CN104513041A - Inorganic fiber reinforced heat insulation board - Google Patents
Inorganic fiber reinforced heat insulation board Download PDFInfo
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- CN104513041A CN104513041A CN201310450913.9A CN201310450913A CN104513041A CN 104513041 A CN104513041 A CN 104513041A CN 201310450913 A CN201310450913 A CN 201310450913A CN 104513041 A CN104513041 A CN 104513041A
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Abstract
The invention relates to an inorganic fiber reinforced heat insulation board. The board is prepared by: taking inorganic fiber as the reinforcement phase, adding one or more heat insulation fillers, and adding a proper ratio of an organic binder or inorganic binder and an additive, and carrying out mixing, molding and drying. The heat insulation board is characterized in that it comprises the following components by weight: 10-80 of the inorganic fiber, 10-60 of the heat insulation filler, 1-10 of the organic binder, 5-20 of the inorganic binder, and 1-10 of the additive. The inorganic fiber reinforced heat insulation board prepared by the invention has excellent high temperature resistance, good heat insulation comprehensive performance and mechanical properties, and the production process is simple, the operation is convenient, and the cost is low.
Description
Technical field
The present invention relates to fiber reinforcement thermal insulation composite material field.
Background technology
Along with socioeconomic high speed development, global energy consumption is sharply risen, energy scarcity oneself become the problem of world wide.Lagging material, as one of most effective measures of energy conservation, has obtained fully paying close attention to and extensively research.Adopt good lagging material to be conducive to reducing product energy consumption in the industry, reduce production cost, increase service life of equipment etc., there are considerable economic results in society.At military project and aerospace field, its device environment for use is harsh, requires that its thermal protection system not only has efficient heat-proof quality, also must possess the features such as resistance at higher temperature, high reliability and efficient and light weight.Therefore, carry out the research of the composite heat-insulated material of high temperature resistant, effectively insulating, for civilian or military hardware all has important practical significance.
At present, according to the current situation that domestic and international lagging material is studied, the compound system that what heat-proof quality was best belong to nanosized SiO_2 aerogel and prepare on this basis.But its preparation process is complicated, and technique is restive, be difficult to batch production, and mechanical property is poor.And traditional ceramic beaverboard to the infrared rays in certain wave band not tool block ability, therefore, the radiant heat energy of this wave band will nearly through thermal baffle.Under the high temperature conditions, the vapor that the solid phase conduction caused relative to skeleton and the gas molecule collision of material internal cause, the radiation thermal conduction of aerogel occupies sizable ratio in total heat conductance.When as lagging material in hot environment, when especially the cold and hot surface temperature difference is greater than 100 DEG C, its thermal conductivity will increase greatly.
Summary of the invention
The object of the invention is to the weak point that overcomes in above-mentioned background technology and provide a kind of mechanical property can strengthen heat insulating board by inorganic fibre that is good, heat insulating excellent combination property.The production technique of heat insulating board of the present invention is simple, and easy to operate, cost is low.
The present invention realizes above-mentioned purpose by following technical solution: namely a kind of inorganic fibre strengthens heat insulating board, using inorganic fibre as wild phase, add one or more thermal insulating fillings, and add the organic bond of suitable proportion or inorganic bonding agent and additive, obtained after batch mixing, shaping and drying.It is characterized in that its composition weight is: inorganic fibre 10 ~ 80, thermal insulating filling 10 ~ 60, organic bond 1 ~ 10, inorganic bonding agent 5 ~ 20, additive 1 ~ 10.
Inorganic fibre of the present invention is the combination of the one or more than one in pure aluminium silicate, glass fibre, basalt fibre, mullite fiber and brucite fiber.
Thermal insulating filling of the present invention is the combination of the one or more than one in aerosil, white carbon black, sepiolite, pearlstone and diatomite.
Organic bond of the present invention is the combination of the one or more than one in resin, starch and Mierocrystalline cellulose.
Inorganic bonding agent of the present invention be silicon sol or other take silicon as the combination of the one or more than one in the inorganic bonding agent of principal element, Alumina gel and lignosulfite.
Additive of the present invention is the combination of a kind of in titanium dioxide and crystal whisker of hexa potassium titanate or two kinds.
