CN104589775B - Meta Materials and its processing method - Google Patents
Meta Materials and its processing method Download PDFInfo
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- CN104589775B CN104589775B CN201310530003.1A CN201310530003A CN104589775B CN 104589775 B CN104589775 B CN 104589775B CN 201310530003 A CN201310530003 A CN 201310530003A CN 104589775 B CN104589775 B CN 104589775B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of Meta Materials and its processing methods, this method comprises: increase to the surface of Meta Materials functional layer the processing of surface binding force, wherein Meta Materials functional layer includes dielectric layer and the conductive geometry on dielectric layer；Meta Materials functional layer after surface treatment is combined with an at least composite layer.The present invention is by carrying out roughening process to functional layer, the contact area of functional layer and composite material can be increased, to effectively increase the surface binding force between functional layer and composite layer, the surface of Meta Materials finished product can be made more smooth, avoid the occurrence of deflection deformation and layering, effectively increase product at yield.
Description
Technical field
The present invention relates to Material Fields, and in particular it relates to a kind of Meta Materials and its processing method.
Background technique
Meta Materials are generally made of dielectric material and conductive geometry, wherein conductive geometry along a certain plane or
Curved surface is arranged in array, and an array shape is one layer.In the design of common Meta Materials, micro-structure can be more than one layer, multilayer
Micro-structure intersperses among in dielectric material according to certain rules, and multiplelayer microstructure mutually disjoints.
Fiber-reinforced resin matrix compound material has excellent mechanical property, and its dielectric properties can also be in certain model
It is adjusted according to the design needs in enclosing, therefore is often used as forming the dielectric material of Meta Materials.
But a variety of composite materials of such as fiber-reinforced resin matrix compound material and conductive geometry in the related technology
Adhesive force it is insufficient, not only result in the Meta Materials being process and be layered, and Meta Materials is easy to cause to bend.
In view of the above problems in the related art, currently no effective solution has been proposed.
Summary of the invention
In view of the above problems in the related art, the present invention proposes a kind of Meta Materials and its processing method, can be improved function
Binding force between ergosphere and composite material improves product quality.
The technical scheme of the present invention is realized as follows:
According to an aspect of the invention, there is provided a kind of processing method of Meta Materials.
The processing method includes: increase to the surface of Meta Materials functional layer the processing of surface binding force, wherein super material
Expect that functional layer includes dielectric layer and the conductive geometry on dielectric layer；By after surface treatment Meta Materials functional layer with
At least a composite layer is combined.
Wherein, the processing for carrying out increasing surface binding force to Meta Materials functional layer includes: to carry out slightly to conductive geometry
Change.
And it is possible to be roughened by least one of following technique to conductive geometry: brownification technique, microetch
Carving technology, blackening craft, mechanical grinding technique.
In addition, carrying out increasing the processing of surface binding force including: on the surface of conductive geometry to Meta Materials functional layer
Increase active group.
Also, before being combined, microetch carving technology is carried out to conductive geometry by micro etching solution, wherein
In micro etching solution be added comprising active group solution or to terminate micro-structure carry out microetch carving technology after by the inclusion of
The solution of active group handles conductive geometry.
Optionally, active group may include at least one of: hydroxyl, carboxyl.
Optionally, the etching solution that microetch carving technology uses includes sulfuric acid system and at least one of: sodium peroxydisulfate, mistake
Ammonium sulfate, hydrogen peroxide.And it is possible to carry out microetch carving technology with Static Etch.It is alternatively possible to lead within the scope of 10~70 DEG C
It crosses micro etching solution and carries out microetch carving technology.The concentration of micro etching solution can be 30~150g/l.Optionally, microetch carving technology is held
The continuous time can be 1-15 minutes.
In addition, the processing for carrying out increase surface binding force to Meta Materials functional layer includes: the medium to Meta Materials functional layer
Layer is roughened.
Wherein it is possible to be roughened by least one of following technique to dielectric layer: physics blasting craft, ion beam
Bombardment technique, chemical etching technology.
In addition, carrying out increasing the processing of surface binding force including: to beat Meta Materials functional layer to Meta Materials functional layer
Hole technique, forms hole on a functional.
Furthermore it is also possible to drilling technology be completed, at this point, this method can be wrapped further before forming Meta Materials function
It includes:
Functional layer to be processed is provided, machining function layer is treated and is cleaned, wherein functional layer to be processed include dielectric layer with
And the conductive layer above dielectric layer；
Functional layer to be processed after cleaning is dried；
Patterning removal technique and drilling technology are carried out to conductive layer, obtain dielectric layer Meta Materials functional layer with hole.
