CN104576971A - Flexible element and manufacturing method thereof - Google Patents
Flexible element and manufacturing method thereof Download PDFInfo
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- CN104576971A CN104576971A CN201410130932.8A CN201410130932A CN104576971A CN 104576971 A CN104576971 A CN 104576971A CN 201410130932 A CN201410130932 A CN 201410130932A CN 104576971 A CN104576971 A CN 104576971A
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- cushion
- release layer
- electronic component
- bendable
- flexible substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 170
- 238000000034 method Methods 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 11
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 10
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 239000002985 plastic film Substances 0.000 claims description 9
- 229920006255 plastic film Polymers 0.000 claims description 9
- 230000009477 glass transition Effects 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 6
- 239000002086 nanomaterial Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 239000002105 nanoparticle Substances 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 235000012222 talc Nutrition 0.000 claims description 5
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 claims description 4
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- 229910004205 SiNX Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- GBMDVOWEEQVZKZ-UHFFFAOYSA-N methanol;hydrate Chemical compound O.OC GBMDVOWEEQVZKZ-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Molecular Biology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a flexible element and a manufacturing method thereof. The buffer layer is disposed on the first flexible substrate. The electronic element is disposed on the buffer layer. The invention also provides a manufacturing method of the flexible element, which comprises the following steps of firstly, providing a hard substrate. Then, a release layer is formed on the hard substrate. Then, a buffer layer is formed on the release layer. And forming an electronic element on the buffer layer. And then, the buffer layer and the electronic element are separated from the hard substrate through the release layer. Finally, a first flexible substrate is formed on the buffer layer and the electronic element, wherein the buffer layer is positioned between the electronic element and the first flexible substrate.
Description
Technical field
The invention relates to a kind of bendable element and manufacture method thereof.
Background technology
At present, the production method of bendable element, normally smears plastic cement solution and is solidified to form a flexible substrate on a glass substrate, or directly bonds one deck flexible substrate on the glass substrate.Then, flexible substrate makes required electronic component, to form bendable element.
Electronic component is for tft layer, and generally speaking, the manufacturing process temperature of thin film transistor (TFT) may up to 600 degree.But flexible substrate is such as the material of pi (PI), ethylene terephthalate (PET) or tygon (PEN) etc., its glass transition temperature, usually only at 300 degree to about 400 degree, more difficultly bears above-mentioned high temperature manufacturing process.
Summary of the invention
The invention provides a kind of bendable element and manufacture method thereof, it can avoid flexible substrate that situation that is rotten or fusing occurs in the process manufactured.
The manufacture method of a kind of bendable element of the present invention, comprises the following steps, first, provides a hard substrate.Then, a release layer is formed on hard substrate.Come again, form a cushion on release layer.Then, an electronic component is formed on the buffer layer.Come again, by release layer, cushion and electronic component are separated on hard substrate.Finally, be formed on cushion and electronic component by one first flexible substrate, wherein cushion is between electronic component and the first flexible substrate.
In one embodiment of this invention, the method for above-mentioned formation release layer on hard substrate comprises the surface making release layer cover hard substrate.
In one embodiment of this invention, the method for above-mentioned formation release layer on hard substrate comprises one first district making release layer cover a surface of hard substrate.
In one embodiment of this invention, the method for above-mentioned formation cushion comprises makes cushion cover the release layer in the firstth district in place, and extends to one second surperficial district to cover hard substrate.
In one embodiment of this invention, before above by release layer cushion and electronic component being separated on hard substrate, also further excision substrate the secondth district and be positioned at the cushion in the secondth district.
In one embodiment of this invention, above-mentioned the method that first flexible substrate is formed on cushion and electronic component to be comprised: be coated with the side away from electronic component of a glue-line at cushion; And attach the first flexible substrate to glue-line.
In one embodiment of this invention, above-mentioned the method that first flexible substrate is formed on cushion and electronic component to be comprised: be coated with the side away from electronic component of a plastic cement solution at cushion; And curing plastic solution is to form the first flexible substrate.
