CN104539533B - The method and its application of channel table are established according to each layer of TSV connection state in 3D NoC - Google Patents
The method and its application of channel table are established according to each layer of TSV connection state in 3D NoC Download PDFInfo
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Abstract
The invention discloses the method and its application that each layer of TSV connection state in a kind of NoC according to 3D establishes channel table, it is characterized in that the foundation of channel table is to establish most short circular path by shortest path first respectively for all upper channel nodes on each layer and lower channel node, record has next upper channel node and the lower channel address of node being in most short circular path in the channel table of each passage node；Record has closest upper channel node and lower channel node address in the channel table of ordinary node；A kind of isomery 3D NoC TSV Fault-tolerant Routing Algorithms based on upper and lower preference strategy utilize above-mentioned channel table, when carrying out interlayer transmission to packet, the available upper channel node of the node or lower channel address of node are obtained using the channel table of present node, the address is sent data packets to, data are transmitted by the passage node.The present invention can realize the valid data transmission in random scale isomery 3D NoC, and have TSV fault-tolerant and congestion relief function.
Description
Technical field
It is more specifically a kind of to be used for isomery 3D NoC structures the present invention relates to a kind of 3D NoC routing algorithms, have
Routing algorithm on fault-tolerant to failure TSV and the congestion effect of alleviation lower channel piece.
Background technology
3D NoC (Three-Dimension Network-on-Chip) are a kind of more by silicon clear opening (TSV) interconnection
Layer crystal justifies (die) and realizes the interconnection mode of Vertical collection.It overcomes component all in 2D-NoC all in a plane
The limitation of upper distribution, so as to obtain smaller volume, more preferable power consumption and radio-frequency performance.3D-NoC makes chip by Vertical collection
Integrated level increase substantially, by most experts be considered it is a kind of continue Moore's Law growth trend new method, turn into current
One of semiconductor industry technology with fastest developing speed.
Common 3D NoC topological structures have 3D Mesh, 3D Torus, three-dimensional stacked Mesh etc., wherein by numerous scholars
Widely studied structure is 3D Mesh.Traditional 3D Mesh structures are that a kind of 2D NoC by rule are formed by stacked on top
Regular 3D network structures, each interlayer realizes interlayer communication by TSV.These TSV are actually in wafer and wafer
Between manufacture a series of vertical conducting, for realizing the interconnection of chip chamber.One TSV just represents one and used in vertical direction
Carry out the data link of transmission signal.
Traditional 3D NoC on-chip routers are realized by extending 2D on-chip routers, are route on original 2D pieces
On the basis of device East, West, South, North and local 5 pairs of input/output ports, increase upper and lower two pairs of ports to realize vertical direction
Interlayer communication.Routing algorithm therein is also to realize the transmission of data by extending the routing algorithm in traditional 2D NoC,
Such as it is X-Y-Z routing algorithms to extend traditional X-Y dimension sequence routing algorithms, i.e., is first transferred to packet and purpose section in layer
The intermediate node of the same upright position of point, is then vertically transported to destination node by TSV again.In the industrial design of now,
Generally the module for realizing difference in functionality is placed on the different layers of 3D chips, such as most last layer places CPU core, intermediate layer is placed
RAM and ROM, bottom place communication module.Such design is difficult to accomplish that the network node layout on each layer is consistent, so as to lead
Cause some routing nodes to have passage up or down, that is, there is TSV to be connected, and some nodes do not have vertical direction passage then.This
The structure of sample is difficult to reach the purpose of transmission packet using traditional 3D routing algorithms.
Nowadays, chip manufacturing process enters below 65 nanoscales, and manufacturing process becomes increasingly complex, and manufacture difficulty is increasingly
Greatly.TSV size only has 10 microns, and TSV manufacturing technologies are ripe not enough at present, and manufacturing cost is high, and is easily making
Occur situations such as cavity, fracture, align by mistake during making and cause TSV to fail.One 65nm CMOS technologies process technology manufacture
Silicon, 46%-65% cost overhead has been used in TSV processing.Therefore, TSV quantity should be lacked as far as possible, and
Routing algorithm on piece is needed to have the function of carrying out fault restoration to TSV failures.
Therefore, it is necessary to a kind of 3D NoC routing algorithms, to solve the communication issue in irregular 3D NoC structures, simultaneously
Possess the fault-tolerant functions with alleviation congestion of good TSV again.
