CN104635889B - The manufacture method of radiating bottom plate - Google Patents
The manufacture method of radiating bottom plate Download PDFInfo
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- CN104635889B CN104635889B CN201310573750.3A CN201310573750A CN104635889B CN 104635889 B CN104635889 B CN 104635889B CN 201310573750 A CN201310573750 A CN 201310573750A CN 104635889 B CN104635889 B CN 104635889B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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Abstract
The invention discloses a kind of manufacture method of radiating bottom plate, wherein, one metal base plate includes at least a heat pipe thinning area or specific thinning area, using being stamped and formed out more several hoppers of escaping in heat pipe thinning area or specific thinning area fate, another punching press forging is imposed again, the real material block of heat pipe thinning area or specific thinning area is given into punching press forging, escape hopper to fill up and reach different thinning desired values, finally, heat pipe is positioned over heat pipe thinning area, technology is squeezed with another punched and carrys out stake-fastening heat pipe, completes the combination of radiating bottom plate.In another arrangement, the at least transmission area of a heat pipe thinning area or specific thinning area is formed in metal base plate using punching press forging technology, again with predetermined thickness, the corresponding foil of undersized, imposing punching press forging using the lower mould with fin circle for mould engages both, reach different thinning desired values, heat pipe is positioned over heat pipe thinning area again, technology is squeezed with another punched and carrys out stake-fastening heat pipe, completes the combination of radiating bottom plate.
Description
Technical field
The present invention is on a kind of radiating bottom plate, particularly relates to one kind to escape hopper punching press forging technology, or punched squeezes
Filling space technology forms the manufacture method of the radiating bottom plate of various thinning areas.
Background technology
Ultrathin notebook computer integral thickness (liquid crystal screen containing LED+main frame+casing in itself etc.) has closely been subtracted by market demands
Below 15mm is as thin as, wherein, except the thickness of CPU+ motherboards+battery+mechanical hard disk or solid-state semiconductor hard disc will be thinned
Outside, the use of thinning heat radiation module and ultrathin heat pipe, even more NB(Notebook computer)The epochmaking ring of mechanism thinning.
In view of this, inventor proposed a Chinese patent application case on November 28th, 2012, and Application No. is
CN201210501553.6.The patent application case discloses a kind of strip ㄇ shape radiating bottom plates, and the horizontal plane of ㄇ shape radiating bottom plates is set
Have and escape to expect irrigation canals and ditches, and allow the thickness of the radiating bottom plate directly over CPU to be optionally thinned to below 0.4mm or any institutes
The thickness wanted.And the side wall in strip ㄇ shapes portion then has c-type rib, to clamp heat pipe.
It refer to Figure 1A and Figure 1B.Figure 1A be using stamping technology to a radiating bottom plate 130 formed a strip ㄇ shapes 135 in
Schematic perspective view therein.The width of strip ㄇ shapes 135 can house heat pipe (not shown) to produce heat pipe accommodation space 1310
Benchmark.The 135 positive top surface of strip ㄇ shapes of radiating bottom plate 130 is gone out with stamping technology more several to be escaped to expect irrigation canals and ditches 135v.It is each to escape
Expect irrigation canals and ditches 135v width, position and quantity, have been subjected to careful calculating.For example, in one embodiment, the length of radiating bottom plate 130
L1 is 44.8mm, escapes to expect that irrigation canals and ditches 135v has six, and irrigation canals and ditches 135v is escaped to expect in both ends each one, and middle four equidistant to escape to expect irrigation canals and ditches 135v
Width L2 be 3.2mm.And both ends each one escape to expect that irrigation canals and ditches 135v width escapes to expect that irrigation canals and ditches 135v is small compared among.Figure 1B is Figure 1A's
Plan view from above.