In one embodiment of this invention, be also included in after the first flexible substrate is formed on cushion and electronic component, form a display element on electronic component.
In one embodiment of this invention, configuration one second flexible substrate is also comprised in the side away from electronic component of display element.
In one embodiment of this invention, above-mentioned display element includes OLED (Organiclight emitting diode, be called for short OLED), electrophoretic display device (EPD) (Eletrophoretic Display, be called for short EPD), electric wet-type display (Electrowetting Display, be called for short EWD) or liquid crystal display (Liquid Crystal Display is called for short LCD).
In one embodiment of this invention, the material of above-mentioned release layer comprises the inorganic material of sheet hexagonal structure.
In one embodiment of this invention, the material of above-mentioned release layer comprises cadmium sulfide micro Nano material, hydroxide nanoparticle material, sheet hexagonal structure silver, boron nitride, mica or talcum.
In one embodiment of this invention, above-mentioned release layer is formed on hard substrate with coating or the mode of spraying.
In one embodiment of this invention, the glass transition temperature of the material of above-mentioned release layer is higher than 600 DEG C.
In one embodiment of this invention, above-mentioned cushion comprises monox (SiOx), silicon nitride (SiNx) or its combination.
In one embodiment of this invention, above-mentioned first flexible substrate comprises a ultra-thin glass, a plastic film or a stainless steel layer.
In one embodiment of this invention, above-mentioned hard substrate is a glass substrate, a ceramic substrate or a hard plastic substrate.
The invention provides a kind of bendable element, comprise one first flexible substrate, a cushion and an electronic component.Cushion is configured on the first flexible substrate.Electronic component arrangements on the buffer layer.
In one embodiment of this invention, also comprise a release layer, between the first flexible substrate and cushion, the material of release layer comprises the inorganic material of sheet hexagonal structure.
In one embodiment of this invention, above-mentioned release layer is distributed between the first flexible substrate and cushion unevenly.
In one embodiment of this invention, the material of above-mentioned release layer comprises cadmium sulfide micro Nano material, hydroxide nanoparticle material, sheet hexagonal structure silver, boron nitride, mica or talcum.
In one embodiment of this invention, the glass transition temperature of the material of above-mentioned release layer is higher than 600 DEG C.
In one embodiment of this invention, above-mentioned cushion comprises monox (SiOx), silicon nitride (SiNx) or its combination.
In one embodiment of this invention, also comprise a display element, be configured on electronic component.
In one embodiment of this invention, also comprise one second flexible substrate, configuration on the display element.
In one embodiment of this invention, also comprise a glue-line, be configured between the first flexible substrate and cushion.
In one embodiment of this invention, above-mentioned electronic component comprises multiple tft layer or multiple touch control component.
In one embodiment of this invention, above-mentioned display element includes OLED (Organiclight emitting diode, be called for short OLED), electrophoretic display device (EPD) (Eletrophoretic Display, be called for short EPD), electric wet-type display (Electrowetting Display, be called for short EWD) or liquid crystal display (Liquid Crystal Display is called for short LCD).
In one embodiment of this invention, above-mentioned first flexible substrate comprises a ultra-thin glass, a plastic film or a stainless steel layer.
Based on above-mentioned, bendable element of the present invention and manufacture method thereof, utilize can resistant to elevated temperatures hard substrate as the substrate supported, first on hard substrate, form release layer, then on release layer, form cushion.After completing the preparation of the electronic component of high temperature on the buffer layer, can easily cushion and electronic component be departed from hard substrate by release layer, thereafter flexible substrate is configured on cushion and electronic component, to produce bendable element.Because flexible substrate is just formed on cushion and electronic component after electronic component, can avoid the flexible substrate of non-refractory that the situation melted occurs when the high temperature manufacturing process of electronic component.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Figure 1A to Fig. 1 F is the schematic flow sheet of the manufacture method of a kind of bendable element according to one embodiment of the invention;
Fig. 1 G is the step schematic diagram of the manufacture method of the bendable element of Figure 1A to Fig. 1 F;
Fig. 2 A to Fig. 2 I is the schematic flow sheet of the manufacture method of a kind of bendable element according to another embodiment of the present invention;
Fig. 2 J is the step schematic diagram of the manufacture method of the bendable element of Fig. 2 A to Fig. 2 I.
