CN104625939A - Glass substrate manufacturing method - Google Patents
Glass substrate manufacturing method Download PDFInfo
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- CN104625939A CN104625939A CN201410642262.8A CN201410642262A CN104625939A CN 104625939 A CN104625939 A CN 104625939A CN 201410642262 A CN201410642262 A CN 201410642262A CN 104625939 A CN104625939 A CN 104625939A
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- grinding
- glass substrate
- lapping liquid
- pad
- grinding pad
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The present invention relates to a glass substrate manufacturing method, which comprises a grinding process and a cleaning process. During the grinding process, the main plane of a glass substrate maintained in the holding hole of a grinding carrier is grounded by a grinding pad and a grinding liquid. The grinding pad is provided with a grounding layer made of foamed resin and smaller than 40 in shore hardness. The grinding liquid contains 3-50 nm silicon dioxide as abrasive particles. During the cleaning process, the surface of the glass substrate is cleaned.
Description
Technical field
The present invention relates to the manufacture method of glass substrate.
Background technology
As the glass base plate for magnetic recording carrier for magnetic recording system etc., used aluminium alloy base plate, but along with the requirement of high record density in the past always, compared that aluminium alloy base plate is harder, flatness and the excellent glass substrate of flatness became main flow gradually.
The glass substrate of magnetic recording media is by after glass-based slab is cut into regulation shape, carries out grinding etc. to manufacture to end face and principal plane.In grinding step in the manufacture method of this glass base plate for magnetic recording carrier, glass substrate is remained in grinding carrier, contain the lapping liquid (slurry) of abrasive particle while use grinding pad to grind to supply between glass substrate and grinding pad.
Among above-mentioned grinding step, in the grinding of glass substrate grinding pad abradant surface on produce scar (abradant surface of grinding carrier scratching grinding pad).Under the state that the abradant surface of grinding pad has scar during grinding glass substrate, likely produce following problem: product quality has problems; Glass substrate breakage in grinding and on abradant surface with need during scar change grinding pad; Etc..In addition, the service time of grinding pad shortens, and also there is the problem making productivity ratio be deteriorated, cause cost increase such.
Grinding rate needs the surface of cutting and grinding pad to adjust abradant surface (finishing process (De レ ス process)) when declining.In addition, when using the glass substrate of grinding pad manufacture can not meet required quality, be considered as reaching the durable limit and new grinding pad will being replaced with.
Must suspend grinding step due to finishing process or replacing grinding pad, the productivity ratio that there is glass substrate declines, cost increases such problem.In addition, finishing process is the operation of carrying out cutting adjustment to the abradant surface of grinding pad, therefore along with the carrying out of finishing process, and the lost of life of grinding pad.
In addition, describe in patent document 1 in the manufacture method of the glass substrate for disc with the grinding step using planetary gears, so that the grinding pad suppressing to fit in upper lower platform to produce one side grinding (eccentric wear), reduce for the purpose of the productivity ratio caused because of grinding pad glides, grinding step is provided with: the first grinding phase, makes above-mentioned upper lower platform rotate the first type surface grinding above-mentioned glass substrate along prescribed direction; Second grinding phase, above-mentioned upper lower platform is made to rotate along the opposite direction in afore mentioned rules direction the first type surface grinding above-mentioned glass substrate.
Prior art document
Patent document
Patent document 1: Japanese Laid-Open 2011-67901 publication
Summary of the invention
The problem that invention will solve
But from the view point of fully preventing from producing scar at the abradant surface of grinding pad, extending the life-span of grinding pad in the grinding of glass substrate, the technology disclosed in patent document 1 is insufficient.
Therefore, the object of the present invention is to provide the manufacture method of glass substrate, the manufacture method of this glass substrate can prevent the abradant surface of grinding pad from producing scar in the grinding of glass substrate, extends the life-span of grinding pad.
For the means of dealing with problems
The present inventor finds, after using the abradant surface 1 μ l lapping liquid being dropped to grinding pad to play 50 seconds, the contact angle of lapping liquid is grinding pad and the lapping liquid of less than 50 °, improve the permeability of lapping liquid to grinding pad, the principal plane of glass substrate is ground, can prevent from thus the abradant surface of grinding pad producing scar and the life-span extending grinding pad in the grinding of glass substrate, thus complete the present invention.
