CN104532308A - Leveling agent used for acidic copper electroplating and application thereof - Google Patents
Leveling agent used for acidic copper electroplating and application thereof Download PDFInfo
- Publication number
- CN104532308A CN104532308A CN201410845771.0A CN201410845771A CN104532308A CN 104532308 A CN104532308 A CN 104532308A CN 201410845771 A CN201410845771 A CN 201410845771A CN 104532308 A CN104532308 A CN 104532308A
- Authority
- CN
- China
- Prior art keywords
- leveling agent
- electroplating
- acid
- hole
- blind hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a leveling agent used for acidic copper electroplating and application of the leveling agent. The leveling agent is a polymer provided with a thiadiazole structure unit, and please see the specifications for the structural formula of the polymer, wherein R is selected from alkyl groups or alkyl substituent groups of zero to ten carbon atoms, and n is an integer not smaller than two. The polymer provided with the thiadiazole structure unit serving as the leveling agent of an acid copper electroplating bath is used for acid electroplating, and clearances will not appear during blind hole filling; in addition, the sag amount of the leveling agent is reduced substantially compared with an existing conventional leveling agent (such as Janus green); the leveling agent shows a good dispersive capacity during through hole electroplating, y/x values are all greater than 0.8, and the simultaneous electroplating technology of through hole electroplating and blind hole filling can be achieved completely.
Description
Technical field
The present invention relates to a kind of acid electroplating additive, be specifically related to a kind of leveling agent for acid copper plating and uses thereof.
Background technology
Current, electronic product is constantly towards microminiaturized and lightening future development, and this reliability for printed circuit board is had higher requirement.The reliability of printed circuit board function depends on sour copper electroplating technology to a great extent, i.e. the quality of the electroplates in hole and blind hole fill process.Sour copper electroplating technology was that copper → machine drilling → the electroplates in hole is filled out in laser drill → blind hole plating in the past; Through hole and blind hole constrain production capacity respectively through twice electroplating work procedure, and improve production cost.For addressing these problems, the electroplates in hole and blind hole filling electroplating technology were simultaneously developed in recent years.But, if the plating bath that use is filled to object with blind hole carries out the electroplates in hole, the thin of the copper coating thickness abnormity in through hole bight can be caused, thus easily produce chink line, so can not the electroplates in hole be applied to; If the plating bath for the purpose of the electroplates in hole carries out blind hole filling, the copper coating lower thickness of the inner bottom part of blind hole can be caused, be difficult to effectively carry out blind hole filling.Therefrom be not difficult to find out, the organic substance as additive existed in sour copper electroplating bath realizes uniform copper metal deposition for through hole inside, blind hole inside avoids hole, substrate surface are avoided for pin hole and projection etc. most important.
Promotor (or being called accelerator, brightening agent), inhibitor (or being called supporting agent, wetting agent), leveling agent three kinds of additives generally can be used in acid copper plating bath.From electroplating principle, the electroplates in hole and blind hole are filled while in electroplating technology, promotor, by promoting the charge transfer process on copper interface, provides Active Growth position to change over nuclear process; Inhibitor is adsorbed on cathode surface uniformly, increases deposition overvoltage; Leveling agent selective adsorption at high potential position, thus suppresses the coating at this position to deposit.Promotor velocity of diffusion than very fast, and inhibitor and leveling agent velocity of diffusion slow; And make most of leveling agent be adsorbed on substrate surface and position, aperture because substrate surface exists higher electromotive force compared with blind via bottom or through hole central part; These factors can suppress substrate surface, especially suppress aperture side surface upper part to separate out copper coating, and the promotor making rate of diffusion fast accelerates deposited copper coating at blind via bottom and through-hole side wall, finally realize the electroplates in hole and blind hole and fill and electroplate simultaneously.Leveling agent rejection ability is excessively strong, easily causes openings thickness of coating thin singularly, thus easily causes chink line.And the rate of diffusion of leveling agent is crossed, and easily to cause slowly blind hole to fill layers of copper above metapore protruding.