Preferably, when carrying out drilling technology, under the premise of not influencing conductive geometry, with aperture maximum principle into
Row punching.
It is cleaned it is alternatively possible to treat machining function layer by the sulfuric acid that concentration is 5%-20%.And it is possible to 10
It is dried in the range of DEG C -150 DEG C.
Optionally, dielectric layer can be made of high molecular material.
In addition, composite layer can contain reinforcing material.
According to another aspect of the present invention, a kind of Meta Materials are additionally provided, which is made of above-mentioned processing method.
The present invention by functional layer carry out roughening process, the contact area of functional layer and composite material can be increased, from
And the surface binding force between functional layer and composite layer is effectively increased, the surface of Meta Materials finished product can be made more flat
It is whole, avoid the occurrence of deflection deformation and layering, effectively increase product at yield.
Detailed description of the invention
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the processing method of Meta Materials according to an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art's every other embodiment obtained belong to what the present invention protected
Range.
According to an embodiment of the invention, providing a kind of processing method of Meta Materials.
As shown in Figure 1, the processing method of Meta Materials according to an embodiment of the present invention mainly includes step S101 and step
S103.Wherein, in step s101, increase to the surface of Meta Materials functional layer the processing of surface binding force, wherein super material
Material functional layer includes that (conductive geometry can be by being covered in for dielectric layer and the conductive geometry on dielectric layer
Conductive layer on dielectric layer carries out patterning removal and obtains).Wherein, the material of conductive geometry (layer) may include: copper,
Iron, silver, nickel, tungsten or titanium etc. or its alloy, wherein preferably may include copper.
In some embodiments, the dielectric material of Meta Materials functional layer be macromolecule material film, including polyethylene film,
Polypropylene film, pet film or polylactic acid film etc..
It in some embodiments, can be with when the surface to Meta Materials functional layer carries out increasing the processing of surface binding force
Conductive geometry is roughened, needs to be bound to answering in Meta Materials functional layer with subsequent to enhance conductive geometry
The adhesive force adhesive force of conductive layer and fiber reinforcement based composites layer (for example, increase) between condensation material specifically can be with
After forming Meta Materials functional layer, roughening process is carried out to conductive geometry.
For example, can be implemented by brownification technique, microetch carving technology, blackening craft or mechanical grinding technique to conductive geometry
The roughening process of structure.Roughening process can increase the roughness that conductive geometry (can be made of metal) surface, thus
The bond area of conductive geometry and composite material (for example, resin), Jin Erzeng can be increased in subsequent combined process
Large surface binding force.
It in some embodiments, can be at 10 DEG C to 70 in the case where carrying out microetch carving technology to conductive geometry
Microetch process is carried out to conductive geometry using etching solution in the range of DEG C, handles the time between 1 minute to 15 points
In the range (optionally, the duration of processing can be within the scope of 2 minutes to 5 minutes) of clock, it is preferable that in order to make etching speed
Rate is more stable, and microetch carving technology can be carried out within the temperature range of 26 DEG C to 32 DEG C.Etching used by microetch carving technology
Liquid is sulfuric acid system, that is, in etching solution system include sulfate ion and hydrogen ion, and the concentration of etching solution between 30g/L extremely
In the range of 150g/L (optionally, the concentration of etching solution can be within the scope of 75g/L to 125g/L).Further, etching solution
It can also include at least one of sodium peroxydisulfate, ammonium persulfate, hydrogen peroxide.In some embodiments, static erosion can be used
It carves and carries out microetch carving technology (etch-rate is made to be maintained at static etch rate).
On the other hand, can also conductive geometry surface increase active group, thus increase conductive geometry with
Binding force between composite material.When increasing active group to conductive geometry surface, active group can be passed through
Solution, the surface of conductive geometry is handled.
The technique that the surface of conductive geometry increases active group and is roughened to conductive geometry can be with
It is used alone, can also be applied in combination.For example, the technique of active group can be combined using microetch carving technology and increase, at this point,
The solution of active group can be added, in this way, etching solution can not only be right in the etching solution used by microetch carving technology
Conductive geometry carries out microetch, and active group meeting and metal reaction in etching solution, and generates one in metal surface
Very thin, the uniform organic metal conversion film of layer, to increase active group, active group in conductive geometry surface
Including hydroxy or carboxy etc..In addition it is also possible to execute the technique for increasing active group after carrying out microetch carving technology.