That is, the present invention is as described below.
(1) manufacture method for glass substrate, the manufacture method of described glass substrate comprises:
Grinding step, described grinding step uses grinding pad and the principal plane of lapping liquid to the glass substrate remained in the retaining hole of grinding carrier to grind, described grinding pad has the grinding layer that Shore D hardness is the Foamex of less than 40, and it is that the silica of 3 ~ 50nm is as abrasive particle that described lapping liquid contains primary particle diameter; With
Matting, the surface of described matting to glass substrate is cleaned,
The feature of the manufacture method of described glass substrate is,
In described grinding step, after using the abradant surface 1 μ l lapping liquid being dropped to grinding pad to play 50 seconds, the contact angle of lapping liquid is that the grinding pad of less than 50 ° and the principal plane of lapping liquid to glass substrate grind.
(2) manufacture method of the glass substrate as described in (1), wherein, in described grinding carrier, after the surface 1 μ l lapping liquid being dropped to grinding carrier plays 0.1 second, the contact angle of lapping liquid is less than 75 °.
(3) manufacture method of the glass substrate as described in (1) or (2), wherein, described lapping liquid is below 1.7mPas the viscosity of 25 DEG C.
(4) manufacture method of the glass substrate according to any one of (1) ~ (3), wherein, the pH of described lapping liquid is 1 ~ 6, and the content as the silica of abrasive particle is 5 ~ 25 quality %.
(5) manufacture method of the glass substrate according to any one of (1) ~ (4), wherein, described glass substrate is at the round-meshed glass base plate for magnetic recording carrier of central portion tool.
Invention effect
According to the manufacture method of glass substrate of the present invention, improve the permeability of lapping liquid to grinding pad, can suppress grinding pad produces scar in final grinding step.Thereby, it is possible to extend the life-span of grinding pad, the productivity ratio that can realize in the manufacturing process of glass base plate for magnetic recording carrier improves and cost reduces.
Accompanying drawing explanation
Fig. 1 is the figure be described the double-side polishing apparatus of the glass substrate that can load grinding carrier.
Fig. 2 is the stereogram of glass substrate.
Detailed description of the invention
[summary of the manufacture method of glass substrate]
The summary of the manufacture method of the glass substrate of present embodiment is described.
In the present invention, glass substrate can be amorphous glass, also can be sintered glass ceramics, can also be the tempered glass (such as chemically reinforced glass) on the top layer of glass substrate with strengthening layer.
Specifically, such as, time to glass substrate requirement high mechanical properties, the top layer preferably being implemented in glass substrate forms the strengthening operation (such as chemical enhanced operation) of strengthening layer.Strengthening operation also can be implemented by any instant before initial grinding step, after final grinding step or between each grinding step.
The glass-based slab of glass substrate of the present invention by float glass process, fusion process, compressing method, glass tube down-drawing or again the method such as daraf(reciprocal of farad) (リ De ロ ー method) be shaped, but the present invention is by the restriction of this point.
Glass substrate manufactures by implementing to comprise following operation to the glass-based slab be shaped by said method.
Glass-based slab is processed into after central portion has the disc-shape of circular port by (operation 1), and the shape of inner circumferential side and circumferential lateral surface being carried out to chamfer machining gives operation;
The end surface grinding operation that (operation 2) end face (inner circumferential end face and peripheral end face) to glass substrate grinds;
The first type surface grinding step that (operation 3) two principal planes up and down to glass substrate grind;
(operation 4) carries out dry matting after carrying out precision cleaning to glass substrate.
Further, the glass substrate obtained by the manufacture method comprising above-mentioned operation can make magnetic recording media (disk) by forming bottom, magnetosphere, protective layer or lubricating film etc. further on its surface afterwards.
Grinding (the ラ ッ プ of principal plane can be implemented before first type surface grinding step, such as free abrasive grinding, bonded-abrasive grinding etc.), in addition, the cleaning (inter process cleaning) of glass substrate or the etching (inter process etching) of glass baseplate surface can be implemented between each operation.
