CN104617233A - OLED automatic binding device - Google Patents
OLED automatic binding device Download PDFInfo
- Publication number
- CN104617233A CN104617233A CN201510047820.0A CN201510047820A CN104617233A CN 104617233 A CN104617233 A CN 104617233A CN 201510047820 A CN201510047820 A CN 201510047820A CN 104617233 A CN104617233 A CN 104617233A
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- Prior art keywords
- oled
- robot
- transmitting device
- vacuum
- binding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automatic Assembly (AREA)
- Manipulator (AREA)
Abstract
The invention discloses an OLED automatic binding device which comprises a cylindrical coordinate robot used for taking or placing the IC tray on the AGV or tray shelf; a multi-joint robot used for taking the OLED device from a clamping box and placing the OLED device on a transmission device or taking OLED device from the transmission device and placing the OLED device into the clamping box; a DELTA robot used for taking OLED device from the transmission device and placing the OLED device on a vacuum absorbing work table, or taking the bound device from the vacuum absorbing work table and placing the device on the transmission device; the DELTA robot is further used for taking the IC from the IC tray and placing the IC at the pointed place; the vacuum absorbing work table used for absorbing and fixing the OLED device; and a orthogonal coordinate robot used for binding the IC on the OLED device. The OLED automatic binding device can bind the OLED device and the IC automatically; the binding device is combined with the factory automatic system for improving the production efficiency of the whole production line and the compatibility of the manufacture information.
Description
Technical field
The invention belongs to OLED Display Technique field, particularly the automatic binding device of a kind of OLED.
Background technology
Organic Light Emitting Diode is also called Organic Electricity laser display (Organic Light-Emitting Diode, OLED), teaches Deng Qingyun and finds in the lab, expand the research to OLED thus by Chinese descendant in America.OLED Display Technique has self luminous characteristic, adopts very thin coating of organic material and glass substrate, when have electric current by time, these organic materials will be luminous, and OLED display screen curtain visible angle is large, and can save electric energy.
OLED Display Technique has self luminous characteristic, adopts very thin coating of organic material and glass substrate.Include in total layer: hole transmission layer (HTL), luminescent layer (EL) and electron transfer layer (ETL).When supplying power to appropriate voltage, positive pole hole and negative electrode electric charge will combine in luminescent layer, produce light, produce red, green and blue RGB three primary colors, form basic color according to its formula is different.The characteristic of OLED is that oneself is luminous, and need backlight unlike TFT LCD, therefore visibility and brightness are all high, next is that voltage requirements is low and power saving efficiency is high, adds that reaction is fast, lightweight, thickness is thin, simple structure, cost is low, is regarded as one of product of 21 century most future.When have electric current by time, these organic materials will be luminous.The color of OLED luminescence depends on the material of organic luminous layer, therefore manufacturer can obtain required color by the material changing luminescent layer.Active array organic light emitting display have built-in electronic circuit system therefore each pixel by a corresponding circuit drive.OLED has simple structure, self-luminous and does not need the advantages such as backlight, contrast are high, thickness is thin, visual angle is wide, reaction speed is fast, can be used for flexibility panel, serviceability temperature scope is wide, and technology provides the best mode browsing photo and video and the less-restrictive caused the design of camera.
Along with the development of OLED manufacturing process technology, device electrode integrated level is also more and more higher, and the device pin position that different OLED manufacturing companies produces and function definition are also not quite similar.In order to improve the needs bound precision and meet factory's flexible manufacturing, OLED and IC (integrated circuit) is needed to bind, current major part binds the manually-operated mode all adopted, device after OLED, IC and binding all needs manually to pick and place, automaticity and production efficiency are low, waste of manpower resource.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the automatic binding device of a kind of OLED is provided, OLED and IC can be bound automatically, in whole process, device picks and places the mode all adopting mechanized operation, without the need to manual operation, can enhance productivity, and the automatization system of whole automatic binding device and factory is combined, improve the whole production efficiency of product line and the compatibility of manufacturing information.
The object of the invention is to be achieved through the following technical solutions: the automatic binding device of a kind of OLED, comprise base station and be positioned at the positioning pedestal of base station center, and be arranged on around positioning pedestal:
Cylindrical coordinates robot: be placed on base station for the IC pallet that picks and places on AGV or tray rack, realize the quick switching of IC pallet when plant running, be placed on operation work base station mainly facilitating simultaneously DELTA robot and cylindrical coordinates robot;
Articulated robot: be placed on transmitting device or pick up OLED from transmitting device put into card casket for taking out OLED from card casket;
DELTA robot: for picking up OLED from transmitting device and putting into the vacuum-adsorption working table on positioning pedestal, or pick up from vacuum-adsorption working table the device bound and be placed on transmitting device, DELTA robot also for picking up IC and being placed on assigned address from IC pallet;
Vacuum-adsorption working table: for adsorbing fixing OLED;
Cartesian robot: for IC is bundled in OLED.
