CN104607370A - Height compensation method and device of adhesive dispensing positions - Google Patents
Height compensation method and device of adhesive dispensing positions Download PDFInfo
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- CN104607370A CN104607370A CN201410836365.8A CN201410836365A CN104607370A CN 104607370 A CN104607370 A CN 104607370A CN 201410836365 A CN201410836365 A CN 201410836365A CN 104607370 A CN104607370 A CN 104607370A
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- glue
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Abstract
The invention discloses a height compensation method and device of adhesive dispensing positions. The height compensation method of the adhesive dispensing positions comprises the steps that firstly, a reference point on a first part to be subjected to adhesive dispensing is selected to serve as a first reference plane; secondly, the distance M1 from the first adhesive dispensing position to the first reference plane is measured; thirdly, a reference point on a second part to be subjected to adhesive dispensing is selected to serve as a second reference plane; fourthly, the distance M2 from the first adhesive dispensing position to the second reference plane is measured; fifthly, a value obtained by subtracting the M1 from the M2 is a height variation value delta M, the sum of the delta M and the M1 is an adhesive dispensing height M3 after height variation, and the second adhesive dispensing position is formed with the M3 as a height parameter in order to carry out height compensation. The height compensation device of the adhesive dispensing positions comprises a vision module (1), a height measurement module (2), a processing module (3) and an adhesive dispensing mechanism (4). The height compensation method and device of the adhesive dispensing positions have the advantages that when the parts to be subjected to adhesive dispensing vary, heights of the adhesive dispensing positions can be compensated, and therefore adhesive dispensing accuracy is higher and a better adhesive dispensing effect is achieved.
Description
Technical field
The present invention relates to dispensing method and device, particularly relate to altimetric compensation method and the device of a glue position.
Background technology
Point colloid system is a kind of process equipment being widely used in production field, and its scope of application covers the technique such as bonding, embedding, coating, sealing, filling, drop, line gluing of product.The positional precision of some colloid system directly affects the effect of gluing process, especially in contact point glue.Present technology is compensate the coordinate of XY plane by vision system thus reach the object of position compensation mostly.During due to contact point glue, the coordinate only compensating XY can only reach the effect of translation compensation, and the height putting glue then affects final some glue effect.When a glue part height is inconsistent, do not have the dispensing method of altimetric compensation cannot realize good some glue.
To sum up, there is following defect in dispensing method of the prior art and device: when some glue part height change, do not have altimetric compensation, cause a glue effect poor.
Summary of the invention
One of the technical problem to be solved in the present invention is, for above-mentioned defect of the prior art, provides the altimetric compensation method of a kind of some glue position, comprises the following steps:
S1: treat that a glue part chooses reference point builds the first reference planes first;
S2: the distance M1 measuring first glue point and the first reference planes;
S3: treat that a glue part chooses reference point builds the second reference planes second;
S4: the distance M2 measuring first glue point and the second reference planes;
The value that S5:M2 deducts M1 is height change value Δ M, and Δ M and M1 sum are the some glue height M3 after height change, is that height parameter forms second point glue point, carries out altimetric compensation with M3.
In the altimetric compensation method of of the present invention some glue position, in described step S1, first treats that a quantity of the reference point of glue part is at least 3, and wherein at least 3 reference points are not on the same line.
In the altimetric compensation method of of the present invention some glue position, in described step S2, the quantity of first glue point is at least 1.
In the altimetric compensation method of of the present invention some glue position, in described step S5, glue applying mechanism is carried out height according to second point glue point and is regulated, and to regulate the height of second point glue point, carries out altimetric compensation.
Two of the technical problem to be solved in the present invention is, for above-mentioned defect of the prior art, provides the height compensation device of a kind of some glue position, comprising:
Vision module, for treating a glue part to be chosen reference point and treat a glue part chooses reference point second first;
Survey high module, for measuring the distance M1 of first glue point and the first reference planes and measuring the distance M2 of first glue point and the second reference planes;
Processing module, for: treat that a reference point for glue part builds the first reference planes according to first, treat that a reference point for glue part builds the second reference planes according to second, and form some glue height M3, the value that M2 deducts M1 is height change value Δ M, Δ M and M1 sum are the some glue height M3 after height change, are that height parameter forms second point glue point with M3;
Glue applying mechanism, for carrying out altimetric compensation according to second point glue point.