It should be noted that, the grinding of the principal plane of indication is herein the grinding of sensu lato principal plane.In addition, grinding step only can carry out first time grinding, also can carry out first time grinding and second time grinding, also can carry out third time grinding after second time grinding.
Then, each operation is described.
(operation 1) shape gives operation
Shape is given in operation, is processed into by glass-based slab after central portion has the disc-shape of circular port, carries out chamfer machining to inner circumferential side and circumferential lateral surface.Shape is given in operation and is usually used the grinding stone being fixed with diamond abrasive grain to carry out to the chamfer machining of inner circumferential and outer circumferential side face.
(operation 2) end surface grinding operation
In end surface grinding operation, end surface grinding is carried out to the inner circumferential end face of glass substrate and peripheral end face.Can in peripheral end face and inner circumferential end face any one first implement grinding.
(operation 3) first type surface grinding step
In first type surface grinding step, use double-side polishing apparatus, the principal plane to glass substrate supplies lapping liquid while grind the principal plane up and down of glass substrate.It should be noted that, be not particularly limited as double-side polishing apparatus, but can enumerate diameter dimension such as can be used to be the twin grinder (such as 16B type double-side polishing apparatus, 20B type double-side polishing apparatus and 22B type double-side polishing apparatus etc.) of the carrier of 16 inches, 20 inches or 22 inches.
Grinding step can be the single hop grinding only carrying out first time grinding (finally grinding), also can be the two section grindings carrying out first time grinding and second time grinding (finally grinding), after also can being through first time grinding, second time grinding, carry out three sections of grindings of third time grinding (finally grinding).Matting (inter process cleaning) is set usually between each grinding step.
It should be noted that, the grinding (such as free abrasive grinding and bonded-abrasive grinding etc.) of principal plane can be implemented before first type surface grinding step.The grinding of the principal plane of indication is herein the grinding of sensu lato principal plane.
The manufacture method of glass substrate of the present invention by implementing ad hoc approach described later in above-mentioned final grinding, improve the easy compatibility (Tame of lapping liquid to grinding pad thus and contaminate body や The さ), thus prevent from the abradant surface of grinding pad produces scar in the grinding of glass substrate, extend the life-span of grinding pad.The details of first type surface grinding step describes hereinafter.
In first type surface grinding step, use and glass substrate is remained in grinding carrier, contain the lapping liquid of abrasive particle while use grinding pad to carry out the lapping device ground to supply between glass substrate and grinding pad.
In above-mentioned lapping device, grinding pad fitted in upper lower platform and sandwiches glass substrate, using planetary gears that glass substrate and grinding pad are relatively moved, thus the principal plane of glass substrate is ground.Utilize the grinding of this lapping device can simultaneous grinding multiple pieces of glass substrate, therefore from the viewpoint of the method that production efficiency is excellent.
With reference to Fig. 1, above-mentioned lapping device is described.
As shown in Figure 1, the mode that lapping device 12 is installed between the central gear 13 of stainless steel, gear ring 14 according to the grinding carrier 10 that can arrange glass substrate 30 is formed.Central gear 13, gear ring 14 and the gear part 10a formation planetary gears formed with the outer peripheral face of carrier 10 in grinding, carry out rotary actuation with rotation comparison central gear 13, the gear ring 14 of regulation, thus grinding with carrier 10 rotation while revolution around central gear 13.
Now, under the state maintaining glass substrate 30 in the glass substrate retaining hole 11 that the glass substrate maintaining part 10b place of the inner side of gear part 10a is formed, grinding carrier 10 is clamped, by being pressed between upper mounting plate 15 and lower platform 17, the face facing with glass substrate 30 of described upper mounting plate 15 and lower platform 17 is provided with grinding pad 16,18.Further, to the lapping liquid supplied between grinding pad 16,18 and grinding carrier 10, glass substrate 30 containing abrasive particle, two principal planes of the glass substrate remained in grinding carrier 10 are ground simultaneously.
