CN104536490B - Intelligent heat dissipation device - Google Patents
Intelligent heat dissipation device Download PDFInfo
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- CN104536490B CN104536490B CN201510001022.4A CN201510001022A CN104536490B CN 104536490 B CN104536490 B CN 104536490B CN 201510001022 A CN201510001022 A CN 201510001022A CN 104536490 B CN104536490 B CN 104536490B
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Abstract
The invention discloses a kind of Intelligent heat dissipation device, comprising: the first temperature-sensitive layer stacked gradually, heat dissipation film and the second temperature-sensitive layer;Described first temperature-sensitive layer and the second temperature-sensitive layer are all in order to measure temperature;Described heat dissipation film includes: the first electrode layer stacked gradually;Solution layer, including the some positive electricity heat conduction particles that can move in a solvent, some negative electricity heat conduction particles;The second electrode lay;When described first electrode layer applies different voltage with the second electrode lay, described positive electricity heat conduction particle and negative electricity heat conduction particle move at described solvent interior orientation.This Intelligent heat dissipation device, first temperature-sensitive layer and the second temperature-sensitive layer measure the temperature of corresponding side, after comparing, by applying voltage on the first electrode layer and the second electrode lay, control positive electricity heat conduction particle and negative electricity heat conduction particle moving direction in the first solvent, thus determine the heat dissipation direction of this Intelligent heat dissipation device.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of intelligent heat dissipation with automatic regulation function
Device.
Background technology
Along with the high speed development of electronic industry, society's electronic equipment popularity rate is more and more higher now.The most individual
People's computer, mobile phone, server, GPS navigation device etc. have become as the necessary articles for use of people's daily life.
Along with integrated circuit and the development of encapsulation technology, inside chip or the electronic module speed of service are increasingly faster,
The parts of the high temperature produced also get more and more.Plus short, thin, light, littleization of electronic installation, so that in pole
To place such considerable chip or electronic module in little space, short the least thin space cannot pass heat
Derivation is gone, and chip or electronic module at high temperature can reduce service behaviour, shortens working life.
The heat abstractor being conventionally used to electronic equipment mainly utilizes the modes such as conduction of heat, heat radiation, thermal convection current to enter
Row heat radiation, the heat that electronic equipment produces mainly is delivered to by the way of heat transfer by these radiating modes
Extraneous.But, the reversible feature of heat transfer, when ambient temperature is too high, it is originally used for the relevant of heat radiation
Ambient temperature is delivered to electronic equipment internal by heat abstractor, and this heat abstractor becomes the device of heat absorption on the contrary,
This is clearly unfavorable for the heat radiation of electronic product.
Summary of the invention
Based on this, it is necessary to provide the heat abstractor of a kind of Intelligent adjustment.
A kind of Intelligent heat dissipation device, comprising: the first temperature-sensitive layer, heat dissipation film and the second temperature-sensitive that stack gradually
Layer;Described first temperature-sensitive layer and the second temperature-sensitive layer are all in order to measure temperature;Described heat dissipation film includes: layer successively
The first folded electrode layer;Solution layer, including some positive electricity heat conduction particles that can move in a solvent, some negative
Electricity heat conduction particle;The second electrode lay;When described first electrode layer applies different voltages with described the second electrode lay
Time, described positive electricity heat conduction particle and described negative electricity heat conduction particle move at described solvent interior orientation.
Wherein in an embodiment, described solution layer also include moving in a solvent some nonpolarity every
Hot granule.
Wherein in an embodiment, described Intelligent heat dissipation device includes multiple described heat dissipation film stacked gradually,
Adjacent heat dissipation film shares the most described first electrode layer or described the second electrode lay.
Wherein in an embodiment, the solution layer of the described heat dissipation film adjacent with described first temperature-sensitive layer wraps
Include the some nonpolarity insulation particle that can move in a solvent.
Wherein in an embodiment, the quantity of described heat dissipation film is two, the respectively first heat dissipation film and
What two heat dissipation films, described first heat dissipation film and described second heat dissipation film stacked gradually is arranged on described first temperature-sensitive
Between layer and the second temperature-sensitive layer;The second electrode lay of described first heat dissipation film and the first of described second heat dissipation film
Electrode layer is public electrode layer.