The design of routing algorithm will look for one most preferably in several big performance indications such as throughput, delay, power consumption on piece
Equalization point.Numerous scholars both domestic and external also had many researchs to 3D NoC routers and routing algorithm.The main collection of these researchs
In it is following some：
1st, a kind of layering router for extensive 3D NoC chips, is made up of, one two modules being kept completely separate
Individual is 5*5 on-chip router, and for intralayer communication, another is that 4*4 on-chip router is used for interlayer communication, so as to big
More preferable throughput and delay are obtained in scale 3D NoC structures, and this method can preferably be applied to the 3D NoC of isomery
In, but it is not suitable for small-scale 3D NoC structures, it is impossible to the situation of part TSV failures is tackled, also without alleviation congestion
Function.
2nd, solve the communication issue in the isomery 3D NoC structures for reducing TSV using a kind of preferential routing algorithm of elevator,
The algorithm to each network node by distributing an elevator node with TSV up and down, so as to realize interlayer communication,
But the fault-tolerant processing of part TSV failures is not accounted for.
3rd, TSV failures and input port are handled by increasing the method for an input port for on-chip router, and had
There is congestion aware function, but this method is not suitable for isomery 3D NoC.
4th, perspective routing algorithm, the Route Selection of present node is calculated and advances to upper router progress, so as to
Selecting router-level topology and cross bar switch, two steps are parallel, and so as to improve router throughput, but this improved method is not
Suitable for the 3D NoC of isomery.
The content of the invention
The present invention is to avoid weak point present in above-mentioned prior art, there is provided each layer in a kind of NoC according to 3D
TSV connection states establish the method and its application of channel table, fault-tolerant to solve data communication, TSV in irregular 3D NoC structures
The problem of with the packet congestion of vertical direction passage.The applicable isomery 3D NoC topological structures of the present invention are：Each layer meets
Standard 2DMesh structures, but the structure of layer and layer is not necessarily identical, and every layer of TSV and last layer for having several uneven distributions
Or next layer is connected.It is an object of the present invention to realized effectively in the above-mentioned isomery 3D NoC structures of random scale to realize
Data transfer, and hardly increasing router area overhead and having to failing on the premise of not reducing router throughput
TSV fault-tolerant processings and the function to vertical transfer passage congestion relief.
The present invention adopts the following technical scheme that to solve technical problem：
The characteristics of present invention establishes the method for channel table according to each layer of TSV connection state in 3D NoC is according to the following procedure
Carry out：
Step a：The upper channel node and lower channel node in each layers of 3D NoC are determined, the upper channel node refers to
Its top is connected with TSV node, and the lower channel node refers to the node for being connected with TSV thereunder；It is every to define 3D NoC
All nodes in one layer in addition to the upper channel node and lower channel node are ordinary node；
Step b：Channel table is established respectively for the router on each node in the 3D NoC, is marked with the passage
The upper channel node or lower channel that packet upper layer or next layer pass through required for carrying out data transmission in record respective nodes
Node；And record and each ordinary node closest upper channel node and lower channel node；
Step c：Most short circular path is established by shortest path first for all upper channel nodes on each layer, each
Record has the next upper channel address of node being in the most short circular path in the channel table of upper channel node；For
All lower channel nodes establish most short circular path by shortest path first on each layer, in the channel table of each lower channel node
Middle record has the next lower channel address of node being in the most short circular path.
The characteristics of isomery 3D NoC TSV Fault-tolerant Routing Algorithms of the present invention based on upper and lower preference strategy is as follows
Carry out：
Step 1：The packet A received for the router on node A, the destination node of packet is parsed first
Address, if the address of the destination node is node A address, packet A is sent to node A IP kernel, completes data
Transmission；Otherwise, into step 2；
Step 2：If the address of destination node is in this layer, rotating routing algorithm using 2D NoC will by destination interface
Packet A is sent to next node, completes node A data transfer；If the address of destination node is in upper strata, enter step
Rapid 3；If the address of destination node is in lower floor, into step 5；
Step 3：If node A is upper channel node, and by node A upper channel Successful transmissions packet A, is then completed
Node A data transfer；If packet A transmission can not be successfully completed by node A upper channel, then into step 4；If section
Point A is ordinary node, then into step 4；
Step 4：The available upper channel node B of node A address is obtained using node A channel table, by upper channel node B
Interim destination address of the address as packet A, routing algorithm is rotated by 2D NoC and sends out packet A from designated port
Go out, complete node A data transfer；
Step 5：It is lower channel node for node A, and by node A lower channel Successful transmissions packet A, then it is complete
Into node A data transfer；If packet A transmission can not be successfully completed by node A lower channel, then into step 6；If
Node A is ordinary node, then into step 6；
Step 6：The available lower channel node B of node A address is obtained using node A channel table, by lower channel node B
Interim destination address of the address as packet A, routing algorithm is rotated by 2D NoC and sends out packet A from designated port
Go out, complete node A data transfer.