Therefore, need badly to develop and a kind ofly can be used for the leveling agent that the electroplates in hole and blind hole fill electroplating technology simultaneously.
Summary of the invention
The object of this invention is to provide a kind of additive, it can be used as the leveling agent of acid copper plating electroplate liquid, can meet the electroplates in hole and blind hole filling electroplating technology requirement simultaneously.
For achieving the above object, the invention provides a kind of leveling agent for acid copper plating, this leveling agent is the polymkeric substance with thiadiazoles drone salt structural unit, its structural formula as the formula (1):
（1）
Wherein, R is selected from alkyl or the substituted alkyl of 0-10 carbon atom, n be not less than 2 integer.
Above-mentioned acid copper plating composition, wherein, R is selected from the alkoxyl group of 2-8 carbon atom.
Above-mentioned acid copper plating composition, wherein, R is selected from the alkyl of 0-5 carbon atom.
Above-mentioned acid copper plating composition, wherein, R is selected from the alkyl of the hydroxyl of 1-4 carbon atom.
Present invention also offers the purposes of above-mentioned leveling agent, this leveling agent can be filled as the electroplates in hole in printed circuit board and blind hole and be electroplated simultaneously.
Present invention also offers a kind of acid copper plating copper electroplating liquid composition, it comprises copper ion source, ionogen, promotor, inhibitor, and wherein, said composition also comprises the above-mentioned leveling agent of at least one.
Any cupric ion solvable in electroplate liquid is applicable.The cupric ion be applicable to includes, but are not limited to: copper sulfate, cupric chloride, cupric nitrate, thionamic acid copper, copper methanesulfonate.Copper sulfate and copper methanesulfonate are preferred.Also the mixture of copper ion source can be used.In copper electroplating liquid, the content of cupric ion is generally at 30-60g/L, preferred 40-50g/L.These cupric ion salt are commercial available and can be further purified.
The acidic electrolyte bath be applicable in electroplate liquid includes, but are not limited to: sulfuric acid, acetic acid, methylsulphonic acid.Sulfuric acid is preferred.In copper electroplating liquid, acid content is generally at 30-150g/L, preferred 50-100g/L.Ionogen comprises halide-ions source.Preferred halide-ions source is chlorion, and general cupric chloride or the hydrochloric acid of adopting joins in acid copper plating solution.In electroplate liquid, the concentration of halide-ions is at 10-100ppm, preferred 30-80ppm, more preferably 50-60ppm.These ionogen are commercial available and can be further purified.
The electroplate liquid that the present invention relates to comprises promotor further.This promotor being well known to a person skilled in the art.Representational promotor is the compound containing sulfide or sulfonic acid group, preferably from one or more of the compound shown in following formula (2)-(5).
（2）
（3）
（4）
（5）
Wherein M is selected from hydrogen atom and basic metal, and a is selected from the integer of 1-8, b, c independently be selected from 0 or 1.
Some concrete suitable promotor comprise such as sodium polydithio-dipropyl sulfonate, 3-sulfydryl-1-propane sulfonic acid sodium.In electroplate liquid, the content of promotor is preferably from 0.5-100ppm, and more preferably the content of promotor is from 0.5-10ppm, also more preferably from 1-4ppm.If the content of promotor is less than 0.5ppm in acid copper plating solution, is difficult to ensure that substrate surface produces bright coating, thus produces the problem such as copper powder, pin hole.
The copper electroplating liquid used in the present invention comprises inhibitor alternatively.Structural formula below the preferred embodiment of inhibitor has described in (6)-(11), but be not limited to these.
(6), wherein a is the integer of 10-500;
(7), wherein a is the integer of 10-500;
(8), wherein a, b, c are separately selected from the integer of 10-100;
(9), wherein a, b, c are separately selected from the integer of 10-100;
(10), wherein a, b are separately selected from the integer of 10-100;
(11), wherein n is selected from the integer of 10-500.
