CN104497897A - Method for adhering paperboard material and lamination material - Google Patents
Method for adhering paperboard material and lamination material Download PDFInfo
- Publication number
- CN104497897A CN104497897A CN201410725170.6A CN201410725170A CN104497897A CN 104497897 A CN104497897 A CN 104497897A CN 201410725170 A CN201410725170 A CN 201410725170A CN 104497897 A CN104497897 A CN 104497897A
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- conducting strip
- paperboard
- paperboard material
- covering material
- adhesive bonding
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Abstract
The invention discloses a method for adhering a paperboard material and a lamination material and belongs to the field of lamination methods. The method is designed for solving the problem that by the conventional method, the paperboard material and the lamination material are poor in sealing property and not environmentally friendly. The method for adhering the paperboard material and the lamination material at least comprises the following steps: step 1, placing the paperboard material attached to the lamination material on a first conducting strip, pressing a second conducting strip to the paperboard material attached to the lamination material; and step 2, electrifying the first conducting strip and/or the second conducting strip for a preset time t, wherein resonance is generated between molecules in the paperboard material and the lamination material so as to achieve mutual permeation and adhesion by virtue of the current generated between the first conducting strip and the second conducting strip. By the method, the paperboard material and the lamination material are good in adhesive effect and environmentally friendly.
Description
Technical field
The present invention relates to film covering method field, be specifically related to the adhesive bonding method of a kind of paperboard material and covering material.
Background technology
Paperboard material is in order to improve the performance parameters such as its rigidity, shrinking percentage, intensity, thermotolerance, and usually need to carry out aluminum coated steel on its surface, wherein, the bonding of covering material and paperboard material is committed step, decides the success or failure of coating technique.
In prior art, the adhesive bonding method major part of covering material and paperboard material is bonded by organic compound tackiness agent, the method is unfavorable for environmental protection and bonding effect is undesirable, also there are some to be that method by sewing up realizes bonding, but can not seal and not reach higher use standard after bonding.
Summary of the invention
The object of the invention is to the adhesive bonding method proposing a kind of paperboard material and covering material, the good and environmental protection of the method bonding effect.
For reaching this object, the present invention by the following technical solutions:
An adhesive bonding method for paperboard material and covering material, described method at least comprises the steps:
Step 1, by laminating covering material after paperboard material be positioned on the first conducting strip, by second conducting strip compress laminating covering material after described paperboard material;
Step 2, be described first conducting strip and/or described second conducting strip energising preset time t, the electric current produced between described first conducting strip and described second conducting strip makes the molecule in described paperboard material and described covering material produce resonance thus realizes interpenetrating bonding.
Further, described first conducting strip and/or described second conducting strip are connected with high-frequency current machine, and described high-frequency current machine is used for providing power supply.
Further, described step 1 is specially:
T conduction time of described paperboard material is set according to the paperboard material thickness of required bonding, paperboard material after laminating covering material is positioned on the first conducting strip, press pressed switch, the second conducting strip is by the downward pressing of described paperboard material after laminating covering material;
Further, described step 2 is specially:
Setting t conduction time of described paperboard material according to the paperboard material thickness of required bonding, is described first conducting strip and/or described second conducting strip energising preset time t
Further, described method also comprises:
After the preset time t that is energized in step 3, described step 2 terminates, the conducting strip be connected with described high-frequency current machine is upspring automatically, and remove described paperboard material, operation completes.
Further, described covering material is made up of polypropylene.
Further, an end face level of the described paperboard material after laminating covering material is placed on described first conducting strip.
Beneficial effect of the present invention is:
(1) paperboard material provided by the invention and covering material adhesive bonding method make the performances such as the shrinking percentage of the paperboard material after bonding, intensity, thermotolerance and chemical stability be greatly improved.
(2) the present invention realizes the molecular resonance of paperboard material and covering material by producing high-frequency current between conducting strip and then paperboard material and covering material is interpenetrated bond, avoid the problem using organic compound tackiness agent welding in existing method, the good and environmental protection of the method bonding effect.
Embodiment
Technical scheme of the present invention is further illustrated below by embodiment.
An adhesive bonding method for paperboard material and covering material, described method comprises the steps:
Step 1, t conduction time according to the paperboard material after the paperboard material thickness of required bonding setting laminating covering material, paperboard material after laminating covering material is positioned on the first conducting strip, in present embodiment, first conducting strip is lower conducting strip, second conducting strip is upper conducting strip, wherein, one end face level of paperboard material is placed in the first conducting strip and namely descends on conducting strip and to be placed in same level with lower conducting strip, press pressed switch, namely the second conducting strip goes up conducting strip by the downward pressing of described paperboard material after laminating covering material;
Step 2, upper conducting strip are connected with high-frequency current machine, and this high-frequency current machine is used for providing power supply.For upper conducting strip energising preset time t, the high-frequency current produced between upper and lower two conducting strips makes the molecule in paperboard material and covering material produce resonance thus realizes interpenetrating bonding.
After the preset time t that is energized in step 3, step 2 terminates, the upper conducting strip be connected with high-frequency current machine is upspring automatically, and remove paperboard material, operation completes.