Description of reference numerals:
11 ~ 17,21 ~ 29: step;
30: hard substrate;
32: surface;
34th: the first district;
36th: the second district;
100,200: bendable element;
100 ': flexible type display panel;
110,210: release layer;
120,220: cushion;
130,230: electronic component;
235,255: glue-line;
140: the first flexible substrate;
150,250: display element;
240,260: flexible substrate.
Embodiment
Figure 1A to Fig. 1 F is the schematic flow sheet of the manufacture method of a kind of bendable element according to one embodiment of the invention.Fig. 1 G is the step schematic diagram of the manufacture method of the bendable element of Figure 1A to Fig. 1 F.The manufacture method 10 of the bendable element of the present embodiment, comprises the following steps, first, refers to Figure 1A, provides a hard substrate 30(step 11).In the present embodiment, hard substrate 30 is a glass substrate, and in other embodiments, hard substrate 30 also can be a ceramic substrate or a stainless-steel sheet etc. can exotic material.In the present embodiment, due to thin film transistor (TFT) can be made on hard substrate 30 in step afterwards, therefore, hard substrate 30 needs the high temperature that can tolerate thin film transistor (TFT) manufacturing process, and such as hard substrate 30 can bear the temperature higher than 600 DEG C.Certainly, along with the difference of manufacturing process, material and the heatproof upper limit of hard substrate 30 also can adjust thereupon, not with the above-mentioned system that is limited, as long as hard substrate 30 can tolerate follow-up manufacturing process temperature.
Then, form a release layer 110 (step 12) on hard substrate 30, in the present embodiment, release layer 110 covers whole surperficial 32 of hard substrate 30.The material of release layer 110 comprises the inorganic material of sheet hexagonal structure, such as, be cadmium sulfide micro Nano material, hydroxide nanoparticle material, sheet hexagonal structure silver, boron nitride, mica or talcum.
For example, the material of release layer 110 can select the micro Nano material of the cadmium sulfide of hexagonal plate, and its particle diameter is micron order, and thickness is nanoscale.Manufacture about the cadmium sulfide crystal of hexagonal plate can be made with reference to " hydrothermal growth of hexagonal prism and hexagonal plate CdS crystal " of artificial crystallography report (JOURNAL OF SYNTHETIC CRYSTALS) volume the 4th phase August the 34th in 2005.Thereafter the cadmium sulfide crystal of hexagonal plate is dissolved in toluene (Toluene), hexane (Hexanes), methenyl choloride (Chloroform), methylene chloride (Dichloromethane), methyl alcohol (Methanol) or water, makes cadmium sulfide solution and be beneficial to be coated on hard substrate 30.
Or, the material of release layer 110 also can select hexagonal plate silver powder, and the manufacture about hexagonal plate silver powder can be prepared with reference to " synthesis of hexagonal plate silver powder " of volume the 4th phase in PM technique (Powder Metallurgy Techonology) August the 21st in 2003.The mode that the solution of the release layer 110 prepared or powder can be coated with or spray is formed on hard substrate 30.
Certainly, above-mentionedly only enumerate the material of release layer 110 of part and enforceable preparation method, the material of release layer 110 and preparation method are not made with above-mentioned being limited.In the present embodiment, release layer 110 is in order to tolerate follow-up high temperature manufacturing process, and its glass transition temperature need higher than 600 DEG C, in other embodiments, the temperature requirements of the visual manufacturing process of the glass transition temperature needed for the material of release layer 110 and different, not as restriction.
Come again, refer to Figure 1B, form a cushion 120 (step 13) on release layer 110.In the present embodiment, cushion 120 has higher water wettability, the follow-up material be formed in above cushion 120 can be allowed more entirely can be formed in hard substrate 30 with on release layer 110, the material of cushion 120 can be monox (SiOx), silicon nitride (SiNx) or its combination (SiOx/SiNx) etc., but the material of cushion 120 is not as restriction.
