CN104507300A - Phase change material for filling shell of heating electronic equipment - Google Patents
Phase change material for filling shell of heating electronic equipment Download PDFInfo
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- CN104507300A CN104507300A CN201510012674.8A CN201510012674A CN104507300A CN 104507300 A CN104507300 A CN 104507300A CN 201510012674 A CN201510012674 A CN 201510012674A CN 104507300 A CN104507300 A CN 104507300A
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- change material
- electronic equipment
- phase change
- phase
- heating electronic
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Abstract
The invention discloses a phase change material for filling a shell of heating electronic equipment. The phase change material is formed by mixing phase change microcapsules of which the average diameters are 20 mu and copper oxide aerogel. The phase change material has the advantages of being small in density, strong in flexicity and high in heat storage capacity, and the temperature of the electronic equipment can be effectively and quickly reduced and can be limited to below 40 DEG C.
Description
Technical field
The present invention is mainly used in mobile phone heat radiation, laptop radiating, machine room heat radiation etc.
Background technology
Electronic radiation is a general orientation in current field of heat transfer, and weighing the quality of a radiator has 2 points: heat radiation and quiet.As everyone knows, high temperature is the formidable enemy of integrated circuit.High temperature not only can cause system cloud gray model unstable, and useful life shortens, and even likely makes some parts burn.The heat of high temperature is caused not to be from outside electronic equipment, but electronic equipment internal, or perhaps IC interior.The effect of electronic heat sink is exactly by these heat absorption, then diffuses in cabinet or outside cabinet, ensures that the temperature of all parts is normal.Most radiator passes through and heat generating components surface contact, absorbs heat, then is delivered at a distance by heat by various method, and in the air in such as casing, then these hot-airs pass to outside casing by casing, complete the heat radiation of computer.But the main trend of electronic equipment is microminiaturized, and increasing micro high-power electronic equipment appears on the market.Meanwhile, the heat dissipation problem of micromodule equipment is badly in need of solving.Utilize traditional heat dissipation equipment obviously can not ensure micromodule equipment effective cooling under quiet condition, for this reason, utilize new material to be one of best selection as heat dissipating method.
The present invention proposes a kind of phase-change material for filling heating electronic equipment casing, the heat radiation of various micro high-power electronic equipment can be applied to.
Summary of the invention
The present invention relates to a kind of phase-change material for filling heating electronic equipment casing.This kind of novel phase-change material is filled in electronic equipment casing the object that can realize preventing the too high and quick cooling of electronic equipment temperature.It is that the temperature caused when electronic equipment generates heat too much under high-power state raises phenomenon generation suddenly that phase transition temperature is decided to be 40 DEG C, and cupric oxide aeroge both ensure that heat conducted the mechanical performance that in turn ensure that phase-change material fast.
The invention will be further described below, do not limit the scope of the invention.A kind of phase-change material for filling heating electronic equipment casing.It is proportionally embedded in the expanded material of electronic equipment casing, according to our experimental results, described a kind of ratio for filling the heating phase-change material of electronic equipment casing and the gross thickness of electronic equipment casing is proper between 0.5-0.8.Described a kind of phase-change material for filling heating electronic equipment casing both with membranaceous multilayer form superposition embedding, also evenly can embed with powdery form.
Claims (2)
1. a kind of phase-change material for filling heating electronic equipment casing described in evenly to be closed according to the mass ratio of 50:1 by a kind of 40 DEG C of special phase-change material micro-capsules and the cupric oxide aeroge with 90% porosity and forms very much.
2. the average diameter of 40 DEG C of phase-change material micro-capsules according to claim 1 is 20 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012674.8A CN104507300A (en) | 2015-01-09 | 2015-01-09 | Phase change material for filling shell of heating electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012674.8A CN104507300A (en) | 2015-01-09 | 2015-01-09 | Phase change material for filling shell of heating electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104507300A true CN104507300A (en) | 2015-04-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510012674.8A Pending CN104507300A (en) | 2015-01-09 | 2015-01-09 | Phase change material for filling shell of heating electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104507300A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455441A (en) * | 2016-10-25 | 2017-02-22 | 南京中新赛克科技有限责任公司 | Efficient temperature control device for handheld terminal device |
| CN113998983A (en) * | 2021-10-28 | 2022-02-01 | 中国电子科技集团公司第十八研究所 | Composite thermal insulation material integrally formed with battery shell and preparation process thereof |
| CN114967858A (en) * | 2021-12-27 | 2022-08-30 | 淮阴师范学院 | Device of making an uproar falls in main frame |
-
2015
- 2015-01-09 CN CN201510012674.8A patent/CN104507300A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455441A (en) * | 2016-10-25 | 2017-02-22 | 南京中新赛克科技有限责任公司 | Efficient temperature control device for handheld terminal device |
| CN106455441B (en) * | 2016-10-25 | 2018-11-16 | 南京中新赛克科技有限责任公司 | A kind of high efficiency temperature controlled device of hand-held terminal device |
| CN113998983A (en) * | 2021-10-28 | 2022-02-01 | 中国电子科技集团公司第十八研究所 | Composite thermal insulation material integrally formed with battery shell and preparation process thereof |
| CN114967858A (en) * | 2021-12-27 | 2022-08-30 | 淮阴师范学院 | Device of making an uproar falls in main frame |
| CN114967858B (en) * | 2021-12-27 | 2023-09-22 | 淮阴师范学院 | Noise reduction device for computer host |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150408 |
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| RJ01 | Rejection of invention patent application after publication |