CN104592755B - A kind of enhanced phenolic glass fiber moulding compound - Google Patents

A kind of enhanced phenolic glass fiber moulding compound Download PDF

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Publication number
CN104592755B
CN104592755B CN201410830640.5A CN201410830640A CN104592755B CN 104592755 B CN104592755 B CN 104592755B CN 201410830640 A CN201410830640 A CN 201410830640A CN 104592755 B CN104592755 B CN 104592755B
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China
Prior art keywords
glass fiber
moulding compound
molding compound
compound
resins system
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CN104592755A (en
Inventor
高禄生
易江洲
张建鸣
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Hunan New Insulating Materials Co Ltd
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Hunan New Insulating Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

Abstract

A kind of enhanced phenolic glass fiber moulding compound disclosed by the invention, moulding compound is made by molding compound resins system and glass fibre through dip-coating, drying；The molding compound resins system is by diamin type high fire-retardancy benzoxazine resin containing phosphor, Nano-meter SiO_22, KH550, methyl tetrahydro phthalic anhydride, dimethylformamide, methanol is prepared from.It is of the invention different from traditional composite, its organic phase and inorganic phase are in the compound of nanometer range, interfacial area between the two is very big, advantageously form the chemical bonding or sub- chemical bonding between interface, form preferable adhesion, eliminate the two alternate unmatched problems of thermal coefficient of expansion, and the rigidity of inorganic matter, dimensional stability, heat endurance and fire-retardant toughness, processability and dielectric properties with organic polymer combine, so as to reach the strange performance that many conventional insulator engineering moulding compounds are unable to reach.

Description

A kind of enhanced phenolic glass fiber moulding compound
Technical field
The present invention relates to a kind of enhanced phenolic glass fiber moulding compound.
Background technology
Anti- thermal technology and thermal protection structure that current China guided missile, fighter plane, aerospace craft are used, substantially continue to use 70 The phenolic glass fiber moulding compound for the polyvinyl alcohol modification that age uses.There is molding time length, mechanical performance in this moulding compound Difference, electrical insulation strength is low, production cost is high, environmental pollution is serious, and after installation cable core, plug exist it is irrational Stress, causing the use unfailing performance of guided missile and aerospace craft reduces.To adapt to defence and military development, in the urgent need to developing, Produce the high-grade advanced composite material matched therewith.
The content of the invention
It is an object of the invention to many present in the phenolic glass fiber moulding compound for existing polyvinyl alcohol modification Problem and provide a kind of by the rigidity of inorganic matter, dimensional stability, heat endurance and fire-retardant toughness with organic polymer, processing The enhanced phenolic glass fiber moulding compound that property and dielectric properties combine.
The technical problems to be solved by the invention can be achieved through the following technical solutions：
A kind of enhanced phenolic glass fiber moulding compound, by molding compound resins system and glass fibre through dip-coating, drying Moulding compound is made；The molding compound resins system is prepared from by the raw material of following parts by weight：
The mass ratio of wherein described molding compound resins system and glass fibre is 1.05~1.10.
In a preferred embodiment of the invention, the molding compound resins system by following parts by weight raw material prepare and Into：
In a preferred embodiment of the invention, the particle diameter of the nanosized SiO_2 is 20~30 nanometers.
In a preferred embodiment of the invention, the glass fibre is that 40 glass fiber yarns operate on silk.
Diamin type high fire-retardancy benzoxazine resin containing phosphor of the present invention is the hexa-member heterocycle body by atom and atomic building System, therein 1,3-benzoxazine can ring-opening polymerisation, the similar phenolic resin structure of formation under heating and/or catalyst action Polybenzoxazine.The resin had both overcome the shortcoming of traditional phenolic resin, had good combination property again.The two of the present invention First amine type high fire-retardancy benzoxazine resin containing phosphor is prepared according to the method for Patent No. 200710115318.4.
It is of the invention different from traditional composite, its organic phase and inorganic phase be in the compound of nanometer range, both it Between interfacial area it is very big, advantageously form chemical bonding between interface or sub- chemical bonding, form preferable adhesion, eliminate The two alternate unmatched problems of thermal coefficient of expansion, and by the rigidity of inorganic matter, dimensional stability, heat endurance and it is fire-retardant with it is organic Toughness, processability and the dielectric properties of polymer combine, so as to reach that many conventional insulator engineering moulding compounds can not reach The strange performance arrived.
Embodiment
The diamin type high fire-retardancy benzoxazine resin containing phosphor of example below is by the hexa-atomic of atom and atomic building Heterocyclic system, therein 1,3-benzoxazine can ring-opening polymerisation, the similar phenolic aldehyde tree of formation under heating and/or catalyst action The Polybenzoxazine of fat structure.The resin had both overcome the shortcoming of traditional phenolic resin, had good combination property again.This hair Bright diamin type high fire-retardancy benzoxazine resin containing phosphor is prepared according to the method for Patent No. 200710115318.4.Specifically Performance is shown in Table 1
Table 1
The particle diameter of the nanosized SiO_2 of example below is 20~30 nanometers.Glass fibre is that 40 glass fiber yarns are operated on Silk.
Embodiment 1
A kind of enhanced phenolic glass fiber moulding compound, by molding compound resins system and glass fibre through dip-coating, drying Moulding compound is made；The molding compound resins system is prepared from by the raw material of following parts by weight：
The mass ratio of wherein described molding compound resins system and glass fibre is 1.05.
Embodiment 2
A kind of enhanced phenolic glass fiber moulding compound, by molding compound resins system and glass fibre through dip-coating, drying Moulding compound is made；The molding compound resins system is prepared from by the raw material of following parts by weight：
The mass ratio of wherein described molding compound resins system and glass fibre is 1.08.
Embodiment 3
A kind of enhanced phenolic glass fiber moulding compound, by molding compound resins system and glass fibre through dip-coating, drying Moulding compound is made；The molding compound resins system is prepared from by the raw material of following parts by weight：
The mass ratio of wherein described molding compound resins system and glass fibre is 1.10.
The enhanced phenolic glass fiber moulding compound main performance of above-described embodiment is shown in Table 2
Table 2