Wherein in an embodiment, the second electrode lay of the described heat dissipation film adjacent with described second temperature-sensitive layer
Subregion is arranged, and described second temperature-sensitive layer also corresponding subregion is arranged, each district of described the second electrode lay
Territory applies identical or different voltage.
Wherein in an embodiment, the regional of described the second electrode lay is each with described second temperature-sensitive layer
Individual region one_to_one corresponding.
Wherein in an embodiment, the first electrode layer of the described heat dissipation film adjacent with described first temperature-sensitive layer
Subregion is arranged, and arranges insulating barrier between the regional of described first electrode layer, and described first temperature-sensitive layer is also
Corresponding subregion is arranged, and the regional of described first electrode layer applies identical or different voltage.
Wherein in an embodiment, the described positive electricity heat conduction particle in the solution layer of identical heat dissipation film and negative electricity
The quantitative proportion of heat conduction particle is 1:1.
Wherein in an embodiment, the described positive electricity heat conduction particle in the solution layer of identical heat dissipation film, negative electricity
The quantitative proportion of heat conduction particle and nonpolarity insulation particle is 5:5:1.
Above-mentioned Intelligent heat dissipation device, the first temperature-sensitive layer and the second temperature-sensitive layer measure the temperature of corresponding side, compare
After relatively, by applying voltage on the first electrode layer and the second electrode lay, control positive electricity heat conduction particle and bear
Electricity heat conduction particle moving direction in the first solvent, thus determine the heat dissipation direction of this Intelligent heat dissipation device.
Above-mentioned Intelligent heat dissipation device, is arranged the first electrode layer, the selective subregion of the second electrode lay, respectively
Individual region can apply similar and different voltage;First temperature-sensitive layer, the second temperature-sensitive layer also corresponding subregion
Arranging, regional is used for measuring the temperature of relevant position.So controlling the same of heat abstractor heat dissipation direction
Time, additionally it is possible to dispelling the heat in the position too high to local temperature, optionally dispels the heat diverse location.
Accompanying drawing explanation
Fig. 1 is the generalized section of the Intelligent heat dissipation device of embodiment 1 in the present invention;
Fig. 2 is the schematic top plan view of the second temperature-sensitive layer of the Intelligent heat dissipation device of embodiment 1 in invention;
Fig. 3 is the schematic top plan view of the second electrode lay of the Intelligent heat dissipation device of embodiment 1 in invention;
Fig. 4 is the schematic top plan view of the first temperature-sensitive layer of the Intelligent heat dissipation device of embodiment 1 in invention;
Fig. 5 is the schematic top plan view of the first electrode layer of the Intelligent heat dissipation device of embodiment 1 in invention;
Fig. 6 is the cross-sectional schematic of the Intelligent heat dissipation device of embodiment 2 in the present invention;
Fig. 7 is the schematic top plan view of the second temperature-sensitive layer of the Intelligent heat dissipation device of embodiment 2 in invention;
Fig. 8 is the schematic top plan view of the 3rd electrode layer of the Intelligent heat dissipation device of embodiment 2 in invention;
Fig. 9 is the schematic top plan view of the first temperature-sensitive layer of the Intelligent heat dissipation device of embodiment 2 in invention;
Figure 10 is the schematic top plan view of the first electrode layer of the Intelligent heat dissipation device of embodiment 2 in invention.