Compared with the prior art, the present invention has the beneficial effect that：
1st, the present invention in 3D NoC routers due to employing channel table, on ordinary node and destination address
Positioned at upper strata or the packet of lower floor, using the upper channel node in the channel table of ordinary node or lower channel address of node as
The interim destination address of packet, transmission packet to upper channel node or lower channel node, are transmitted packet by node
To last layer or next layer, effective data transfer is realized in random scale isomery 3D NoC so as to realize.
2nd, the present invention due in channel table by all upper channel nodes and lower channel node on each layer respectively by most
Short path algorithm establishes most short circular path, and record has and is in respectively in the channel table of each upper channel node and lower channel node
Next passage address of node in most short circular path, therefore, at some or some TSV are damaged or vertical channel occurs
In the case of congestion, packet can be transferred to next upper channel node or lower channel node and carry out inter-layer data transmission,
Reach in the case of redundancy TSV is not increased to failure TSV fault-tolerant processings and the function to vertical transfer passage congestion relief.
3rd, when the present invention states function in realization, relative to common 3D NoC routers, it is only necessary to increase storage channels
The memory of table, and only two data, therefore increased area overhead can be ignored in each channel table.
4th, when the present invention states function in realization, relative to common 3D NoC routing algorithms, excessive choosing is not increased
Select and judge, and also have and possess vertical channel congestion mitigation capability, therefore route throughput to reduce.
Brief description of the drawings
Fig. 1 is the program flow diagram of the isomery 3D NoC TSV Fault-tolerant Routing Algorithms based on upper and lower preference strategy of the present invention
Embodiment
In the present embodiment, the method for establishing channel table according to each layer of TSV connection state in 3D NoC is according to the following procedure
Carry out：
Step a：The applicable topological structure of the present embodiment is a kind of 3D NoC frameworks of isomery, is not each node
TSV is connected with, therefore determines the upper channel node and lower channel node in each layers of 3D NoC first, the upper channel node is
Refer to the node for being connected with TSV above it, the lower channel node refers to the node for being connected with TSV thereunder；Define 3D
All nodes in each layers of NoC in addition to the upper channel node and lower channel node are ordinary node；One node may
Only upper channel node, lower channel node or ordinary node, it is also possible to be both upper channel node, be lower channel node again；
Step b：Upper channel node can be by the TSV of itself top connection to upper layer transport data, and lower channel node can
Data are transmitted to lower floor with the TSV by itself lower section connection, and ordinary node can not carry out interlayer communication in itself, in order that
Packet in ordinary node can reach upper strata or lower floor, be established respectively for the router on each node in 3D NoC logical
Road table, pass through required for being carried out data transmission with packet upper layer in channel table record respective nodes or next layer upper logical
Road node or lower channel node；And record and each ordinary node closest upper channel node and lower channel node；Then will
Packet is sent to the upper channel node or lower channel node closed on, by these upper channel nodes and lower channel node by data
Bag is sent to upper strata or lower floor.
Step c：When being carried out data transmission using some upper channel node or lower channel node, it is possible that following three
Kind situation causes packet bust this：One be due to TSV manufacturing technology it is ripe not enough, cause in chip manufacturing proces
TSV cavity, fracture, by mistake align situations such as and cause TSV to fail；Two are due to circuit aging caused by long-time use and draw
The TSV failures risen；Three be due to passage node router vertical direction port data amount it is excessive caused by vertical direction end
Mouth congestion.
In order to avoid causing the thing of packet packet loss even whole circuit board failure to occur when there is the above situation,
The present invention establishes most short circular path for all upper channel nodes on each layer by shortest path first, in each upper channel section
Record has the next upper channel address of node being in the most short circular path in the channel table of point；For on each layer
All lower channel nodes establish most short circular path by shortest path first, and being recorded in the channel table of each lower channel node has
The next lower channel address of node being in the most short circular path.If some passage node occurs above-mentioned three kinds
Situation, then can search the channel table of the passage node, using the upper channel node in channel table or lower channel address of node as
The interim destination address of packet, the node that the interim destination address represents is transmitted packets to, then carries out interlayer communication.
The present invention connects each layer of upper channel node and lower channel node respectively by the way of most short circular path, can effectively keep away
Exempt from same layer, when all there is the situation that can not send data in adjacent two passage nodes and caused by whole circuit board mistake
Effect.So as to reach on the premise of redundancy TSV is not increased, realized to the fault-tolerant of TSV, and possessed vertical by routing algorithm
Direction passage congestion relief function.
In the present embodiment the isomery 3D NoCTSV Fault-tolerant Routing Algorithms based on upper and lower preference strategy be using channel table and by
Following steps are carried out：
Step 1：The packet A received for the router on node A, the destination node of packet is parsed first
Address, if the address of the destination node is node A address, packet A is sent to node A IP kernel, completes data
Transmission；Otherwise, into step 2.