The inhibitor used in the present invention can be a kind of or their mixture of two or more.The add-on of inhibitor is generally 50-1500ppm, preferred 200-800ppm.If the concentration of inhibitor is less than 50ppm in electroplate liquid, the wetting effect of plating solution can be reduced, thus produce a large amount of pin hole at coating surface.
Present invention also offers a kind of preparation method according to above-mentioned leveling agent, the method is that raw material forms amide polymer intermediate with 2,5-diamino thiadiazoles, dicarboxylic acid compound, then make through the aminoalkyl of methyl-sulfate to intermediate.The concrete steps of the method are: step 1, be dissolved in water, be under agitation warming up to 150-200 by 2,5-diamino thiadiazoles and dicarboxylic acid compound
oc, insulation 5-10 hour, then naturally cools to room temperature; Step 2, joins in system by methyl-sulfate and methyl alcohol, is warming up to 40-80
oc, insulation 12-24 hour.Wherein, the structure of described dicarboxylic acid compound is:
, wherein the definition of R is as above-mentioned.Wherein, described dicarboxylic acid compound selects oxalic acid, propanedioic acid, succinic acid, oxysuccinic acid.These dicarboxylic acid compounds are commercial available and can be further purified.
The polymkeric substance with thiadiazoles drone salt structural unit of comprising in formula (1) provided by the invention can at least improve leveling performance as the electroplating composition of leveling agent than a lot of conventional acid copper plating composition, makes it be applicable to the electroplates in hole and blind hole fills electroplating technology simultaneously.
Acid copper plating composition to power on copper-plated metal in substrate by any prior art and the known method of document.Typically, use conventional electroplating device by conventional electroplating process incoming call copper-plated metal.These electroplating processs are all known in the field.Current density and electrode surface current potential can change with specific substrate to be plated.In general, anode and cathode current density can at 0.1-10A/dm
2change in scope, preferred current density is at 0.2A/dm
2to 3A/dm
2, typically be 2A/dm
2.Maintaining temperature of electroplating solution scope is from 18-35
oc, preferred range is from 23-25
oc.
The present invention is according to above-mentioned theory and practical application performance, design and synthesize a kind of leveling agent of polymkeric substance as sour copper electroplating bath with thiadiazoles drone salt structural unit, for acid electroplating, blind hole is filled and be there will not be space, and amount of recess significantly reduces relative to existing conventional planarization agent (as Janus green), the electroplates in hole shows good dispersive ability, and y/x value is all greater than 0.8, more ideally can realize the electroplates in hole and blind hole filling electroplating technology simultaneously.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 is embodiments of the invention 1 polymkeric substance
p1nucleus magnetic hydrogen spectrum figure.
Fig. 2 is the space schematic diagram that blind hole is filled.
Fig. 3 is that blind hole fills amount of recess schematic diagram.
Fig. 4 is the y/x value schematic diagram of through hole.
Fig. 5 is that the present invention is with the polymkeric substance of embodiment 1
p1for the blind hole filling effect blind hole filling effect figure of the acid copper plating liquid of leveling agent.
Fig. 6 is for the present invention is with the polymkeric substance of embodiment 1
p1for the electroplates in hole design sketch of the acid copper plating liquid of leveling agent.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
Embodiment 1
Present embodiments provide the polymkeric substance with thiadiazoles drone salt structural unit, its structural formula as shown in table 1 (wherein, n be more than or equal to 2 integer), its synthetic route is as follows:
Table 1: polymer P 1 structural formula that embodiment 1 provides
The preparation method of polymer P 1, comprises the steps:
Step 1, the synthesis of 2,5-diamino thiadiazoles
The structural formula of 2,5-diamino thiadiazoles is
Its detailed preparation method is shown in document " Johnson FA; Saliu AA; Amudat L. Zn (II) complex with N-and S-donor ligand:synthesis and biological studies. Journal of Chemical and Pharmaceutical Research. 4 (3), 1511-1518 (2012) ".
