CN104502630A - Single-chip double-axis horizontal optical fiber acceleration sensor and preparation method thereof - Google Patents
Single-chip double-axis horizontal optical fiber acceleration sensor and preparation method thereof Download PDFInfo
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- CN104502630A CN104502630A CN201510010031.XA CN201510010031A CN104502630A CN 104502630 A CN104502630 A CN 104502630A CN 201510010031 A CN201510010031 A CN 201510010031A CN 104502630 A CN104502630 A CN 104502630A
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Abstract
The invention provides a single-chip double-axis horizontal optical fiber acceleration sensor and a preparation method thereof. The method comprises the following steps: forming two single-axis acceleration sensing units with mutually orthogonal sensing directions and sensitive to horizontal acceleration on a first substrate, wherein the single-axis acceleration sensing units comprise micro reflectors, elastic beams and high-light reflection films; forming a micro reflector torsion space on the surface of a second substrate; bonding the first substrate and the second substrate; performing optical coupling package on a double-axis acceleration sensing chip and an optical fiber collimator. The two single-axis acceleration sensing chips with mutually orthogonal sensing directions are integrated on the same substrate, and the transmission of an optical signal is performed on the side of the double-axis acceleration sensing chip, so the package of the single-chip double-axis acceleration sensor based on an MEMS (Micro Electro Mechanical System) technology is greatly simplified.
Description
Technical field
The present invention relates to sensor field, particularly relate to a kind of single-chip double-shaft level optical fiber acceleration transducer and preparation method thereof.
Background technology
Acceleration transducer can measure moving object acceleration, in the application such as inertia measurement, inertial navigation, vibration survey, have demand widely.Relative to the conventional acceleration sensor of pressure drag, piezoelectricity, capacitance principle, optical fiber acceleration transducer becomes the important acceleration transducer of a class with its technical characterstic, is being subject to increasing attention, is applied widely in national economy, national defence., special application field important at some, the seismic detection system of such as aerospace guidance system, petroleum prospecting, the vibration monitoring on naval vessel, bridge construction structure detection system, traffic conditions monitoring system etc., be badly in need of having electromagnetism interference, high sensitivity, great dynamic range, easily multiplexing high-performance optical fiber acceleration transducer.
Optical fiber acceleration transducer mainly can be divided into intensity modulation type, phase modulation-type and wavelength-modulated type by optical sensitive principle, and already carried out extensive, deep research, wherein MEMS optical fiber acceleration transducer arouses widespread concern.MEMS optical fiber acceleration transducer adopts MEMS sensitive structure and optic Fiber Detecting Technology, has merged the feature of MEMS micro-fabrication technology and optical fiber sensing technology, has had the technical advantages such as volume is little, highly sensitive, batch micro operations.
Acceleration is a vector signal, and acceleration transducer has the response of directivity sensitivity usually, and MEMS optical fiber acceleration transducer can be divided into single shaft, twin shaft and 3 axis MEMS optical fiber acceleration transducer accordingly.At such as vector hydrophone, in the practical application such as inertial navigation and gesture stability, usually need complete acceleration information, the three axle optical fiber acceleration transducers developed based on MEMS technology are significant.
By encapsulation and integration technology, the 3-axis acceleration sensor based on MEMS technology realizes by three kinds of modes: (1) three individual axis acceleration sensing unit is directly packaged into 3-axis acceleration sensor.This implementation adds volume and the packaging cost of 3-axis acceleration sensor, and due to the quadrature mismatch of each single-axis sensors in encapsulation process, the sensitivity of reporting to the leadship after accomplishing a task of 3-axis acceleration sensor is inevitable, thus causes the performance degradation of sensor.(2) multivariant acceleration transducer is formed by single mass and some elastic beams, three components of first three mode of vibration of acceleration transducer difference sensing acceleration.But the 3-axis acceleration sensor of this single-chip of Design and manufacture is complicated, and to have identical performance at different sensitive direction be full of challenges.(3) three single-axis acceleration sensors unit are manufactured on the 3-axis acceleration sensor single substrate being formed single-chip by MEMS technology.Compared with above-mentioned MEMS 3-axis acceleration sensor, this kind of acceleration transducer has many good qualities: comprising moderate volume, little cross sensitivity, and easily realizes having identical performance at different sensitive direction.But the single-chip tri-axis acceleration sensor based on MEMS technology realized at present is that directly degree of will speed up signal converts electric signal to, instead of utilizes optic Fiber Detecting Technology to convert light signal to.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of single-chip double-shaft level optical fiber acceleration transducer and preparation method thereof, the Z-axis optical fiber acceleration transducer based on MEMS technology being easy to realize with us is integrated, realizes the single-chip tri-axis acceleration sensor based on MEMS technology.
