CN104626145B - The driving mechanism of mechanical arm - Google Patents

The driving mechanism of mechanical arm Download PDF

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Publication number
CN104626145B
CN104626145B CN201410734308.9A CN201410734308A CN104626145B CN 104626145 B CN104626145 B CN 104626145B CN 201410734308 A CN201410734308 A CN 201410734308A CN 104626145 B CN104626145 B CN 104626145B
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China
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cylinder
mechanical arm
piston
cylinder body
connecting rod
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Expired - Fee Related
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CN201410734308.9A
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CN104626145A (en
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王冈
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Individual
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Abstract

The driving mechanism that the invention discloses a kind of mechanical arm, it comprises: the first cylinder; The second cylinder, itself and the first cylinder be arranged in parallel; In the cylinder body of the first cylinder and in the cylinder body of the second cylinder, being all filled with boiling point and being 80 DEG C of following, heats of vaporization is the liquid medium below 400J/g; Semiconductor chilling plate, it is located between the cylinder body of the first cylinder and the cylinder body of the second cylinder, and two surfaces of semiconductor chilling plate fit in respectively the wall of cylinder body of the first cylinder and the wall of the cylinder body of the second cylinder; And mechanical arm, it is connected with the piston of the first cylinder and the piston of the second cylinder by a swing mechanism; The counter motion of the piston by these two cylinders drives swing mechanism motion, swings to order about mechanical arm. The present invention changes to adjust the pendulum angle of mechanical arm by the pressure in two cylinders of semiconductor chilling plate control, it is simple in structure, and operation is rapid, accurate, and failure rate is low.