Inorganic fibre of the present invention strengthens heat insulating board, its preparation technology is: first inorganic fibre and thermal insulating filling are fully uniformly mixed, add inorganic bonding agent or organic bond and additive more successively fully to mix, add appropriate water makes mixture soak simultaneously, then pour material in mould extrusion forming, eventually pass drying treatment and can obtain inorganic fibre of the present invention enhancing heat insulating board.Cloth can also be pasted at outside surface of the present invention, fibrous paper increases fastness and aesthetics, then stick aluminium foil raising material heat-proof quality.
Specific embodiment
Embodiment 1: by aluminum silicate fiber 30 parts, white carbon black 55 parts, silicon sol 10 parts and titanium dioxide 5 parts join in mixing equipment, are fully uniformly mixed, and add appropriate water simultaneously and make mix wetting; After stirring, then mixture is put into mould extrusion forming; Finally product drying treatment at 110 DEG C can be obtained inorganic fibre of the present invention and strengthen heat insulating board.
Embodiment 2: by 40 parts, glass fibre, white carbon black 22 parts, sepiolite powder 20 parts, starch 5 parts, resin 5 parts and titanium dioxide 8 parts join in mixing equipment, are fully uniformly mixed, and add appropriate water simultaneously and make mix wetting; After stirring, then mixture is put into mould extrusion forming, and at being placed in 200 DEG C, drying treatment can obtain inorganic fibre of the present invention enhancing heat insulating board.
Embodiment 3: by aluminum silicate fiber 25 parts, basalt fibre 20 parts, sepiolite powder 20 parts, swelling perlite powder 20 parts, silicon sol 5 parts, Alumina gel 5 parts and titanium dioxide 5 parts add to be beaten in mixing equipment, fully be uniformly mixed, add appropriate moisture simultaneously and make mix wetting, after stirring, then mixture is put into mould extrusion forming; Finally product drying treatment at 150 DEG C can be obtained inorganic fibre of the present invention and strengthen heat insulating board.
Claims (6)
1. an inorganic fibre strengthens heat insulating board, using inorganic fibre as wild phase, add one or more thermal insulating fillings, and add the organic bond of suitable proportion or inorganic bonding agent and additive, and obtained after batch mixing, shaping and drying, it is characterized in that its composition weight is: inorganic fibre 10 ~ 80, thermal insulating filling 10 ~ 60, organic bond 1 ~ 10, inorganic bonding agent 5 ~ 20, additive 1 ~ 10.
2. inorganic fibre according to claim 1 strengthens heat insulating board, it is characterized in that inorganic fibre is the combination of the one or more than one in pure aluminium silicate, glass fibre, basalt fibre, mullite fiber and brucite fiber.
3. inorganic fibre according to claim 1 strengthens heat insulating board, it is characterized in that thermal insulating filling is the combination of the one or more than one in aerosil, white carbon black, sepiolite, pearlstone and diatomite.
4. inorganic fibre according to claim 1 strengthens heat insulating board, it is characterized in that organic bond is the combination of the one or more than one in resin, starch and Mierocrystalline cellulose.
5. inorganic fibre according to claim 1 strengthens heat insulating board, it is characterized in that inorganic bonding agent be silicon sol or other take silicon as the combination of the one or more than one in the inorganic bonding agent of principal element, Alumina gel and lignosulfite.
6. inorganic fibre according to claim 1 strengthens heat insulating board, it is characterized in that additive is the combination of a kind of in titanium dioxide and crystal whisker of hexa potassium titanate or two kinds.
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CN201310450913.9A CN104513041A (en) | 2013-09-29 | 2013-09-29 | Inorganic fiber reinforced heat insulation board |
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CN201310450913.9A CN104513041A (en) | 2013-09-29 | 2013-09-29 | Inorganic fiber reinforced heat insulation board |
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CN201310450913.9A Pending CN104513041A (en) | 2013-09-29 | 2013-09-29 | Inorganic fiber reinforced heat insulation board |
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CN104944889A (en) * | 2015-06-04 | 2015-09-30 | 合肥和安机械制造有限公司 | Composite modified porous calcium silicate-carbonized foaming phenolic resin based insulation material for forklift engine exhaust pipe and preparation method of insulation material |
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Application publication date: 20150415 |