Detailed description of the invention
Intelligent heat dissipation device disclosed here may be used for the heat radiation of electronic equipment.This Intelligent heat dissipation device includes
The first temperature-sensitive layer, heat dissipation film and the second temperature-sensitive layer stacked gradually, the quantity of heat dissipation film can be one or many
Individual, the first temperature-sensitive layer and the second temperature-sensitive layer are all in order to measure temperature.In the present embodiment, all with the first sense
Temperature layer is used for measuring the ambient temperature of electronic equipment local environment, the second temperature-sensitive layer be used for measuring electronic equipment or
Temperature near electronic equipment illustrates;Certainly, the first temperature-sensitive layer and the second temperature-sensitive layer measure the object of temperature
Can exchange, those skilled in the art should know.The first electrode layer that heat dissipation film includes stacking gradually, molten
Liquid layer and the second electrode lay;Solution layer include being encapsulated in the solvent within solution layer, some positive electricity heat conduction particles,
Some negative electricity heat conduction particles.These positive electricity heat conduction particles and negative electricity heat conduction particle are respectively positively charged and negative electricity
Can be used for transmitting the granule of heat.According to the temperature of the corresponding object that the first temperature-sensitive layer and the second temperature-sensitive layer are measured,
Different voltage is applied with the second electrode lay so that positive electricity heat conduction particle and negative electricity heat conduction at the first electrode layer
Grain carries out corresponding displacement in a solvent, thus arrives the mesh controlling this Intelligent heat dissipation device heat dissipation direction
's.
When the temperature of electronic equipment is higher than ambient temperature, outside the heat that electronic equipment produces can being delivered to
In portion's environment.When the quantity of heat dissipation film is one, control the first electrode layer and the second electrode lay of heat dissipation film
Between voltage so that positive electricity heat conduction particle is towards the first electrode layer or the second electrode lay displacement, and bears
Electricity heat conduction particle moves in the opposite direction, the arrangement that positive electricity heat conduction particle and negative electricity heat conduction particle can be orderly
In solution layer.As long as the quantity of positive electricity heat conduction particle and negative electricity heat conduction particle is suitable, part positive electricity heat conduction
Grain has with negative electricity heat conduction particle and contacts, and can enter between all of positive electricity heat conduction particle and negative electricity heat conduction particle
Row efficient heat transfer.So, the heat that electronic equipment produces is by positive electricity heat conduction particle and negative electricity heat conduction
The transmission of grain, and be delivered in external environment condition, reach the purpose of heat radiation.When the quantity of heat dissipation film is multiple,
The voltage between the first electrode layer and the second electrode lay of multiple heat dissipation film can be controlled, in each solution layer
Positive electricity heat conduction particle and negative electricity heat conduction particle displacement in the opposite direction, positive electricity heat conduction particle and negative conductance
When the quantity of hot granule is abundant, part positive electricity heat conduction particle has with negative electricity heat conduction particle and contacts, all of
Efficient heat transfer can be carried out between positive electricity heat conduction particle and negative electricity heat conduction particle.Between each heat dissipation film also
Efficient heat transfer can be carried out.Thus the heat that electronic equipment produces is delivered to outside by multiple heat dissipation films
In environment, reach the purpose of heat radiation.
When the temperature of electronic equipment is less than ambient temperature, the heat that electronic equipment produces is not appropriate for being delivered to
In external environment condition.When the quantity of heat dissipation film is one, control the first electrode layer and second electrode of heat dissipation film
Voltage between Ceng so that positive electricity heat conduction particle and negative electricity heat conduction particle are in a solvent both facing to the second temperature-sensitive layer
Displacement, the direction is the direction near electronic equipment, and the heat that electronic equipment produces can pass through positive electricity
Heat conduction particle and negative electricity heat conduction particle disperse to fall, and are not required to be delivered in external environment condition, thus arrive
The purpose of heat radiation.When the quantity of heat dissipation film is multiple, control the of the heat dissipation film near the first temperature-sensitive layer
Voltage between one electrode layer and the second electrode lay so that positive electricity heat conduction particle and negative electricity heat conduction particle are at solvent
In the heat that can transmit both facing to the second temperature-sensitive layer displacement, so this heat dissipation film and external environment condition almost
It is negligible.And positive electricity heat conduction particle and negative electricity heat conduction particle are towards on the contrary in the solution layer of other heat dissipation films
Direction displacement, when the quantity of positive electricity heat conduction particle and negative electricity heat conduction particle is abundant, the positive conductance of part
Hot granule has with negative electricity heat conduction particle and contacts, can between all of positive electricity heat conduction particle and negative electricity heat conduction particle
To carry out efficient heat transfer so that heat transfer can occur between each heat dissipation film, the heat that electronic equipment produces
Amount can disperse to fall by the positive electricity heat conduction particle in each heat dissipation film and negative electricity heat conduction particle, and and is not required to
In external environment condition to be delivered to, thus arrive the purpose of heat radiation.
