CN104626147A - Automatic mechanical arm demonstration system and method - Google Patents
Automatic mechanical arm demonstration system and method Download PDFInfo
- Publication number
- CN104626147A CN104626147A CN201310562249.7A CN201310562249A CN104626147A CN 104626147 A CN104626147 A CN 104626147A CN 201310562249 A CN201310562249 A CN 201310562249A CN 104626147 A CN104626147 A CN 104626147A
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- China
- Prior art keywords
- manipulator
- camera
- wireless communication
- radio communication
- mechanical arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0081—Programme-controlled manipulators with master teach-in means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
Abstract
The invention relates to the field of semiconductor manufacturing with a mechanical arm used for conveying products such as wafers, in particular to an automatic mechanical arm demonstration system and method. A mechanical arm wireless communication module is connected with a mechanical arm controller, receives control signals sent out by the mechanical arm controller and conducts communication with the mechanical arm controller. The mechanical arm is connected with the mechanical arm wireless communication module, receives the control signals of the mechanical arm wireless communication module and moves to a target position. A wireless communication wafer tool is connected with the mechanical arm, receives the control signals and then conducts image recognition. By means of the automatic mechanical arm demonstration system and method, the function of the automatic alignment of the center of the mechanical arm for conveying the wafers and the center of a conveying unit, and the automatic storage of the center position information of the conveying unit can be achieved, and the purposes of improving the positioning precision, saving the operation time and preventing equipment damage caused by human errors are achieved.
Description
Technical field
The present invention relates to and use manipulator to manufacture field to the semiconductor production that the products such as wafer transmit, be specially the automatic teaching system of a kind of manipulator and method.
Background technology
In the production process of semiconductor front road technique wafer, because process complexity is with high costs, to the production capacity of wafer and yield requirement very strict, so go as much as possible to avoid because debugging or device failure cause equipment downtime.
When TRACK enters factory's debugging or carries out unit replacement, need to carry out position teaching to ensure that manipulator can be transferred to assigned address wafer like clockwork accurately to correlation unit.Because production shutdown can bring larger economic loss to producer, so require that teaching work accurately completes as far as possible at short notice.
Under present mode, the center teaching of manipulator supply unit is all estimated by operating personnel or undertaken by semi-automatic auxiliary equipment, the problem that the while of also existing consuming time, precision is low, is easy to because the improper phenomenon causing wafer cannot be transferred to assigned address or manipulator collision in teaching position.
Summary of the invention
For the deficiencies in the prior art, the invention provides a kind of automatic teaching system of manipulator of field of semiconductor manufacture, it is a kind of system that can realize the automatic tutorial function in manipulator supply unit center, solve the existing consuming time and susceptible problem of positioning precision, can reduce because human error causes the risk of device damage simultaneously.
The technical scheme that the present invention is adopted for achieving the above object is:
The automatic teaching system of a kind of manipulator, manipulator wireless communication module connects Manipulator Controller, receives the control signal that Manipulator Controller sends, communicates with Manipulator Controller;
Manipulator connects manipulator wireless communication module, receives the control signal of manipulator wireless communication module, moves to target location;
Radio communication wafer instrument connects manipulator, carries out image recognition after reception control signal.
Described radio communication wafer instrument comprises wafer instrument wireless communication module, CPU module, FPGA module and camera;
Described wafer instrument wireless communication module one end connects manipulator, and the other end connects CPU module, for communicating with CPU module with manipulator;
Described CPU module connects FPGA module, sends signal to FPGA module, obtains positional information;
Described camera connects described FPGA module, for image sampling.
Described camera comprises the first camera, second camera, the 3rd camera and the 4th camera.
Described first camera is placed in the edge of radio communication wafer instrument, corresponding teaching object centers position, for carrying out image sampling to the horizontal sides of teaching object;
Described second camera and the 3rd camera are placed in the edge of radio communication wafer instrument, and are placed in the first camera both sides respectively, for carrying out image sampling to the vertical side edge of teaching object;
Described 4th camera is placed in the center of radio communication wafer instrument, for sampling to the planar graph of teaching object.