Description

The driving mechanism of mechanical arm
Technical field
The present invention relates to mechanical arm field, particularly a kind of driving mechanism of mechanical arm.
Background technology
Some holding function of the apish arm of mechanical arm energy, it can capture by fixed routine, carryObject or operation tool. Mechanical arm can replace people's heavy work to realize the mechanization of producing with automaticChange, and can under hostile environment, operate with protection personal safety, thereby mechanical arm is widely used in machineryThe industries such as manufacture, metallurgy, electronics, light industry. Current mechanical arm adopts the modes such as hydraulic pressure or air pressure to driveWhen moving swing, its stable working, accurate positioning, but it need to build air pressure station or Hydraulic Station, andWhile adopting multiple engines or motor directly to drive, its drive mechanism complexity, transmission process noise is large,In the time that mechanical arm needs frequent swing, its reaction is quick not, and fault rate is high. Therefore existing manipulatorThe type of drive complex structure of arm, fault rate is higher, has a strong impact on the operating efficiency of mechanical arm, and increasesAdd the use cost of mechanical arm.
The information that is disclosed in this background technology part is only intended to increase the reason to general background of the present inventionSeparate, and should not be regarded as admitting or imply that in any form this information structure has been this area general technologyThe prior art that personnel are known.
Summary of the invention
The object of the present invention is to provide a kind of driving mechanism of mechanical arm, thereby overcome existing machineryThe complex structure of arm, the shortcoming that fault rate is high.
For achieving the above object, the invention provides a kind of driving mechanism of mechanical arm, wherein, comprising:The first cylinder; The second cylinder, itself and described the first cylinder be arranged in parallel; In the cylinder body of described the first cylinderBe that 80 DEG C of following, heats of vaporization are the liquid below 400J/g with being all filled with boiling point in the cylinder body of the second cylinderMedium; Semiconductor chilling plate, it is located between the cylinder body of described the first cylinder and the cylinder body of the second cylinder,Two surfaces of this semiconductor chilling plate fit in respectively wall and second gas of the cylinder body of described the first cylinderThe wall of the cylinder body of cylinder; And mechanical arm, it is by the piston of a swing mechanism and described the first cylinderAnd the piston of the second cylinder connects; By the piston of described the first cylinder and the piston of the second cylinder oppositelyMotion drives described swing mechanism motion, swings to order about this mechanical arm.
Preferably, in technique scheme, described swing mechanism comprises: first connecting rod, its one end and instituteState the piston hinge of the first cylinder; Second connecting rod, the piston hinge of its one end and described the second cylinder; WithAnd third connecting rod, the other end of its one end and described first connecting rod is hinged, and the other end of this third connecting rodHinged with the other end of described second connecting rod; The rear portion of described mechanical arm is fixedly installed on this third connecting rodCentre.
Preferably, in technique scheme, also comprise one be fixedly installed and be positioned at described mechanical arm afterThe mechanical postbrachium of side, the rear end of described mechanical arm is articulated with on this machinery postbrachium.
Preferably, in technique scheme, described swing mechanism comprises: the first tooth bar, itself and describedThe piston of one cylinder is fixedly connected with; The second tooth bar, it is fixedly connected with the piston of described the second cylinder; WithAnd gear, it is arranged on a support bar; The both sides of this gear respectively with described the first tooth bar and the second toothBar engagement; The rear end of described mechanical arm is fixedly installed on this gear.
Preferably, in technique scheme, described boiling point is that 80 DEG C of following, heats of vaporization are below 400J/gLiquid medium be carrene or carbon tetrachloride.
Compared with prior art, the present invention has following beneficial effect:
The present invention changes to drive swing mechanism fortune by the pressure in two cylinders of semiconductor chilling plate controlMoving, to adjust the pendulum angle of mechanical arm, its drive disk assembly needing is few, simple in structure, moves fastSpeed is accurate, noise is little, and the present invention can be applicable to the frequent swing of mechanical arm, fault rate neatlyLow, maintenance is convenient.
Brief description of the drawings
The structure that Fig. 1 is is bar linkage structure according to the swing mechanism of the driving mechanism of mechanical arm of the present inventionSchematic diagram.
Fig. 2 is is gear & rack structure according to the swing mechanism of the driving mechanism of mechanical arm of the present inventionStructural representation.
Main description of reference numerals:
1-the first cylinder, the piston of 2-the first cylinder; 3-the second cylinder, the piston of 4-the second cylinder; 5-halfConductor cooling piece; 6-mechanical arm; 7-machinery postbrachium; 8-first connecting rod; 9-second connecting rod; 10-the 3rd connectsBar; 11-support bar; 12-gear; 13-the first tooth bar; 14-the second tooth bar.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail, but is to be understood that thisThe protection domain of invention is not subject to the restriction of detailed description of the invention.
Unless separately there is other clearly to represent, otherwise in whole description and claims, term " bagDraw together " or its conversion element of stating being understood to include as " comprising " or " including " etc. orPart, and do not get rid of other element or other part.
As depicted in figs. 1 and 2, according to a kind of embodiment of the specific embodiment of the invention be: Yi ZhongjiThe driving mechanism of tool arm, it comprises: the first cylinder 1, the second cylinder 3, semiconductor chilling plate 5, pendulumActuation mechanism and mechanical arm 6, wherein:
As shown in Figure 1, in the cylinder body of the first cylinder 1, being filled with boiling point is that 80 DEG C of following, heats of vaporization areLiquid medium below 400J/g, these media are vaporization and liquefaction easily; Same in the cylinder body of the second cylinder 3It is that 80 DEG C of following, heats of vaporization are the liquid medium below 400J/g that sample is filled with boiling point. And the second cylinder 3Be arranged in parallel with the first cylinder 1; Vaporization by medium or liquefaction change the first cylinder 1 cylinder body andPressure in the cylinder body of the second cylinder 3, to control the piston 2 of the first cylinder and the piston 4 of the second cylinderStretch out or regain. When the liquid medium in the cylinder body of the first cylinder 1 or the cylinder body of the second cylinder 3Rapidly vaporization when heat, raises cylinder interior air pressure, thus promote the first cylinder piston 2 orThe piston 4 of the second cylinder outwards moves; Meet when cold and will liquefy rapidly when medium, volume-diminished, cylinder bodyInterior air pressure reduces, thereby the piston 2 of the first cylinder or the piston 4 of the second cylinder are moved inward.Preferably, boiling point is that 80 DEG C of following, heats of vaporization are that liquid medium below 400J/g is carrene or fourChlorination carbon, it is easily manufactured, and use cost is lower, and the piston of two cylinders moves quick and precisely. Can rootSelect suitable medium according to the temperature of working environment, general boiling point is that 80 DEG C of following, heats of vaporization are 400J/gThe boiling point of following liquid medium than the temperature of working environment high 20 DEG C~50 DEG C, for example, 0 DEG C of left and rightWorking environment under, medium can be selected carrene; Under the working environment of 30 DEG C of left and right, medium is optionalSelect carbon tetrachloride.