For achieving the above object and other relevant objects, the invention provides a kind of single-chip double-shaft level optical fiber acceleration transducer, described single-chip double-shaft level optical fiber acceleration transducer at least comprises:
First substrate, for the formation of the two-axis acceleration sensitive chip with two individual axis acceleration sensing units; Described individual axis acceleration sensing unit comprises micro-reflective mirror, elastic beam and light highly reflecting films, described micro-reflective mirror is supported by described elastic beam, the two ends of described elastic beam are connected with described micro-reflective mirror and carriage respectively, and described smooth highly reflecting films are attached on described micro-reflective mirror;
Second substrate, forms micro-reflective mirror and reverses space, as wafer-level packaging;
And optical fiber collimator, encapsulated by same encapsulating package with described two-axis acceleration sensitive chip.
Preferably, described two-axis acceleration sensitive chip is parallel with described two-axis acceleration sensitive chip plane to the sensitive direction of acceleration.
Preferably, the acceleration of horizontal direction is converted into the torsion angle of described micro-reflective mirror by described two-axis acceleration sensitive chip.
Preferably, described single-chip double-shaft level optical fiber acceleration transducer comprises two optical fiber collimators, is positioned at the same side of described two-axis acceleration sensitive chip.
Preferably, the sensitive direction of described two individual axis acceleration sensing units is orthogonal.
Preferably, the center of gravity of described micro-reflective mirror is immediately below described elastic beam axis.
Preferably, described optical fiber collimator is utilized to realize single-chip double-shaft level optical fiber acceleration transducer to incident light coupled characteristic and described two-axis acceleration sensitive chip.
Preferably, described optical fiber collimator is utilized to realize uniaxial optical fibers acceleration transducer to incident light coupled characteristic and described individual axis acceleration sensing unit.
Preferably, described optical fiber collimator comprises single optical fiber calibrator or double-fiber collimator.
Preferably, described single-chip double-shaft level optical fiber acceleration transducer also comprises: the micro electro mechanical device being formed in described first substrate or described second substrate.
More preferably, described micro electro mechanical device comprises one or more in acceleration transducer, Magnetic Sensor, gyroscope, pressure transducer, humidity sensor, temperature sensor, sonic transducer.
For achieving the above object and other relevant objects, the invention provides a kind of preparation method of single-chip double-shaft level optical fiber acceleration transducer, the preparation method of described single-chip double-shaft level optical fiber acceleration transducer at least comprises the following steps:
First substrate is provided, at described first substrate surface deep etching, forms first micro-reflective mirror and reverse space;
Second substrate is provided, forms second micro-reflective mirror at described second substrate surface and reverse space;
By described first substrate and the second substrate bonding, form bonding pad;
Light highly reflecting films are formed at described first substrate surface;
Described first substrate is formed the mutually orthogonal individual axis acceleration sensing unit in two acceleration sensitive directions;
To described bonding pad scribing, form two-axis acceleration sensitive chip; By encapsulating package, described two-axis acceleration sensitive chip and optical fiber collimator are carried out optical coupled encapsulation, form single-chip double-shaft level optical fiber acceleration transducer.
Preferably, described smooth high reverse--bias is attached on described two-axis acceleration sensing unit.
Preferably, adopt and carry out each step based on microcomputer electric surface technology or micro electronmechanical body silicon processing technique.
Preferably, also step is comprised: in described first substrate and described second substrate, form micro electro mechanical device.
As mentioned above, single-chip double-shaft level optical fiber acceleration transducer of the present invention and preparation method thereof, has following beneficial effect:
Single-chip double-shaft level optical fiber acceleration transducer of the present invention and preparation method thereof is by the same substrate integrated for individual axis acceleration sensitive chip orthogonal for two sensitive directions, and the transmission of light signal is in two-axis acceleration sensitive chip side, enormously simplify the encapsulation of the single-chip double-axel acceleration sensor based on MEMS technology.
Accompanying drawing explanation
Fig. 1 a ~ Fig. 1 f is shown as preparation method's schematic flow sheet of single-chip double-shaft level optical fiber acceleration transducer of the present invention.