In the present embodiment, the solution layer of heat dissipation film also include moving in a solvent some nonpolarity every
Hot granule.Insulation particle that these are nonpolarity is the most not charged, and does not has good heat conductivility.These are electrodeless
Property insulation particle act as so that between the positive electricity heat conduction particle in solution layer and negative electricity heat conduction particle arrange
More tight, and also be able to play heat insulation effect.
When this Intelligent heat dissipation device includes multiple heat dissipation film, corresponding first between adjacent heat radiation film, can be shared
Electrode layer and the second electrode lay, so can simplify the design of external circuit, the voltage being applied on heat dissipation film
Logic relatively simple, it is easy to control the voltage of each heat dissipation film.In the present embodiment, can be from electricity
The solution layer of the heat dissipation film that subset is farthest arranges nonpolarity insulation particle, makes this heat dissipation film have heat insulation
Function.
The second electrode lay subregion of the heat dissipation film adjacent with the second temperature-sensitive layer is arranged, and the second temperature-sensitive layer is the most corresponding
Subregion arrange.Second temperature-sensitive layer can the temperature of subregional measurement electronic equipment, when measuring electronics
When the temperature in some place of equipment is higher, the voltage that the corresponding region of the second electrode lay applies can be controlled, make
Positive electricity heat conduction particle or negative electricity heat conduction particle aggregation in corresponding region, and phase is not assembled in other regions
The positive electricity heat conduction particle answered or negative electricity heat conduction particle.So in the place that this electronic equipment temperature is of a relatively high
Heat can pass, and not heat is not transmitted elsewhere, thus reaches to solve electronic equipment
The problem that local temperature is higher.The regional of the regional of the second electrode lay and the second temperature-sensitive layer one a pair
Should, so can more be accurately controlled the heat radiation of electronic equipment.
First electrode layer subregion of the heat dissipation film adjacent with the first temperature-sensitive layer is arranged, and the first temperature-sensitive layer is the most corresponding
Subregion arrange, between the regional of the first electrode layer, insulating barrier is set.So uneven when external environment condition
For the moment, the voltage that the regional of the first electrode layer applies can be controlled, thus control positive electricity heat conduction particle
With negative electricity heat conduction particle arrangement mode in solution layer, control the concrete mode of heat transmission.
In the present embodiment, positive electricity heat conduction particle and negative electricity heat conduction particle are the granule of Nano grade, and it can
To select one from the group of the material compositions such as metal, high molecular polymer, inorganic matter, magnet, diamagnetic body
Or multiple material is prepared by methods such as radiation polymerization, thermal curing method, coprecipitations.Positive electricity heat conduction
Grain and negative electricity heat conduction extra-granular are also enclosed with one layer of insulant, to prevent from producing between above-mentioned granule fax
Lead.Nonpolarity insulation particle is also the granule of Nano grade, its can by insulant by radiation polymerization,
The granule of the hollow that the method such as thermal curing method, coprecipitation is made, the nonpolarity insulation particle so made is not
Charged, and there is good heat-proof quality, heat conductivility is the most inconspicuous.In solution layer in heat dissipation film
Solvent be not with positive electricity heat conduction particle, negative electricity heat conduction particle and the liquid of nonpolarity insulation particle generation chemical reaction
Body or mixed liquor.
In the present embodiment, the positive electricity heat conduction particle in the solution layer of same heat dissipation film and negative electricity heat conduction particle
Quantitative proportion be 1:1.When the solution layer of heat dissipation film also includes nonpolarity insulation particle, same heat radiation
The quantitative proportion of positive electricity heat conduction particle, negative electricity heat conduction particle and nonpolarity insulation particle in the solution layer of film is
5:5:1.
Below in conjunction with specific embodiment, the invention will be further elaborated.