Also comprising rechargeable battery and be built in radio communication wafer instrument, providing power supply for giving radio communication wafer instrument.
A kind of manipulator automatic teaching method, the signal that Manipulator Controller sends sends to manipulator by manipulator wireless communication module, radio communication wafer instrument is adjusted to the assigned address of manipulator;
The instruction that Manipulator Controller sends sends to manipulator by manipulator wireless communication module, and driving device hand moves to assigned address;
The control instruction that radio communication wafer means accepts machinery hand controls sends, carries out Model Identification, feeds back to Manipulator Controller after drawing recognition result;
Manipulator Controller judges recognition result, and preserves recognition result.
The identifying of radio communication wafer instrument comprises:
Wafer instrument wireless communication module receives the signal of Manipulator Controller, carries out image sampling by camera;
CPU module receives picture signal, is sent to FPGA module and carries out Model Identification, and calculate recognition result after the picture signal collected being processed in real time;
Wafer instrument wireless communication module receives recognition result, and recognition result is fed back to Manipulator Controller.
The deterministic process of Manipulator Controller to recognition result comprises:
If can correctly identify, then the positional information in recognition result information is preserved;
If can not correctly identify, then continue sending controling instruction, Repetitive controller process.
The present invention has following beneficial effect and advantage:
1. to have structure simple in the present invention, and it is convenient to realize, automatically the feature such as convenient.
2. the full-automatic mode of the present invention improves precision effectively, saves the position teaching time, significantly improves production capacity and saves funds.
3. the present invention adopts automated manner, effectively can prevent human error, reduces the risk of machine breakdown.
Accompanying drawing explanation
Fig. 1 is top view of the present invention;
Fig. 2 is front view of the present invention;
Fig. 3 is axonometric drawing of the present invention;
Fig. 4 is the structural representation of radio communication wafer instrument of the present invention;
Fig. 5 is radio communication wafer tool interior connection layout of the present invention;
Wherein 1. charging hole 2. battery case 3. the 4th camera 4. the 3rd camera 5. first camera 6. second cameras, 7 Manipulator Controllers, 8 manipulator wireless communication modules, 9 manipulators, 10 radio communication wafer instruments.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Native system can assign instruction by Manipulator Controller by communication, and the wafer instrument that driving device hand arm carries moves to assigned address; Use the built-in camera of wafer instrument to carry out identification location to assigned address, ensure that the arm center of manipulator is consistent with transfer position center; The supply unit center location information obtained after identifying location is wirelessly transferred to Manipulator Controller, automatically preserves for semiconductor production as teaching position.The full-automatic mode of the present invention improves precision effectively, saves the position teaching time, significantly improves production capacity and saves funds.
Have and can realize bearing the conveying manipulator center of wafer and the auto-alignment at supply unit center, and automatically preserve the function of supply unit center location information.Dismounting on a robotic arm can be realized simply.Can by carrying automatic teaching radio communication wafer instrument on a robotic arm, control manipulator and move to the teaching position estimated, utilize the camera of automatic teaching radio communication wafer tool interior to carry out image recognition to target object (circular hole or thrust or frame), automatically correctly find position consistent with transfer position center, the arm center of manipulator.
Automatic teaching radio communication wafer tool interior in system carries minisize pick-up head 4 tool, and corresponding XYZ direction, carries out image recognition to circular hole, thrust or frame respectively.
By the Wireless Telecom Equipment of internal system, automated location correction can be carried out according to the result that automatic teaching radio communication wafer instrument identifies, and memory retention is carried out to the correct result of final understanding.
Native system adopts the data communication (camera real-time sampling picture and position coordinates) realizing between internal system unit in accordance with the communication of SEMI standard.
Be top view of the present invention, front view and axonometric drawing as shown in Figures 1 to 3.