Fig. 2A is refer to, shows that completing the three-dimensional of forging processing to the top surface of strip ㄇ shapes 135 of radiating bottom plate 130 illustrates
Figure, the thickness d of the top surface of strip ㄇ shapes 135 only have the half of radiating bottom plate 130 (before undressed) original thickness.Fig. 2 B show Fig. 2A's
Plan view from above, it is noted that, escape to expect that irrigation canals and ditches have the unfilled area of V-arrangement close to the side wall of strip ㄇ shapes 135.Then, in installation heat pipe (not
Diagram) after heat pipe accommodation space 1310, then forging processing is carried out to fin to coat radiating tube 131.
Radiating bottom plate disclosed by above-mentioned patent application case, apply in ultra-thin NB heat radiation module, make heat radiation module+
CPU integral thickness is minimized.But some applications must use the heat radiation module of thin board type, the used thin bottom of radiating
Plate only has 1mm thick, often stills need accommodating heat pipe, therefore need have embedment heat pipe on the thin bottom plate of radiating of thin board type heat radiation module
Thinning area.
Thin board type heat radiation module used in particularly advanced tablet personal computer is often fan-free, and heat pipe must be grown and must bury totally
Enter and radiate in thin bottom plate, therefore the thin base areas that radiates must be in response to motherboard component placement again, avoid element and thin bottom of radiating greatly
Plate interferes, therefore must form more several different degrees of thinning areas in the thin bottom plate of 1mm radiatings.Signal as shown in Figure 3A
Figure, for example, 0.3mm is thinned in the first area 210,0.4mm is thinned in the second area 220, and heat pipe area 305 is thinned to 0.5mm.
In the prior art, these thinning areas are reached in a manner of (numerically controlled lathe, which mills out, to be come) is processed by CNC, but
It is on the implementation, to be radiated as described above thin bottom plate with CNC turnning and millings, not only cost is high (wanting one, area area's milling), and for
The soft aluminium radiating bottom plate of thickness only 1mm matter, by the possibility for the difficult and viscous knife having in clamping.In addition, by heat pipe and the thin bottom of radiating
Plate is combined into thin board type heat radiation module, and existing welding technique first will radiate aluminium thin bottom plate nickel plating, then carry out high temperature WU welderings, no
But significantly heightened heat dissipation module cost, for natively very thin (1mm) and low-melting aluminum radiating bottom plate, flatness
It is even more a major challenge to maintain, and is significantly become because the residual stress after welding process and welding all may produce the thin bottom plate of radiating
Shape.
In view of this, the purpose of the present invention is just to provide for the manufacturing technology of a radiating bottom plate, to reduce cost and overcome
The problem of prior art.
The content of the invention
Present invention solves the technical problem that it is to provide a kind of manufacture method of radiating bottom plate, particularly a kind of nothing of fan-free
Weld thin board type radiating bottom plate, radiating bottom plate include the more several thinning areas of thickness and areas in various degree and heat pipe thinning area in
Wherein.The thinning areas of more several thickness and areas in various degree, in response to element in the layout of motherboard.Use heat pipe thinning area
In being embedded to a flat heat pipe.
Present invention solves the technical problem that gradation punching press forging or successional punching press forging completion can be used more several
The thinning area of different degrees of thickness and area, during punching press forging, can utilize punching after heat pipe is placed in heat pipe thinning area
Die mould squeezes metal base plate regional area of the technology by heat pipe and squeezes into a small amount of material and heat pipe is made into stake-fastening, is particularly these
Process is all to carry out at ambient temperature.
The present invention proposes a kind of manufacture method of radiating bottom plate, and radiating bottom plate includes heat pipe embedment thinning area and multiple sizes
And the identical or different thinning area of thinned degree, in wherein, the heat pipe thinning area is used to be embedded to a flat heat pipe.
Certainly, technology of the invention, which is equally applicable for thin plate, one or several thinning areas, and thin plate is not limited to bottom of radiating
The application of plate.