In addition, when the surface to Meta Materials functional layer carries out increasing the processing of surface binding force, in addition to can be to conduction
Geometry is handled, with increase except its adhesive force between composite material (help to improve Meta Materials functional layer with
Adhesive force between composite material), dielectric layer can also be handled.
It in some embodiments, can be with when the surface to Meta Materials functional layer carries out increasing the processing of surface binding force
Roughening treatment is carried out to the dielectric layer of Meta Materials functional layer.Carrying out roughening treatment to the dielectric layer of Meta Materials functional layer can be right
Conductive geometry is implemented to carry out before roughening process processing, can also carry out or carry out behind simultaneously.It is alternatively possible to logical
Physics blasting craft, ion beam bombardment technique, chemical etching technology etc. is crossed to implement to carry out slightly the dielectric layer of Meta Materials functional layer
Change processing.To the roughening treatment that the dielectric layer of Meta Materials functional layer carries out can increase in subsequent combined process dielectric layer and
The adhesion strength of fiber reinforcement based composites.
In addition, in some embodiments, when the surface to Meta Materials functional layer carries out increasing the processing of surface binding force,
Functional layer can also be punched, wherein the hole formed on a functional can be the through-hole through functional layer, can also not
It is through-hole.The conductive geometry of Meta Materials functional layer is to be formed by patterning removal technique, and drilling technology can be
Executed before patterning removal technique, can also be executed after carrying out patterning removal technique, pattern removal technique
It can be designed according to actual needs with the sequencing of drilling technology.Preferably, in drilling technology, conduction is not being influenced
Under the premise of geometry, drilling technology is carried out with aperture maximum principle, thus guarantee that the aperture in hole reaches maximum as far as possible, with
Just in the subsequent technique for being combined Meta Materials functional layer and composite material, make to accommodate in hole as much as possible compound
Material.Under the premise of not influencing conductive geometry, hole can be on conductive geometry (the two is adjacent to each other), can also be with
A distance away with conductive geometry.In some embodiments, the hole formed in drilling technology can be round, square
Shape, ellipse, square or triangle etc..
Optionally, carry out patterning removal technique before, machining function layer can be treated and cleaned, and to cleaning after
Functional layer to be processed (for example, can be dried in an oven) is dried.
In some embodiments, machining function layer is treated using 5% to 20% sulfuric acid to be cleaned (for example, sulfuric acid is dense
10%) degree can be, to remove surface and oil contaminant, and treat machining function layer in the range of 10 DEG C to 150 DEG C and be dried
(for example, the temperature being dried can be within the scope of 90 DEG C to 110 DEG C, it is alternatively possible to be 110 DEG C), and then to drying
Functional layer afterwards carries out patterning removal technique (or further executing drilling technology).
It is described above that conductive geometry is roughened, increases active group, to Jie in conductive geometry surface
Matter layer is roughened and to the technique that dielectric layer is punched, may be used alone, can also be used in combination.
Then, with continued reference to Fig. 1, in step s 103, by Meta Materials functional layer after surface treatment and at least one compound
Material layer is combined, wherein the mode of the combination can be pressing or other can be by Meta Materials functional layer and at least one
Composite layer is configured to other modes together.Composite layer can contain reinforcing material, for example, in some embodiments
In, composite layer can be made of fiber-reinforced resin matrix compound material, including carbon-fibre reinforced epoxy resin, glass fibre
Reinforced epoxy or aramid fiber enhancing unsaturated polyester resin etc..It in some embodiments, can be in functional layer two sides
Binding fiber enhances based composites on conductive geometry and on dielectric layer, can also be only in the conductive geometry knot of functional layer
Binding fiber enhances based composites on structure or on dielectric layer.In the embodiment only in conjunction with one layer of fiber reinforcement based composites
In, it can save or skip (including the conductive geometry knot of the roughening treatment to unbonded one side surface of fiber reinforcement based composites
The roughening of structure, the roughening of dielectric layer and the increase of organic active group).Whether it is combined in the two sides of functional layer compound
Material, during functional layer and composite layer are combined processing, since combined process need to carry out at high temperature under high pressure,
Therefore, fiber reinforcement based composites are in viscosity flow state (can also select other composite materials with similar characteristics), by
It is by roughening in the surface of functional layer, therefore, function layer surface has bigger surface area multiple with fiber reinforcement base
Condensation material is in contact, to effectively increase the binding force of functional layer Yu fiber reinforcement based composites, reduces finished product Meta Materials
There is a possibility that out-of-flatness or deflection deformation.