Step 2, the synthesis of polymer P 1
Under nitrogen protection, 2,5-diamino thiadiazoles (2.32g, 20mmol), 1,3-propanedioic acid (2.08g, 20mmol), deionized water (2mL) are joined in pressure bottle, is warming up to 180 DEG C and (can be 150-200
oarbitrary value in C) react 8h.Reaction solution is naturally cooled to room temperature.Methyl-sulfate (7.57g, 60mmol) and methyl alcohol (20mL) are joined in pressure bottle, is warming up to 60 DEG C and (can be 40-80
oarbitrary value in C) react 16h.Reaction solution is naturally cooled to room temperature.First alcohol and water is removed in underpressure distillation, obtains polymkeric substance
p1.
1H NMR (400 MHz, CDCl
3), 3.86-3.79 (s, 2H), 1.27 (t,
J = 7.0 Hz, 9H). Anal. calcd for (C
8H
11N
4O
2S)
n: C 42.28, H 4.88, N 24.65; found: C 42.43, H 4.98, N 24.76。Polymkeric substance
p1nucleus magnetic hydrogen spectrum figure shown in Figure 1.Polymer P 1 is dissolved in 1 premium on currency, adjusts solution ph to about 7 as leveling agent with 20% dilute sulphuric acid, for subsequent use.
Embodiment 2
Reaction product in the same manner as in Example 1 in preparation table 2.The results of elemental analyses of this reaction product is summarized in table 2.
The results of elemental analyses of table 2:P2-P9
Embodiment 3
Copper electroplating liquid is obtained as the cupric sulfate pentahydrate in copper source, 60g/L sulfuric acid, 50ppm chlorion, 1ppm sodium polydithio-dipropyl sulfonate and 400ppm PEG20000 by mixing 180g/L.Reaction product also containing 5mL/L embodiment 1 in plating solution.
Embodiment 4
Substantially prepare different copper electroplating liquids according to embodiment 3, each reaction product of the embodiment 2 being 5mL/L except wherein using content.
Embodiment 5(comparative example)
Substantially prepare different copper electroplating liquids according to embodiment 3, the Janus green being 5ppm except wherein using content (Janus Green) is as leveling agent.
Embodiment 6
Each plating solution above-mentioned copper electroplating layer on the printed circuit board of the blind hole at the through hole and 100 μm, aperture and hole depth 70 μm with 2mm thickness and diameter 0.3mm.Plating test is carried out in Haring cell.Bath temperature is 24
oc.Each coating bath applies 2A/dm
2current density 50 minutes.Plating result carries out with reference to the evaluation method of Fig. 2, the space shown in 3,4, amount of recess, x/y value.Be illustrated in figure 5 with
p1for the blind hole filling effect of the acid copper plating liquid of leveling agent, its tight, amount of recess is-2 microns.Be illustrated in figure 6 with
p1for the electroplates in hole result of the acid copper plating liquid of leveling agent.All electroplating effects are as shown in table 3.
Table 3: the electroplating effect of the acid copper plating liquid being leveling agent with the Janus green of P1-P9, comparative example
Use the copper electroplating liquid that the polymkeric substance with thiadiazoles drone salt structural unit of the present invention is leveling agent, blind hole is filled and is not all occurred space, and amount of recess is all less than the comparative example result using Janus green as leveling agent.The electroplates in hole shows good dispersive ability, and y/x value is all greater than 0.8.
In sum, leveling agent provided by the invention, has thiadiazoles drone salt structural unit, for acid copper plating, embodies good the electroplates in hole and blind hole filling electroplating effect simultaneously.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (5)
1. for a leveling agent for acid copper plating, it is characterized in that, this leveling agent is the polymkeric substance with thiadiazoles drone salt structural unit, its structural formula as the formula (1):
（1）
Wherein, R is selected from the organic group of 0-10 carbon atom, n be not less than 2 integer.