Further, described DELTA robot terminal is equipped with vacuum cup and contraposition CCD, and described vacuum cup is for drawing OLED or IC, and contraposition CCD is for picking up alignment mark and alignment mark being transferred to the judgement that controller carries out alternate position spike.
Further, be provided with below described positioning pedestal for carrying out the CMX precision stage to bit correction to the XY θ direction of positioning pedestal under control of the controller.
Further, described Cartesian robot terminal is fixed with binding pressure head, and described binding pressure head can move in XYZ direction, by pressing down the binding realizing IC and OLED.
Further, the end of described transmitting device is provided with the transducer for detecting OLED.
The invention has the beneficial effects as follows:
1, the automatic binding device of a kind of OLED is devised, OLED and IC can be bound automatically, in whole process, device picks and places the mode all adopting mechanized operation, without the need to manual operation, can enhance productivity, and the automatization system of whole automatic binding device and factory is combined, improve the whole production efficiency of product line and the compatibility of manufacturing information;
2, adopt contraposition CCD and CMX precision stage to carry out azimuth vernier adjusting to positioning pedestal, ensure that IC accurately can be placed on preposition, realize the accurate binding of OLED and IC, improve precision.
Accompanying drawing explanation
Fig. 1 is automatic binding device structural representation of the present invention;
Description of reference numerals: 1-positioning pedestal, 2-cylindrical coordinates robot, 3-articulated robot, 4-transmitting device, 5-DELTA robot, 6-Cartesian robot, 7-IC pallet, 8-OLED device.
Embodiment
Further illustrate technical scheme of the present invention below in conjunction with accompanying drawing, but the content that the present invention protects is not limited to the following stated.
As shown in Figure 1, the automatic binding device of a kind of OLED, comprises base station and is positioned at the positioning pedestal 1 of base station center, and be arranged on around positioning pedestal 1:
Cylindrical coordinates robot 2: for picking and placeing AGV (automatic guided vehicle: Automated G uided Vehicle, be called for short AGV) or tray rack on IC pallet 7 and be placed on base station, as shown in Figure 1, realize the quick switching of IC pallet 7 when plant running, be placed on operation work base station mainly facilitating simultaneously DELTA robot and cylindrical coordinates robot.
Articulated robot 3: be placed on transmitting device 4 or pick up OLED from transmitting device 4 put into card casket for taking out OLED from card casket;
DELTA robot 5: for picking up OLED from transmitting device 4 and putting into the vacuum-adsorption working table on positioning pedestal 1, or pick up from vacuum-adsorption working table the device bound and be placed on transmitting device 4, DELTA robot 5 also for picking up IC and being placed on assigned address from IC pallet 7;
Vacuum-adsorption working table: for adsorbing fixing OLED;
Cartesian robot 6: for IC is bundled in OLED.
Further, described DELTA robot 5 terminal is equipped with vacuum cup and contraposition CCD, and described vacuum cup is for drawing OLED or IC, and contraposition CCD is for picking up alignment mark and alignment mark being transferred to the judgement that controller carries out alternate position spike.
Further, be provided with below described positioning pedestal 1 for carrying out the CMX precision stage to bit correction to the XY θ direction of positioning pedestal 1 under control of the controller.
Further, described Cartesian robot 6 terminal is fixed with binding pressure head, and described binding pressure head can move in XYZ direction, by pressing down the binding realizing IC and OLED.
Further, the end of described transmitting device 4 is provided with the transducer for detecting OLED.
The operation principle of the automatic binding device of OLED of the present invention is: cylindrical coordinates robot 2 gets on to put IC pallet 7 from AGV or tray rack, realizes the quick switching of IC pallet 7 when plant running.When the AGV that card casket is housed moves to assigned address, articulated robot 3 takes out a slice OLED 8 and is placed on transmitting device 4 from card casket, OLED 8 is transported to the other end on transmitting device 4, the end of transmitting device 4 is provided with transducer, transducer is connected with controller, transducer detects that OLED 8 arrives the motor stalls of transmitting device 4 behind precalculated position, DELTA robot 5 picks up OLED 8 from transmitting device 4 and puts on the vacuum-adsorption working table of the center of positioning pedestal 1, the fixing OLED 8 of vacuum-adsorption working table absorption; DELTA robot 5 picks up corresponding IC again and arrives desired location from different IC pallets 7, pick up alignment mark by contraposition CCD and be transferred to controller and carry out position deviation judgement, and then under control of the controller XY θ directional trim is carried out to positioning pedestal 1 by CMX precision stage, after contraposition CCD confirms that contraposition completes, DELTA robot 5 is placed on desired location corresponding IC, and then the binding movable press head of Cartesian robot 6 terminal is bound region to device and pressed down and IC is bundled in OLED 8.IC and OLED 8 are bound by hot pressing, after having bound, binding pressure head rises and resets, the vacuum of vacuum-adsorption working table is closed, DELTA robot 5 picks up the device bound and is put on the transmitting device 4 of opposite side and transmits, device is picked up by articulated robot 3 when arriving articulated robot 3 position and deposits in the card casket of AGV, enters subsequent processing.