In the altimetric compensation method of of the present invention some glue position, the high module of described survey is laser-measured height module.
Implement altimetric compensation method and the device of of the present invention some glue position, beneficial effect is: when a glue part changes, can compensate a height for glue position, like this to new until a glue part that is second until some glue part gluing time, owing to having carried out altimetric compensation, invocation point glue precision can be made so higher, some glue better effects if.
Accompanying drawing explanation
Fig. 1 is the flow chart of the altimetric compensation embodiment of the method for some glue position of the present invention;
Fig. 2 is the structured flowchart of the height compensation device of some glue position of the present invention;
In figure:
1-vision module; 2-surveys high module; 3-processing module; 4-glue applying mechanism.
Detailed description of the invention
Clearly understand to make object of the present invention, technical scheme and advantage, the various embodiments that hereafter will describe will with reference to corresponding accompanying drawing, these figures constitute a part for embodiment, which describe the various embodiments realizing the present invention and may adopt.Should understand, also can use other embodiment, or the amendment on 26S Proteasome Structure and Function is carried out to the embodiment enumerated herein, and can not depart from the scope and spirit of the present invention.
As shown in Figure 1, the altimetric compensation method of the some glue position of the present embodiment, comprises the following steps:
S1: treat that a glue part chooses reference point builds the first reference planes first;
S2: the distance M1 measuring first glue point and the first reference planes;
S3: treat that a glue part chooses reference point builds the second reference planes second;
S4: the distance M2 measuring first glue point and the second reference planes;
The value that S5:M2 deducts M1 is height change value Δ M, and Δ M and M1 sum are the some glue height M3 after height change, is that height parameter forms second point glue point, carries out altimetric compensation with M3.
If the quantity of first glue point is 1 in step S2, so:
S1: treat that a glue part chooses reference point builds the first reference planes first; Such as treat a glue part to be chosen A, B, C tri-points first, form first plane of reference by these three points, obviously, these three points should not be on the same line.Convenient in order to describe, first plane of reference is named as Pabc.First treats that a glue part can be circuit board, lamp bar etc.
S2: the distance M1 measuring first glue point and the first reference planes; First glue point be P1 (x1, y1, z1), P1 to the distance of face Pabc be M1.
S3: treat that a glue part chooses reference point builds the second reference planes second; Such as treat a glue part to be chosen E, F, G tri-points first, form second plane of reference by these three points, obviously, these three points should not be on the same line.Second reference planes are named as Pabc2.Now also namely first treat by second, a glue part is treated that a glue part is replaced, now reference planes will change, and namely become the second reference planes from the first reference planes.Because the first reference planes become the second reference planes, now first glue point X-coordinate is identical, Y-coordinate is identical, but Z coordinate is different.
S4: the distance M2 measuring first glue point and the second reference planes; The distance of P1 to face Pabc2 is M2.
The value that S5:M2 deducts M1 is height change value Δ M, and Δ M and M1 sum are the some glue height M3 after height change, is that height parameter forms second point glue point, carries out altimetric compensation with M3.Also be Δ M > 0, then second point glue point should raise Δ M on the height basis of first glue point; Δ M < 0, then second point glue point should decline Δ M on the height basis of first glue point; Δ M=0, then second point glue point is consistent with the height of first glue point.Such glue applying mechanism is carried out height according to second point glue point and is regulated, and to regulate the height of second point glue point, carries out altimetric compensation.
If the quantity of first glue point is 4 in step S2, so:
S1: treat that a glue part chooses reference point builds the first reference planes first; Such as treat a glue part to be chosen A, B, C tri-points first, form first plane of reference by these three points, obviously, these three points should not be on the same line.Convenient in order to describe, first plane of reference is named as Pabc.First treats that a glue part can be circuit board, lamp bar etc.
S2: the distance M1 measuring first glue point and the first reference planes.4 first glue point is P1 (x1, y1, z1), P2 (x2, y2, z2), P3 (x3, y3, z3), P4 (x4, y4, z4), and some glue point is essentially a glue instruction.In certain embodiments, the quantity of first glue point likely can be more, only illustrate with 4 here.The distance of P1 to face Pabc be M11, P2 to the distance of face Pabc be M12, P3 to the distance of face Pabc be M13, P4 to the distance of face Pabc be M14.