Aforesaid method bonds one of them end face of paperboard material and covering material, as bonded another end face of paperboard material and covering material, then, after needing another end face and covering material to fit, proceeds following steps:
The paperboard material of step 4, covering material of being fitted other end to be placed on lower conducting strip and to be placed in same level with lower conducting strip;
Step 5, press pressed switch, the downward pressing of upper conducting strip, the high-frequency current of upper and lower two conducting strips makes the molecule in paperboard material and covering material produce resonance thus realizes interpenetrating bonding.
Step 6, after completing bonding, upper conducting strip is upspring automatically, and the paperboard material of other end and covering material have bonded.
Step 7, deenergization, complete the bonding of two end faces of paperboard material.
Also can bond two end faces of paperboard material and covering material in aforesaid method simultaneously, before being positioned over lower conducting strip, after two of paperboard material end faces and covering material all being posted, adopt above-mentioned steps 1-3 complete operation.
The quantity of above-mentioned conducting strip is not limit, and can bond, thus improve adhesion efficiency by placing multiple paperboard material between the multiple conducting strip of employing; In addition, in step 2, high-frequency current machine must be used, other modes cannot be adopted to provide power supply for conducting strip.
Below be only realize preferred version of the present invention to be not intended to limit; anyly the specific embodiment of the present invention is modified or equivalent replacement is carried out to portion of techniques feature; and do not depart from the spirit of technical solution of the present invention, all should be encompassed in request of the present invention protection technical scheme scope in the middle of.Protection scope of the present invention also comprises those skilled in the art and does not pay the thinkable any alternate embodiments of creative work.
Claims (7)
1. an adhesive bonding method for paperboard material and covering material, is characterized in that, described method at least comprises the steps:
Step 1, by laminating covering material after paperboard material be positioned on the first conducting strip, by second conducting strip compress laminating covering material after described paperboard material;
Step 2, be described first conducting strip and/or described second conducting strip energising preset time t, the electric current produced between described first conducting strip and described second conducting strip makes the molecule in described paperboard material and described covering material produce resonance thus realizes interpenetrating bonding.
2. the adhesive bonding method of a kind of paperboard material according to claim 1 and covering material, is characterized in that, described first conducting strip and/or described second conducting strip are connected with high-frequency current machine, and described high-frequency current machine is used for providing power supply.
3. the adhesive bonding method of a kind of paperboard material according to claim 2 and covering material, it is characterized in that, described step 1 is specially:
Be positioned on the first conducting strip by paperboard material after laminating covering material, press pressed switch, the second conducting strip is by the downward pressing of described paperboard material after laminating covering material.
4. the adhesive bonding method of a kind of paperboard material according to claim 3 and covering material, it is characterized in that, described step 2 is specially:
Setting t conduction time of described paperboard material according to the paperboard material thickness of required bonding, is described first conducting strip and/or described second conducting strip energising preset time t
5. the adhesive bonding method of a kind of paperboard material according to claim 4 and covering material, it is characterized in that, described method also comprises:
After the preset time t that is energized in step 3, described step 2 terminates, the conducting strip be connected with described high-frequency current machine is upspring automatically, and remove described paperboard material, operation completes.
6. the adhesive bonding method of a kind of paperboard material according to claim 5 and covering material, is characterized in that, described covering material is made up of polypropylene.
7. the adhesive bonding method of a kind of paperboard material according to claim 1 and covering material, is characterized in that, an end face level of the described paperboard material after laminating covering material is placed on described first conducting strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410725170.6A CN104497897B (en) | 2014-12-03 | 2014-12-03 | A kind of adhesive bonding method of paperboard material and covering material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410725170.6A CN104497897B (en) | 2014-12-03 | 2014-12-03 | A kind of adhesive bonding method of paperboard material and covering material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104497897A true CN104497897A (en) | 2015-04-08 |
| CN104497897B CN104497897B (en) | 2018-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410725170.6A Active CN104497897B (en) | 2014-12-03 | 2014-12-03 | A kind of adhesive bonding method of paperboard material and covering material |
Country Status (1)
| Country | Link |
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| CN (1) | CN104497897B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305892A (en) * | 2000-01-17 | 2001-08-01 | 蔡磊 | High-frequency vortex filming machine |
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN101607607A (en) * | 2009-07-14 | 2009-12-23 | 朱长宝 | Sealing opening of aluminum-plastic paper composite packaging material adhesive bonding method and device thereof |
-
2014
- 2014-12-03 CN CN201410725170.6A patent/CN104497897B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305892A (en) * | 2000-01-17 | 2001-08-01 | 蔡磊 | High-frequency vortex filming machine |
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN101607607A (en) * | 2009-07-14 | 2009-12-23 | 朱长宝 | Sealing opening of aluminum-plastic paper composite packaging material adhesive bonding method and device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104497897B (en) | 2018-07-17 |
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Effective date of registration: 20190515 Address after: No. 28, No. 1, Sanlian Industrial Zone, Gulao Town, Heshan City, Jiangmen City, Guangdong Province Patentee after: Heshan Hongxuan Cultural Supplies Co., Ltd. Address before: Room C803, Jingmei Building, Jingshao, Tuen Mun Hill, Hong Kong, China Patentee before: Huang Jiangming |