The present invention a feasible technical solution be:
A metal base plate is provided, comprising at least a heat pipe thinning area or specific thinning area in wherein;
Real material block gross mass according to heat pipe thinning area or the specific thinning area be equal to after forging the heat pipe thinning area or
The gross mass of the specific thinning area, calculate this and escape hopper number and size, reality material block number and size, it is described escape hopper and
The real material block is spaced each other;
Carry out first time punching press according to gained is calculated, with formed it is more several escape hopper in the heat pipe thinning area or this specific subtract
In the fate in thin area;And second of punching press forging is carried out, to cause the real material for expecting block to be returned because of the punching press forging
Mend and escape hopper to form the heat pipe thinning area or the specific thinning area described in adjacent;
After heat pipe is placed in into the heat pipe thinning area, carries out third time punched and squeeze several small metal derbies at heat pipe edge
Type squeezes carrys out stake-fastening heat pipe in heat pipe edge.
The present invention proposes the manufacture method of another radiating bottom plate, and it is reached with punching press forging filling method, its technology solution
Certainly scheme is:
A metal base plate is provided, comprising an at least heat pipe thinning area or specific thinning area fate in wherein;
First time punching press is imposed, a transmission is formed to remove the material of the heat pipe thinning area or the specific thinning area fate
Area;One or several kinds of corresponding foils are provided, the foil thickness is equal to the remaining thickness of the heat pipe thinning area
Or the specific thinning area predetermined thickness, above-mentioned sheet metal be dimensioned slightly smaller than it is described in response to transmission area, the undersized is
Refer to when the foil is placed in the transmission area only to remain and have a small space, when being subjected to punched and squeezing technology, the foil
Edge, because thickness reduces and the quality that extends, it is sufficient to fill up the small space, and both formation is tightly engaged into;
The crowded upper mould of one group of punched is provided and lower mould, the lower mould are provided with a fin circle, the position correspondence of the fin circle
In the edge of the foil;
When imposing second punched with the upper mould and lower mould and squeezing, the fin circle partial span foil makes Bao Jin
Category piece is formed with the heat dissipation metal bottom plate and is tightly engaged into;
After heat pipe is placed in into the heat pipe thinning area, progress third time punched, which squeezes, squeezes several small metal derbies at heat pipe edge
Carry out stake-fastening heat pipe in heat pipe edge.
The present invention has advantages below:
1st, for the making of radiating bottom plate, can hold during the external form of punching press radiating bottom plate, hole, segment difference, boss etc.
Perhaps on identical punch table, in a manner of the progressive die or segmentation stage die, insert special punching press forging type and squeeze process, it is synchronous complete
Thinning area is embedded into heat pipe and thinning that other are the various different shape size thinning areas for avoiding element from interfering, have simple fast
This rapid-result low advantage;Not like general technology, need to additionally use CNC turnning and millings, once can only the block of thinning one, time-consuming cost is high,
The thinning processing of aluminum or copper bottom plate for large area, can more avoid clamping workpiece and be not easy and the soft aluminium of matter is stained with glutinous cutter
The problem of.
2nd, the present invention in radiating bottom plate heat pipe thinning area and other thinning areas, no matter thinning area number number, size, shape
Shape differs with thickness, can all be completed in synchronous in-process punching press forging, therefore process time and cost can be greatly decreased.
3rd, it is with simple Sheet Metal Forming Technology that punching press forging type of the present invention, which squeezes technology, is completed on general punch table, without making
With expensive accurate CNC boards or forging board, not only processing cost is low, and fixed equipment investment is low, can also significantly reduce supply chain
And delivery date.
4th, the present invention in radiating bottom plate heat pipe thinning area and other thinning areas, with punching press forging technology complete, to be thinned
The mechanical strength in area has strengthening action.
5th, the present invention in heat pipe and metal base plate combination, can be from heat pipe thinning area also using punching press forging type extruding process
Back side local type extrusion aluminium material, then opposite heat tube carry out stake-fastening;Also aluminium material can be extruded by heat pipe thinning area front local type, then
Opposite heat tube carries out stake-fastening.Riveted action is also to be completed on punch table, has the low advantage of the simple cost of process.