Then, refer to Fig. 1 C, form an electronic component 130 (step 14) on cushion 120.In the present embodiment, electronic component 130 comprises multiple thin film transistor (TFT) or multiple touch control components etc., but the kind of electronic component 130 is not as restriction.
Come again, by release layer 110, cushion 120 and electronic component 130 are separated (step 15) on hard substrate 30.In the present embodiment, release layer 110 is peelable in hard substrate 30, is separated on hard substrate 30 to make cushion 120 and electronic component 130.The cushion 120 of the present embodiment, from the process of shape, can be used to the temporary transient supporting layer being used as electronic component 130, can intactly depart from hard substrate 30 to make electronic component 130.In addition, in Fig. 1 D, after peeling off hard substrate 30, the release layer 110 on cushion 120 is still considerably complete, but in other embodiments, release layer 110 also may be distributed on cushion 120 unevenly.That is, release layer 110 some can to remain on hard substrate 30 another part along with cushion 120 and is separated on hard substrate 30, and even some release layer 110 may peel off.
Come again, refer to Fig. 1 E, one first flexible substrate 140 is formed on cushion 120 and electronic component 130, wherein cushion 120 (step 16) between electronic component 130 and the first flexible substrate 140.First flexible substrate 140 can be a ultra-thin glass, a plastic film or a stainless steel layer etc., wherein plastic film is such as pi (PI), ethylene terephthalate (PET), the material of tygon (PEN) or polycarbonate (PC) etc., but the kind of the first flexible substrate 140 is not as restriction.
In the present embodiment, the first flexible substrate 140 is formed in the below of release layer 110, cushion 120 and electronic component 130, and release layer 110 is between the first flexible substrate 140 and cushion 120.But in other embodiments, release layer 110 also can be removed after cushion 120 by fabricator, then the first flexible substrate 140 is formed the below of cushion 120 and electronic component 130, directly contact with cushion 120 to make the first flexible substrate 140.
In addition, in the present embodiment, by being coated with a plastic cement solution in the side away from electronic component 130 of cushion 120, and curing plastic solution is to form the first flexible substrate 140, and completes the preparation of bendable element 100.In other embodiments, the mode that the first flexible substrate 140 also can bond is formed on cushion 120 and electronic component 130, and the generation type of the first flexible substrate 140 is not with the above-mentioned system that is limited.
As referring to figure 1e, the bendable element 100 of the present embodiment comprises one first flexible substrate 140, release layer 110, cushion 120 and an electronic component 130.In the present embodiment, cushion 120 is configured in above the first flexible substrate 140, and release layer 110 is evenly distributed between the first flexible substrate 140 and cushion 120, and electronic component 130 is configured on cushion 120.But in other embodiments, due to release layer 110 be separated with hard substrate 30 time, may have part remains on hard substrate 30, therefore, release layer 110 is also likely be distributed between the first flexible substrate 140 and cushion 120 unevenly, even release layer 110 also can be removed by fabricator in advance on cushion 120, and the first flexible substrate 140 of follow-up formation is directly contacted with cushion 120.
To make display panel, by after the first flexible substrate 140 forms cushion 120 and electronic component 130, refer to Fig. 1 F, (step 17) can be formed on display element 150 a to electronic component 130 further to form a flexible type display panel 100 '.Display element 150 can include OLED (Organic light emitting diode, be called for short OLED), electrophoretic display device (EPD) (Eletrophoretic Display, be called for short EPD), electric wet-type display (Electrowetting Display, be called for short EWD) or liquid crystal display (Liquid Crystal Display, be called for short LCD) etc., but the kind of display element 150 is not as restriction.
