CN104614935A - Universal high-precision micro-structure preparation system and application method of universal high-precision micro-structure - Google Patents

Abstract

The invention discloses a universal high-precision microstructure preparation system and an application method. This system uses a unique gas circulation system and heat dissipation system, combined with a heating system, displacement system and monitoring system, to prepare high-precision microstructures on the sample surface. The programming is controlled by the computer to control the displacement system of piezoelectric ceramics, which has high precision; the monitoring system can monitor all parameters in the process of processing; the inert gas circulation system ensures that the surface of the sample is not easy to be oxidized during processing, and greatly improves the stability of the sample. Preparation quality; the water-cooled heat dissipation system enables the processing of samples at high temperatures, thereby improving the universality of sample material selection. The system has the advantages of low cost, high efficiency, fast speed, high precision and strong universality, and has great promotion and application prospects in the field of microstructure preparation.

Description

A universal high-precision microstructure preparation system and application method

technical field

The invention belongs to a micro-electromechanical system, and is mainly used for processing the microstructure on the surface of a microdevice. Through parameter setting, a computer automatically completes the processing of the microstructure on the surface of a sample.

Background technique

With the development of nanotechnology, there is an increasing demand for microstructural processing of materials and material surfaces. At present, the main methods for processing the microstructure of the sample surface include LIGA processing technology based on synchrotron radiation light source, electron beam etching (EBL) technology, ion beam etching (FIB) technology and ultraviolet lithography technology. Among these methods, ultraviolet lithography is more convenient, low in cost, fast in speed, but low in precision, LIGA, EBL and FIB are high in precision, but expensive in equipment, slow in processing speed, and small in processable area. In recent years, scientific and technological workers at home and abroad have tried to develop different microstructure preparation devices, but generally speaking, the precision is not high enough, the working temperature is too low (limited to some materials with low melting points), and the samples are seriously oxidized during processing. , constantly exploring new methods and technologies, and developing a microstructure preparation system with good comprehensive performance, a wide range of processing, high precision, and strong universality has always been necessary and important.

Contents of the invention

Aiming at the current limitations, the present invention designs a microstructure preparation system with high precision, low cost, fast speed, large processing area and strong universality, that is, a universal high-precision microstructure preparation system. Controlled by a computer, combined with various sensor systems and piezoelectric ceramics, the preparation has high precision and controllable parameters.

The purpose of the present invention is to provide a universal and high-precision microstructure preparation system and application method.

A universal and high-precision microstructure preparation system, including a base support, a heating chamber protection body, a control chamber, and a lifting rod. The base support supports the heating chamber protection body, and the heating chamber protection body is equipped with a control chamber; Heating chamber. The sample stage tray, sample stage, and feed head are arranged in the heating chamber from low to high. There is a feed head cover outside the feed head. The lifting rod runs through the heating chamber protection body and the heating chamber. Finally, it is connected with the sample stage tray; the heating chamber is equipped with a gas circulation subsystem; the control chamber is equipped with a guide rod, a stepping motor displacement controller, a pressure device, a pressure sensor, and piezoelectric ceramics. With the help of the guide rod, the stepper The motor displacement controller, the pressurizing device, the pressure sensor and the piezoelectric ceramics are connected in sequence.

The gas circulation subsystem is specifically as follows, the side wall of the heating cavity is provided with an air inlet hole and an air outlet hole, the position of the air inlet hole is lower than the air outlet hole, and the diameter of the air outlet hole is 1/3 of the diameter of the air inlet hole, The gas is passed through the air pump through the air inlet hole and discharged through the air outlet hole.

The side wall of the heating cavity is further provided with a thermocouple through hole, through which the temperature PID controller transmits data to an external computer.

The piezoelectric ceramic jacket has a water cooling head.

The lifting rod is connected with the sample stage tray through the threaded hole.

The feed pressure head and the sample stage are respectively made of zirconia high temperature resistant materials.

Proceed as follows:

1) Staking:

First, place the sample on the upper surface of the sample stage, with the side to be imprinted facing the feed indenter; then, place the designed mold on the upper surface of the sample, one side of the mold is close to the sample, and the other side is close to the feed indenter ;

2) Turn on the gas circulation system:

Open the argon valve, and pass the gas into the heating chamber through the air inlet to form a protective gas, which can effectively prevent the surface of the sample from being oxidized;

3) Turn on the water cooling system: turn on the water cooling system connected to the back end of the water cooling head to cool the piezoelectric ceramics;

4) Heating: Set the temperature of the sample during imprinting, heat the heating chamber to the temperature required by the sample through the temperature control system connected to the external computer and maintain this temperature for more than 15 minutes, so that the temperature in the heating chamber is uniform;

5) Zero adjustment: the system is zeroed by the stepper motor displacement controller, so that the head of the piezoelectric ceramic is close to the feed head when the system is working;

6) Embossing: Set various parameters in the embossing process, and then emboss the sample through the control of an external computer.

7) Cooling: After the processing is completed, the sample is taken out after the heating chamber is cooled to room temperature.