6th, the stake-fastening of heat pipe and metal base plate in the present invention, technology is squeezed using most environmentally friendly punching press forging type,
Relative to welding processing procedure, aluminium radiating bottom plate is not necessary to nickel plating, and the combination of heat pipe need not use tin cream, be not required to through Overwelding and rewelding furnace high temperature
Welding, therefore, have the advantage of environmental protection, low cost with saving man-hour concurrently.
7th, the stake-fastening of heat pipe and metal base plate in the present invention, all it is that technology is squeezed with punching press forging type at ambient temperature
Carry out, unlike welding processing procedure, to the radiating bottom plate of large area, must be easy to through Overwelding and rewelding furnace high-temperature soldering because high-temperature residual should
The release of power and cause heat dissipation metal bottom deformation, largely effect on the flatness and qualification rate of radiating bottom plate.
Brief description of the drawings
The following drawings is only intended to do schematic illustration and explanation to the present invention, not delimit the scope of the invention, wherein:
Figure 1A is that the radiating bottom plate of prior art is stamped to form strip ㄇ shapes and comprising the stereogram for escaping material irrigation canals and ditches;
Figure 1B is the radiating bottom plate plan view from above of prior art;
Fig. 2A is subjected to forging for strip ㄇ shape top surfaces and processes the stereogram to form plane;
Fig. 2 B are the plan view from above that strip ㄇ shape top surfaces are subjected to after forging processing;
Fig. 3 A are that first embodiment of the present invention radiating bottom plate is formed multiple various sizes of subtract with punching press forging technology
Thin area, after heat pipe placement after, then with another punching press forging type squeezing fix plan view from above;
Fig. 3 B are formed more for first embodiment of the present invention radiating bottom plate with stamping technology in various sizes of thinning area
Individual real material block and the schematic top plan view for escaping hopper;
Fig. 3 C include a heat pipe for having bending and squeezed by type for first embodiment of the present invention radiating bottom plate is fixed on a heat
The schematic diagram of pipe thinning area;
Fig. 4 A are gone out several discontinuous for radiating bottom plate in the first embodiment of the present invention with punching press forging technology
Perforation is to be used as the top view for escaping hopper 310;
Fig. 4 B are the cross-sectional view of radiating bottom plate before forging in the first embodiment of the present invention, rectangle block up and down
Respectively there are mould and lower mould in a forging;
Fig. 4 C are to escape the top view after hopper is filled up by the material of material block in fact in the first embodiment of the present invention after forging;
Fig. 4 D are the cross-sectional view after forging in the first embodiment of the present invention;
Fig. 5 A are the top view of radiating bottom plate before forging in the second embodiment of the present invention(In transmission groove (or transmission area)
There is a foil, both have the gap of very little);
Fig. 5 B are the cross-sectional view of the second embodiment of the present invention(Foil respectively have up and down in a forging mould and
Lower mould);
Fig. 5 C are the cross-sectional view after forging.
Drawing reference numeral explanation:
130:Radiating bottom plate 135:Strip ㄇ shapes
135v:Escape to expect irrigation canals and ditches 132:Fin
134:Escape hopper 300:Radiating bottom plate
131:Heat pipe 360:Transmission area(Or transmission groove)
136:V-arrangement unfilled area 210v, 220v, 310:Escape hopper
210:First area 220:Secondth area
210f:The first area 220f after punching press forging:The secondth area after punching press forging
250:Heat pipe 255:Aluminium
305:Heat pipe thinning area 210r, 220r, 320:Real material block
400U、410U:Mould 415 in forging:Fin circle
400D、410D:Lower mould
Embodiment
In order to which technical characteristic, purpose and the effect of the present invention is more clearly understood, now control illustrates this hair
Bright embodiment.
The technology of the present invention, can be applied not only to ultrathin notebook PC, can also be applied to tablet personal computer, the present invention
What is proposed is a kind of manufacture method of radiating bottom plate.For example, it refer to Fig. 3 A and Fig. 3 B, a radiating bottom plate 300, radiating bottom plate
300 thickness is about 1mm, and it contains several different thinning areas:First area 210, heat pipe thinning area 305, the second area 220.