Generally speaking, the manufacture method of the bendable element of the present embodiment comprises at least following steps.Utilization can resistant to elevated temperatures hard substrate 30 as support substrate, first on hard substrate 30, form release layer 110, release layer 110 is formed cushion 120, and complete the preparation of electronic component 130 of high temperature on cushion 120 after, easily cushion 120 and electronic component 130 are departed from hard substrate 30 by release layer 110, thereafter the first flexible substrate 140 is configured in cushion 120 with on electronic component 130, to produce bendable element 100.Because the glass transition temperature of the first flexible substrate 140 is lower than the manufacturing process temperature of electronic component 130, in the present embodiment, first flexible substrate 140 is just formed in cushion 120 with on electronic component 130 after electronic component 130, can avoid the first flexible substrate 140 of non-refractory that the situation melted occurs when carrying out the high temperature manufacturing process of electronic component 130.
Fig. 2 A to Fig. 2 I is the schematic flow sheet of the manufacture method of a kind of bendable element according to another embodiment of the present invention.Fig. 2 J is the step schematic diagram of the manufacture method of the bendable element of Fig. 2 A to Fig. 2 I.The manufacture method 20 of the bendable element of the present embodiment comprises the following steps.Refer to Fig. 2 A, a hard substrate 30(step 21 be provided), and form a release layer 210 on hard substrate 30 (step 22).In the present embodiment, the surface 32 of hard substrate 30 comprises one first district 34 and one second district 36.Release layer 210 covers the first district 34 of hard substrate 30, namely refers to the middle section on the surface 32 of hard substrate 30.
Then, refer to Fig. 2 B, form a cushion 220 on release layer 210 (step 23).In the present embodiment, cushion 220 covers the release layer 210 be positioned in the first district 34, and extend to surface 32 the second district 36 to cover hard substrate 30.In the present embodiment, the second district 36 is the position beyond the first district 34 on face 32.As shown in Figure 2 B, the second district 36 is positioned at the first district 34 around.The thickness of cushion 220 in the second district 36 optionally adds the thickness of release layer 210 close to the thickness of cushion 220 in the first district 34, flushes on the surface away from hard substrate 30 to enable cushion 220.
Come again, refer to Fig. 2 C, form electronic component 230 on cushion 220 (step 24).Then, Fig. 2 D is referred to, the second district 36 of excision hard substrate 30, the portion of buffer layer 220 being positioned at the second district 36 and portions of electronics element 230(step 25).In the present embodiment, because electronic component 230 is formed on whole cushion 220, therefore when carrying out the action of excising, the part that electronic component 230 drops on the second district 36 can be resected to.But in other embodiments, electronic component 230 also can being only formed in the first district 34, and thus, this is when carrying out the action of excising, just only can being resected to the second district 36 of hard substrate 30 and being positioned at the portion of buffer layer 220 in the second district 36.
After carrying out above-mentioned excision action, as shown in Figure 2 E, hard substrate 30 will only be left the first district 34 and can have release layer 210 between cushion 220 and hard substrate 30.To make display panel, then then, refer to Fig. 2 F, display element 250 is formed on electronic component 230 (step 26).Come again; as shown in Figure 2 G; configure the side (step 27) away from electronic component 230 of a flexible substrate 260 at display element 250; to protect display element 250; wherein flexible substrate 260 can be a ultra-thin glass or a clear plastic film, but the kind of flexible substrate 260 is not as restriction.In the present embodiment, the mode that flexible substrate 260 is configured in display element 250 is by being first coated with the side away from electronic component 230 of a glue-line 255 at display element 250, then flexible substrate 260 is pasted to display element 250 by glue-line 255.Certainly, in other embodiments, also directly can be coated with plastic cement solution on display element 250 and the action that it is cured, and form flexible substrate 260.
Then, as illustrated in figure 2h, by release layer 210, cushion 220 and electronic component 230 are separated (step 28) on hard substrate 30.Finally, as shown in figure 2i, another flexible substrate 240 is formed on cushion 220 and electronic component 230, to complete bendable element 200(step 29), the bendable element 200 of the present embodiment is flexible type display panel, but the kind of bendable element 200 is not as restriction.In the present embodiment, release layer 210 is between flexible substrate 240 and cushion 220.After release layer 210 also can first be removed by fabricator on cushion 220, then flexible substrate 240 is formed on cushion 220 and electronic component 230.