Can think, the coefficient of kinetic friction such as in upper mounting plate 15 side rise and the rotation of glass substrate 30 or revolution cannot be carried out smoothly or the coefficient of kinetic friction in lower platform 17 side rises and the rotation of glass substrate 30 or revolution cannot be carried out smoothly time, on glass substrate 30 to grinding carrier 10 or creep into grinding carrier 10, on grinding pad 16,18, produce scar thus.
As shown in Figure 2, glass substrate 30 is formed to have the discoid of circular port at the central portion of two principal planes 31, has inner circumferential side 32 and circumferential lateral surface 33.The thickness of slab of the glass substrate 30 after grinding is preferably 0.5mm ~ 1.0mm.
Grinding pad 16,18 has the grinding pad (below also referred to as grinding pad) that Shore D hardness is the grinding layer of the Foamex of less than 40.Having Shore D hardness is that the Thickness Ratio hard polyaminoester pad (being generally 1.5mm ~ 2.0mm) of the grinding pad of the grinding layer of the Foamex of less than 40 is thin, usually has the thickness of about 0.3mm ~ 1.2mm.
In addition, pad the gash depth formed on the surface also shallow than the gash depth (being generally 1.2mm ~ 1.7mm) of hard polyaminoester pad, there is the degree of depth of about 0.2mm ~ 1.0mm usually.
Therefore, for having for grinding pad that Shore D hardness is the grinding layer of the Foamex of less than 40, when the depth ratio hard polyaminoester pad of groove is shallow, lapping liquid has to the supply of abradant surface and easily becomes uneven trend.
Can the block number of glass substrate 30 of simultaneous grinding different because the size of grinding carrier 10, double-side polishing apparatus 12 is different.Specifically, such as in the 16B type double-side polishing apparatus of grinding carrier using diameter 16 inches, each batch can the glass substrate 30 of simultaneous grinding 80 ~ 110 pieces, in the 22B type double-side polishing apparatus of grinding carrier using diameter 22 inches, each batch can the glass substrate 30 of simultaneous grinding 115 ~ 222 pieces.It should be noted that, when grinding, not needing all to install glass substrate 30 in all glass substrate retaining holes 11 of grinding carrier 10.
(operation 4) matting
In matting, the scouring of washing agent is such as used successively to the glass substrate after final grinding, at the Ultrasonic Cleaning that impregnated under the state in detergent solution with impregnated in the Ultrasonic Cleaning etc. under the state in pure water, utilizes the steam of isopropyl alcohol etc. to carry out drying.
[manufacture method of glass substrate of the present invention]
In the manufacture method of glass substrate of the present invention, in above-mentioned (operation 3) first type surface grinding step, use and there is grinding pad that Shore D hardness is the grinding layer of the Foamex of less than 40 and be the lapping liquid of silica as abrasive particle of 3 ~ 50nm containing primary particle diameter, the principal plane of the glass substrate remained in the retaining hole of grinding carrier is ground.
Grinding pad is thick by lamination to 0.3 ~ 1.2mm, and hardness counts less than 40 with Shore D hardness, is preferably less than 30.When Shore D hardness is greater than 40, likely bring small scar due to the press-in of abrasive particle to glass.In addition, Xiao A hardness is preferably more than 20, is more preferably more than 30.By making Xiao A hardness be more than 30, enough grinding rates can be obtained.
The raw material meeting the grinding pad of above-mentioned condition can be set forth in suede (ス エ ー De abradant surface with Foamex usually) pad, non-woven fabrics pad, woven cloths pad etc., wherein can enumerate suede pad as most preferred.
As the structure of grinding pad, specifically, the structure of superficial layer (so-called NAP layer) that such as there is basic unit and made by plastic foam etc. can be enumerated.Grinding pad is eliminated the epidermis of superficial layer by grinding preferably by finishing process.Thus, the bubble contained in plastic foam, by opening, forms the abradant surface of grinding glass substrate.
So, grinding except scalping epidermis and make the bubble of plastic foam be the grinding pad that the grinding pad of the state of opening is also referred to as suede type.Grinding pad is usually used in the final grinding of glass substrate.
For grinding pad, before grinding glass substrate, preferably use corrector to implement finishing process in advance, the abradant surface shape of grinding pad and surface roughness are adjusted.