In the embodiment for forming hole to dielectric layer, extra fiber reinforcement based composites can flow into the hole of functional layer
In, so that further avoiding finished product Meta Materials there is out-of-flatness or deflection deformation.In the equal binding fiber enhancing in the two sides of functional layer
In the embodiment of based composites, if punched hole is through-hole on a functional, since two layers of fiber reinforcement base is compound
Material can be fused in the through-hole of functional layer, to further improve fiber reinforcement based composites layer and functional layer
Between adhesive force, and efficiently avoid the lamination of finished product Meta Materials in use.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (14)
1. a kind of processing method of Meta Materials characterized by comprising
Increase to the surface of Meta Materials functional layer the processing of surface binding force, wherein the Meta Materials functional layer includes being situated between
Matter layer and the conductive geometry on the dielectric layer；
The Meta Materials functional layer after surface treatment is combined at least two composite layers,
Wherein, the processing for carrying out increasing surface binding force to the Meta Materials functional layer includes carrying out to the Meta Materials functional layer
Drilling technology forms hole on a functional, when carrying out the drilling technology, under the premise of not influencing conductive geometry, with
Aperture maximum principle is punched,
Wherein, the hole is through-hole；
Before being combined, microetch carving technology is carried out to the conductive geometry by micro etching solution, wherein described micro-
The solution comprising active group is added in etching solution so that the active group and the metal reaction of Meta Materials functional layer are with shape
At organic metal conversion film.
2. processing method according to claim 1, which is characterized in that the active group includes at least one of: hydroxyl
Base, carboxyl.
3. processing method described according to claim 1~any one of 2, which is characterized in that the microetch carving technology used
Etching solution includes sulfuric acid system and at least one of: sodium peroxydisulfate, ammonium persulfate, hydrogen peroxide.
4. processing method described according to claim 1~any one of 2, which is characterized in that carried out with Static Etch described micro-
Etch process.
5. processing method described according to claim 1~any one of 2, which is characterized in that pass through within the scope of 10~70 DEG C
Micro etching solution carries out the microetch carving technology.
6. processing method described according to claim 1~any one of 2, which is characterized in that the concentration of the micro etching solution is
30~150g/l.
7. processing method described according to claim 1~any one of 2, which is characterized in that the microetch carving technology continues
Time is 1-15 minutes.
8. processing method according to claim 1, which is characterized in that by least one of following technique to being given an account of
Matter layer is roughened: physics blasting craft, ion beam bombardment technique, chemical etching technology.
9. processing method according to claim 1, which is characterized in that further comprise:
Functional layer to be processed is provided previously, the functional layer to be processed is cleaned, wherein the functional layer to be processed includes
Dielectric layer and the conductive layer above the dielectric layer；
Functional layer to be processed after cleaning is dried；
Patterning removal technique and drilling technology are carried out to conductive layer, obtain dielectric layer Meta Materials functional layer with hole.
10. processing method according to claim 9, which is characterized in that by concentration be 5%-20% sulfuric acid to described
Functional layer to be processed is cleaned.
11. processing method according to claim 10, which is characterized in that carried out in the range of 10 DEG C -150 DEG C described dry
Dry processing.
12. according to claim 1-2, processing method described in any one of 8-9, which is characterized in that the dielectric layer is by high score
Sub- material is made.
13. according to claim 1-2, processing method described in any one of 8-9, which is characterized in that the composite layer contains
There is reinforcing material.
14. a kind of Meta Materials, which is characterized in that be made of processing method according to claim 1 to 13.
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| CN201310530003.1A CN104589775B (en) | 2013-10-30 | 2013-10-30 | Meta Materials and its processing method |
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| CN201310530003.1A CN104589775B (en) | 2013-10-30 | 2013-10-30 | Meta Materials and its processing method |
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| CN1213848C (en) * | 1997-02-05 | 2005-08-10 | 老约瑟夫·曼德兹苏 | Process of roughening thermoplastic films and roughed plastic films |
| CN2292016Y (en) * | 1997-06-24 | 1998-09-23 | 徐素花 | Glass fibre reinforced plastics composite board |
| CN103158227B (en) * | 2011-12-15 | 2016-02-03 | 鸿富锦精密工业（深圳）有限公司 | Complex and preparation method thereof |
| CN103296462B (en) * | 2012-03-01 | 2017-08-25 | 深圳光启高等理工研究院 | Based on metamaterial sheet processing method and Meta Materials without fibre base plate |
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