CN101063780A

CN101063780A - Method for binding IC chip and softness circuit board on displaying module

Info

Publication number: CN101063780A
Application number: CN 200710027694
Authority: CN
Inventors: 朱景河
Original assignee: Truly Semiconductors Ltd
Current assignee: Truly Semiconductors Ltd
Priority date: 2007-04-25
Filing date: 2007-04-25
Publication date: 2007-10-31

Abstract

This invention discloses one method to bind integration circuit chip and flexible circuit board on display module, which comprises the following steps: adding each opposite conductive film in the metal wire area of display module to cover the bind lead leg bit of the circuit board; binding the circuit chip on the said conductive film; then binding the flexible circuit board onto the bind lead le bit pointing to the flexible circuit board; then processing double pressure on integration circuit chip and flexible circuit board to fix each conductive film to connect the integration circuit chip and flexible circuit board and display module.

Description

The method of binding integrated circuit (IC) chip and FPC on display module

Technical field

The present invention relates to a kind of electron device method for making, particularly a kind of two main compression technology method of on display module, binding integrated circuit (IC) chip and FPC.

Background technology

LCDs LCD in early days is essentially letter and fixing image, now and following to the LCD display in the removable product, proposed to have the requirement of the VGA image of programmable, its available different size satisfies different request for utilizations.People have very strong cry to further making the LCD thin typeization and alleviating its quality.The present a kind of technology that can satisfy this demand that occurs, promptly brilliant glass tipping technology COG (chip on glass is about to chip and is tied to technological process on glass).In a LCD display that adopts the COG technology, integrated circuit (IC) chip (IC) device directly is mounted on the same glass substrate as the LCD ingredient.The key that the COG technology successfully realizes is to have used anisotropic conductive film (ACF).ACF is a kind of adhesive material, in the COG technology, is used as and is used for satisfying the medium that chip is connected with glass.

In the prior art, the COG that is applied to the semiconductor display module binds the main pressure that machine can only paste ACF (anisotropic conductive film), bind IC (integrated circuit (IC) chip) and COG, and then attaches anisotropic conductive film ACF, binding FPC (FPC) and FOG (FPC is tied to technological process on glass) master pressure again.The function of this COG binding machine is single, needs to carry out main the pressure in the production run of whole C OG twice.Use the COG flow process shortcoming of this COG binding machine to be, flow process is longer, and shipment speed is slow, in process of production, can cause all wastes, as the waste of waiting for, the waste of processing, the waste of action, the waste of carrying etc.; And COG and FOG divide and open twice attaching and twice main pressing solidly, the frequency of staff contact with have a good chance, cause secondary pollution easily.

Summary of the invention

The object of the present invention is to provide a kind of method of on display module, binding integrated circuit (IC) chip and FPC, thereby reach the purpose that to simplify technological process and reduce secondary pollution.

To achieve these goals, a kind of method of binding integrated circuit (IC) chip and FPC in display module provided by the invention comprises the steps:

A. attach anisotropic conductive film in the metal lead wire zone of display module;

B. being bundled in described anisotropic conductive film after the integrated circuit (IC) chip contraposition on the binding pin position of integrated circuit (IC) chip;

C. FPC is bundled in described anisotropic conductive film on the binding pin position of this FPC;

D. integrated circuit (IC) chip and FPC are carried out two main pressures, solidify described anisotropic conductive film, make described integrated circuit (IC) chip and FPC and display module conducting.

The anisotropic conductive film of step a of the present invention adopts whole of disposable attaching can cover the anisotropic conductive film of the binding pin position of integrated circuit chip binding pin position and FPC.

The attaching anisotropic conductive film of step a of the present invention can be divided into twice and attach the binding pin position that the integrated circuit chip is bound pin position and FPC respectively.

Two main pressure the in the steps d of the present invention is simultaneously integrated circuit (IC) chip and FPC to be led pressure.

The present invention adopts the pressing solidly of master of COG and FOG to carry out simultaneously, adopts the inventive method can shortened process, avoid since secondary pollution to cause correlation function to show bad, therefore can when improve yields, reduce production costs and enhance productivity.

Description of drawings

Fig. 1 is not for pasting the vertical view of the flat-panel monitor of ACF as yet;

Fig. 2 is not for pasting the side view of the flat-panel monitor of ACF as yet;

Fig. 3 is for attaching the vertical view of the flat-panel monitor of COG-FOG dual purpose ACF;

Fig. 4 is for attaching the side view of the flat-panel monitor of COG-FOG dual purpose ACF;

Fig. 5 goes up the vertical view of the flat-panel monitor of IC for attaching COG-FOG dual purpose ACF and binding;

Fig. 6 goes up the side view of the flat-panel monitor of IC for attaching COG-FOG dual purpose ACF and binding;

Fig. 7 goes up the vertical view of the flat-panel monitor of IC and FPC for attaching COG-FOG dual purpose ACF and binding;

Fig. 8 goes up the side view of the flat-panel monitor of IC and FPC for attaching COG-FOG dual purpose ACF and binding.