Manipulator wireless communication module connects Manipulator Controller, receives the control signal that Manipulator Controller sends, communicates with Manipulator Controller;
Manipulator connects manipulator wireless communication module, receives the control signal of manipulator wireless communication module, moves to target location;
Radio communication wafer instrument connects manipulator, carries out image recognition after reception control signal.
As the structural representation that Fig. 4 is radio communication wafer instrument of the present invention.
Radio communication wafer tool diameter is 2 kinds of specifications, is respectively 200mm and 300mm, and wafer instrument thickness is 6mm.2mm place, wafer bottom is arranged in the center of the built-in camera of wafer.
Radio communication wafer upper tool part arranges miniature charging battery, comprises charging hole 1 and battery case 2, uses civilian 220V to charge by special charging device.
Be illustrated in figure 5 radio communication wafer tool interior connection layout of the present invention.
Wafer instrument built-in CPU and FPGA(Field Programmable Gate Array) unit, can the image that camera collection comes be processed and Model Identification in real time.
Built-in camera 4 tool; Blur-free imaging can be carried out to circular hole, thrust or frame.
The built-in wireless communication module of wafer instrument (RF), can receive in accordance with SEMI standard and send wireless messages (camera real-time sampling picture and position coordinates).
Wafer instrument built-in rechargeable battery, and charge by special arrangement.
Wireless communication module one end connects Manipulator Controller, and the other end connects CPU module, for communicating with CPU module with main frame; CPU module connects FPGA module, sends signal to FPGA module, obtains positional information; Camera connects FPGA module, for image sampling.
Teaching wafer instrument is communicated with Manipulator Controller by RF, utilizes camera to carry out image sampling, then carries out process by CPU and FPGA and calculates positional information, finally by RF and Manipulator Controller mutual.
Camera function comprises:
Wafer tool interior carries minisize pick-up head 4 tool, can carry out blur-free imaging to circular hole, thrust or frame.
First camera is placed in the edge of radio communication wafer instrument, corresponding teaching object centers position, for carrying out image sampling to the horizontal sides of teaching object.
Second camera and the 3rd camera are placed in the edge of radio communication wafer instrument, and are placed in the first camera both sides respectively, for carrying out image sampling to the vertical side edge of teaching object.
4th camera is placed in the center of radio communication wafer instrument, for sampling to the planar graph of teaching object.
Radio communication wafer tool work process of the present invention is as follows:
The teaching of 1.Cassette object
(1) wafer instrument wireless communication module receives Manipulator Controller signal, specifies teaching object type and place coordinate;
(2) use second camera and 2 vertical side edge of the 3rd camera to teaching object to carry out image sampling;
(3) use the first camera to carry out image sampling to the horizontal sides of teaching object;
(4) built-in CPU and FPGA(Field Programmable Gate Array) module processes and Model Identification in real time to gathering the image come, and calculates the coordinate of result.
(5) by wafer instrument wireless communication module, recognition result (image result and coordinate) is fed back to Manipulator Controller.
The teaching of 2.Plate unit
(1) wafer instrument wireless communication unit accepts Manipulator Controller signal, specifies teaching object type and place coordinate;
(2) use the 4th camera to carry out image sampling to the planar graph of teaching object;
(3) use the first camera to carry out image sampling to the horizontal sides of teaching object;
(4) built-in CPU and FPGA(Field Programmable Gate Array) unit processes and Model Identification in real time to gathering the image come, and calculates the coordinate of result.
(5) by wafer instrument wireless communication unit, recognition result (image result and coordinate) is fed back to Manipulator Controller.
After receiving Manipulator Controller instruction, utilize the camera that is built in the tool interior being similar to wafer to carry out image recognition to target object (circular hole or thrust or frame) to position, by communication, locating information is transferred to Manipulator Controller afterwards, and then realizes manipulator automated location location.
The present invention can reach and effectively improve homework precision, saves the activity duration, reduces the object that human factor causes equipment breakage risk.