These robots used in the present invention can adopt the product of the existing standard of industrial robot company, as there are this series products a large amount of in the companies of robot such as YAMAHA, YASKAWA, ABB.
Those of ordinary skill in the art will appreciate that, embodiment described here is to help reader understanding's principle of the present invention, should be understood to that protection scope of the present invention is not limited to so special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combination of not departing from essence of the present invention according to these technology enlightenment disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
Claims (5)
1. the automatic binding device of OLED, is characterized in that, comprise base station and be positioned at the positioning pedestal (1) of base station center, and is arranged on positioning pedestal (1) around:
Cylindrical coordinates robot (2): be placed on base station for the IC pallet (7) that picks and places on AGV or tray rack, realize the quick switching of IC pallet (7) when plant running;
Articulated robot (3): to be placed on transmitting device (4) upper or pick up OLED from transmitting device (4) and put into card casket for taking out OLED from card casket;
DELTA robot (5): for picking up OLED and the vacuum-adsorption working table put on positioning pedestal (1) from transmitting device (4), or pick up from vacuum-adsorption working table the device bound and be placed on transmitting device (4), DELTA robot (5) is also placed on assigned address for pickup IC from IC pallet (7);
Vacuum-adsorption working table: for adsorbing fixing OLED;
Cartesian robot (6): for IC is bundled in OLED.
2. the automatic binding device of OLED according to claim 1, it is characterized in that, described DELTA robot (5) terminal is equipped with vacuum cup and contraposition CCD, described vacuum cup is for drawing OLED or IC, and contraposition CCD is for picking up alignment mark and alignment mark being transferred to the judgement that controller carries out alternate position spike.
3. the automatic binding device of OLED according to claim 2, it is characterized in that, described positioning pedestal (1) below is provided with for carrying out the CMX precision stage to bit correction to the XY θ direction of positioning pedestal (1) under control of the controller.
4. the automatic binding device of OLED according to claim 1, it is characterized in that, described Cartesian robot (6) terminal is fixed with binding pressure head, and described binding pressure head can move in XYZ direction, and by pressing down the binding realizing IC and OLED.
5. the automatic binding device of OLED according to claim 1, is characterized in that, the end of described transmitting device (4) is provided with the transducer for detecting OLED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510047820.0A CN104617233B (en) | 2015-01-30 | 2015-01-30 | OLED automatic binding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510047820.0A CN104617233B (en) | 2015-01-30 | 2015-01-30 | OLED automatic binding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104617233A true CN104617233A (en) | 2015-05-13 |
| CN104617233B CN104617233B (en) | 2017-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510047820.0A Expired - Fee Related CN104617233B (en) | 2015-01-30 | 2015-01-30 | OLED automatic binding device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101063780A (en) * | 2007-04-25 | 2007-10-31 | 信利半导体有限公司 | Method for binding IC chip and softness circuit board on displaying module |
| JP2008067955A (en) * | 2006-09-15 | 2008-03-27 | Taiyo Elec Co Ltd | Game machine |
| CN101625978A (en) * | 2009-08-07 | 2010-01-13 | 广东中显科技有限公司 | Binding manufacture technology for electrical element of flat-panel display |
| CN102768419A (en) * | 2011-12-05 | 2012-11-07 | 北京京东方光电科技有限公司 | COG (chip on grass) bonding technique |
| CN202995182U (en) * | 2012-11-13 | 2013-06-12 | 深圳市盛德鑫自动化设备有限公司 | COG (chip on glass) multifunction machine |
-
2015
- 2015-01-30 CN CN201510047820.0A patent/CN104617233B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008067955A (en) * | 2006-09-15 | 2008-03-27 | Taiyo Elec Co Ltd | Game machine |
| CN101063780A (en) * | 2007-04-25 | 2007-10-31 | 信利半导体有限公司 | Method for binding IC chip and softness circuit board on displaying module |
| CN101625978A (en) * | 2009-08-07 | 2010-01-13 | 广东中显科技有限公司 | Binding manufacture technology for electrical element of flat-panel display |
| CN102768419A (en) * | 2011-12-05 | 2012-11-07 | 北京京东方光电科技有限公司 | COG (chip on grass) bonding technique |
| CN202995182U (en) * | 2012-11-13 | 2013-06-12 | 深圳市盛德鑫自动化设备有限公司 | COG (chip on glass) multifunction machine |
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| Publication number | Publication date |
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| CN104617233B (en) | 2017-01-18 |
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Granted publication date: 20170118 Termination date: 20210130 |