Per area's size and thinned degree is identical or different.For example, the first area 210 is thinned (comprising hopper 210v and real material block 210r is escaped)
0.3mm, 0.4mm is thinned (comprising hopper 220v and real material block 220r is escaped) in the second area 220, and heat pipe thinning area 305 (includes and escaped
Hopper 310 and real material block 320) it must then be thinned to 0.5mm.Heat pipe thinning area 305 has secured a heat pipe 250 thereon.Its
In, heat pipe 250 is that from the peripheral type of heat pipe thinning area 305 extrusion aluminium 255, (when radiating, thin bottom plate is aluminum with punching press forging technology
When) fixed.Type squeezes aluminium and need not be continuous, and type squeezes aluminium 255 as shown in Figure 3A, and segmentation is formed at the edge of heat pipe 250.
Type squeezes the material that aluminium 255 is the radiating bottom plate from heat pipe edge, is not additional material.Other heat pipe thinning area 305 is simultaneously
Be not limited to the strip shown in Fig. 3 A, it can also be have one bending strip, as shown in Figure 3 C or two (or more)
The strip (not shown) of bending.
According to the first embodiment of the present invention, the first area 210f after punching press forging, heat pipe thinning area 305, punching press forging
The second area 220f afterwards be according to conservation of mass basic physical principle calculate each area escape 310 numbers of hopper and size interval with
And after real material block 320, once or by several times gone out with stamping technology.
Calculated according to obtained by the basic physical principle of above-mentioned conservation of mass, gone out in each area and more several escape hopper 310.Escape
Hopper 310 and escape to be real material block 320 between hopper 310.Escape 310 numbers of hopper and chi corresponding to having per area according to thinned degree
Very little, real material 320 numbers of block and size, as shown in Figure 4 A, with reference to Fig. 3 A, the first area 210, the meaning of the secondth area 220 are
Be stamped and formed out escaping for the first time hopper 310 and between real material block 320 result.
Fig. 4 A to Fig. 4 D are the flow and calculating process for illustrating above-mentioned punching press forging by taking the areas of thinning area Zhong mono- as an example.Figure
What 4A illustrated is that radiating bottom plate 300 goes out several discontinuous perforation to be used as the top view for escaping hopper 310 by punch press.Fig. 4 B
What is illustrated is the cross-sectional view before forging, and respectively there is mould in a forging heat pipe thinning area 305 up and down material block 320 in fact
400U and lower mould 400D.After what Fig. 4 C illustrated is forging, escape hopper 310 expected in fact the material of block 320 fill up after top view,
Rectangle thinning block 305f is formed after the 305 stamped forging of heat pipe thinning area.Fig. 4 D are the cross-sectional view after forging.
As described above, it is to be equal to punching press forging according to more several real gross masses for expecting blocks 320 to escape hopper number n and size
The gross mass in area and calculating should retain how many real material blocks, after drawing, then make punching press forging to predetermined hopper 310 of escaping, with
Form transmission escapes hopper 310.
It is listed below with formula:
In above-mentioned formula, liFor i-th of the real material length of block 320, W is rectangle block(Heat pipe thinning area)305 width, t0
For thickness of slab, ρ0For sheet material original density.L is rectangle block (that is, thinning area) total length, ρfFor density after forging, tfFor forging back plate
It is thick.Density will increase after forging, such as:ρf=ρ0×1.1。
Above-mentioned rectangle block thinning area is demonstration example, therefore should not can be used for variously-shaped, example using upper as limit
Such as, a square type connects another small square type, circular or other irregular shapes.
The thinned groove of radiating bottom plate, however it is not limited to escape hopper reduction described in first embodiment.The second of the present invention
Embodiment is forging filling method.First, the thinned fate of multiple different shapes, different-thickness is washed into multiple wear with punch press
Groove, then backfilled with the corresponding foil forging of predetermined thickness.