In addition, in the present embodiment, the mode be formed in by flexible substrate 240 on cushion 220 and electronic component 230 is first coated with the side away from electronic component 230 of a glue-line 235 at cushion 220, then flexible substrate 240 is pasted to release layer 210 by glue-line 235.In other embodiments, bendable element 200 also can economize the step of configure flexible substrate 260, that is, saves step 27, directly carry out step 28 after step 26.
It is worth mentioning that, in the present embodiment, be after elder generation makes display element 250 and flexible substrate 260 on electronic component 230, then carry out release step.In other embodiments, because high temperature manufacturing process completes when forming electronic component 230, therefore, in the second district 36 of excision hard substrate 30, the portion of buffer layer 220 being positioned at the second district 36 and portions of electronics element 230(step 25) after, also the action as step 28 can also first be carried out, that is, first cushion 220 is separated by release layer 210 with electronic component 230 on hard substrate 30.Afterwards, then carry out step 26, flexible substrate 240 is formed on cushion 220 and electronic component 230.Then, then carry out step 27, electronic component 230 is formed display element 250 and flexible substrate 260.Certainly, the production order of bendable element 200 is not with the above-mentioned system that is limited, as long as flexible substrate 240 is formed at cushion 220 again with on electronic component 230 after the high temperature manufacturing process of electronic component 230 completes.
In sum, bendable element of the present invention and manufacture method thereof, utilization can resistant to elevated temperatures hard substrate as support substrate, first on hard substrate, form release layer, release layer forms cushion, and after completing the preparation of the electronic component of high temperature on the buffer layer, can easily cushion and electronic component be departed from hard substrate by release layer, thereafter flexible substrate is configured on cushion and electronic component, to produce bendable element.Because flexible substrate is just formed on cushion and electronic component after electronic component, the flexible substrate of non-refractory can be avoided to occur when the high temperature manufacturing process of electronic component to melt or rotten situation.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (32)
1. a manufacture method for bendable element, is characterized in that, comprising:
Hard substrate is provided;
Form release layer on this hard substrate;
Form cushion on this release layer;
Form electronic component on this cushion;
By this release layer, this cushion and this electronic component are separated on this hard substrate; And
Be formed in by first flexible substrate on this cushion and this electronic component, wherein this cushion is between this electronic component and this first flexible substrate.
2. the manufacture method of bendable element according to claim 1, is characterized in that, forms the method for this release layer on this hard substrate and comprises the surface making this release layer cover this hard substrate.
3. the manufacture method of bendable element according to claim 1, is characterized in that, forms the method for this release layer on this hard substrate and comprises the firstth district making this release layer cover the surface of this hard substrate.
4. the manufacture method of bendable element according to claim 3, is characterized in that, the method forming this cushion comprises makes this cushion cover this release layer in this firstth district in place, and the secondth district extending to this surface is to cover this hard substrate.
5. the manufacture method of bendable element according to claim 4, it is characterized in that, before by this release layer this cushion and this electronic component being separated on this hard substrate, also further this hard substrate of excision this secondth district and be positioned at this cushion in this secondth district.
6. the manufacture method of bendable element according to claim 1, is characterized in that, the method that this first flexible substrate is formed on this cushion and this electronic component is comprised:
Coated glue layer is in the side away from this electronic component of this cushion; And
Attach this first flexible substrate to this glue-line.
7. the manufacture method of bendable element according to claim 1, is characterized in that, the method that this first flexible substrate is formed on this cushion and this electronic component is comprised:
Coating plastic cement solution is in the side away from this electronic component of this cushion; And
Solidify this plastic cement solution to form this first flexible substrate.
8. the manufacture method of bendable element according to claim 1, is characterized in that, is also included in after being formed on this cushion and this electronic component by this first flexible substrate, forms display element on this electronic component.
9. the manufacture method of bendable element according to claim 8, is characterized in that, also comprise:
Configure the side away from this electronic component of the second flexible substrate at this display element.