Embodiment

As depicted in figs. 1 and 2, overlooking and side view for the flat-panel monitor that do not paste anisotropic conductive film ACF as yet.Be ready to can the above two main COG of pressure binding machines flat-panel monitor is formed by glass protecgulum 61 and glass back cover 62 and middle liquid crystal cell 7 thereof, have integrated circuit die I C binding pin position 11 and FPC FPC to bind pin position 12 in the metal pins line zone 1 of its underpart;

As shown in Figure 3 and Figure 4, overlooking and side view for the flat-panel monitor that attaches COG-FOG dual purpose anisotropic conductive film ACF.After flat-panel monitor is served the two main COG of pressure binding machines, the mechanical arm of the two main COG of pressure binding machines can adsorb flat-panel monitor to the platform that pastes anisotropic conductive film ACF, specifications with reference to anisotropic conductive film ACF, the anisotropic conductive film ACF that will have proper width cuts into the fritter of appropriate length, and by the specifications required pressure of anisotropic conductive film ACF, under the condition of temperature and time (as 100MPa, 200 ℃, 8s), it is attached to the metal pins line zone 1 that binding pin position is arranged on the flat-panel monitor, and allow anisotropic conductive film ACF cover integrated circuit die I C binding pin position 11 and FPC FPC binding pin position 12; Attaching anisotropic conductive film 3 can be the anisotropic conductive film 3 of the binding pin position 12 that can cover integrated circuit chip binding pin position 11 and FPC of disposable attaching sheet, perhaps is divided into two anisotropic conductive film 3 that twice attaching covers the binding pin position 12 of integrated circuit chip binding pin position 11 and FPC respectively;

As shown in Figure 5 and Figure 6, go up the overlooking and side view of flat-panel monitor of integrated circuit chip IC for attaching COG-FOG dual purpose anisotropic conductive film ACF and binding.Two main COG binding machines of pressing will be transported to as the flat-panel monitor of Fig. 3 on the binding IC platform by mechanical arm, carry out contraposition with integrated circuit die I C 4 by register guide, and integrated circuit chip IC 4 is tied on the flat-panel monitor as Fig. 5;

As shown in Figure 7 and Figure 8, go up the overlooking and side view of flat-panel monitor of integrated circuit chip IC and FPC FPC for attaching COG-FOG dual purpose anisotropic conductive film ACF and binding.The two main COG of pressure binding machines use mechanical arm will be transported to binding FPC FPC platform as the flat-panel monitor of Fig. 5, carry out contraposition with FPC FPC register guide, under the condition by the specifications required pressure of anisotropic conductive film ACF, temperature and time, FPC FPC 5 is tied on the flat-panel monitor as Fig. 8;

Again the mechanical arm of binding machines by two main COG of pressure as the flat-panel monitor of Fig. 8 is transported to main pressure at last and waits for platform, behind neat some flat-panel monitors, these some flat-panel monitors are transported to main pressing platform by two main mechanical arms of COG binding machines of pressing, carrying out the main of integrated circuit chip IC 4 and FPC FPC 5 simultaneously presses, two main pressures are to solidify ACF 3 under the condition of specifications required pressure, temperature and time by ACF, make integrated circuit chip IC 4 and FPC FPC 5 and flat-panel monitor conducting; Through just becoming the semi-manufacture of flat display module after two main pressure operations; The last flat display module semi-manufacture that will finish two main pressures are again pressed the mechanical arm of COG binding machines to be transported to by two masters and are flowed into next post on the conveying belt.

Claims

1, a kind of method of binding integrated circuit (IC) chip and FPC on display module is characterized in that comprising the steps:

A. attach anisotropic conductive film (3) in the metal lead wire zone (1) of display module;

B. being bundled in described anisotropic conductive film (3) after integrated circuit (IC) chip (4) contraposition on the binding pin position (11) of integrated circuit (IC) chip;

C. FPC (5) is bundled in described anisotropic conductive film (3) on the binding pin position (12) of this FPC;

D. integrated circuit (IC) chip (4) and FPC (5) are carried out two main pressures, solidify described anisotropic conductive film (3), make described integrated circuit (IC) chip (4) and FPC (5) and display module conducting.

2, method of binding integrated circuit (IC) chip and FPC on display module according to claim 1 is characterized in that: the anisotropic conductive film of described step a adopts whole of disposable attaching can cover the anisotropic conductive film of the binding pin position of integrated circuit chip binding pin position and FPC.

3, method of binding integrated circuit (IC) chip and FPC on display module according to claim 1 is characterized in that: the attaching anisotropic conductive film of described step a is divided into twice and attaches the binding pin position that the integrated circuit chip is bound pin position and FPC respectively.

4, method of binding integrated circuit (IC) chip and FPC on display module according to claim 1 is characterized in that: two main pressure of described steps d is simultaneously integrated circuit (IC) chip and FPC to be led pressure, solidifies anisotropic conductive film.