Implementation method process of the present invention comprises:
1. automatic teaching radio communication wafer instrument is placed on assigned address.
2. Manipulator Controller sends instruction to manipulator, is mounted on manipulator arm by automatic teaching radio communication wafer instrument.
3. Manipulator Controller sends instruction to manipulator, and driving device hand moves to assigned address.
4. Manipulator Controller sends teaching instruction to automatic teaching radio communication wafer instrument by wireless communication unit.
5. teaching radio communication wafer instrument carries out image sampling by built-in camera to destination object automatically, utilize Built-in Image processing unit to process in real time and Model Identification, result (image result and coordinate) feeds back to Manipulator Controller by radio communication.
6. Manipulator Controller judges result.If result meets teaching condition, then the positional information comprised in object information is preserved as manipulator supply unit center; If result does not meet teaching condition, then repeat 3-5 until condition meets.
Claims (8)
1. the automatic teaching system of manipulator, is characterized in that:
Manipulator wireless communication module connects Manipulator Controller, receives the control signal that Manipulator Controller sends, communicates with Manipulator Controller;
Manipulator connects manipulator wireless communication module, receives the control signal of manipulator wireless communication module, moves to target location;
Radio communication wafer instrument connects manipulator, carries out image recognition after reception control signal.
2. the automatic teaching system of a kind of manipulator according to claim 1, is characterized in that:
Described radio communication wafer instrument comprises wafer instrument wireless communication module, CPU module, FPGA module and camera;
Described wafer instrument wireless communication module one end connects manipulator, and the other end connects CPU module, for communicating with CPU module with manipulator;
Described CPU module connects FPGA module, sends signal to FPGA module, obtains positional information;
Described camera connects described FPGA module, for image sampling.
3. the automatic teaching system of a kind of manipulator according to claim 2, is characterized in that: described camera comprises the first camera, second camera, the 3rd camera and the 4th camera.
4. the automatic teaching system of a kind of manipulator according to claim 3, is characterized in that:
Described first camera is placed in the edge of radio communication wafer instrument, corresponding teaching object centers position, for carrying out image sampling to the horizontal sides of teaching object;
Described second camera and the 3rd camera are placed in the edge of radio communication wafer instrument, and are placed in the first camera both sides respectively, for carrying out image sampling to the vertical side edge of teaching object;
Described 4th camera is placed in the center of radio communication wafer instrument, for sampling to the planar graph of teaching object.
5. the automatic teaching system of a kind of manipulator according to claim 2, is characterized in that: also comprise rechargeable battery and be built in radio communication wafer instrument, provides power supply for giving radio communication wafer instrument.
6. a manipulator automatic teaching method, is characterized in that:
The signal that Manipulator Controller sends sends to manipulator by manipulator wireless communication module, radio communication wafer instrument is adjusted to the assigned address of manipulator;
The instruction that Manipulator Controller sends sends to manipulator by manipulator wireless communication module, and driving device hand moves to assigned address;
The control instruction that radio communication wafer means accepts machinery hand controls sends, carries out Model Identification, feeds back to Manipulator Controller after drawing recognition result;
Manipulator Controller judges recognition result, and preserves recognition result.
7. a kind of manipulator automatic teaching method according to claim 6, is characterized in that: the identifying of radio communication wafer instrument comprises:
Wafer instrument wireless communication module receives the signal of Manipulator Controller, carries out image sampling by camera;
CPU module receives picture signal, is sent to FPGA module and carries out Model Identification, and calculate recognition result after the picture signal collected being processed in real time;
Wafer instrument wireless communication module receives recognition result, and recognition result is fed back to Manipulator Controller.