Embodiment 1:
Refer to Fig. 1, in the present embodiment, the quantity of the heat dissipation film 120 in this Intelligent heat dissipation device 100 is
One.First temperature-sensitive layer the 110, first electrode layer 1201 that this Intelligent heat dissipation device 100 includes stacking gradually,
Solution layer 1202, the second electrode lay the 1203, second temperature-sensitive layer 130.Second temperature-sensitive layer 130 is used for measuring electricity
The temperature of subset, the first temperature-sensitive layer 110 is used for measuring ambient temperature.It is packaged with solvent in solution layer 1202,
Solution layer 1202 is transportable compact arranged positive electricity heat conduction particle, negative electricity heat conduction particle in being included in solvent
With nonpolarity insulation particle, the quantitative proportion of three is 5:5:1.
Refer to the schematic top plan view that Fig. 2, Fig. 2 are the second temperature-sensitive layer 130, the second temperature-sensitive layer 130 subregion
Arranging, the second temperature-sensitive layer 130 includes several the second temperature-sensitive regions 1301, each the second temperature-sensitive region 1301
The temperature of the electronic equipment of relative position can be measured.
Refer to the schematic top plan view that Fig. 3, Fig. 3 are the second electrode lay 1203, the second electrode lay 1203 also divides
Region is arranged, and the second electrode lay 1203 includes several the second electrode lay regions 12031, each second electrode
Layer region 12031 can apply different or identical voltage.Please combined Fig. 2, the second electrode lay by Fig. 3
Each the second electrode lay region 12031 of 1203 and each the second temperature-sensitive region 1301 of the second temperature-sensitive layer 130
It it is one_to_one corresponding.The temperature measured to by each the second temperature-sensitive region 1301 of the second temperature-sensitive layer 130 is controlled
Make the voltage that each the second electrode lay region 12031 of corresponding the second electrode lay 1203 applies.
Refer to the schematic top plan view that Fig. 4, Fig. 4 are the first temperature-sensitive layer 110, the first temperature-sensitive layer 110 subregion
Arranging, the first temperature-sensitive layer 110 includes several the first temperature-sensitive regions 1101, each the first temperature-sensitive region 1101
The temperature of the external environment condition of relative position can be measured.
Refer to the schematic top plan view that Fig. 5, Fig. 5 are the first electrode layer 1201, the first electrode layer 1201 also divides
Region is arranged, and the first electrode layer 1201 includes several the first electrode layer regions 12011, each first electrode
Being provided with insulating regions between layer region 12011, each the first electrode layer region 12011 can apply difference
Or identical voltage.Please combined Fig. 4 by Fig. 5, each the first electrode layer region of the first electrode layer 1201
12011 and first each the first temperature-sensitive region 1101 of temperature-sensitive layer 110 be one_to_one corresponding.By the first temperature-sensitive
The temperature that each the first temperature-sensitive region 1101 of layer 110 is measured controls corresponding first electrode layer 1201
Each the first electrode layer region 12011 apply voltage.
When the ambient temperature that the first temperature-sensitive layer 110 is measured is less than the temperature of the second temperature-sensitive layer 130 electronic equipment,
Intelligent heat dissipation device 100 opens the pattern of external environment transmission heat.Each the of the second electrode lay 1203
A negative voltage-V is all applied on two electrode layer regions 12031, and each first electrode of the first electrode layer 1201
A positive voltage V is all applied on layer region 12011.Positive electricity heat conduction particle under the effect of the second electrode lay 1203
Towards the second electrode lay 1203 displacement, and it is gathered near the second electrode lay 1203;And at the first electricity
Under the effect of pole layer 1201, negative electricity heat conduction particle is towards the first electrode layer 1201 displacement, and is gathered in
Near first electrode layer region 12011 of one electrode layer 1201.Elapse over time, positive electricity heat conduction particle and
Negative electricity heat conduction particle is the most poly-more many in relevant position, and final positive electricity heat conduction particle and negative electricity heat conduction particle closely connect
Touching, nonpolarity insulation particle is gathered near the insulating regions of the first electrode layer 1201.Positive electricity heat conduction particle is inhaled
Receive the heat that electronic equipment produces, and transmit a negative electricity heat conduction particle, and transfer heat to the external world, thus
Complete the purpose of heat radiation.