Fig. 2 is shown as the vertical view of single-chip double-shaft level optical fiber acceleration transducer of the present invention.
Fig. 3 is shown as the principle of work schematic diagram of single-chip double-shaft level optical fiber acceleration transducer of the present invention.
Element numbers explanation
11 optical fiber collimators
111 optical fiber
112 condenser lenses
21 first substrates
211 device layers
212 oxygen buried layers
213 substrate silicon layer
22 individual axis acceleration sensing units
221 elastic beams
222 micro-reflective mirrors
223 smooth highly reflecting films
224 carriages
23 first micro-reflective mirrors reverse space
31 second substrates
32 second micro-reflective mirrors reverse space
41 BCB glue
51 two-axis acceleration sensitive chips
61 encapsulating packages
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this instructions can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this instructions also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Refer to Fig. 1 a ~ Fig. 3.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present invention in a schematic way, then only the assembly relevant with the present invention is shown in graphic but not component count, shape and size when implementing according to reality is drawn, it is actual when implementing, and the kenel of each assembly, quantity and ratio can be a kind of change arbitrarily, and its assembly layout kenel also may be more complicated.
As shown in Fig. 1 a ~ Fig. 1 f, the invention provides a kind of preparation method of single-chip double-shaft level optical fiber acceleration transducer, the preparation method of described single-chip double-shaft level optical fiber acceleration transducer at least comprises the following steps:
Step one: provide the first substrate 21, carries out deep etching on described first substrate 21 surface, forms first micro-reflective mirror and reverses space 23.
Particularly, as shown in Figure 1a, in the present embodiment, adopt commercial soi wafer as the first substrate 21, described first substrate 21 comprises device layer 211, and its thickness is set as 30 μm; Oxygen buried layer 212, its thickness is set as 2 μm; Substrate silicon layer 213, its thickness is set as 380 μm; Described oxygen buried layer 212 is between described device layer 211 and described substrate silicon layer 213.Described substrate silicon layer 213 is coated with thick photoresist, etches described substrate silicon layer 213 after photoetching development until expose described oxygen buried layer 212, in the present embodiment, adopt deep reaction ion etching (DRIE) to etch described substrate silicon layer 213.Utilize the concentrated sulphuric acid to remove photoresist, in recycling BOE solution, remove the described oxygen buried layer 212 exposed, form first micro-reflective mirror and reverse space 23.
Step 2: provide the second substrate 31, forms second micro-reflective mirror on described second substrate 31 surface and reverses space 32.
Particularly, as shown in Figure 1 b, in the present embodiment, adopt commercial two silicon chip of throwing as the second substrate 31, by thermal oxide at the superficial growth thickness of described second substrate 31 be
siO
2, photoetching is also with the SiO of growth on BOE solution graphically described second substrate 31
2, adopt the concentrated sulphuric acid remove photoresist, put into 40 DEG C, concentration be 40% KOH solution corrode, form the space 32 of the torsion of described second micro-reflective mirror, its degree of depth is about 60 μm.
Step 3: by described first substrate 21 and the second substrate 31 bonding, forms bonding pad.
Particularly, as illustrated in figure 1 c, in the present embodiment, the surface forming the space 32 of the torsion of described second micro-reflective mirror with photoresist spinner in described second substrate 31 is coated with BCB glue 41, its thickness is set as 9 μm, the second substrate 31 scribbling BCB glue 41 and described first substrate 21 is formed the surperficial prealignment in the space 31 of the torsion of described first micro-reflective mirror and bonding.
Step 4: form light highly reflecting films 223 on described first substrate 21 surface.
Particularly, as shown in Figure 1 d, in the present embodiment, by magnetron sputtering deposition metallic film TiW/Au on the surface of the first substrate 21, its thickness is set as
photoetching development, obtains described smooth highly reflecting films 223 with Au corrosive liquid and TiW corrosive liquid patterned metal film respectively.
Step 5: form the mutually orthogonal individual axis acceleration sensing unit 22 in two acceleration sensitive directions in described first substrate 21.
Particularly, as shown in fig. le, in the present embodiment, resist coating in described first substrate 21, relative to the position exposure imaging of described smooth highly reflecting films 223, by deep reaction ion etching (DRIE), form the individual axis acceleration sensing unit 22 that two sensitive directions are mutually orthogonal.