Beneficial effects of the present invention:

This system adopts a unique gas circulation system to ensure that the samples are protected by inert gas during processing and will not be oxidized, and this system also uses a unique water cooling system to allow the system to work at high temperatures. This system not only makes up for the shortcomings of UV lithography, but also overcomes the shortcomings of LIGA such as small processing range, long time, and high cost. A new approach to structure.

The sample is safe and reliable during processing, and is not easy to oxidize; the processing precision is high, and the application of piezoelectric ceramics can reach the nanometer level; the processing range is large, and the size of the range can reach the micron level; the processing speed is fast, and the entire processing process only takes a few minutes; the processing cost is low, The processing is convenient, and each processing only needs to replace different molds.

Description of drawings

Figure 1 is a schematic diagram of the overall structure of the system;

Figure 2 is a diagram of the control chamber, the motor system and the water cooling system;

Fig. 3 is a temperature control system diagram and a gas circulation system diagram;

Figure 4 is a partial electrical and control connection diagram when the system is working;

Fig. 5 is a system control diagram;

Fig. 6 is the zeroing algorithm;

Figure 7-1 and 7-2 are software input parameters;

Figure 8 working algorithm;

In the figure, 1-1 control cavity, 1-2 heating cavity protection body, 1-3 base bracket, 2-1 pressurizing device, 2-2 tray, 2-3 guide rod, 2-4 heat insulation pad, 3- 1 Stepper motor displacement controller, 3-2 Pressure sensor, 3-3 Piezoelectric ceramics, 4 Heating cavity, 4-1 Feed pressure head, 4-2 Feed pressure head cover, 4-3 Sample stage, 4- 4. Sample table tray, 4-5 lifting rod, 4-6 thermocouple through hole, 5-1 air inlet hole, 5-2 air outlet hole, 6 water cooling head.

Detailed ways

The schematic diagram of the entire universal high-precision microstructure preparation system is shown in Figure 1, and the control diagram is shown in Figure 5, where 1-1 is the control chamber, 1-2 is the heating chamber protection body, and 1-3 is the base support; The device 2-1, the tray 2-2 and the guide rod 2-3 are the mechanical parts of the control chamber, the pressurizing device 2-1 is a pressurizing device, which plays the role of stabilizing the pressure, and the tray 2-2 is used to support the pressure sensor 3 -2 and piezoelectric ceramics 3-3, guide rod 2-3, used to fix and guide the instruments in the entire control cavity 1-1, the bottom is covered with a ring spring, used to buffer the pressure from above, leaving room for displacement . The heat insulation pad 2-4 is mainly used to isolate the heat transmitted from the heating chamber, so that it does not affect the normal operation of the control chamber; the sensors of the control chamber include a stepper motor displacement controller 3-1, a pressure sensor 3- 2. Piezoelectric ceramics 3-3 are mainly used to monitor various states of a universal high-precision microstructure preparation system and output an accurate displacement; the heating chamber 4 includes the feed head 4-1, Feed pressure head cover 4-2, sample stage 4-3, sample stage tray 4-4, lifting rod 4-5 are the parts in the heating chamber respectively, among which the feed pressure head 4-1 is used for outputting piezoelectric ceramics The sample is pressed during the displacement, the feed head cover 4-2 is used to fix the pressure head, the sample table 4-3 is used to place samples and molds, the sample table tray 4-4, and the lifting rod 4-5 are used to The height of the sample can be adjusted freely with the sample tray, which is convenient for embossing samples of different thicknesses. The thermocouple through holes 4-6 are used to place the thermocouple. As shown in Figure 3, the thermocouple is connected to a temperature PID controller , control the heating of the heating chamber 4, and stop automatically after reaching the set temperature.

FIG. 2 is a schematic diagram of the water cooling system and the withering process. The water cooling head 6 is mainly used to dissipate heat from the piezoelectric ceramic 3-3 when the system is heated. Threaded holes (not shown) can be used for fixing.

Fig. 3 is a schematic diagram of the gas circulation subsystem and the heating subsystem. The air inlet 5-1 is used for real-time argon flow when the system is working, and the air outlet 5-2 is used for gas outlet when the system is working to achieve gas circulation.

The use of a universal high-precision microstructure preparation system is divided into 7 steps,

1) Lofting: First, place the sample on the upper surface of the sample table 4-3, with the side to be imprinted facing the feed indenter 4-1; then, place the designed mold on the upper surface of the sample, with one side of the mold tightly Stick the sample, one side is close to the feeding pressure head 4-1.

2) Open the gas circulation system: open the argon gas valve, and pass gas to the heating chamber 4 through the air inlet 5-1. If the pressure reading on the argon gas bottle is stable, it means that the argon gas has been stably introduced into the chamber to form a protection Gas, effectively prevent the surface of the sample from being oxidized.

3) Turn on the water-cooling system: turn on the water-cooling system connected to the back end of the water-cooling head 6. After a period of time, the water pressure is stable, indicating that the water-cooling system has been working normally, and the piezoelectric ceramics 3-3 have been cooled. Note that the water cooling system and the gas circulation system must be turned on all the way during work and cannot be interrupted.