Such as, the grinding pad of the polyurethane formation that has and there is in inside foaming layer, temporarily keep abrasive particles wherein.Therefore, in order to make this foaming layer be opening, need to use trimmer to carry out finishing process to the abradant surface of grinding pad, the superficial layer of grinding removing grinding pad, makes to form abradant surface.Finishing process refers to, after grinding pad being installed on the platform of lapping device, uses the process of the superficial layer of corrector grinding removing grinding pad.
The primary particle diameter of the silica as abrasive particle contained in lapping liquid is 3 ~ 50nm, is preferably 5 ~ 40nm, is more preferably 7 ~ 30nm.When the primary particle diameter of silica is less than 3nm, be difficult to obtain high grinding rate, productivity ratio is likely deteriorated.This is because the active grow of silica surface, is easily attached to substrate surface and does not grind.In addition, when the primary particle diameter of silica is greater than 50nm, be difficult to the surface roughness being ground to the principal plane that can meet magnetic recording media high record density.
The pH of lapping liquid is preferably 1 ~ 6, is more preferably 2 ~ 6, more preferably 3 ~ 5.5.By making the pH of lapping liquid be less than 6, between grinding pad and glass substrate, not easily producing friction, can prevent from grinding pad produces scar, can rate reduction be prevented.By making the pH of lapping liquid be more than 1, the surface not easily roughening of glass substrate, can prevent lapping device from getting rusty.
About the pH of lapping liquid, after using pH titer [phthalate pH titer (pH4.01), neutral phosphate pH titer (pH 6.86), borate pH titer (pH 9.18)] to carry out 3 calibrations, utilize pure water to clean pH electrode, then use pH determining instrument to measure the pH of lapping liquid.As pH determining instrument, the pH analyzer (model: D-53S) that Ku Chang manufacturing company can be used to manufacture.
Be preferably 5 ~ 25 quality % as the content of the silica of abrasive particle in lapping liquid, be more preferably 5 ~ 20 quality %, more preferably 5 ~ 15 quality %.By making the content of silica be below 25 quality %, can prevent the excess stickiness of lapping liquid from raising, lapping liquid can be suppressed the infiltrative minimizing of grinding pad.In addition, by making the content of silica be more than 5 quality %, enough grinding rates can be obtained.
Grinding pad and lapping liquid are set to such combination, and after the abradant surface wherein 1 μ l lapping liquid being dropped to grinding pad plays 50 seconds, the contact angle of lapping liquid is less than 50 °.This contact angle is preferably less than 45 °, is more preferably less than 40 °, more preferably less than 38 °.
After playing 50 seconds by utilizing the satisfied abradant surface wherein 1 μ l lapping liquid being dropped to above-mentioned grinding pad, the contact angle of lapping liquid is that the lapping liquid of the relation of less than 50 ° and the principal plane of the combination of grinding pad to glass substrate grind, can prevent from grinding pad produces scar in glass substrate grinding, the life of grinding pad, can boost productivity, reduce costs.
After using the abradant surface 1 μ l lapping liquid being dropped to grinding pad to play 50 seconds, the contact angle of lapping liquid is greater than the grinding pad of 50 ° and lapping liquid when grinding glass substrate, in glass substrate grinding grinding pad surface on easily produce scar, produce the problem of the lost of life of grinding pad.
The permeability of lapping liquid to grinding pad is evaluated in the following manner.Finishing process is carried out to the abradant surface of grinding pad, after using pure water to clean, by grinding pad at room temperature drying 1 day.The abradant surface of grinding pad after the drying drips 1 μ l lapping liquid, use contact angle determination device to measure dropping lapping liquid and play the contact angle after 50 seconds.As contact angle determination device, contact angle determination device (manufacturer: consonance interface science Inc., model: PCA-1) can be used.
The contact angle playing the lapping liquid after 50 seconds in order to the abradant surface making 1 μ l lapping liquid drop to grinding pad is less than 50 °, specifically, the content of the little abrasive particle of the particle diameter of such as abrasive particle is selected to be the dispersed also excellent lapping liquids of 5 ~ 25 quality % even if can enumerate, and the grinding pad of excellent affinity to this lapping liquid.