Step 6: to described bonding pad scribing, forms two-axis acceleration sensitive chip; By encapsulating package, described two-axis acceleration sensitive chip and optical fiber collimator are carried out optical coupled encapsulation, form single-chip double-shaft level optical fiber acceleration transducer.
Particularly, in the present embodiment, with the bonding pad scribing of scribing machine by structure release, two-axis acceleration sensitive chip 51 is as shown in fig. le formed.As shown in Figure 1 f, with epoxy resin, described two-axis acceleration sensitive chip 51 is welded on the pedestal of encapsulating package 61, successively optical fiber collimator 11 and described twin shaft angular velocity sensitive chip 51 is packaged together with optical adjusting bracket.
After step 5, also can form micro electro mechanical device in described first substrate 21 or the second substrate 31.Described micro electro mechanical device accelerometer, gyroscope, pressure transducer, humidity sensor, temperature sensor and sonic transducer etc.
Can adopt and prepare single-chip double-shaft level optical fiber acceleration transducer of the present invention based on microcomputer electric surface technology or micro electronmechanical body silicon processing technique, no longer be described in detail at this.
As shown in Fig. 1 a to 1f, the technology single-chip double-shaft level optical fiber acceleration transducer based on MEMS that above-mentioned preparation method is formed at least comprises:
First substrate 21, for the formation of the two-axis acceleration sensitive chip 51 with two individual axis acceleration sensing units 22, be illustrated in figure 2 the vertical view of single-chip double-shaft level optical fiber acceleration transducer of the present invention, the sensitive direction of two individual axis acceleration sensing units 22 is orthogonal; Described individual axis acceleration sensing unit 22 comprises micro-reflective mirror 222, elastic beam 221 and light highly reflecting films 223, described micro-reflective mirror 222 is supported by described elastic beam 221, the two ends of described elastic beam 221 are connected with described micro-reflective mirror 222 and carriage 224 respectively, and described smooth highly reflecting films 223 are attached on described micro-reflective mirror 222;
Second substrate 31, is positioned at the below of described first substrate 21, as wafer-level packaging;
And optical fiber collimator 11, encapsulated by same encapsulating package 61 with described first substrate 21 and described second substrate 31.
Described single-chip double-shaft level optical fiber acceleration transducer is by described two-axis acceleration sensitive chip 51, and described optical fiber collimator 11 and described encapsulating package 61 3 part form.Described two-axis acceleration sensitive chip 51 comprises two individual axis acceleration sensing units 22.Described individual axis acceleration sensing unit 22 is made up of described micro-reflective mirror 222, described elastic beam 221 and described smooth highly reflecting films 223.The center of gravity of described micro-reflective mirror 222 to be positioned at immediately below described elastic beam 221 axis and through described elastic beam 221 axis and the plane vertical with the minute surface of described micro-reflective mirror 222, to ensure that described individual axis acceleration sensing unit 22 is only responsive to the acceleration signal in a direction in plane.
Described two-axis acceleration sensitive chip 51 parallel with described two-axis acceleration sensitive chip 51 plane to the sensitive direction of acceleration.The sensitive direction of described two individual axis acceleration sensing units 22 is orthogonal.The acceleration of horizontal direction is converted into the torsion angle of described micro-reflective mirror 222 by described two-axis acceleration sensitive chip 51.
In the present embodiment, described single-chip double-shaft level optical fiber acceleration transducer comprises two optical fiber collimators 11, is positioned at the same side of described two-axis acceleration sensitive chip 51.Described optical fiber collimator comprises single optical fiber calibrator, double-fiber collimator.In the present embodiment, described optical fiber collimator 11 comprises optical fiber 111 and condenser lens 112.
Described optical fiber collimator 11 pairs of incident light coupled characteristics and described two-axis acceleration sensitive chip 51 is utilized to realize single-chip double-shaft level optical fiber acceleration transducer.
Described optical fiber collimator 11 pairs of incident light coupled characteristics and described individual axis acceleration sensing unit 22 is utilized to realize uniaxial optical fibers acceleration transducer.
Described single-chip double-shaft level optical fiber acceleration transducer also comprises: the micro electro mechanical device being formed in described first substrate 21 or described second substrate 31.Described micro electro mechanical device comprise in acceleration transducer, Magnetic Sensor, gyroscope, pressure transducer, humidity sensor, temperature sensor, sonic transducer one or more.
