CN104576566B - Module integrated circuit packaging structure and preparation method thereof - Google Patents
Module integrated circuit packaging structure and preparation method thereof Download PDFInfo
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- CN104576566B CN104576566B CN201310479116.3A CN201310479116A CN104576566B CN 104576566 B CN104576566 B CN 104576566B CN 201310479116 A CN201310479116 A CN 201310479116A CN 104576566 B CN104576566 B CN 104576566B
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Abstract
A kind of module integrated circuit packaging structure and preparation method thereof, module integrated circuit packaging structure includes：One base board unit, an electronic unit, an encapsulation unit, one first heat-sink unit and one second heat-sink unit.Base board unit includes a circuit substrate.Electronic unit includes multiple electronic components for being arranged on circuit substrate and being electrically connected at circuit substrate.Encapsulation unit includes a packing colloid for being arranged on circuit substrate and covering multiple electronic components.First heat-sink unit includes a heat dissipating substrate layer being set directly on the top surface of packing colloid.Second heat-sink unit includes multiple radiating auxiliary layers being set directly on the top surface of heat dissipating substrate layer.Thereby, the present invention can be by the design of " be arranged on packing colloid heat dissipating substrate layer " and " being arranged on multiple radiating auxiliary layers on heat dissipating substrate layer ", with the heat dissipation of effective hoisting module integrated circuit package structure.
Description
Technical field
It is espespecially a kind of to be used for heat radiation effect the present invention relates to a kind of module integrated circuit packaging structure and preparation method thereof
Module integrated circuit packaging structure of energy and preparation method thereof.
Background technology
In recent years, scientific and technological Fast Growth so that the numerous and confused application towards combination science and technology of various products, and it is also continuous
Ground is among progress.Additionally due to the function of product is more and more so that current most product is all to use module
The mode of change carrys out Integration Design.However, integrating the module of a variety of difference in functionalitys in the product, although obtain so that the function of product is big
Width increase, but under the demand for being particular about product miniaturization and attractive appearance now, how to design and have small product size concurrently
Small and multi-functional product is current all trades and professions all in the target strongly studied.
And be constantly to be made by the evolution of process technique with the technology of increasingly high-order in terms of semiconductor manufacturing
The chip or element of small volume are produced, is able to design less functional module so that the Module manufacturers of application are relative, and then
End product can be allowed to utilize and arrange in pairs or groups as more effective.It is well known, however, that functional module does not have provides conductive structure in addition
Carry out heat radiation efficiency.Therefore, how by structure design improvement come the radiating effect of enhanced feature module, it has also become this thing
The important topic of industry occurrences in human life.
The content of the invention
The embodiment of the present invention is to provide a kind of module integrated circuit packaging structure and its system for heat radiation efficiency
Make method.
A kind of module integrated circuit packaging structure for heat radiation efficiency that a wherein embodiment of the invention is provided,
It includes：One base board unit, an electronic unit, an encapsulation unit, one first heat-sink unit and one second heat-sink unit.The base
Slab element includes a circuit substrate.The electronic unit includes multiple being arranged on the circuit substrate and being electrically connected at described
The electronic component of circuit substrate.The encapsulation unit is arranged on the circuit substrate including one and covers multiple electronics members
The packing colloid of part.First heat-sink unit includes a heat dissipating substrate being set directly on the top surface of the packing colloid
Layer.Second heat-sink unit includes multiple radiating auxiliary layers being set directly on the top surface of the heat dissipating substrate layer.
A kind of module integrated circuit packaging structure for heat radiation efficiency that the other embodiment of the present invention is provided,
It includes：One base board unit, an electronic unit, an encapsulation unit, one first heat-sink unit and one second heat-sink unit.The base
Slab element includes a circuit substrate.The electronic unit is arranged on the circuit substrate including at least one and is electrically connected at institute
The first electronic component and at least one for stating circuit substrate are arranged on the circuit substrate and are electrically connected at the circuit substrate
The second electronic component, heat described in wherein at least one produced by first electronic component is more than the second electronic component at least described in one
Produced heat.The encapsulation unit is arranged on the circuit substrate including one and covers the first electronic component at least described in one
And at least described in one second electronic component packing colloid.First heat-sink unit is set directly at the packaging plastic including one
Heat dissipating substrate layer on the top surface of body.Second heat-sink unit includes multiple top surfaces for being set directly at the heat dissipating substrate layer
On the first radiating auxiliary layer and multiple the second radiating auxiliary layers being set directly on the top surface of heat dissipating substrate layer, wherein
Multiple first radiating auxiliary layers are located at the top of the first electronic component at least described in one, multiple second radiating auxiliary layers
Total surface area positioned at the top of the second electronic component at least described in one, and multiple first radiating auxiliary layers is more than multiple institutes
State the total surface area of the second radiating auxiliary layer.