When the ambient temperature that the first temperature-sensitive layer 110 is measured is higher than the temperature of the second temperature-sensitive layer 130 electronic equipment,
Can not be by the temperature transfer of electronic equipment to external environment condition.A negative voltage-V is applied at the second electrode lay 1203,
First electrode layer 1201 does not the most apply voltage, and it is attached that positive electricity heat conduction particle is all gathered in the second electrode lay 1203
Closely, elapsing over time, positive electricity heat conduction particle is the most poly-more many, and it is in close contact.At a large amount of positive conductance
Under the attraction of hot granule, negative electricity heat conduction particle also moves towards positive electricity heat conduction particle, and with positive electricity heat conduction particle
It is in close contact, and nonpolarity heat insulating ball is ostracised near the second electrode lay 1203.So electronic equipment produces
Raw heat can be fallen by the positive electricity heat conduction particle being in close contact and the dispersion of negative electricity heat conduction particle, and nonpolarity
Heat insulating ball, between external environment condition and negative electricity heat conduction particle, can stop that the heat of external environment condition passes to negative electricity
Heat conduction particle, thus reach heat insulation effect.
When the second temperature-sensitive region 1301 measurement to electronic equipment local temperature is too high, at corresponding second electrode
Layer region 12031 applies a negative voltage-V, and positive electricity heat conduction particle is gathered in corresponding the second electrode lay region
Near 12031, then survey 110 ambient temperatures measured according to the first temperature-sensitive and control the first electrode layer 1201
The voltage applied.The heat that electronic equipment produces is attached by being gathered in corresponding the second electrode lay region 12031
Near positive electricity heat conduction particle disperses or is delivered in external environment condition, thus solves electronic equipment local pyrexia
Problem.
Embodiment 2
Refer to Fig. 6, in the present embodiment, the quantity of the heat dissipation film in this Intelligent heat dissipation device 200 is two,
It is respectively the first heat dissipation film 221 and the second heat dissipation film 222.This Intelligent heat dissipation device 200 includes stacking gradually
First temperature-sensitive layer the 210, first heat dissipation film the 221, second heat dissipation film 222 and the second temperature-sensitive layer 230.Second sense
Temperature layer 230 is for measuring the temperature of electronic equipment, and the first temperature-sensitive layer 210 is used for measuring ambient temperature.First
Heat dissipation film 221 includes first electrode layer the 2211, first solution layer 2212 and the second electrode lay stacked gradually
2213;Second heat dissipation film 222 includes the second electrode lay the 2213, second solution layer 2222 and stacked gradually
Three electrode layers 2223;First heat dissipation film 221 and the second heat dissipation film 222 share the second electrode lay 2213.First
Being packaged with solvent in solution layer 2212, the first solution layer 2212 is transportable tight row in being included in solvent
Positive electricity heat conduction particle, negative electricity heat conduction particle and the nonpolarity insulation particle of row, the quantitative proportion of three is 5:5:
1.Being packaged with solvent in second solution layer 2222, the second solution layer 2222 is transportable in being included in solvent
Compact arranged positive electricity heat conduction particle, negative electricity heat conduction particle, both quantitative proportions are 1:1.
Refer to the schematic top plan view that Fig. 7, Fig. 7 are the second temperature-sensitive layer 230, the second temperature-sensitive layer 230 subregion
Arranging, the second temperature-sensitive layer 230 includes several the second temperature-sensitive regions 2301, each the second temperature-sensitive region 2301
The temperature of the electronic equipment of relative position can be measured.
Refer to the schematic top plan view that Fig. 8, Fig. 8 are the 3rd electrode layer 2223, the 3rd electrode layer 2223 also divides
Region is arranged, and the 3rd electrode layer 2223 includes several the 3rd electrode layer regions 22231, each the 3rd electrode
Layer region 22231 can apply different or identical voltage.Please combined Fig. 7 by Fig. 8, the 3rd electrode layer
Each the 3rd electrode layer region 22231 of 2223 and each the second temperature-sensitive region 2301 of the second temperature-sensitive layer 230
It it is one_to_one corresponding.The temperature measured to by each the second temperature-sensitive region 2301 of the second temperature-sensitive layer 230 is controlled
Make the voltage that each the second electrode lay region 22231 of corresponding 3rd electrode layer 2223 applies.