Grinding carrier and lapping liquid are preferably set to such combination, and after the surface that wherein 1 μ l lapping liquid drops to grinding carrier plays 0.1 second, the contact angle of lapping liquid is preferably less than 75 °, is more preferably less than 70 °, more preferably less than 65 °.
After utilizing the surface wherein 1 μ l lapping liquid being dropped to grinding carrier to play 0.1 second, the contact angle of lapping liquid is that the lapping liquid of less than 75 ° and the principal plane of the combination of carrier to glass substrate grind, can prevent from grinding pad produces scar in the grinding of glass substrate thus, the life of grinding pad, can boost productivity, reduce costs.
The contact angle of lapping liquid to grinding carrier is evaluated as follows.Grinding carrier surface after the drying drips 1 μ l lapping liquid, use contact angle determination device to measure dropping lapping liquid and play the contact angle after 0.1 second.As contact angle determination device, contact angle determination device (manufacturer: consonance interface science Inc., model: PCA-1) can be used.
Lapping liquid is preferably below 1.7mPas the viscosity of 25 DEG C, is more preferably below 1.6mPas.In addition, be usually preferably more than 1.1mPas, be more preferably more than 1.2mPas.By making the viscosity of lapping liquid be below 1.7mPas, in glass substrate grinding, the surface of grinding pad is difficult to produce scar, can extend the life-span of grinding pad.In addition, during lower than 1.1mPas, the liquid formed between glass and grinding pad is lepthymenia, and frictional force raises, and producing the vibration etc. of grinder, is not preferred.
After playing 0.1 second to make the surface 1 μ l lapping liquid being dropped to grinding carrier, the contact angle of lapping liquid is preferably less than 75 °, specifically, the little wear particle concentration of such as particle size is selected to be the lapping liquids of 5 ~ 25 quality % also in polymolecularity even if can enumerate, and the grinding carrier that hydrophobicity is not too strong.
Embodiment
Below embodiments of the invention are specifically described, but the present invention is not limited thereto.
[manufacture of glass substrate]
(operation 1) shape gives operation
Be processed into the silicate glass plate of float forming at the round-meshed disc-shape glass substrate of central portion tool.Chamfer machining is carried out to the inner circumferential side of this disc-shape glass substrate and circumferential lateral surface.Afterwards, alumina abrasive grain is used to carry out grinding to the top and bottom of glass substrate, cleaning removing abrasive particle.
(operation 2) end surface grinding operation
Use abrasive brush and cerium oxide abrasive particle to grind inner circumferential side and inner circumferential chamfered section, the scar of removing inner circumferential side and inner circumferential chamfered section, is processed into minute surface.Then, for the glass substrate after grinding inner circumferential end face, use abrasive brush and cerium oxide abrasive particle to grind circumferential lateral surface and periphery chamfered section, the scar of removing circumferential lateral surface and periphery chamfered section, is processed into minute surface.The glass substrate carried out after inner circumferential end surface grinding and peripheral end face grinding cleans removing abrasive particle by Ultrasonic Cleaning.
(operation 3) first type surface grinding step
Then, use the double-side polishing apparatus of Fig. 2, first time grinding carried out to the principal plane of glass substrate, then carry out cleaning, drying.Afterwards, second time grinding is carried out to the principal plane of glass substrate, then carries out cleaning, dry.
Third time grinding (finally grinding) is implemented to the glass substrate after cleaning.As the milling tool of final grinding, (lamination is thick to 0.65mm to use above-mentioned enforcement to repair the flexibel polyurethane grinding pad after processing, hardness is counted 24 with Shore D hardness, is counted 72 with Xiao A hardness) and contain the lapping liquid that average primary particle diameter is the colloidal silica of 20 ~ 30nm, use 16B type double-side polishing apparatus (speedfam Inc.: DSM-16B-5PV) to grind upper and lower principal plane.Milling time sets according to the mode making total amount of grinding count 1 μm with the total of the thickness direction of upper and lower two principal planes.