A kind of modular integrated circuit for heat radiation efficiency that another embodiment in addition of the invention is provided encapsulates knot
The preparation method of structure, it comprises the following steps：One circuit substrate is provided；Multiple electronic components are arranged on the circuit substrate
On, to be electrically connected at the circuit substrate；In forming a packing colloid on the circuit substrate, to cover multiple electronics
Element；In formed on the top surface of the packing colloid heat dissipating substrate layer；In the heat dissipating substrate layer top surface on a figure is set
Case template, wherein the patterned template has running through for multiple a part of upper surfaces for the exposed heat dissipating substrate layer
Opening；Multiple radiating auxiliary layers are filled in multiple described in opening, the plurality of radiating auxiliary layer setting respectively
On the portion of upper surface of heat dissipating substrate layer；And, remove the patterned template.
Beneficial effects of the present invention can be, module integrated circuit packaging structure that the embodiment of the present invention is provided and its
Preparation method, it can be by the way that " first heat-sink unit includes a radiating being set directly on the top surface of the packing colloid
Basalis " and " second heat-sink unit includes multiple radiatings auxiliary being set directly on the top surface of heat dissipating substrate layer
The design of layer ", with the heat dissipation of effective hoisting module integrated circuit package structure.
To enable the feature and technology contents that are further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, but institute's accompanying drawings are only provided and used with reference to explanation, not for the present invention person of being any limitation as.
Brief description of the drawings
Fig. 1 is the system of the disclosed module integrated circuit packaging structure for heat radiation efficiency of first embodiment of the invention
Make the flow chart of method.
Fig. 2 is the step S100 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 3 is the step S102 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 4 is the step S104 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 5 is the step S106 of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention section
Schematic diagram.
Fig. 6 is the step S108 and module of the preparation method of the module integrated circuit packaging structure of first embodiment of the invention
The diagrammatic cross-section of integrated circuit package structure.
Fig. 7 extends to circuit substrate for the heat dissipating substrate layer of the module integrated circuit packaging structure of first embodiment of the invention
The outer diagrammatic cross-section around surrounding.
Fig. 8 is the diagrammatic cross-section of the module integrated circuit packaging structure of second embodiment of the invention.
Fig. 9 is the upper schematic diagram of the base board unit of second embodiment of the invention.
Figure 10 is the diagrammatic cross-section of the module integrated circuit packaging structure of third embodiment of the invention.
Figure 11 is the diagrammatic cross-section of the module integrated circuit packaging structure of fourth embodiment of the invention.
Figure 12 is the upper schematic diagram of the base board unit of fourth embodiment of the invention.
Figure 13 is the diagrammatic cross-section of the module integrated circuit packaging structure of fifth embodiment of the invention.
【Symbol description】
Module integrated circuit packaging structure Z
Base board unit 1
Circuit substrate 10
Outside around surrounding 100
Ground plane 11
Outer conducting structure 12
Outer conducting layer 120
Chadless 121
Interior conductive structure 13
Inner conducting layer 130
First end 1301
Second end 1302
Electronic unit 2
Electronic component 20
First electronic component 21
Second electronic component 22
Encapsulation unit 3
Packing colloid 30
Top surface 300
First heat-sink unit 4
Heat dissipating substrate layer 40
Top surface 400
Portion of upper surface 401
Second heat-sink unit 5
Radiate auxiliary layer 50
First radiating auxiliary layer 51
Second radiating auxiliary layer 52
Patterned template S
Through open S 10
Embodiment
(first embodiment)
Refer to shown in Fig. 1 to Fig. 6, the present invention provides a kind of modular integrated circuit for heat radiation efficiency and encapsulates knot
Structure Z preparation method, it comprises the following steps：
First, step S100 is：Coordinate shown in Fig. 1 and Fig. 2 there is provided a circuit substrate 10, then, by multiple electronic components
20 are arranged on circuit substrate 10 to be electrically connected at circuit substrate 10, are subsequently formed a packing colloid 30 in circuit substrate 10
On, to cover multiple electronic components 20.For further, multiple electronic components 20 can be distinguished at least one first electronic component
21 and at least one second electronic component 22, and heat at least produced by one first electronic component 21 can be more than at least one second electricity
Heat produced by subcomponent 22.For example, multiple electronic components 20 can be resistance, electric capacity, inductance or with a predetermined function
Semiconductor chip etc., packing colloid 30 can be silicones（silicone）Or epoxy resin（epoxy）Made is non-
Gelatin body, but the present invention is not limited.