Semiconductor chilling plate 5 is located between the cylinder body of the first cylinder 1 and the cylinder body of the second cylinder 3, shouldTwo surfaces of semiconductor chilling plate 5 fit in respectively wall and second cylinder 3 of the cylinder body of the first cylinder 1The wall of cylinder body, the cylinder body of two cylinders is good by heat conduction with the wall that semiconductor chilling plate 5 contactsMaterial is made; When after semiconductor chilling plate 5 energisings, two surface there will be variations in temperature, itsIn a surface temperature step-down, another side temperature uprises, two surperficial temperature difference can reach more than 30 DEG C,Change after the sense of current, two surperficial state of temperatures of semiconductor chilling plate 5 will take a turn for the worse, formerThe meeting that carrys out high temperature becomes low temperature, and originally the meeting of low temperature becomes high temperature, the heat energy of low-temperature end is transferred to simultaneouslyTemperature end. Therefore can change rapidly in the first cylinder 1 and the second cylinder 3 by semiconductor chilling plate 5Temperature so that the piston 2 of the first cylinder and the piston 4 of the second cylinder oppositely move, and firstThe speed that the piston 2 of cylinder moves with the piston 4 of the second cylinder is all identical with distance. By semiconductor refrigeratingSheet 5 is adjusted the temperature transition of two cylinders, can make the work of piston 2 and second cylinder of the first cylinderPlug 4 flexibly and fast oppositely moves, and ensures this two uniformity that piston moves, and the first gasThe piston 2 of cylinder and the piston 4 of the second cylinder can stably be realized frequently and moving around.
Mechanical arm 6 connects by a swing mechanism and the piston 2 of the first cylinder and the piston of the second cylinder 4Connect; Counter motion by the piston 2 of the first cylinder and the piston 4 of the second cylinder drives swing mechanismMotion, swings to order about mechanical arm 6. When the first cylinder 1 and the second cylinder 3 are established up and down side by sideWhile putting, can order about mechanical arm 6 by swing mechanism and carry out swinging up and down of vertical direction; When firstWhen cylinder 1 and the second cylinder 3 along continuous straight runs arrange side by side, can order about machinery by swing mechanismArm 6 carries out swinging of horizontal direction. Preferably, as shown in Figure 1, swing mechanism comprises firstConnecting rod 8, second connecting rod 9 and third connecting rod 10, the piston 2 of one end of first connecting rod 8 and the first cylinderHinged; The piston 4 of one end of second connecting rod 9 and the second cylinder is hinged; The upper end of third connecting rod 10 andThe other end of one connecting rod 8 is hinged, and the other end of the lower end of this third connecting rod 10 and second connecting rod 9 is hinged;The rear portion of mechanical arm 6 is fixedly connected with the centre of third connecting rod 10. When after semiconductor chilling plate 5 energisings,Can change rapidly the cylinder body of the first cylinder 1 and the cylinder body of the second cylinder 3 by semiconductor chilling plate 5Temperature, so that the piston of the first cylinder 1 and the second cylinder 3 carries out counter motion, thereby connects by firstBar 8 and second connecting rod 9 drive third connecting rod 10 to swing, and swing accordingly with driving mechanical arm 6.Order about mechanical arm 6 by linkage as swing mechanism and swing, it is simple in structure, is convenient to dimensionProtect maintenance, and its stable drive is quick. Further, also comprise a mechanical postbrachium 7 being fixedly installed, machineThe front end of the rear end of tool arm 6 and this machinery postbrachium 7 is hinged. Can further carry by mechanical postbrachium 7The structural rigidity of high mechanical arm 6 and the stability of operation, be convenient to maintaining.
Or preferably, as shown in Figure 2, swing mechanism comprises support bar 11, gear 12, the first toothBar 13 and the second tooth bar 14, the first tooth bars 13 are fixedly connected with the piston 2 of the first cylinder; The second tooth bar14 are fixedly connected with the piston 4 of the second cylinder. Gear 12 is arranged at a support bar in the mode that can rotateOn 11, support bar 11 is fixedly installed; The both sides of this gear 12 respectively with the first tooth bar 13 and the second tooth bar14 engagements; The rear end of mechanical arm 6 is fixedly installed on gear 12. When after semiconductor chilling plate 5 energisings,Can change rapidly the cylinder body of the first cylinder 1 and the cylinder body of the second cylinder 3 by semiconductor chilling plate 5Temperature, so that the piston of the first cylinder 1 and the second cylinder 3 carries out counter motion, the first tooth bar 13 andTwo tooth bars 14 are along with the piston 2 of the first cylinder and the piston 4 of the second cylinder oppositely move, to order aboutGear 12 rotates, and carries out the positive and negative driving mechanical arm 6 that transfers by gear 12 and swing.Work as and swing for swing mechanism carrys out lead agency arm 6 by pinion and rack, its compact conformation, biographyAccurately moving.
When work, detected the swing displacement of mechanical arm 6 by displacement detector, and displacement information is anti-The control system of feeding, control system is according to the current location of mechanical arm 6 and need to move to next positionRelation between putting is controlled energising size and the energising direction of semiconductor chilling plate 5, changes the with correspondenceThe temperature of the cylinder body of the cylinder body of one cylinder 1 and the second cylinder 3, makes piston 2 and second gas of the first cylinderThe piston 4 of cylinder oppositely moves, and swings thereby order about mechanical arm 6 by swing mechanism. ThisInvention keeps consistency because two pistons move, and mobile inertia is little, and it can fast be controlled exactlyMechanical arm 6 processed swings and the final position stopping, and the noise of mechanical arm 6 while swingingLittle. The present invention only need control the energising size and Orientation of semiconductor chilling plate 5, by less parts justCan control mechanical arm 6 and swing frequently for a long time, it is simple in structure, failure rate is low, maintainingConvenient.
The aforementioned description to concrete exemplary of the present invention is in order to illustrate and the object of illustration.These descriptions not want the present invention to be defined as disclosed precise forms, and obviously, according to above-mentionedInstruction, can much change and change. Exemplary embodiment is selected and the object described existsIn explaining certain principles of the present invention and practical application thereof, thereby make those skilled in the art can be realNow and utilize various exemplary of the present invention and various selection and change.Scope of the present invention is intended to be limited by claims and equivalents thereof.