Refer to the schematic top plan view that Fig. 9, Fig. 9 are the first temperature-sensitive layer 210, the first temperature-sensitive layer 210 subregion
Arranging, the first temperature-sensitive layer 210 includes several the first temperature-sensitive regions 2101, each the first temperature-sensitive region 2101
The temperature of the external environment condition of relative position can be measured.
Refer to the schematic top plan view that Figure 10, Figure 10 are the first electrode layer 2211, the first electrode layer 2211 is also
Subregion is arranged, and the first electrode layer 2211 includes several the first electrode layer regions 22111, each first electricity
Being provided with insulating regions between pole layer region 22111, each the first electrode layer region 22111 can apply difference
Or identical voltage.Please combined Fig. 9 by Figure 10, each the first electrode layer region of the first electrode layer 2211
22111 and first each the first temperature-sensitive layer region 2101 of temperature-sensitive layer 210 be one_to_one corresponding.By the first sense
The temperature that each the first temperature-sensitive layer region 2101 of temperature layer 210 is measured controls corresponding first electrode layer
The voltage that each the first electrode layer region 22111 of 2211 applies.
When the ambient temperature that the first temperature-sensitive layer 210 is measured is less than the temperature of the second temperature-sensitive layer 230 electronic equipment,
Intelligent heat dissipation device 100 opens the pattern of external environment transmission heat.Electronic equipment local location temperature is relatively
Height, the position that the second temperature-sensitive region 2301 measurement in the second temperature-sensitive layer 230 to corresponding temperature is higher,
Apply a positive voltage V on corresponding 3rd electrode layer region 22231, and whole the second electrode lay 2213 applies
One negative voltage-V;Negative electricity heat conduction particle in second solution layer 2222 is towards the 3rd electricity being applied with positive voltage V
Pole layer region 22231 collects around, and the positive electricity heat conduction particle in the second solution layer 2222 is towards the second electrode
Layer 2213 is assembled, and in the second solution layer 2222, positive electricity heat conduction particle and negative electricity heat conduction particle attracts each other
Under, positive electricity heat conduction particle and negative electricity heat conduction particle are in close contact.For the first heat dissipation film 221,
A positive voltage V, the first solution layer is all applied on each first electrode layer region 22111 of one electrode layer 2211
Positive electricity heat conduction particle in 2212 is assembled towards the second electrode lay 2213, and negative electricity heat conduction particle is towards the first electrode
Layer 2211 displacement, and be gathered near the first electrode layer region 22111 of the first electrode layer 2211.With
Time passage, positive electricity heat conduction particle and negative electricity heat conduction particle are the most poly-more many in relevant position, final positive conductance
Hot granule and negative electricity heat conduction particle are in close contact, and nonpolarity insulation particle is gathered in the exhausted of the first electrode layer 2211
Edge areas adjacent.Second heat dissipation film 222 and the first heat dissipation film 221 absorb the heat at electronic equipment higher temperatures,
And transfer heat to the external world, thus complete the purpose of heat radiation, and it is too high to solve electronic equipment local temperature
Problem.