Then, step S102 is：Coordinate shown in Fig. 1, Fig. 2 and Fig. 3, form heat dissipating substrate layer 40 in packing colloid 30
On top surface 300.For example, heat dissipating substrate layer 40 can be metal material layer, grapheme material layer or any with high heat conduction energy
The material layer of power, but the present invention is not limited.
Then, step S104 is：Coordinate shown in Fig. 1, Fig. 3 and Fig. 4, a patterned template S is set in heat dissipating substrate layer 40
Top surface 400 on, there are multiple a part of upper surfaces 401 for exposed heat dissipating substrate layer 40 to pass through by wherein patterned template S
Wear open S 10.Can be square, trapezoidal or arbitrary shape through open S 10 according to different design requirements for further
Shape, but the present invention is not limited.
Next, step S106 is：Coordinate shown in Fig. 1, Fig. 4 and Fig. 5, multiple radiating auxiliary layers 50 are filled respectively in multiple
In open S 10, plurality of radiating auxiliary layer 50 is arranged on the portion of upper surface 401 of heat dissipating substrate layer 40.More enter one
For step, multiple radiating auxiliary layers 50 can be distinguished into multiple first radiating auxiliary layers 51 and multiple second radiating auxiliary layers 52, many
Individual first radiating auxiliary layer 51 can be located at the top of at least one first electronic component 21, and multiple second radiating meetings of auxiliary layer 52
Positioned at the top of at least one second electronic component 22.For example, multiple radiating auxiliary layers 50 can be metal material layer, graphene
Material layer or any material layer with high heat conduction ability, but the present invention is not limited.
Finally, step S108 is：Coordinate shown in Fig. 1, Fig. 5 and Fig. 6, remove patterned template S, with completely exposed multiple the
One radiating auxiliary layer 51 and multiple second radiating auxiliary layers 52.For further, multiple first radiating auxiliary layers 51 and air
The total surface area of contact can be more than the total surface area of the multiple second radiating auxiliary layers 52 and air contact.
In summary, as shown in fig. 6, according to above-mentioned provided preparation method, first embodiment of the invention can be provided
A kind of module integrated circuit packaging structure Z for heat radiation efficiency, it includes：One base board unit 1, an electronic unit 2, one
Encapsulation unit 3, one first heat-sink unit 4 and one second heat-sink unit 5.Base board unit 1 includes a circuit substrate 10.Electronic unit
2 include multiple electronic components 20 for being arranged on circuit substrate 10 and being electrically connected at circuit substrate 10.Encapsulation unit 3 includes one
It is arranged on circuit substrate 10 and covers the packing colloid 30 of multiple electronic components 20.First heat-sink unit 4 is directly set including one
Put the heat dissipating substrate layer 40 on the top surface 300 of packing colloid 30.Second heat-sink unit 5 is set directly at radiating base including multiple
Radiating auxiliary layer 50 on the top surface 400 of bottom 40.