10. the manufacture method of bendable element according to claim 8, is characterized in that, this display element includes OLED, electrophoretic display device (EPD), electric wet-type display or liquid crystal display.
The manufacture method of 11. bendable elements according to claim 1, is characterized in that, the material of this release layer comprises the inorganic material of sheet hexagonal structure.
The manufacture method of 12. bendable elements according to claim 1, is characterized in that, the material of this release layer comprises cadmium sulfide micro Nano material, hydroxide nanoparticle material, sheet hexagonal structure silver, boron nitride, mica or talcum.
The manufacture method of 13. bendable elements according to claim 1, is characterized in that, this electronic component comprises multiple thin film transistor (TFT) or multiple touch control component.
The manufacture method of 14. bendable elements according to claim 1, is characterized in that, this release layer is formed on this hard substrate with coating or the mode of spraying.
The manufacture method of 15. bendable elements according to claim 1, is characterized in that, the glass transition temperature of the material of this release layer is higher than 600 DEG C.
The manufacture method of 16. bendable elements according to claim 1, is characterized in that, this cushion comprises monox, silicon nitride or its combination.
The manufacture method of 17. bendable elements according to claim 1, is characterized in that, this first flexible substrate comprises ultra-thin glass, plastic film or stainless steel layer.
The manufacture method of 18. bendable elements according to claim 17, it is characterized in that, this plastic film comprises pi, ethylene terephthalate, tygon or polycarbonate.
The manufacture method of 19. bendable elements according to claim 1, is characterized in that, this hard substrate is glass substrate, ceramic substrate or or stainless-steel sheet.
20. 1 kinds of bendable elements, is characterized in that, comprising:
First flexible substrate;
Cushion, is configured on this first flexible substrate; And
Electronic component, is configured on this cushion.
21. bendable elements according to claim 20, is characterized in that, also comprise release layer, and between this first flexible substrate and this cushion, the material of this release layer comprises the inorganic material of sheet hexagonal structure.
22. bendable elements according to claim 21, is characterized in that, this release layer is distributed between this first flexible substrate and this cushion unevenly.
23. bendable elements according to claim 21, is characterized in that, the material of this release layer comprises cadmium sulfide micro Nano material, hydroxide nanoparticle material, sheet hexagonal structure silver, boron nitride, mica or talcum.
24. bendable elements according to claim 21, is characterized in that, the glass transition temperature of the material of this release layer is higher than 600 DEG C.
25. bendable elements according to claim 20, is characterized in that, this cushion comprises monox, silicon nitride or its combination.
26. bendable elements according to claim 20, is characterized in that, also comprise display element, be configured on this electronic component.
27. bendable elements according to claim 26, is characterized in that, also comprise:
Second flexible substrate, is configured on this display element.
28. bendable elements according to claim 20, is characterized in that, also comprise glue-line, are configured between this first flexible substrate and this cushion.
29. bendable elements according to claim 20, is characterized in that, this electronic component comprises multiple thin film transistor (TFT) or multiple touch control component.
30. bendable elements according to claim 20, it is characterized in that, this display element includes OLED, electrophoretic display device (EPD), electric wet-type display or liquid crystal display.
31. bendable elements according to claim 20, is characterized in that, this first flexible substrate comprises ultra-thin glass, plastic film or stainless steel layer.
32. bendable elements according to claim 31, it is characterized in that, this plastic film comprises pi, ethylene terephthalate, tygon or polycarbonate.
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| Application Number | Priority Date | Filing Date | Title |
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| TW102138515 | 2013-10-24 | ||
| TW102138515 | 2013-10-24 | ||
| TW102139102 | 2013-10-29 | ||
| TW102139102A TW201517251A (en) | 2013-10-24 | 2013-10-29 | Flexible device and manufacturing method thereof |
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| CN104576971A true CN104576971A (en) | 2015-04-29 |
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| CN201410130932.8A Pending CN104576971A (en) | 2013-10-24 | 2014-04-02 | Flexible element and manufacturing method thereof |
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