2. acid copper plating composition as claimed in claim 1, it is characterized in that, R is selected from the alkoxyl group of 2-8 carbon atom.
3. acid copper plating composition as claimed in claim 1, it is characterized in that, R is selected from the alkyl of 0-5 carbon atom.
4. acid copper plating composition as claimed in claim 1, it is characterized in that, R is selected from the alkyl of the hydroxyl of 1-4 carbon atom.
5. according to a purposes for the leveling agent in claim 1-4 described in any one, it is characterized in that, this leveling agent can be filled as the electroplates in hole in printed circuit board and blind hole and be electroplated simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410845771.0A CN104532308B (en) | 2014-12-31 | 2014-12-31 | A kind of leveling agent for acid copper plating and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410845771.0A CN104532308B (en) | 2014-12-31 | 2014-12-31 | A kind of leveling agent for acid copper plating and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104532308A true CN104532308A (en) | 2015-04-22 |
| CN104532308B CN104532308B (en) | 2017-03-08 |
Family
ID=52847921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410845771.0A Active CN104532308B (en) | 2014-12-31 | 2014-12-31 | A kind of leveling agent for acid copper plating and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104532308B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105839151A (en) * | 2016-04-19 | 2016-08-10 | 电子科技大学 | Even-plating agent of copper electroplating bath of HDI board used for copper interconnection and copper electroplating bath |
| CN105951137A (en) * | 2016-05-23 | 2016-09-21 | 中国广州分析测试中心 | HDI laminated plate blind buried hole copper plating bath |
| CN107217306A (en) * | 2017-05-19 | 2017-09-29 | 湖州三峰能源科技有限公司 | The Chemical composition that of polysilicon chip acid making herbs into wool optimization agent and its application |
| CN107326348A (en) * | 2017-07-24 | 2017-11-07 | 电子科技大学 | A kind of method and related chemistry copper plating bath that core inductance quality value is lifted based on chemical plating Porous Cu |
| CN111155153A (en) * | 2020-02-19 | 2020-05-15 | 广州三孚新材料科技股份有限公司 | Copper electroplating solution and copper electroplating method |
| CN113737232A (en) * | 2021-11-08 | 2021-12-03 | 深圳市板明科技股份有限公司 | Circuit board through hole copper electroplating leveling agent and application and preparation method thereof |
| CN114574911A (en) * | 2022-04-28 | 2022-06-03 | 深圳市板明科技股份有限公司 | Electroplating process for through hole of circuit board with high thickness-diameter ratio |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900377A (en) * | 2004-07-23 | 2007-01-24 | 上村工业株式会社 | Electrolytic copper plating bath and plating process therewith |
| US20070170066A1 (en) * | 2006-01-06 | 2007-07-26 | Beaudry Christopher L | Method for planarization during plating |
| CN101302632A (en) * | 2007-04-03 | 2008-11-12 | 罗门哈斯电子材料有限公司 | Metal plating compositions |
-
2014
- 2014-12-31 CN CN201410845771.0A patent/CN104532308B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1900377A (en) * | 2004-07-23 | 2007-01-24 | 上村工业株式会社 | Electrolytic copper plating bath and plating process therewith |
| US20070170066A1 (en) * | 2006-01-06 | 2007-07-26 | Beaudry Christopher L | Method for planarization during plating |
| CN101302632A (en) * | 2007-04-03 | 2008-11-12 | 罗门哈斯电子材料有限公司 | Metal plating compositions |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105839151A (en) * | 2016-04-19 | 2016-08-10 | 电子科技大学 | Even-plating agent of copper electroplating bath of HDI board used for copper interconnection and copper electroplating bath |
| CN105839151B (en) * | 2016-04-19 | 2018-08-21 | 电子科技大学 | A kind of plating agent of HDI plate electrolytic copper plating baths for copper-connection and electrolytic copper plating bath |
| CN105951137A (en) * | 2016-05-23 | 2016-09-21 | 中国广州分析测试中心 | HDI laminated plate blind buried hole copper plating bath |