Step 2：If the address of destination node is in this layer, rotating routing algorithm using 2D NoC will by destination interface
Packet A is sent to next node, completes node A data transfer；If the address of destination node is in upper strata, enter step
Rapid 3；If the address of destination node is in lower floor, into step 5.
Step 3：If node A is upper channel node, and by node A upper channel Successful transmissions packet A, is then completed
Node A data transfer；If packet A transmission can not be successfully completed by node A upper channel, then into step 4；Can not
The situation of packet A transmission is successfully completed, TSV caused by being due to the failure of TSV manufacturing processes itself or being circuit aging loses
Effect, it is also possible to be due to congestion and cause packet A can not temporarily send；If node A is ordinary node, into step 4.
Step 4：The available upper channel node B of node A address is obtained using node A channel table, by upper channel node B
Interim destination address of the address as packet A, routing algorithm is rotated by 2D NoC and sends out packet A from designated port
Go out, complete node A data transfer.The method for carrying out packet A transmission using a passage node is changed in the present embodiment, by energy
The situation of the packet A transmission failure because of caused by the TSV failures being connected with passage node A is effectively avoided to occur；And can be logical
When congestion occurs for road node A vertical direction passage, packet is transferred to passage node B and sent, it is vertical so as to alleviate node A
The congestion situation of direction passage.
Step 5：It is lower channel node for node A, and by node A lower channel Successful transmissions packet A, then it is complete
Into node A data transfer；If packet A transmission can not be successfully completed by node A lower channel, then into step 6；If
Node A is ordinary node, then into step 6.
Step 6：The available lower channel node B of node A address is obtained using node A channel table, by lower channel node B
Interim destination address of the address as packet A, routing algorithm is rotated by 2D NoC and sends out packet A from designated port
Go out, complete node A data transfer.
2D NoC rotation routing algorithms are to use《The design of high-performance on-chip router and emulation based on stochastic route》(high mountain
Peak, Li Runfeng, Chen Tian, Liu Jun, Chen Peng, high-performance on-chip router design and emulation of the Wang Wei based on stochastic route, electronic, horological
Amount and instrument journal [J], 2013,27 (7):A kind of high-performance routing algorithm 669-675) proposed in a text.The algorithm be by
What following steps were carried out：
The packet A received for node A, the address of the destination node of packet is parsed first, if the purpose
Address of node is node A address, then packet A is sent to node A IP kernel, completes data transfer；If only X-axis
Location or Y-axis address are identical, then are transmitted by corresponding port in Y-axis or X-axis, the algorithm terminates；If X-axis and Y-axis address are all
Differ, then it represents that have that the transmission channel of X-axis and Y-axis both direction is available, if the direction signs position in node A is " 0 ",
Then transmit in X-direction, then transmitted if " 1 " in Y direction；Flag is negated after being transmitted.
Packet transmission in layer is used for using 2D NoC rotation routing algorithms in the present invention, can be with active balance layer
The data traffic of interior X-direction and Y-direction, so as to have more preferable throughput and delay.
Claims (1)
1. each layer of TSV connection state establishes the method for channel table in a kind of NoC according to 3D, it is characterized in that entering according to the following procedure
OK：
Step a：The upper channel node and lower channel node in each layers of 3D NoC are determined, the upper channel node refers to thereon
Side is connected with TSV node, and the lower channel node refers to the node for being connected with TSV thereunder；Define each layers of 3D NoC
In all nodes in addition to the upper channel node and lower channel node be ordinary node；
Step b：Channel table is established respectively for the router on each node in the 3D NoC, and phase is recorded with the channel table
Answer the upper channel node or lower channel node that packet upper layer or next layer pass through required for carrying out data transmission on node；
And record and each ordinary node closest upper channel node and lower channel node；
Step c：Most short circular path is established by shortest path first for all upper channel nodes on each layer, led on each
Record has the next upper channel address of node being in the most short circular path in the channel table of road node；For each
All lower channel nodes establish most short circular path by shortest path first on layer, remember in the channel table of each lower channel node
Record has the next lower channel address of node being in the most short circular path.
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| CN106302209B (en) * | 2015-06-12 | 2019-11-29 | 华为技术有限公司 | A kind of network-on-chip NoC and the method for data transmission |
| CN108512735B (en) * | 2017-02-25 | 2021-04-20 | 华为技术有限公司 | Data transmission method and device |
| CN111382115B (en) * | 2018-12-28 | 2022-04-15 | 北京灵汐科技有限公司 | Path creating method and device for network on chip and electronic equipment |
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