Claims (5)

1. a driving mechanism for mechanical arm, is characterized in that, comprising:
The first cylinder;
The second cylinder, itself and described the first cylinder be arranged in parallel; The cylinder body of described the first cylinder is interior with secondIn the cylinder body of cylinder, being all filled with boiling point and being 80 DEG C of following, heats of vaporization is the liquid medium below 400J/g;
Semiconductor chilling plate, it is located between the cylinder body of described the first cylinder and the cylinder body of the second cylinder,Two surfaces of this semiconductor chilling plate fit in respectively wall and second gas of the cylinder body of described the first cylinderThe wall of the cylinder body of cylinder; The cylinder body of the cylinder body of described the first cylinder and described the second cylinder and this semiconductor systemThe wall of cold contact is made by Heat Conduction Material; And
Mechanical arm, it is by a swing mechanism and the piston of described the first cylinder and the piston of the second cylinderConnect; Counter motion by the piston of described the first cylinder and the piston of the second cylinder drives described pendulumActuation mechanism motion, swings to order about this mechanical arm.
2. the driving mechanism of mechanical arm according to claim 1, is characterized in that, described swingMechanism comprises:
First connecting rod, the piston hinge of its one end and described the first cylinder;
Second connecting rod, the piston hinge of its one end and described the second cylinder; And
Third connecting rod, the other end of its one end and described first connecting rod is hinged, and another of this third connecting rodEnd is hinged with the other end of described second connecting rod; The rear portion of described mechanical arm is fixedly installed on the 3rd and connectsThe centre of bar.
3. the driving mechanism of mechanical arm according to claim 2, is characterized in that, also comprises oneThe mechanical postbrachium that is fixedly installed and is positioned at the rear of described mechanical arm, the rear end of described mechanical arm is hingedOn this machinery postbrachium.
4. the driving mechanism of mechanical arm according to claim 1, is characterized in that, described swingMechanism comprises:
The first tooth bar, it is fixedly connected with the piston of described the first cylinder;
The second tooth bar, it is fixedly connected with the piston of described the second cylinder; And
Gear, it is arranged on a support bar; The both sides of this gear respectively with described the first tooth bar and secondTooth bar engagement; The rear end of described mechanical arm is fixedly installed on this gear.
5. according to the driving mechanism of the mechanical arm described in any one in claim 1-4, it is characterized in that,Described boiling point is that 80 DEG C of following, heats of vaporization are that liquid medium below 400J/g is carrene or tetrachloroCarbon.
CN201410734308.9A 2014-12-04 2014-12-04 The driving mechanism of mechanical arm Expired - Fee Related CN104626145B (en)

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Application Number Priority Date Filing Date Title
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CN104626145B true CN104626145B (en) 2016-05-18

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CN107457795A (en) * 2017-10-12 2017-12-12 谷新运 A kind of tomato absorption clamps synchronous picking mechanical arm end effector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU804193A1 (en) * 1979-04-23 1981-02-15 Научно-Исследовательский И Конст-Рукторско-Технологический Институттеплоэнергетического Приборостроения Chill mould locking mechanism
CN1045637A (en) * 1989-03-17 1990-09-26 上海船用柴油机研究所 Four connecting rod swing-block mechamisms of energy balance reciprocal inertia force
CN203051047U (en) * 2013-01-27 2013-07-10 赵立地 Improved liquid cooling compressor
CN203387439U (en) * 2013-04-22 2014-01-08 冯桥志 Thermoelectric power generation system of water heater

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU804193A1 (en) * 1979-04-23 1981-02-15 Научно-Исследовательский И Конст-Рукторско-Технологический Институттеплоэнергетического Приборостроения Chill mould locking mechanism
CN1045637A (en) * 1989-03-17 1990-09-26 上海船用柴油机研究所 Four connecting rod swing-block mechamisms of energy balance reciprocal inertia force
CN203051047U (en) * 2013-01-27 2013-07-10 赵立地 Improved liquid cooling compressor
CN203387439U (en) * 2013-04-22 2014-01-08 冯桥志 Thermoelectric power generation system of water heater

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