By taking one of those long L × wide W rectangle thinning area as an example, transmission groove 360 is first washed into punch press, is then ready for another
The elongated foil 370 of one L1 × W1 sizes, the thickness t of foil 370fFinal goal thickness is equal to, wherein L1 is omited
Less than L, W1 is slightly less than W, then the elongated local type of foil 370 squeezed into forging with impact forging preparation method, and then by the saturating of radiating bottom plate
Dead slot 360 is filled up.
Processing procedure as Fig. 5 A to Fig. 5 C explanations.Fig. 5 A show the top view before forging, in transmission groove (or transmission
Area) in 360, equipped with a foil 370, both have the gap of very little.Fig. 5 B are cross-sectional view.Above and below thin plate 370
Respectively there is mould 410U and lower mould 410D in a forging.It is worth giving special heed to, lower mould has a fin circle 415 to correspond to Thin Rectangular gold
Belong to the edge of piece 370, when upper and lower mould matched moulds forging, fin circle 415 will provide local type and squeeze stamping press in the thin gold being in contact
Belong to piece surrounding, foil edge is squeezed by type extends and be thinned, and and then is closely connected with transmission area 360.Fig. 5 C are
Cross-sectional view after forging, after the forging of foil 370, edge is strutted to the side of transmission area 360 because thickness is thinned and extended
Wall and be filled with transmission area 360, the thinned amount of above-mentioned foil is enough to fill up gap between the two.Above-mentioned fin circle width
About 0.4-2.0mm.
The schematical embodiment of the present invention is the foregoing is only, is not limited to the scope of the present invention.Appoint
What those skilled in the art, the equivalent variations made on the premise of the design of the present invention and principle is not departed from and modification,
Protection scope of the present invention should be belonged to.
Claims (10)
- A kind of 1. manufacture method of radiating bottom plate, it is characterised in that:A metal base plate is provided, the metal base plate includes a thinning area;Real material block gross mass according to the thinning area is equal to the gross mass of the thinning area after forging, and hopper is escaped in calculating Number and size, real material block number and size, and the hopper of escaping is spaced each other with the real material block;According to gained is calculated, first time punching press is carried out, to form more several hoppers of escaping in the thinning area;AndSecond of punching press forging is carried out, to cause the real material for expecting block to be covered because of the punching press forging in adjacent institute State and escape hopper to form the thinning area.
- 2. the manufacture method of radiating bottom plate as claimed in claim 1, it is characterised in that the thinning area is that a heat pipe is thinned Area, after a heat pipe is placed in the heat pipe thinning area, progress third time punched, which squeezes, carrys out heat pipe described in stake-fastening.
- A kind of 3. manufacture method of radiating bottom plate, it is characterised in that:One metal base plate and a flat type heat pipe are provided;A heat pipe thinning area is highly designed according to the flat type heat pipe;Real material block gross mass according to the heat pipe thinning area is equal to heat pipe thinning area gross mass after forging, calculates the heat pipe Escape hopper number and size, real material block number and size in thinning area, and the hopper of escaping is expected block each other in fact with described Interval;According to gained is calculated, first time punching press is carried out, to form more several hoppers of escaping in the heat pipe thinning area;AndSecond of punching press forging is carried out, to cause the real material for expecting block to be covered because of the punching press forging in adjacent institute State and escape hopper to form the heat pipe thinning area;After the flat type heat pipe is placed in into the heat pipe thinning area, progress third time punched, which squeezes, carrys out flat type heat described in stake-fastening Pipe.
- 4. the manufacture method of radiating bottom plate as claimed in claim 3, it is characterised in that include multiple different shapes, different thickness The thinning area of degree, the multiple thinning area area are planned in the radiating bottom plate with thinned degree according to actual demand, to coordinate Component placement.
- 5. the manufacture method of radiating bottom plate as claimed in claim 4, it is characterised in that the metal base plate is a material strip, institute To state punching press forging technology be continuous punching forging or sectional stamping forging, to form the multiple different shape, different-thickness Thinning area and the heat pipe thinning area.
- 6. the manufacture method of radiating bottom plate as claimed in claim 3, it is characterised in that the stake-fastening of the flat type heat pipe by The back-type of the heat pipe thinning area of the radiating bottom plate squeezes the metallic sheet material of protrusion or squeezed by heat pipe thinning area front type The metallic sheet material of protrusion is fixed.