S3: treat that a glue part chooses reference point builds the second reference planes second; Such as treat a glue part to be chosen E, F, G tri-points first, form second plane of reference by these three points, obviously, these three points should not be on the same line.Second reference planes are named as Pabc2.Now also namely first treat by second, a glue part is treated that a glue part is replaced, now reference planes will change, and namely become the second reference planes from the first reference planes.Because the first reference planes become the second reference planes, now first glue point X-coordinate is identical, Y-coordinate is identical, but Z coordinate is different; 4 first glue point is like this equally.
S4: the distance M2 measuring first glue point and the second reference planes; The distance of P1 to face Pabc2 be M21, P2 to the distance of face Pabc2 be M22, P3 to the distance of face Pabc2 be M23, P4 to the distance of face Pabc2 be M24.
S5：ΔM1＝M21-M11，ΔM2＝M22-M12，ΔM3＝M23-M13，ΔM4＝M24-M14。
M31＝ΔM1+M11，M32＝ΔM2+M12，M33＝ΔM3+M13，M34＝ΔM4+M14。
Correspondingly form 4 second point glue points, carry out altimetric compensation respectively.Also be Δ M > 0, then second point glue point should raise Δ M on the height basis of first glue point; Δ M < 0, then second point glue point should decline Δ M on the height basis of first glue point; Δ M=0, then second point glue point is consistent with the height of first glue point.Such glue applying mechanism is carried out height according to second point glue point and is regulated, and to regulate the height of second point glue point, carries out altimetric compensation.
The height compensation device of the some glue position of the present embodiment, comprising:
Vision module 1, for treating a glue part to be chosen reference point and treat a glue part chooses reference point second first;
Survey high module 2, for measuring the distance M1 of first glue point and the first reference planes and measuring the distance M2 of first glue point and the second reference planes;
Processing module 3, for: treat that a reference point for glue part builds the first reference planes according to first, treat that a reference point for glue part builds the second reference planes according to second, and form some glue height M3, the value that M2 deducts M1 is height change value Δ M, Δ M and M1 sum are the some glue height M3 after height change, are that height parameter forms second point glue point with M3.Further, processing module 3 for vision module 1 with survey the data that high module 2 gathers and process, preserve, and is correspondingly formed and exports the movement instruction of second point glue point.
Glue applying mechanism 4, for carrying out altimetric compensation according to second point glue point.The movement instruction that glue applying mechanism 4 exports according to processing module 3 carries out action, compensates a glue height.
Preferably, surveying high module 2 is laser-measured height module.This is because the precision of laser-measured height module is higher, performance is more stable, is conducive to accurate altimetric compensation.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. an altimetric compensation method for some glue position, is characterized in that, comprise the following steps:
S1: treat that a glue part chooses reference point builds the first reference planes first;
S2: the distance M1 measuring first glue point and the first reference planes;
S3: treat that a glue part chooses reference point builds the second reference planes second;
S4: the distance M2 measuring first glue point and the second reference planes;
The value that S5:M2 deducts M1 is height change value Δ M, and Δ M and M1 sum are the some glue height M3 after height change, is that height parameter forms second point glue point, carries out altimetric compensation with M3.
2. the altimetric compensation method of according to claim 1 some glue position, is characterized in that, in described step S1, first treats that a quantity of the reference point of glue part is at least 3, and wherein at least 3 reference points are not on the same line.
3. the altimetric compensation method of according to claim 2 some glue position, is characterized in that, in described step S2, the quantity of first glue point is at least 1.
4. the altimetric compensation method of according to claim 3 some glue position, is characterized in that, in described step S5, glue applying mechanism is carried out height according to second point glue point and regulated, and to regulate the height of second point glue point, carries out altimetric compensation.
5. a height compensation device for some glue position, is characterized in that, comprising:
Vision module (1), for treating a glue part to be chosen reference point and treat a glue part chooses reference point second first;
Survey high module (2), for measuring the distance M1 of first glue point and the first reference planes and measuring the distance M2 of first glue point and the second reference planes;
Processing module (3), for: treat that a reference point for glue part builds the first reference planes according to first, treat that a reference point for glue part builds the second reference planes according to second, and form some glue height M3, the value that M2 deducts M1 is height change value Δ M, Δ M and M1 sum are the some glue height M3 after height change, are that height parameter forms second point glue point with M3;
Glue applying mechanism (4), for carrying out altimetric compensation according to second point glue point.