The grinding pad used in example 1 ~ 7 is described.3 kinds of grinding pads are employed in example 1 ~ 7.The grinding pad A that hydrophily is high is employed in example 1 and 2.The grinding pad B that hydrophily is lower than grinding pad A is employed in example 3 ~ 5.The grinding pad C that hydrophily is also lower than grinding pad B is employed in example 6 and 7.
In addition, the lapping liquid used in example 1 ~ 7 is described.3 kinds of lapping liquids are employed in example 1 ~ 7.Lapping liquid A is employed in example 1, example 3 and example 6.Lapping liquid B is employed in example 2, example 4 and example 7.Lapping liquid C is employed in example 5.Lapping liquid becomes large to the contact angle of grinding carrier when using lapping liquid C, diminishing, thinking that this depends on the difference of the electrolytical concentration of lapping liquid when using lapping liquid B.That is, the electrolytical concentration in its lapping liquid of lapping liquid C is high, and the electrolytical concentration of lapping liquid A is high not as good as lapping liquid C, and the electrolytical concentration ratio lapping liquid A of lapping liquid B is low.
The content of the abrasive particle (silica) be set in 1.6mPas, lapping liquid the viscosity of 25 DEG C by the lapping liquid used in first type surface grinding step is set to 7 quality %.Carrying out regulating with citric acid makes the pH of lapping liquid be 4.
[evaluation method]
(1) lapping liquid is to the contact angle of grinding pad
To the grinding pad used in example 1 ~ example 7, abradant surface is carried out finishing process, use was after pure water cleans, drying at room temperature one day.The abradant surface of grinding pad after the drying drips 1 μ l lapping liquid, measure dropping lapping liquid by contact angle determination device (consonance interface science Inc., model: PCA-1) and play the contact angle after 50 seconds.
(2) lapping liquid is to the contact angle of grinding carrier
The surface of grinding carrier after the drying drips 1 μ l lapping liquid, measures dropping lapping liquid play the contact angle after 0.1 second by contact angle determination device (consonance interface science Inc., model: PCA-1).
(3) life-span of grinding pad
Grind in (finally grinding) in the third time of above-mentioned operation 3, from grinding starts, when the abradant surface of grinding pad produces moment or the grinding of scar, glass produces damaged and produces scar thus till the withdraw from service moment at pad, the time of grinding with the principal plane of grinding pad to glass substrate during measuring this accumulative, the benchmark according to following A ~ C evaluates the life-span of grinding pad.
A: adding up of the time of grinding with the principal plane of grinding pad to glass substrate is more than 1200 minutes
B: the adding up to be more than 800 minutes and be less than 1200 minutes of the time of grinding with the principal plane of grinding pad to glass substrate
C: the accumulative of the time of grinding with the principal plane of grinding pad to glass substrate is less than 800 minutes
(4) viscosity of lapping liquid
The viscosity of lapping liquid measures as follows: use viscosimeter (manufacturer: Dong Ji industry companies system, model: rotary viscosimeter RE80L) to measure the lapping liquid of 25 DEG C with rotary speed 100rpm.
(5) pH of lapping liquid
The pH of lapping liquid measures as follows: after using pure chemical company pH titer [phthalate pH titer (pH 4.01), neutral phosphate pH titer (pH 6.86), borate pH titer (pH 9.18)] to carry out 3 calibrations, with pure water cleaning pH electrode, then the pH using pH determining instrument (Ku Chang manufacturing company system, model: D-53S) to carry out lapping liquid measures.
Result is shown in Table 1.
Table 1
As shown in table 1, after the abradant surface 1 μ l lapping liquid being dropped to grinding pad plays 50 seconds lapping liquid to the contact angle of grinding pad be example 1 ~ 5 and this contact angle of less than 50 ° be greater than 50 ° example 6 and 7 compared with, the life-span of grinding pad is long.
From this result, after playing 50 seconds by using the abradant surface 1 μ l lapping liquid being dropped to grinding pad, lapping liquid is the lapping liquid of less than 50 ° and grinding pad, the i.e. lapping liquid lapping liquid to the good penetrability of grinding pad and the combination of grinding pad to the contact angle of grinding pad, makes the life of grinding pad.
In addition, after the surface 1 μ l lapping liquid being dropped to grinding carrier plays 0.1 second lapping liquid to the contact angle of grinding carrier be example 1 ~ 4 and this contact angle of less than 75 ° be greater than 75 ° example 5 compared with, the life-span of grinding pad is longer.
From this result, after playing 0.1 second by using the surface 1 μ l lapping liquid being dropped to grinding carrier, lapping liquid is lapping liquid and the grinding carrier of less than 75 ° to the contact angle of grinding carrier, and the life-span of grinding pad is extended more.
The Japanese patent application 2013-233116 that the application applied for based on November 11st, 2013, in incorporated herein by reference for its content.
Claims (5)
1. a manufacture method for glass substrate, the manufacture method of described glass substrate comprises:
Grinding step, described grinding step uses grinding pad and the principal plane of lapping liquid to the glass substrate remained in the retaining hole of grinding carrier to grind, described grinding pad has the grinding layer that Shore D hardness is the Foamex of less than 40, and it is that the silica of 3 ~ 50nm is as abrasive particle that described lapping liquid contains primary particle diameter; With
Matting, the surface of described matting to glass substrate is cleaned,
The feature of the manufacture method of described glass substrate is,
In described grinding step, after using the abradant surface 1 μ l lapping liquid being dropped to grinding pad to play 50 seconds, the contact angle of lapping liquid is that the grinding pad of less than 50 ° and the principal plane of lapping liquid to glass substrate grind.
2. the manufacture method of glass substrate as claimed in claim 1, wherein, in described grinding carrier, after the surface 1 μ l lapping liquid being dropped to grinding carrier plays 0.1 second, the contact angle of lapping liquid is less than 75 °.
3. the manufacture method of glass substrate as claimed in claim 1 or 2, wherein, described lapping liquid is below 1.7mPas the viscosity of 25 DEG C.
4. the manufacture method of the glass substrate according to any one of claims 1 to 3, wherein, the pH of described lapping liquid is 1 ~ 6, and the content as the silica of abrasive particle is 5 ~ 25 quality %.
5. the manufacture method of the glass substrate according to any one of Claims 1 to 4, wherein, described glass substrate is at the round-meshed glass base plate for magnetic recording carrier of central portion tool.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-233116 | 2013-11-11 | ||
| JP2013233116 | 2013-11-11 |
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| JP7118840B2 (en) * | 2018-09-28 | 2022-08-16 | 富士紡ホールディングス株式会社 | polishing pad |
| DE102020101313B3 (en) | 2020-01-21 | 2021-07-01 | Lapmaster Wolters Gmbh | Carrier disk, double-sided processing machine and method for processing at least one workpiece in a double-sided processing machine |
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| JP3851135B2 (en) * | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | Polishing pad |
| JP4446371B2 (en) * | 2002-08-30 | 2010-04-07 | 花王株式会社 | Polishing liquid composition |
| JP2004303280A (en) * | 2003-03-28 | 2004-10-28 | Hoya Corp | Method for manufacturing glass substrate for information recording medium |
| JP4656650B2 (en) * | 2005-11-28 | 2011-03-23 | 花王株式会社 | Substrate polishing method |
| JP5710353B2 (en) * | 2011-04-15 | 2015-04-30 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
| JP5768554B2 (en) * | 2011-07-21 | 2015-08-26 | 旭硝子株式会社 | Manufacturing method of glass substrate for magnetic recording medium and glass substrate for magnetic recording medium |
| JP5861451B2 (en) * | 2011-12-27 | 2016-02-16 | 旭硝子株式会社 | Method for polishing glass substrate for magnetic recording medium, and method for manufacturing glass substrate for magnetic recording medium |
| MY169261A (en) * | 2012-02-29 | 2019-03-20 | Hoya Corp | Method for manufacturing magnetic-disk glass substrate and method for manufacturing magnetic disk |
| JPWO2013153880A1 (en) * | 2012-04-10 | 2015-12-17 | 旭硝子株式会社 | Glass substrate polishing method |
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| JP2015111487A (en) | 2015-06-18 |
| JP6330628B2 (en) | 2018-05-30 |
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