When the ambient temperature that the first temperature-sensitive layer 210 is measured is higher than the temperature of the second temperature-sensitive layer 230 electronic equipment,
Can not be by the temperature transfer of electronic equipment to external environment condition.Electronic equipment local location temperature is higher, the second sense
The position that corresponding temperature is higher is measured, the corresponding 3rd in the second temperature-sensitive region 2301 in temperature layer 230
Apply a positive voltage V on electrode layer region 22231, and whole the second electrode lay 2213 applies a negative voltage-V;
Negative electricity heat conduction particle in second solution layer 2222 is towards the 3rd electrode layer region being applied with positive voltage V
22231 collect around, and the positive electricity heat conduction particle in the second solution layer 2222 gathers towards the second electrode lay 2213
Collection, in the second solution layer 2222 under the attracting each other of positive electricity heat conduction particle and negative electricity heat conduction particle, positive conductance
Hot granule and negative electricity heat conduction particle are in close contact.And for the first heat dissipation film 221, the first electrode layer 2211
Not applying voltage, the positive electricity heat conduction particle in the first solution layer 2212 is assembled towards the second electrode lay 2213,
Elapsing over time, positive electricity heat conduction particle is the most poly-more many.Under the attraction of positive electricity heat conduction particle, negative electricity heat conduction
Granule is towards positive electricity heat conduction particle displacement, and is in close contact with positive electricity heat conduction particle, and nonpolarity heat insulation
Ball is ostracised, and moves towards the first electrode layer 2211, and is gathered in the vicinity of the first electrode layer 2211.The
Positive electricity heat conduction particle in two heat dissipation films 222 and negative electricity heat conduction particle are by electronic equipment temperature higher position
Heat carries out disperseing between which, and can pass in the first heat dissipation film 221, and the first heat dissipation film 221
In nonpolarity insulation particle stop external environment condition heat be delivered in Intelligent heat dissipation device 200.This intelligence
Heat abstractor can complete the purpose of heat radiation, and solves the problem that electronic equipment local temperature is too high, moreover it is possible to
When enough solution ambient temperature is higher, the problem that heat is delivered to electronic equipment internal.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (10)
1. an Intelligent heat dissipation device, it is characterised in that including: the first temperature-sensitive layer of stacking gradually, heat radiation
Film and the second temperature-sensitive layer;
Described first temperature-sensitive layer and the second temperature-sensitive layer are all in order to measure temperature;
Described heat dissipation film includes: stack gradually
First electrode layer;
Solution layer, including the some positive electricity heat conduction particles that can move in a solvent, some negative electricity heat conduction particles;
The second electrode lay;
When described first electrode layer applies different voltage with described the second electrode lay, described positive electricity heat conduction particle
Move at described solvent interior orientation with described negative electricity heat conduction particle.
Intelligent heat dissipation device the most according to claim 1, it is characterised in that described solution layer also includes
The some nonpolarity insulation particle that can move in a solvent.
Intelligent heat dissipation device the most according to claim 1, it is characterised in that described Intelligent heat dissipation device
Including multiple described heat dissipation films stacked gradually, adjacent heat dissipation film share the most described first electrode layer or
Described the second electrode lay.
Intelligent heat dissipation device the most according to claim 3, it is characterised in that with described first temperature-sensitive layer
The solution layer of adjacent described heat dissipation film includes the some nonpolarity insulation particle that can move in a solvent.
Intelligent heat dissipation device the most according to claim 4, it is characterised in that the quantity of described heat dissipation film
It is two, the respectively first heat dissipation film and the second heat dissipation film, described first heat dissipation film and described second heat dissipation film
Stack gradually is arranged between described first temperature-sensitive layer and described second temperature-sensitive layer;Described first heat dissipation film
First electrode layer of the second electrode lay and described second heat dissipation film is public electrode layer.
Intelligent heat dissipation device the most according to any one of claim 1 to 5, it is characterised in that with institute
The second electrode lay subregion stating the adjacent described heat dissipation film of the second temperature-sensitive layer is arranged, and described second temperature-sensitive layer is also
Corresponding subregion is arranged, and the regional of described the second electrode lay applies identical or different voltage.
Intelligent heat dissipation device the most according to claim 6, it is characterised in that described the second electrode lay
Regional and the regional one_to_one corresponding of described second temperature-sensitive layer.
Intelligent heat dissipation device the most according to any one of claim 1 to 5, it is characterised in that with institute
The the first electrode layer subregion stating the adjacent described heat dissipation film of the first temperature-sensitive layer is arranged, described first electrode layer
Arranging insulating barrier between regional, described first temperature-sensitive layer also corresponding subregion is arranged, described first electricity
The regional of pole layer applies identical or different voltage.
Intelligent heat dissipation device the most according to any one of claim 1 to 5, it is characterised in that identical
Described positive electricity heat conduction particle in the solution layer of heat dissipation film is 1:1 with the quantitative proportion of negative electricity heat conduction particle.
10. according to the Intelligent heat dissipation device described in claim 2 or 4 or 5, it is characterised in that identical scattered
Described positive electricity heat conduction particle, negative electricity heat conduction particle and the quantity of nonpolarity insulation particle in the solution layer of hotting mask
Ratio is 5:5:1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510001022.4A CN104536490B (en) | 2015-01-04 | 2015-01-04 | Intelligent heat dissipation device |
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