6. the altimetric compensation method of according to claim 5 some glue position, is characterized in that, the high module of described survey (2) is laser-measured height module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410836365.8A CN104607370A (en) | 2014-12-29 | 2014-12-29 | Height compensation method and device of adhesive dispensing positions |
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| CN201410836365.8A CN104607370A (en) | 2014-12-29 | 2014-12-29 | Height compensation method and device of adhesive dispensing positions |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105427285A (en) * | 2015-11-05 | 2016-03-23 | 东莞市科隆威自动化设备有限公司 | Automatic positioning belt laser height measurement PCB dispensing method |
| CN106269397A (en) * | 2015-05-26 | 2017-01-04 | 鸿骐新技股份有限公司 | The level point adhesive dispenser in automatic fine tuning point glue path and method thereof |
| CN107597516A (en) * | 2017-10-30 | 2018-01-19 | 东莞华贝电子科技有限公司 | The adjusting method and system of dispensing height |
| CN108620288A (en) * | 2017-03-22 | 2018-10-09 | 深圳市腾盛工业设备有限公司 | A kind of compensation method of dispensing height and device |
| CN110833973A (en) * | 2019-11-29 | 2020-02-25 | 深圳威迈斯新能源股份有限公司 | Dispensing sealing method and dispensing equipment for vehicle-mounted charger module |
| CN111974616A (en) * | 2019-10-23 | 2020-11-24 | 广东安达智能装备股份有限公司 | Dispensing method, dispensing device, computer equipment and storage medium |
| CN113313756A (en) * | 2021-04-26 | 2021-08-27 | 深圳市世宗自动化设备有限公司 | Camera and laser composite guiding dispensing compensation method and related device |
| CN113996502A (en) * | 2021-11-12 | 2022-02-01 | 杭州鸿星电子有限公司 | Height control method and device for dispensing head in dispensing process of quartz crystal resonator |
| CN116273758A (en) * | 2023-04-06 | 2023-06-23 | 芯体素(杭州)科技发展有限公司 | High-precision array contact type fluid dispensing method |
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2014
- 2014-12-29 CN CN201410836365.8A patent/CN104607370A/en active Pending
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| 熊志武等: "RFID设备点胶高度补偿算法研究与实现", 《制造业自动化》 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106269397A (en) * | 2015-05-26 | 2017-01-04 | 鸿骐新技股份有限公司 | The level point adhesive dispenser in automatic fine tuning point glue path and method thereof |
| CN106269397B (en) * | 2015-05-26 | 2018-09-14 | 鸿骐新技股份有限公司 | The horizontal point glue equipment and its method in automatic fine tuning dispensing path |
| CN105427285A (en) * | 2015-11-05 | 2016-03-23 | 东莞市科隆威自动化设备有限公司 | Automatic positioning belt laser height measurement PCB dispensing method |
| CN108620288A (en) * | 2017-03-22 | 2018-10-09 | 深圳市腾盛工业设备有限公司 | A kind of compensation method of dispensing height and device |
| CN108620288B (en) * | 2017-03-22 | 2020-02-14 | 深圳市腾盛精密装备股份有限公司 | Glue dispensing height compensation method and device |
| CN107597516A (en) * | 2017-10-30 | 2018-01-19 | 东莞华贝电子科技有限公司 | The adjusting method and system of dispensing height |
| CN111974616A (en) * | 2019-10-23 | 2020-11-24 | 广东安达智能装备股份有限公司 | Dispensing method, dispensing device, computer equipment and storage medium |
| CN110833973A (en) * | 2019-11-29 | 2020-02-25 | 深圳威迈斯新能源股份有限公司 | Dispensing sealing method and dispensing equipment for vehicle-mounted charger module |
| CN113313756A (en) * | 2021-04-26 | 2021-08-27 | 深圳市世宗自动化设备有限公司 | Camera and laser composite guiding dispensing compensation method and related device |
| CN113996502A (en) * | 2021-11-12 | 2022-02-01 | 杭州鸿星电子有限公司 | Height control method and device for dispensing head in dispensing process of quartz crystal resonator |
| CN116273758A (en) * | 2023-04-06 | 2023-06-23 | 芯体素(杭州)科技发展有限公司 | High-precision array contact type fluid dispensing method |
| CN116273758B (en) * | 2023-04-06 | 2023-09-29 | 芯体素(杭州)科技发展有限公司 | High-precision array contact type fluid dispensing method |
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