For further, as shown in fig. 6, according to above-mentioned provided preparation method, first embodiment of the invention can be with
A kind of module integrated circuit packaging structure Z for heat radiation efficiency is provided, it includes：One base board unit 1, an electronic unit
2nd, an encapsulation unit 3, one first heat-sink unit 4 and one second heat-sink unit 5.Base board unit 1 includes a circuit substrate 10.Electronics
Unit 2 includes at least one the first electronic component 21 and at least for being arranged on circuit substrate 10 and being electrically connected at circuit substrate 10
One is arranged on circuit substrate 10 and is electrically connected at the second electronic component 22 of circuit substrate 10, the electronics of wherein at least one first
Heat produced by element 21 can be more than the heat at least produced by one second electronic component 22.Encapsulation unit 3 is arranged on electricity including one
On base board 10 and covering at least one first electronic component 21 and at least packing colloid 30 of one second electronic component 22.First dissipates
Hot cell 4 includes a heat dissipating substrate layer 40 being set directly on the top surface 300 of packing colloid 30.Second heat-sink unit 5 includes
Multiple the first radiating auxiliary layers 51 being set directly on the top surface 400 of heat dissipating substrate layer 40 and multiple it is set directly at radiating base
The second radiating auxiliary layer 52 on the top surface 400 of bottom 40, plurality of first radiating auxiliary layer 51 can be located at least one first
The top of electronic component 21, multiple second radiating auxiliary layers 52 can be located at the top of at least one second electronic component 22, and many
The total surface area of individual first radiating auxiliary layer 51 and air contact can be more than the multiple second radiating auxiliary layers 52 and air contact
Total surface area.
It is noted that as shown in fig. 7, heat dissipating substrate layer 40 can one be extended from the top surface 300 of packing colloid 30
To the metal screen layer of the outer circular surrounding 100 of circuit substrate 10, to be supplied to module integrated circuit packaging structure Z to reach electrically
Shield effectiveness.In other words, module integrated circuit packaging structure Z provided by the present invention not only can effective heat radiation efficiency,
It can also achieve electrical shield effectiveness.
(second embodiment)
Refer to shown in Fig. 8 and Fig. 9, second embodiment of the invention can provide a kind of module for heat radiation efficiency
Integrated circuit package structure Z, it includes：One base board unit 1, an electronic unit 2, an encapsulation unit 3, one first heat-sink unit 4
And one second heat-sink unit 5.From Fig. 8 and Fig. 7 comparison, the second embodiment of the invention difference maximum with first embodiment
It is：
First, in a second embodiment, base board unit 1 is arranged on the inside of circuit substrate 10 and by circuit substrate 10 including one
The ground plane 11, one coated completely is arranged on the setting of outer conducting structure 12 and one in the outer circular surrounding 100 of circuit substrate 10
In the inside of circuit substrate 10 and it is electrically connected at the interior conductive structure 13 between ground plane 11 and outer conducting structure 12.In addition, outer
Conductive structure 12 includes multiple outer conducting layers 120 being arranged in the outer circular surrounding 100 of circuit substrate 10.Outer conducting structure 12
It is arranged on including multiple in the outer circular surrounding 100 of circuit substrate 10 and through the chadlesses 121 of circuit substrate 10, and it is multiple
Outer conducting layer 120 is separately positioned on the inner surface of multiple chadlesses 121.Interior conductive structure 13 include it is multiple correspond respectively to it is many
The inner conducting layer 130 of individual outer conducting layer 120, and two opposite ends of each inner conducting layer 130 directly connect respectively
Stratum 11 and corresponding outer conducting layer 120.
In addition, in a second embodiment, multiple electronic components 20 can be electrically connected at ground plane by circuit substrate 10
11.For example, at least one is electrically connected at electronic component 20 as the inside of circuit substrate 10 of Multi-layer circuit board structure
Conductive structure design between ground plane 11, make it that multiple electronic components 20 of electronic unit 2 can be by circuit substrate 10
To be electrically connected at ground plane 11.Furthermore, heat dissipating substrate layer 40 can for one extend to circuit substrate 10 outer circular surrounding 100 and
The metal screen layer of outer conducting structure 12 is directly contacted, and ground plane 11 can sequentially pass through interior conductive structure 13 and outer conductive knot
Structure 12, to be electrically connected at metal screen layer.
