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| CN (1) | CN104640413A (en) |
Citations (11)
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| JPH06188624A (en) * | 1992-12-17 | 1994-07-08 | Nippon Steel Corp | Antenna of waveguide structure and its manufacture |
| US5640303A (en) * | 1995-10-30 | 1997-06-17 | Precision Connector Designs, Inc. | Interconnection apparatus for semiconductor/integrated circuit devices |
| US20050093140A1 (en) * | 2003-10-25 | 2005-05-05 | Korea Institute Of Science And Technology | Heat spreader, heat sink, heat exchanger and PDP chassis base |
| US20080225484A1 (en) * | 2007-03-16 | 2008-09-18 | International Business Machines Corporation | Thermal pillow |
| CN101522909A (en) * | 2006-05-17 | 2009-09-02 | 加利福尼亚技术学院 | Thermal cycling system |
| KR100953679B1 (en) * | 2009-06-15 | 2010-04-20 | 두성산업 주식회사 | Material for radiating heat, and method for producing the said material |
| CN102150484A (en) * | 2008-09-26 | 2011-08-10 | 派克汉尼芬公司 | Thermally conductive gel packs |
| CN102863798A (en) * | 2012-08-28 | 2013-01-09 | 东莞市万钧化工新材料科技有限公司 | Method for preparing heat-conducting silicon rubber by using silica gel and product |
| KR101228603B1 (en) * | 2012-07-31 | 2013-01-31 | 엘지전자 주식회사 | Graphite thermal elasticitygasket |
| JP5168110B2 (en) * | 2008-11-28 | 2013-03-21 | 株式会社デンソー | Manufacturing method of electronic device |
-
2013
- 2013-11-08 CN CN201310550398.1A patent/CN104640413A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
| JPH06188624A (en) * | 1992-12-17 | 1994-07-08 | Nippon Steel Corp | Antenna of waveguide structure and its manufacture |
| US5640303A (en) * | 1995-10-30 | 1997-06-17 | Precision Connector Designs, Inc. | Interconnection apparatus for semiconductor/integrated circuit devices |
| US20050093140A1 (en) * | 2003-10-25 | 2005-05-05 | Korea Institute Of Science And Technology | Heat spreader, heat sink, heat exchanger and PDP chassis base |
| CN101522909A (en) * | 2006-05-17 | 2009-09-02 | 加利福尼亚技术学院 | Thermal cycling system |
| US20080225484A1 (en) * | 2007-03-16 | 2008-09-18 | International Business Machines Corporation | Thermal pillow |
| CN102150484A (en) * | 2008-09-26 | 2011-08-10 | 派克汉尼芬公司 | Thermally conductive gel packs |
| JP5168110B2 (en) * | 2008-11-28 | 2013-03-21 | 株式会社デンソー | Manufacturing method of electronic device |
| KR100953679B1 (en) * | 2009-06-15 | 2010-04-20 | 두성산업 주식회사 | Material for radiating heat, and method for producing the said material |
| KR101228603B1 (en) * | 2012-07-31 | 2013-01-31 | 엘지전자 주식회사 | Graphite thermal elasticitygasket |
| CN102863798A (en) * | 2012-08-28 | 2013-01-09 | 东莞市万钧化工新材料科技有限公司 | Method for preparing heat-conducting silicon rubber by using silica gel and product |
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Application publication date: 20150520 |