- A kind of 7. manufacture method of radiating bottom plate, it is characterised in that:One metal base plate and a flat type heat pipe are provided;A heat pipe thinning area is highly designed according to the flat type heat pipe;First time punching press is imposed, transmission area is formed to remove the material of the heat pipe thinning area;A sheet metal is provided, the sheet thicknesses are equal to the predetermined remaining thickness in the heat pipe thinning area, the sheet metal The transmission area is dimensioned slightly smaller than, the undersized refers to still there is a small space when sheet metal is placed in the transmission area, When the sheet metal, which is subjected to punched, to be squeezed, the edge of the sheet metal, because of the quality that thickness reduces and extends, it is sufficient to The small space is filled up, and forms both and is tightly engaged into;The crowded upper mould of one group of punched is provided and lower mould, the lower mould are provided with a fin circle, the position correspondence of the fin circle In the edge of the sheet metal;Impose second of punched to squeeze, so that sheet metal described in fin circle partial span, makes the sheet metal and the metal bottom Plate shape is into being tightly engaged into;AndAfter the flat type heat pipe is placed in into the heat pipe thinning area, progress third time punched, which squeezes, carrys out flat type heat described in stake-fastening Pipe.
- 8. the manufacture method of radiating bottom plate as claimed in claim 7, it is characterised in that described fin circle width is 0.4mm- 2mm。
- 9. the manufacture method of radiating bottom plate as claimed in claim 7, it is characterised in that the stake-fastening of the flat type heat pipe by The back-type of the heat pipe thinning area of the thin bottom plate of radiating squeezes the metallic sheet material of protrusion or by heat pipe thinning area front type The metallic sheet material for squeezing protrusion is fixed.
- 10. the manufacture method of radiating bottom plate as claimed in claim 7, it is characterised in that the metal base plate further include it is multiple not The thinning area of similar shape, different-thickness, the thinning area are subjected to stamping technology and remove the material of the thinning area and formed more Individual transmission area, each thinning area respectively with a foil corresponding thereto, while or impose second of punched by several times and squeeze, The foil punched is squeezed and is tightly fastened and is filled in the multiple transmission area.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101875086A (en) * | 2008-12-11 | 2010-11-03 | 李殷德 | Riveting method |
CN102109286A (en) * | 2011-03-04 | 2011-06-29 | 东莞汉旭五金塑胶科技有限公司 | Heat radiator assembly |
US8305761B2 (en) * | 2009-11-17 | 2012-11-06 | Apple Inc. | Heat removal in compact computing systems |
TWM450061U (en) * | 2012-09-19 | 2013-04-01 | Yu-Syuan Chen | Heat conduction structure |
JP5227672B2 (en) * | 2008-06-17 | 2013-07-03 | 古河電気工業株式会社 | Heat pipe fixing method and heat sink |
CN103219300A (en) * | 2012-01-19 | 2013-07-24 | 升业科技股份有限公司 | Heat dissipation base plate, thin-type heat dissipation module, and method for manufacturing same |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5227672B2 (en) * | 2008-06-17 | 2013-07-03 | 古河電気工業株式会社 | Heat pipe fixing method and heat sink |
CN101875086A (en) * | 2008-12-11 | 2010-11-03 | 李殷德 | Riveting method |
US8305761B2 (en) * | 2009-11-17 | 2012-11-06 | Apple Inc. | Heat removal in compact computing systems |
CN102109286A (en) * | 2011-03-04 | 2011-06-29 | 东莞汉旭五金塑胶科技有限公司 | Heat radiator assembly |
CN103219300A (en) * | 2012-01-19 | 2013-07-24 | 升业科技股份有限公司 | Heat dissipation base plate, thin-type heat dissipation module, and method for manufacturing same |
TWM450061U (en) * | 2012-09-19 | 2013-04-01 | Yu-Syuan Chen | Heat conduction structure |
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