The above-mentioned technology single-chip double-shaft level optical fiber acceleration transducer principle based on MEMS is as shown in Figure 3: described individual axis acceleration sensitive chip 22 is under the effect of sensitive direction acceleration, described micro-reflective mirror 222 can be subject to the effect of moment of inertia, this moment drives described micro-reflective mirror 222 to reverse, and the windup-degree θ of generation is directly proportional to acceleration signal.Thus realize the acceleration signal in a direction in plane and the conversion of described micro-reflective mirror 222 windup-degree θ.The detection of the windup-degree of described micro-reflective mirror 222 adopts described optical fiber collimator 11 to carry out, and the emergent light spot of described optical fiber 111 expands by described optical fiber collimator 11, has very high susceptibility to the incident angle of incident light.The light signal of described optical fiber collimator 11 outgoing reflects deflection through described micro-reflective mirror 222, and light signal is coupled to described optical fiber collimator 11 again.Under the effect of sensitive direction acceleration, described micro-reflective mirror 222 produces angle and reverses θ, cause the reflection angle of reflected light signal to change, the sharply change of the coupling efficiency of the described optical fiber collimator 11 that causes being coupled back, the change of detection coupling light intensity just can detect the acceleration signal of sensitive direction.
The present invention is integrated with MEMS micro-fabrication technology and optic Fiber Detecting Technology, thus its have that the volume of MEMS micro-fabrication technology is little, lightweight, the high sensitivity of mass production and optic Fiber Detecting Technology, high frequency response, passive, electromagnetism interference characteristic.Because the input and output of light signal are in a survey of two-axis acceleration sensitive chip, and only need two optical fiber collimators just can realize the transmission of the light signal of two-axis acceleration sensitive chip, thus not only simplify the encapsulation of chip and also reduce chip package cost and volume.The Z-axis acceleration transducer that single-chip two-axis acceleration sensitive chip of the present invention can realize with us is integrated, realizes single-chip tri-axis optical fiber acceleration transducer.
In sum, the invention provides a kind of single-chip double-shaft level optical fiber acceleration transducer, at least comprise: the first substrate, for the formation of the two-axis acceleration sensitive chip with two individual axis acceleration sensing units; Described individual axis acceleration sensing unit comprises micro-reflective mirror, elastic beam and light highly reflecting films, described micro-reflective mirror is supported by described elastic beam, the two ends of described elastic beam are connected with described micro-reflective mirror and carriage respectively, and described smooth highly reflecting films are attached on described micro-reflective mirror; Second substrate, is positioned at the below of described first substrate, as wafer-level packaging; And optical fiber collimator, encapsulated by same encapsulating package with described first substrate and described second substrate.The invention provides its preparation method, comprising: the first substrate is provided, carry out deep etching at described first substrate surface, form first micro-reflective mirror and reverse space; Second substrate is provided, forms second micro-reflective mirror at described second substrate surface and reverse space; By described first substrate and the second substrate bonding, form bonding pad; Light highly reflecting films are formed at described first substrate surface; Described first substrate is formed the mutually orthogonal individual axis acceleration sensing unit in two acceleration sensitive directions; To described bonding pad scribing, form two-axis acceleration sensitive chip; By encapsulating package, described two-axis acceleration sensitive chip and optical fiber collimator are carried out optical coupled encapsulation, form single-chip double-shaft level optical fiber acceleration transducer.Single-chip double-shaft level optical fiber acceleration transducer of the present invention and preparation method thereof is by the same substrate integrated for individual axis acceleration sensitive chip orthogonal for two sensitive directions, and the transmission of light signal is in two-axis acceleration sensitive chip side, enormously simplify the encapsulation of the single-chip double-axel acceleration sensor based on MEMS technology.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (15)
1. a single-chip double-shaft level optical fiber acceleration transducer, is characterized in that, described single-chip double-shaft level optical fiber acceleration transducer at least comprises:
First substrate, for the formation of the two-axis acceleration sensitive chip with two individual axis acceleration sensing units; Described individual axis acceleration sensing unit comprises micro-reflective mirror, elastic beam and light highly reflecting films, described micro-reflective mirror is supported by described elastic beam, the two ends of described elastic beam are connected with described micro-reflective mirror and carriage respectively, and described smooth highly reflecting films are attached on described micro-reflective mirror;
Second substrate, forms micro-reflective mirror and reverses space, as wafer-level packaging;
And optical fiber collimator, encapsulated by same encapsulating package with described two-axis acceleration sensitive chip.
2. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: described two-axis acceleration sensitive chip parallel with described two-axis acceleration sensitive chip plane to the sensitive direction of acceleration.
3. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: the acceleration of horizontal direction is converted into the torsion angle of described micro-reflective mirror by described two-axis acceleration sensitive chip.
4. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: described single-chip double-shaft level optical fiber acceleration transducer comprises two optical fiber collimators, is positioned at the same side of described two-axis acceleration sensitive chip.
5. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: the sensitive direction of described two individual axis acceleration sensing units is orthogonal.
6. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: the center of gravity of described micro-reflective mirror is immediately below described elastic beam axis.
7. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: utilize described optical fiber collimator to realize single-chip double-shaft level optical fiber acceleration transducer to incident light coupled characteristic and described two-axis acceleration sensitive chip.
8. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: utilize described optical fiber collimator to realize uniaxial optical fibers acceleration transducer to incident light coupled characteristic and described individual axis acceleration sensing unit.
9. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: described optical fiber collimator comprises single optical fiber calibrator or double-fiber collimator.
10. single-chip double-shaft level optical fiber acceleration transducer according to claim 1, is characterized in that: described single-chip double-shaft level optical fiber acceleration transducer also comprises: the micro electro mechanical device being formed in described first substrate or described second substrate.
11. single-chip double-shaft level optical fiber acceleration transducers according to claim 10, is characterized in that: described micro electro mechanical device comprise in acceleration transducer, Magnetic Sensor, gyroscope, pressure transducer, humidity sensor, temperature sensor, sonic transducer one or more.
The preparation method of 12. 1 kinds of single-chip double-shaft level optical fiber acceleration transducers, is characterized in that, the preparation method of described single-chip double-shaft level optical fiber acceleration transducer at least comprises the following steps:
First substrate is provided, at described first substrate surface deep etching, forms first micro-reflective mirror and reverse space;
Second substrate is provided, forms second micro-reflective mirror at described second substrate surface and reverse space;
By described first substrate and the second substrate bonding, form bonding pad;
Light highly reflecting films are formed at described first substrate surface;
Described first substrate is formed the mutually orthogonal individual axis acceleration sensing unit in two acceleration sensitive directions;
To described bonding pad scribing, form two-axis acceleration sensitive chip; By encapsulating package, described two-axis acceleration sensitive chip and optical fiber collimator are carried out optical coupled encapsulation, form single-chip double-shaft level optical fiber acceleration transducer.
The preparation method of 13. single-chip double-shaft level optical fiber acceleration transducers according to claim 12, is characterized in that: described smooth high reverse--bias is attached on described two-axis acceleration sensing unit.
The preparation method of 14. single-chip double-shaft level optical fiber acceleration transducers according to claim 12, is characterized in that: adopt and carry out each step based on microcomputer electric surface technology or micro electronmechanical body silicon processing technique.
The preparation method of 15. single-chip double-shaft level optical fiber acceleration transducers according to claim 12, is characterized in that: also comprise step: in described first substrate and described second substrate, form micro electro mechanical device.
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| CN113311188A (en) * | 2021-05-25 | 2021-08-27 | 欧梯恩智能科技(苏州)有限公司 | Double-shaft diffraction type silicon light acceleration sensor and preparation method thereof |
| CN113311189A (en) * | 2021-05-25 | 2021-08-27 | 欧梯恩智能科技(苏州)有限公司 | Diffraction type silicon light acceleration sensor preparation process and obtained sensor |
| CN115728512A (en) * | 2021-08-25 | 2023-03-03 | 上海拜安传感技术有限公司 | Optical fiber acceleration sensor and forming method thereof |
| CN115728512B (en) * | 2021-08-25 | 2024-02-27 | 上海拜安传感技术有限公司 | Optical fiber acceleration sensor and method for forming optical fiber acceleration sensor |
| CN113823626A (en) * | 2021-09-23 | 2021-12-21 | 华东光电集成器件研究所 | Acceleration value recording device for penetration measurement based on Fanout technology |
| CN113823626B (en) * | 2021-09-23 | 2023-10-31 | 华东光电集成器件研究所 | Acceleration value recording device for penetration measurement based on fan-out technology |
| CN114236683A (en) * | 2021-12-23 | 2022-03-25 | 欧梯恩智能科技(苏州)有限公司 | Self-coupling photon acceleration sensor chip and manufacturing method thereof |
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