| CN105951137B (en) * | 2016-05-23 | 2017-12-01 | 中国广州分析测试中心 | A kind of blind buried via hole copper plating solution of HDI laminated plates |
| CN107217306A (en) * | 2017-05-19 | 2017-09-29 | 湖州三峰能源科技有限公司 | The Chemical composition that of polysilicon chip acid making herbs into wool optimization agent and its application |
| CN107217306B (en) * | 2017-05-19 | 2023-07-07 | 湖州三峰能源科技有限公司 | Chemical composition of polycrystalline silicon wafer acid texturing optimizing agent and application thereof |
| CN107326348A (en) * | 2017-07-24 | 2017-11-07 | 电子科技大学 | A kind of method and related chemistry copper plating bath that core inductance quality value is lifted based on chemical plating Porous Cu |
| CN111155153A (en) * | 2020-02-19 | 2020-05-15 | 广州三孚新材料科技股份有限公司 | Copper electroplating solution and copper electroplating method |
| CN113737232A (en) * | 2021-11-08 | 2021-12-03 | 深圳市板明科技股份有限公司 | Circuit board through hole copper electroplating leveling agent and application and preparation method thereof |
| CN113737232B (en) * | 2021-11-08 | 2022-01-11 | 深圳市板明科技股份有限公司 | Circuit board through hole copper electroplating leveling agent and application and preparation method thereof |
| CN114574911A (en) * | 2022-04-28 | 2022-06-03 | 深圳市板明科技股份有限公司 | Electroplating process for through hole of circuit board with high thickness-diameter ratio |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104532308B (en) | 2017-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104532308A (en) | Leveling agent used for acidic copper electroplating and application thereof | |
| EP2723921B1 (en) | Method for copper plating | |
| Chen et al. | Synthesis of quaternary ammonium salts based on diketopyrrolopyrroles skeletons and their applications in copper electroplating | |
| TWI477486B (en) | Novel compounds and their use | |
| CN102250319A (en) | Copper electroplating bath and method | |
| US20040045832A1 (en) | Electrolytic copper plating solutions | |
| Li et al. | Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating | |
| CN102276796A (en) | Copper electroplating bath and method | |
| Lin et al. | Characterization of through-hole filling by copper electroplating using a tetrazolium salt inhibitor | |
| JP2016504489A (en) | Composition for metal electroplating comprising a planarizing agent | |
| EP2366694A2 (en) | Copper electropating bath and method | |
| Tang et al. | 4, 6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper | |
| Luo et al. | Effects of accelerator alkyl chain length on the microvia filling performance in copper superconformal electroplating | |
| CN106119913A (en) | Copper electroplating liquid and using method thereof and the synthetic method of leveling agent therein | |
| Zhou et al. | 5-Amino-1, 3, 4-thiadiazole-2-thiol as a new leveler for blind holes copper electroplating: Theoretical calculation and electrochemical studies | |
| Luo et al. | Communication—triphenylmethane-based leveler for microvia filling in copper super-conformal electroplating | |
| CN109989077A (en) | A kind of copper electrolyte | |
| CN109824674B (en) | Heterocyclic pyrrolopyrrole dione quaternary ammonium salt compound and preparation method and application thereof | |
| Zhu et al. | Convection-dependent competitive adsorption between SPS and EO/PO on copper surface for accelerating trench filling | |
| CN109972180A (en) | The new application of 2,2 '-dithiodipyridine and the electro-plating method that filling perforation additive is electroplated and uses the additive for using it | |
| US20080087549A1 (en) | Additive For Copper Plating And Process For Producing Electronic Circiut Substrate Therewith | |
| TWI636162B (en) | Acidic aqueous composition for electrolytic copper plating | |
| CN113773309B (en) | Coumarin pyridinium compound and application thereof | |
| CN109989076A (en) | A kind of leveling agent | |
| CN110577497B (en) | Indanthrone quaternary ammonium salt compound and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |