CN104614935A - Universal high-precision micro-structure preparation system and application method of universal high-precision micro-structure - Google Patents
Universal high-precision micro-structure preparation system and application method of universal high-precision micro-structure Download PDFInfo
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- CN104614935A CN104614935A CN201510062823.1A CN201510062823A CN104614935A CN 104614935 A CN104614935 A CN 104614935A CN 201510062823 A CN201510062823 A CN 201510062823A CN 104614935 A CN104614935 A CN 104614935A
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Abstract
The invention discloses a universal high-precision micro-structure preparation system and an application method of a universal high-precision micro-structure. Preparation of the high-precision micro-structure is carried out on the surface of a sample by adopting a unique gas circulating system, a heat dissipation system, a heating system, a displacement system and a monitoring system; the displacement system is used for controlling a piezoelectric ceramic to be stretched through a computer by programming, and the precision is high; the monitoring system is capable of carrying out whole-process monitoring on various parameters in the machining process; by means of the inert gas circulating system, the surface of a sample is difficult to oxidize in the machining process, so that the preparation quality of the sample is greatly improved; the sample can be processed at high temperature through the water cooling heat dissipation system, and therefore, the sample material selection universality is improved. The universal high-precision micro-structure preparation system disclosed by the invention has the advantages of being low in cost, high in efficiency, high in speed, high in precision and universality and the like, and has great popularization and application prospects in the field of preparation of the micro-structures.
Description
Technical field
The invention belongs to MEMS (micro electro mechanical system), be mainly used in carrying out microstructure processing to micro element surface, by the setting of parameter, automatically complete the processing to sample surfaces microstructure by computing machine.
Background technology
Along with the development of nanometer technology, the demand of material and material surface being carried out to microstructure processing is greatly more next.Current have the main method that sample surfaces carries out microstructure processing, based on the LIGA process technology of synchrotron radiation light source, and electron beam lithography (EBL) technology, ion beam etching (FIB) technology and ultraviolet photolithographic technology etc.In these methods, ultraviolet photolithographic is for convenience, more with low cost, and speed is fast, but precision is low, and LIGA, EBL and FIB precision is high, but apparatus expensive, and process velocity is slow, can machining area little.Recent domestic has scientific worker and attempts have developed different microstructure preparation facilities, but precision is not high enough in general, working temperature too low (being only limitted to the material that some fusing points are lower), in process, sample oxidation is serious, therefore, constantly explores new Method and Technology, develop good combination property, can process on a large scale, precision is high, the microstructure preparation system that universality is strong, has its necessity and importance always.
Summary of the invention
For the limitation existed at present, the present invention devises the microstructure preparation system that a set of precision is high, cost is low, speed is fast, working (finishing) area is large, universality is strong, i.e. a kind of pervasive high precision microstructure preparation system, this system is by computing machine master control, coordinate various sensor-based system and piezoelectric ceramics, preparation precision is high, and parameter is controlled.
The object of this invention is to provide a kind of pervasive high precision microstructure preparation system and application process.
A kind of pervasive high precision microstructure preparation system, comprises base support, heating chamber protective, control chamber, elevating lever, and base support supports heating chamber protective, and heating chamber protective is provided with control chamber; Heating cavity is provided with in heating chamber protective, sample stage pallet, sample stage, feeding pressure head is provided with from low to high successively in heating cavity, be provided with feeding pressure head cover outside feeding pressure head, be connected with sample stage pallet after elevating lever has run through heating chamber protective, heating cavity; Gas cycle subsystem is provided with in heating cavity; Be provided with guide pole, stepper motor displacement controller, pressurization device, pressure transducer, piezoelectric ceramics in control chamber, by means of guide pole, stepper motor displacement controller, pressurization device, pressure transducer, piezoelectric ceramics are connected successively.
Described gas cycle subsystem is specific as follows, and the sidewall of heating cavity is provided with air admission hole, venthole, and the position of air admission hole is lower than venthole, and the diameter of venthole is 1/3 of the diameter of air admission hole, and gas is passed into by air admission hole air pump, is discharged by venthole.
The sidewall of described heating cavity is provided with thermopair through hole further, by temperature PID control device to external computer transmission data.
Described piezoelectric ceramics overcoat has water-cooling head.
Described elevating lever is connected with sample stage pallet by threaded hole.
Described feeding pressure head, sample stage adopt zirconia exotic material respectively.
Step is as follows:
1) setting-out:
First, sample is placed on sample stage upper surface, need to carry out impressing one facing to feeding pressure head; Then, the mould of design is placed on sample upper surface, mould one side is close to sample, and one side is close to feeding pressure head;
2) gas-circulating system is opened:
Open argon gas valve, to be ventilated in heating cavity body by air intake opening, form blanket gas, effectively prevent sample surfaces oxidized;
3) to perform fighting water-cooling system: perform fighting and be connected to the water-cooling system of water-cooling head rear end, piezoelectric ceramics is cooled;
4) heat: the temperature that sample during impression is set, by the temperature control system of external computer heating cavity be heated to the temperature required for sample and keep this temperature more than 15 minutes, making homogeneous temperature in heating chamber;
5) return to zero: by stepper motor displacement controller, system is returned to zero, make the head of system operationally piezoelectric ceramics be close to feeding pressure head;
6) impress: the various parameters in setting moulding process, are then impressed sample by external conputer controlled.
7) cool: after process finishing, cavity to be heated takes out sample after being cooled to normal temperature again.
Beneficial effect of the present invention:
Native system adopts unique gas-circulating system to ensure that in process, sample by inert gas shielding, can not be oxidized, and native system also adopts unique water-cooling heat radiating system, can allow system works at high temperature.This system not only compensate for the shortcoming of ultraviolet photolithographic, also overcomes the ranges of work such as LIGA little, and the time is long, the shortcoming that cost is high, its efficient, economic, practical advantage, is expected to the information age at development, becomes the another new approach of processed sample surface micro-structure.
In process, secure sample is reliable, not oxidizable; Machining precision is high, and applying piezoelectric ceramic can reach Nano grade; The range of work is large, and range size can reach micron level; Process velocity is fast, and whole process only needs a few minutes; Processing cost is low, easy making process, and each processing only needs to change different moulds.
accompanying drawing explanation
Fig. 1 is the general structure schematic diagram of system;
Fig. 2 is control chamber and electric system and water-cooling system figure;
Fig. 3 is temperature control system figure and gas-circulating system figure;
Partial electric and control linkage figure when Fig. 4 is system works;
Fig. 5 is System Control Figure;
Fig. 6 is nulling algorithm;
Fig. 7-1,7-2 proportion by subtraction are software input parameter;
Fig. 8 operation algorithm;
In figure, 1-1 control chamber, 1-2 heating chamber protective, 1-3 base support, 2-1 pressurize device, 2-2 pallet, 2-3 guide pole, 2-4 heat insulating mattress, 3-1 stepper motor displacement controller, 3-2 pressure transducer, 3-3 piezoelectric ceramics, 4 heating cavities, 4-1 feeding pressure head, 4-2 feeding pressure head cover, 4-3 sample stage, 4-4 sample stage pallet, 4-5 elevating lever, 4-6 thermopair through hole, 5-1 air admission hole, 5-2 venthole, 6 water-cooling heads.
Embodiment
The schematic diagram of whole pervasive high precision microstructure preparation system is as Fig. 1, and as shown in Figure 5, wherein 1-1 is control chamber to control chart, and 1-2 is heating chamber protective, and 1-3 is base support; Pressurization device 2-1, pallet 2-2, guide pole 2-3 are the mechanical part of control chamber, pressurization device 2-1 is pressurization device, play the effect of voltage stabilizing, pallet 2-2 is used for abutment pressure sensor 3-2 and piezoelectric ceramics 3-3, guide pole 2-3, the apparatus being used for fixing and leading in whole control chamber 1-1, bottom cover has ring spring, be used for buffering from pressure above, allow some leeway to displacement.Heat insulating mattress 2-4, the heat passing to out when being mainly used in the heating of isolated heating chamber, makes it not affect the normal work of control chamber, the sensor of control chamber comprises stepper motor displacement controller 3-1, pressure transducer 3-2, piezoelectric ceramics 3-3, various state time mainly in order to monitor the work of a kind of pervasive high precision microstructure preparation system and export an accurate displacement, heating cavity 4 comprises feeding pressure head 4-1, feeding pressure head cover 4-2, sample stage 4-3, sample stage pallet 4-4, elevating lever 4-5, be respectively the part in heating chamber, wherein feeding pressure head 4-1 is used for when piezoelectric ceramics output displacement is exert pressure to sample, feeding pressure head cover 4-2, be used for fixing pressure head, sample stage 4-3, be used for putting sample and mould, sample stage pallet 4-4, elevating lever 4-5, be used for coordinating the height of sample tray to sample arbitrarily to regulate, conveniently the sample of different-thickness is impressed, thermopair through hole 4-6, be used for putting thermopair, as shown in Figure 3, thermopair external temperature PID controller, control to heat heating cavity 4, automatically stop after reaching design temperature.
Fig. 2 is water-cooling system and withered Principle of Process figure, and water-cooling head 6 dispels the heat to piezoelectric ceramics 3-3 when acting predominantly on system heating.Threaded hole (not using icon) can with fixing.
Fig. 3 is gas cycle subsystem and heating subsystem schematic diagram, and air admission hole 5-1 is used for leading to argon gas in real time when system works, and venthole 5-2, is used for giving vent to anger when system works, reaches gas circulation.
The use of pervasive high precision microstructure preparation system is divided into 7 steps,
1) setting-out: first, is placed on sample stage 4-3 upper surface by sample, need to carry out impressing one facing to feeding pressure head 4-1; Then, the mould of design is placed on sample upper surface, mould one side is close to sample, and one side is close to feeding pressure head 4-1.
2) open gas-circulating system: open argon gas valve, to be ventilated body by air intake opening 5-1 to heating cavity 4, as argon bottle upward pressure registration is stablized, illustrates that argon gas is stable and pass into inside cavity, formation blanket gas, effectively prevents sample surfaces oxidized.
3) to perform fighting water-cooling system: perform fighting and be connected to the water-cooling system of water-cooling head 6 rear end, after a period of time, stable water pressure, illustrates that water-cooling system normally works, and cools piezoelectric ceramics 3-3.Note, water-cooling system and gas-circulating system operationally must whole process be performed fighting, and can not interrupt.
4) heat: the temperature that sample during impression is set.By temperature control system heating chamber be heated to the temperature required for sample and keep this temperature more than 15 minutes, making homogeneous temperature in heating chamber.
3) return to zero: as Fig. 2, the zeroing of system (3-1) is carried out by stepper motor displacement system, the head of system operationally piezoelectric ceramics (3-3) is made to be close to feeding pressure head (4-1), be embodied as the reading of computer by monitor force sensor (3-2), whether meet condition at zero point by the algorithm automatic decision of such as Fig. 6.
4) impress: as Fig. 4, the various parameters in setting moulding process, impression is divided into mode in 2, design parameter setting, as Fig. 7-1 and Fig. 7-2, inputs the various parameters (such as Fig. 7-every 10s of Isosorbide-5-Nitrae 0nm/ during impression, 2min/40s, Fig. 7-2,1.5 times of null pressure, 2min40s), then the beginning on software is clicked, computing machine (host computer), by the custom algorithm as Fig. 8, controls piezoelectric ceramics 3-3 feeding with high precision and retrogressing, impresses sample.
5) cool: after process finishing, after chamber 4 to be heated is cooled to normal temperature, take out sample again.