8. a kind of manipulator automatic teaching method according to claim 6, is characterized in that: the deterministic process of Manipulator Controller to recognition result comprises:
If can correctly identify, then the positional information in recognition result information is preserved;
If can not correctly identify, then continue sending controling instruction, Repetitive controller process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310562249.7A CN104626147A (en) | 2013-11-11 | 2013-11-11 | Automatic mechanical arm demonstration system and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310562249.7A CN104626147A (en) | 2013-11-11 | 2013-11-11 | Automatic mechanical arm demonstration system and method |
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| CN104626147A true CN104626147A (en) | 2015-05-20 |
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| CN201310562249.7A Pending CN104626147A (en) | 2013-11-11 | 2013-11-11 | Automatic mechanical arm demonstration system and method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104842368A (en) * | 2015-05-25 | 2015-08-19 | 上海华力微电子有限公司 | Mechanical arm capable of automatically learning vertical height and automatic learning method of mechanical arm |
| WO2017186172A1 (en) * | 2016-04-29 | 2017-11-02 | 上海微电子装备（集团）股份有限公司 | Robot arm for holding cassette and automatic cassette transfer device |
| CN109866072A (en) * | 2019-01-28 | 2019-06-11 | 浙江工业大学 | A kind of calculation method of truss manipulator bulk tank tapping hole automatic positioning |
| EP3648152A1 (en) * | 2018-11-01 | 2020-05-06 | Integrated Dynamics Engineering GmbH | Method of teaching or controlling a robot and system used therefor |
| EP3648150A1 (en) * | 2018-11-01 | 2020-05-06 | Integrated Dynamics Engineering GmbH | Method of teaching or controlling a robot and system used therefor |
| CN113206031A (en) * | 2021-07-05 | 2021-08-03 | 宁波润华全芯微电子设备有限公司 | Automatic wafer positioning teaching system and method |
| CN114188254A (en) * | 2021-11-18 | 2022-03-15 | 江苏匠岭半导体有限公司 | Wafer carrying manipulator position teaching aid and teaching method thereof |
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| CN1684803A (en) * | 2002-05-30 | 2005-10-19 | 罗兹株式会社 | Automatic reference position teaching method, automatic positioning method, and automatic carrying method for disk-like object, automatic reference position teaching device, automatic positioning devi |
| CN101982609A (en) * | 2010-09-19 | 2011-03-02 | 北京凌云光视数字图像技术有限公司 | Tamping wagon photoelectric measurement system and method |
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| JP2002002909A (en) * | 2000-06-19 | 2002-01-09 | Shinko Electric Co Ltd | Teaching confirmation method for robot for stocker |
| JP2002018753A (en) * | 2000-06-29 | 2002-01-22 | Asm Japan Kk | Device and method for teaching wafer handling robot |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104842368A (en) * | 2015-05-25 | 2015-08-19 | 上海华力微电子有限公司 | Mechanical arm capable of automatically learning vertical height and automatic learning method of mechanical arm |
| WO2017186172A1 (en) * | 2016-04-29 | 2017-11-02 | 上海微电子装备（集团）股份有限公司 | Robot arm for holding cassette and automatic cassette transfer device |
| US11383940B2 (en) | 2016-04-29 | 2022-07-12 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Robot arm for holding cassette and automatic cassette transfer device |
| EP3648152A1 (en) * | 2018-11-01 | 2020-05-06 | Integrated Dynamics Engineering GmbH | Method of teaching or controlling a robot and system used therefor |
| EP3648150A1 (en) * | 2018-11-01 | 2020-05-06 | Integrated Dynamics Engineering GmbH | Method of teaching or controlling a robot and system used therefor |
| CN109866072A (en) * | 2019-01-28 | 2019-06-11 | 浙江工业大学 | A kind of calculation method of truss manipulator bulk tank tapping hole automatic positioning |
| CN113206031A (en) * | 2021-07-05 | 2021-08-03 | 宁波润华全芯微电子设备有限公司 | Automatic wafer positioning teaching system and method |
| CN114188254A (en) * | 2021-11-18 | 2022-03-15 | 江苏匠岭半导体有限公司 | Wafer carrying manipulator position teaching aid and teaching method thereof |
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Application publication date: 20150520 |