Claims (1)

1. a kind of enhanced phenolic glass fiber moulding compound, is made by molding compound resins system and glass fibre through dip-coating, drying Obtain moulding compound；The molding compound resins system is prepared from by the raw material of following parts by weight：
The mass ratio of wherein described molding compound resins system and glass fibre is 1.05~1.10；
The Nano-meter SiO_22Particle diameter be 20~30 nanometers；
The glass fibre is that 40 glass fiber yarns operate on silk.
CN201410830640.5A 2014-12-28 2014-12-28 A kind of enhanced phenolic glass fiber moulding compound Active CN104592755B (en)

Priority Applications (1)

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CN201410830640.5A CN104592755B (en) 2014-12-28 2014-12-28 A kind of enhanced phenolic glass fiber moulding compound

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CN104592755B true CN104592755B (en) 2017-07-28

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11590279B2 (en) 2017-07-20 2023-02-28 Flex Ltd. Clock mechanism flow regulator
CN109251475A (en) * 2018-09-14 2019-01-22 蚌埠创特新材料科技有限公司 A kind of high intensity is resistance to fall nontoxic Ceramic-imitated tableware material
CN109354898A (en) * 2018-10-29 2019-02-19 江苏常阳科技有限公司 A kind of hydrophobic tubular molding compound and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115772A (en) * 1994-07-29 1996-01-31 四川联合大学 Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200413467A (en) * 2003-01-16 2004-08-01 Chang Chun Plastics Co Ltd Resin composition without containing halogen
CN101220152B (en) * 2007-12-11 2010-06-09 山东大学 Production method for diamin type high fire-retardancy benzoxazine resin containing phosphor
CN102977551B (en) * 2011-09-02 2014-12-10 广东生益科技股份有限公司 Halogen-free resin composition and method for preparing copper-clad plate from the halogen-free resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1115772A (en) * 1994-07-29 1996-01-31 四川联合大学 Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material

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