(3rd embodiment)
Refer to shown in Figure 10, it is integrated that third embodiment of the invention can provide a kind of module for heat radiation efficiency
Circuit encapsulating structure Z, it includes：One base board unit 1, an electronic unit 2, an encapsulation unit 3, one first heat-sink unit 4 and one
Second heat-sink unit 5.From Figure 10 and Fig. 8 comparison, the third embodiment of the invention difference maximum with second embodiment exists
In：In the third embodiment, base board unit 1 is arranged on circuit including a ground plane 11 and one being arranged on inside circuit substrate 10
The outer outer conducting structure 12 in surrounding 100 of the one of substrate 10.In addition, outer conducting structure 12 is arranged on circuit base including multiple
Outer conducting layer 120 in the outer circular surrounding 100 of plate 10.The outer circular surrounding 100 of ground plane 11 from circuit substrate 10 is exposed, with
Multiple outer conducting layers 120 are directly contacted, and multiple electronic components 20 can be electrically connected at ground plane by circuit substrate 10
11.In addition, heat dissipating substrate layer 40 can extend to the outer circular surrounding 100 of circuit substrate 10 and directly contact outer conducting structure for one
12 metal screen layer, and ground plane 11 can be directly by multiple outer conducting layers 120 of outer conducting structure 12, to be electrically connected with
In metal screen layer.
(fourth embodiment)
Refer to shown in Figure 11 and Figure 12, fourth embodiment of the invention can provide a kind of mould for heat radiation efficiency
Block integrated circuit package structure Z, it includes：One base board unit 1, an electronic unit 2, an encapsulation unit 3, one first heat-sink unit
4 and one second heat-sink unit 5.From Figure 11 and Fig. 7 comparison, the fourth embodiment of the invention difference maximum with first embodiment
It is not：In the fourth embodiment, base board unit 1 is arranged on the inside of circuit substrate 10 including one and wrapped completely by circuit substrate 10
The ground plane 11 and one covered is arranged on the inside of circuit substrate 10 and is electrically connected at the interior conductive structure 13 of ground plane 11.In addition,
Interior conductive structure 13 includes multiple inner conducting layers 130, and each inner conducting layer 130 has one directly to contact the first of ground plane 11
End 1301 and one is in contrast to first end 1301 and from the exposed second end of the outer circular surrounding 100 of circuit substrate 10
1302, and multiple electronic components 20 can be by the Multi-layer circuit board structure inside circuit substrate 10, to be electrically connected at ground connection
Layer 11.In addition, heat dissipating substrate layer 40 can be the metal screen layer of an outer circular surrounding 100 for extending to circuit substrate 10, metal
Screen layer can directly contact the second end 1302 of each inner conducting layer 130, and ground plane 11 can directly pass through interior conduction
Multiple inner conducting layers 130 of structure 13, to be electrically connected at metal screen layer.
(the 5th embodiment)
Refer to shown in Figure 13, it is integrated that fifth embodiment of the invention can provide a kind of module for heat radiation efficiency
Circuit encapsulating structure Z, it includes：One base board unit 1, an electronic unit 2, an encapsulation unit 3, one first heat-sink unit 4 and one
Second heat-sink unit 5.From Figure 13 and Figure 11 comparison, the fifth embodiment of the invention difference maximum with fourth embodiment exists
In：In the 5th embodiment, base board unit 1 includes one and is arranged on ground plane 11 inside circuit substrate 10, and ground plane 11 is from electricity
The outer circular surrounding 100 of base board 10 is exposed, and multiple electronic components 20 can be connect by circuit substrate 10 with being electrically connected at
Stratum 11.In addition, heat dissipating substrate layer 40 can be the metal screen layer of an outer circular surrounding 100 for extending to circuit substrate 10, gold
Category screen layer can be contacted directly from the exposed ground plane 11 of the outer circular surrounding 100 of circuit substrate 10, so as to obtain multiple electronics
Element 20 directly can be electrically connected at metal screen layer by ground plane 11.
(the possibility effect of embodiment)
In summary, beneficial effects of the present invention can be, the modular integrated circuit envelope that the embodiment of the present invention is provided
Assembling structure Z and preparation method thereof, it can be by the way that " the first heat-sink unit 4 includes a top surface 300 for being set directly at packing colloid 30
On heat dissipating substrate layer 40 " and " the second heat-sink unit 5 include it is multiple be set directly at heat dissipating substrate layer 40 top surface 400 on
The design of radiating auxiliary layer 50 ", with effective hoisting module integrated circuit package structure Z heat dissipation.