Claims (7)
1. a pervasive high precision microstructure preparation system, it is characterized in that, comprise base support (1-3), heating chamber protective (1-2), control chamber (1-1), elevating lever (4-5), base support (1-3) supports heating chamber protective (1-2), heating chamber protective (1-2) is provided with control chamber (1-1); Heating cavity (4) is provided with in heating chamber protective (1-2), sample stage pallet (4-4), sample stage (4-3), feeding pressure head (4-1) is provided with from low to high successively in heating cavity (4), be provided with feeding pressure head cover (4-2) outside feeding pressure head (4-1), elevating lever (4-5) has run through heating chamber protective (1-2), heating cavity (4) is connected with sample stage pallet (4-4) afterwards; Heating cavity is provided with gas cycle subsystem in (4);
Guide pole (2-3), stepper motor displacement controller (3-1), pressurization device (2-1), pressure transducer (3-2), piezoelectric ceramics (3-3) is provided with in control chamber (1-1), by means of guide pole (2-3), stepper motor displacement controller (3-1), pressurization device (2-1), pressure transducer (3-2), piezoelectric ceramics (3-3) are connected successively.
2. pervasive high precision microstructure preparation system according to claim 1, it is characterized in that, described gas cycle subsystem is specific as follows, the sidewall of heating cavity (4) is provided with air admission hole (5-1), venthole (5-2), the position of air admission hole (5-1) is lower than venthole (5-2), the diameter of venthole (5-2) is 1/3 of the diameter of air admission hole (5-1), and gas is passed into by air admission hole (5-1) air pump, is discharged by venthole (5-2).
3. pervasive high precision microstructure preparation system according to claim 1, is characterized in that, the sidewall of described heating cavity (4) is provided with thermopair through hole (4-6) further, by temperature PID control device to external computer transmission data.
4. pervasive high precision microstructure preparation system according to claim 1, is characterized in that, described piezoelectric ceramics (3-3) overcoat has water-cooling head (6).
5. pervasive high precision microstructure preparation system according to claim 1, is characterized in that, described elevating lever (4-5) is connected with sample stage pallet (4-4) by threaded hole.
6. pervasive high precision microstructure preparation system according to claim 1, is characterized in that, described feeding pressure head (4-1), sample stage (4-3) adopt zirconia exotic material respectively.
7. an application process for pervasive high precision microstructure preparation system according to claim 1, it is characterized in that, step is as follows:
1) setting-out:
First, sample is placed on sample stage (4-3) upper surface, need to carry out impressing one facing to feeding pressure head (4-1); Then, the mould of design is placed on sample upper surface, mould one side is close to sample, and one side is close to feeding pressure head (4-1);
2) gas-circulating system is opened:
Open argon gas valve, to be ventilated in heating cavity 4 body by air intake opening (5-1), form blanket gas, effectively prevent sample surfaces oxidized;
3) to perform fighting water-cooling system: perform fighting and be connected to the water-cooling system of water-cooling head (6) rear end, piezoelectric ceramics (3-3) is cooled;
4) heat: the temperature that sample during impression is set, by the temperature control system of external computer heating cavity 4 be heated to the temperature required for sample and keep this temperature more than 15 minutes, making homogeneous temperature in heating chamber;
5) return to zero: by stepper motor displacement controller 3-1, system is returned to zero, make the head of system operationally piezoelectric ceramics (3-3) be close to feeding pressure head (4-1);
6) impress: the various parameters in setting moulding process, are then impressed sample by external conputer controlled;
7) cool: after process finishing, after cavity to be heated (4) is cooled to normal temperature, take out sample again.
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| CN106707694A (en) * | 2015-11-16 | 2017-05-24 | 四川航达机电技术开发服务中心 | Experimental platform for soft lithography |
| CN107991325A (en) * | 2017-12-07 | 2018-05-04 | 齐鲁工业大学 | A kind of high-resolution Micro-CT scanning sample preparation apparatus and application method |
| CN108051462A (en) * | 2017-12-07 | 2018-05-18 | 齐鲁工业大学 | A kind of Micro-CT scanning Multi-example preparation facilities and application method |
| CN110182755A (en) * | 2019-05-17 | 2019-08-30 | 东南大学 | A kind of nanometer of press fit instrument Cryo Equipment |
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