4) Heating: Set the temperature of the sample during imprinting. Heat the heating chamber to the temperature required by the sample through the temperature control system and maintain this temperature for more than 15 minutes, so that the temperature in the heating chamber is uniform.

3) Zero adjustment: as shown in Figure 2, the zero adjustment of the system (3-1) is carried out through the stepping motor displacement system, so that the head of the piezoelectric ceramic (3-3) is close to the feed head ( 4-1), the specific implementation is that the computer monitors the reading of the pressure sensor (3-2), and automatically judges whether the zero point condition is met through the algorithm shown in Figure 6.

4) Embossing: as shown in Figure 4, set various parameters in the imprinting process. The imprinting is divided into 2 methods. The specific parameter settings are shown in Figure 7-1 and Figure 7-2. Parameters (such as Figure 7-1, 40nm/every 10s, 2min/40s, Figure 7-2, 1.5 times the zero pressure, 2min40s), and then click the start on the software, the computer (host computer) through the customization as shown in Figure 8 Algorithm to control the piezoelectric ceramic 3-3 high-precision feed and retreat, and imprint the sample.

5) Cooling: After the processing is finished, the sample is taken out after the heating chamber 4 is cooled to normal temperature.

Claims (7)

1. A universal and high-precision microstructure preparation system, characterized in that it includes a base support (1-3), a heating chamber protection body (1-2), a control chamber (1-1), a lifting rod (4-5 ), the base bracket (1-3) supports the heating chamber protection body (1-2), and the control chamber (1-1) is installed on the heating chamber protection body (1-2); inside the heating chamber protection body (1-2) A heating chamber (4) is provided, and the heating chamber (4) is provided with a sample stage tray (4-4), a sample stage (4-3), and a feed pressure head (4-1) in sequence from low to high, The feeding head (4-1) is provided with a feeding head cover (4-2), and the lifting rod (4-5) runs through the heating chamber protection body (1-2), the heating chamber (4) and the sample The trays (4-4) are connected; the heating chamber (4) is equipped with a gas circulation subsystem; The control chamber (1-1) is equipped with a guide rod (2-3), a stepper motor displacement controller (3-1), a pressurizing device (2-1), a pressure sensor (3-2), piezoelectric ceramics (3-3), with the aid of guide rods (2-3), stepping motor displacement controllers (3-1), pressurizing devices (2-1), pressure sensors (3-2), piezoelectric ceramics (3 -3) connected sequentially. 2. The universal high-precision microstructure preparation system according to claim 1, characterized in that, the gas circulation subsystem is specifically as follows, the side wall of the heating chamber (4) is provided with an air inlet (5-1 ), the air outlet (5-2), the position of the air inlet (5-1) is lower than the air outlet (5-2), and the diameter of the air outlet (5-2) is the diameter of the air inlet (5-1) 1/3 of the gas is pumped in through the air inlet hole (5-1) and discharged through the air outlet hole (5-2). 3. The universal high-precision microstructure preparation system according to claim 1, characterized in that, the side wall of the heating chamber (4) is further provided with a thermocouple through hole (4-6), through which the temperature PID The controller transmits data to an external computer. 4. The universal high-precision microstructure preparation system according to claim 1, characterized in that the piezoelectric ceramic (3-3) is covered with a water cooling head (6). 5. The universal high-precision microstructure preparation system according to claim 1, characterized in that, the lifting rod (4-5) is connected to the sample stage tray (4-4) through a threaded hole. 6. The universal high-precision microstructure preparation system according to claim 1, characterized in that, the feeding indenter (4-1) and the sample stage (4-3) are respectively made of zirconia high-temperature resistant materials. 7. An application method of the universal high-precision microstructure preparation system according to claim 1, characterized in that the steps are as follows: 1) Staking: First, put the sample on the upper surface of the sample stage (4-3), with the side to be imprinted facing the feed head (4-1); then, place the designed mold on the upper surface of the sample, with the mold side tightly Paste the sample, one side is close to the feeding pressure head (4-1); 2) Turn on the gas circulation system: Open the argon gas valve, and pass gas into the heating chamber 4 through the air inlet (5-1) to form a protective gas, effectively preventing the surface of the sample from being oxidized; 3) Turn on the water cooling system: turn on the water cooling system connected to the back end of the water cooling head (6) to cool the piezoelectric ceramics (3-3); 4) Heating: Set the temperature of the sample during imprinting, heat the heating chamber 4 to the temperature required by the sample through the temperature control system connected to the external computer and keep this temperature for more than 15 minutes, so that the temperature in the heating chamber is uniform; 5) Zeroing: Zeroing the system through the stepper motor displacement controller 3-1, so that the head of the piezoelectric ceramic (3-3) is close to the feed head (4-1) when the system is working; 6) Embossing: set various parameters in the embossing process, and then emboss the sample through the control of an external computer; 7) Cooling: After the processing is finished, the sample is taken out after the heating chamber (4) is cooled to normal temperature.