It the foregoing is only the preferred possible embodiments of the present invention, non-therefore the limitation present invention the scope of the claims, therefore such as
The equivalence techniques change done with description of the invention and schema content, is both contained in the scope of the present invention.
Claims (9)
1. a kind of module integrated circuit packaging structure, it is characterised in that the module integrated circuit packaging structure includes：
One base board unit, the base board unit includes a circuit substrate；
One electronic unit, the electronic unit is arranged on the circuit substrate and electrically connected with the circuit substrate including multiple
The electronic component connect；
One encapsulation unit, the encapsulation unit includes an encapsulation for being arranged on the circuit substrate and covering the electronic component
Colloid；
One first heat-sink unit, first heat-sink unit includes a radiating being set directly on the top surface of the packing colloid
Basalis；And
One second heat-sink unit, second heat-sink unit is set directly on the top surface of the heat dissipating substrate layer including multiple
Radiate auxiliary layer,
Wherein, the electronic component is distinguished at least one first electronic component and at least one second electronic component, and described first
Heat produced by electronic component is more than the heat produced by second electronic component, wherein the auxiliary heat radiation helps layer to be distinguished into
Multiple first radiating auxiliary layers and multiple second radiating auxiliary layers, the first radiating auxiliary layer are located at first electronic component
Top, it is described second radiating auxiliary layer be located at second electronic component top, and it is described first radiating auxiliary layer it is total
Surface area is more than the total surface area of the described second radiating auxiliary layer.
2. module integrated circuit packaging structure according to claim 1, it is characterised in that the heat dissipating substrate layer for one from
The top surface of the packing colloid extends to an outer metal screen layer around surrounding of the circuit substrate.
3. module integrated circuit packaging structure according to claim 1, it is characterised in that the base board unit is set including one
Put the inside of the circuit substrate and coated completely by the circuit substrate ground plane, one be arranged on the circuit substrate
Outer conducting structure and one outside one in surrounding are arranged on the inside of the circuit substrate and are electrically connected at the ground plane
Interior conductive structure between the outer conducting structure, wherein the outer conducting structure is arranged on the circuit substrate including multiple
Outer circular surrounding on outer conducting layer, the interior conductive structure includes multiple interior conductions for corresponding respectively to the outer conducting layer
Layer, two opposite ends of each inner conducting layer directly contact the ground plane and the corresponding outer conduction respectively
Layer, and the electronic component by the circuit substrate to be electrically connected at the ground plane, wherein the heat dissipating substrate layer be
One extends to the outer circular surrounding of the circuit substrate and the metal screen layer directly contacted with the outer conducting structure, and described
Ground plane is sequentially by the interior conductive structure and the outer conducting structure to be electrically connected at the metal screen layer.
4. module integrated circuit packaging structure according to claim 1, it is characterised in that the base board unit is set including one
Put the outer conduction being arranged in the ground plane of the inside of the circuit substrate and one outside the one of the circuit substrate on around
Structure, wherein the outer conducting structure includes multiple outer conducting layers being arranged in the outer circular surrounding of the circuit substrate, institute
The outer circular surrounding for stating ground plane from the circuit substrate is exposed directly to be contacted with the outer conducting layer, and the electronic component
By the circuit substrate to be electrically connected at the ground plane, wherein heat dissipating substrate layer extends to the circuit base for one
The outer circular surrounding of plate and the metal screen layer directly contacted with the outer conducting structure, and the ground plane is directly by described
Outer conducting structure is to be electrically connected at the metal screen layer.
5. module integrated circuit packaging structure according to claim 1, it is characterised in that the base board unit is set including one
Put in the inside of the circuit substrate and the ground plane and one that are coated completely by the circuit substrate are arranged on the circuit substrate
Inside and be electrically connected at the interior conductive structure of the ground plane, wherein the interior conductive structure includes multiple inner conducting layers,
Each described inner conducting layer have one directly contact the ground plane first end and one it is opposite with the first end and
From the one of the circuit substrate outer second end exposed around surrounding, and the electronic component by the circuit substrate with electricity
Property be connected to the ground plane, wherein heat dissipating substrate layer is an outer metal around surrounding for extending to the circuit substrate
Screen layer, the metal screen layer is directly contacted with the second end of inner conducting layer each described, and the ground plane
Directly by the interior conductive structure to be electrically connected at the metal screen layer.
6. module integrated circuit packaging structure according to claim 1, it is characterised in that the base board unit is set including one
The ground plane in the inside of the circuit substrate is put, the outer circular surrounding of the ground plane from the circuit substrate is exposed, and institute
Electronic component is stated by the circuit substrate to be electrically connected at the ground plane, wherein heat dissipating substrate layer extends to for one
The outer metal screen layer around surrounding of the circuit substrate, the metal screen layer is directly contacted from the outer of the circuit substrate
Around the exposed ground plane of surrounding, to cause the electronic component directly by the ground plane to be electrically connected at
State metal screen layer.
7. a kind of module integrated circuit packaging structure, it is characterised in that the module integrated circuit packaging structure includes：
One base board unit, the base board unit includes a circuit substrate；
One electronic unit, the electronic unit is arranged on the circuit substrate including at least one and is electrically connected at the circuit
First electronic component of substrate and at least one it is arranged on the circuit substrate and is electrically connected at the second of the circuit substrate
Electronic component, wherein the heat produced by first electronic component is more than the heat produced by second electronic component；
One encapsulation unit, the encapsulation unit be arranged on including one on the circuit substrate and cover first electronic component and
The packing colloid of second electronic component；
One first heat-sink unit, first heat-sink unit includes a radiating being set directly on the top surface of the packing colloid
Basalis；And
One second heat-sink unit, second heat-sink unit is set directly on the top surface of the heat dissipating substrate layer including multiple
First radiating auxiliary layer and multiple the second radiating auxiliary layers being set directly on the top surface of the heat dissipating substrate layer, wherein described
First radiating auxiliary layer is located at the top of first electronic component, and the second radiating auxiliary layer is located at second electronics member
The top of part, and total surface area of the total surface area more than the described second radiating auxiliary layer of the first radiating auxiliary layer.
8. a kind of preparation method of module integrated circuit packaging structure, it is characterised in that methods described comprises the following steps：
One circuit substrate is provided；
Multiple electronic components are arranged on the circuit substrate to be electrically connected at the circuit substrate；
A packing colloid is formed on the circuit substrate to cover the electronic component；
Heat dissipating substrate layer is formed on the top surface of the packing colloid；
The heat dissipating substrate layer top surface on a patterned template is set, wherein the patterned template have it is multiple be used for it is naked
Opening is run through in a part of upper surface for revealing heat dissipating substrate layer；
Multiple radiating auxiliary layers are filled in respectively it is described in opening, wherein the auxiliary heat radiation helps layer to be arranged on the radiating
On the portion of upper surface of basalis；And
The patterned template is removed,
Wherein, the electronic component is distinguished at least one first electronic component and at least one second electronic component, and described
Heat produced by one electronic component is more than the heat produced by second electronic component, wherein by the radiating auxiliary layer area
It is divided into multiple first radiating auxiliary layers and multiple second radiating auxiliary layers, the first radiating auxiliary layer is located at first electronics
The top of element, the second radiating auxiliary layer is located at the top of second electronic component, and the first radiating auxiliary layer
Total surface area be more than described second radiating auxiliary layer total surface area.
9. the preparation method of module integrated circuit packaging structure according to claim 8, it is characterised in that the radiating base
Bottom is an outer metal screen layer around surrounding that the circuit substrate is extended to from the top surface of the packing colloid.
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| CN201310479116.3A CN104576566B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and preparation method thereof |
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|---|---|---|---|
| CN201310479116.3A CN104576566B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and preparation method thereof |
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|---|---|---|---|---|
| CN103219298A (en) * | 2012-05-15 | 2013-07-24 | 日月光半导体制造股份有限公司 | Semiconductor package provided with heat dissipating structure and electromagnetic interference shielding function and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08204070A (en) * | 1995-01-20 | 1996-08-09 | Hitachi Ltd | Electronic part cooling structure |
| US6873043B2 (en) * | 2003-03-10 | 2005-03-29 | Delphi Technologies, Inc. | Electronic assembly having electrically-isolated heat-conductive structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219298A (en) * | 2012-05-15 | 2013-07-24 | 日月光半导体制造股份有限公司 | Semiconductor package provided with heat dissipating structure and electromagnetic interference shielding function and manufacturing method thereof |
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