CN104493690A - Clamping device suitable for wafers of different sizes - Google Patents
Clamping device suitable for wafers of different sizes Download PDFInfo
- Publication number
- CN104493690A CN104493690A CN201410818866.3A CN201410818866A CN104493690A CN 104493690 A CN104493690 A CN 104493690A CN 201410818866 A CN201410818866 A CN 201410818866A CN 104493690 A CN104493690 A CN 104493690A
- Authority
- CN
- China
- Prior art keywords
- clamping device
- clamping
- different size
- wafer
- clamping part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
Abstract
The invention discloses a clamping device suitable for wafers of different sizes. The clamping device is characterized by comprising grabbing rods, a clamping part (3) and a telescopic round ring (1); the grabbing rods comprise three arc grabbing rods (2) of which the upper ends are connected to the telescopic round ring (1); the lower ends of the arc grabbing rods (2) are connected with the clamping part (3); chutes (5) are formed in the middles of the arc grabbing rods (2); clamping rings (4) are arranged on the chutes (5); the clamping part (3) is a circular arc clamping rod; a circular arc clamping groove (31) is formed inside the clamping part (3); rubber is arranged on the surface of the circular arc clamping groove (31); buckles (6) are arranged at the intersections of the clamping rings (4) and the chutes (5). The clamping device has a simple structure, can be used for accurately fixing the wafers, is suitable for the wafers of different sizes and is convenient and practical.
Description
Technical field
The present invention relates to field of semiconductor manufacture, be specifically related to a kind of clamping device adapting to different size wafer.
Background technology
During wafer manufactures, cmp CMP technology is utilized to carry out surface global to wafer planarized, the CMP cmp technological synthesis advantage of chemical grinding and mechanical lapping, comparatively perfectly surface can be obtained while guarantee material removal efficiency, the flatness obtained uses these two kinds of grindings will exceed 1-2 the order of magnitude than simple, and can realize the surface roughness of nanoscale to atom level.To clean wafer after cmp, existing wafer cleaning machine in prior art, but in actual production manufacture process, wafer cleaning machine there will be mistake and reports to the police, now need manual delivery wafer, and the size of wafer is different, therefore the wafer of different size needs the clamping device of different size.
Chinese patent (201420149283.1), discloses a kind of wafer gripping tool, and this utility model is by realizing the stretching of spring and resetting the clamping of wafer and fixing, but it can only be applicable to a kind of wafer of size.
Summary of the invention
For solving deficiency of the prior art, the invention provides a kind of clamping device adapting to different size wafer.
In order to realize above-mentioned target, the present invention adopts following technical scheme:.
Adapt to a clamping device for different size wafer, it is characterized in that, comprise and grab bar, clamping part, flexible annulus, described in grab bar and comprise the arc that three upper ends are connected on described flexible annulus and grab bar; The lower end that described arc grabs bar connects described clamping part; The middle part that described arc is grabbed on bar is provided with chute; Described chute arranges garter spring.
Aforesaid a kind of clamping device adapting to different size wafer, is characterized in that, described clamping part is the supporting rod in circular arc.
Aforesaid a kind of clamping device adapting to different size wafer, is characterized in that, the inner side of described clamping part arranges circular arc draw-in groove.
Aforesaid a kind of clamping device adapting to different size wafer, is characterized in that, the surface of described circular arc draw-in groove arranges rubber.
Aforesaid a kind of clamping device adapting to different size wafer, it is characterized in that, the position that described chute is grabbed on bar at three arcs is identical.
Aforesaid a kind of clamping device adapting to different size wafer, is characterized in that, described garter spring and chute intersection arrange buckle.
Aforesaid a kind of clamping device adapting to different size wafer, is characterized in that, the diameter of described flexible annulus is adjustable, to adapt to the wafer of 5,6,8,12 cun.
The beneficial effect that the present invention reaches: change the lower end size of clamping device to adapt to the wafer of different size by flexible annulus, clamping part is fixed by garter spring and chute, buckle or unclamps wafer; Structure of the present invention is simple, accurately can fix wafer, adapts to the wafer of different size, convenient and practical.
Accompanying drawing explanation
Fig. 1 is the clamping device schematic diagram adapting to different size wafer;
Fig. 2 is clamping part schematic diagram;
In figure, the implication of Reference numeral: 1-stretches annulus; 2-arc grabs bar; 3-clamping part; 31-circular arc draw-in groove; 4-garter spring; 5-chute; 6 buckles.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1, a kind of clamping device adapting to different size wafer, is characterized in that, comprises and grabs bar, clamping part 3, flexible annulus 1, described in grab bar and comprise the arc that three upper ends are connected on described flexible annulus 1 and grab bar 2; The lower end that described arc grabs bar 2 connects described clamping part 3; The described arc middle part of grabbing on bar 2 is provided with chute 5; Described chute 5 arranges garter spring 4.
As shown in Figure 2, clamping part 3 is the supporting rod in circular arc.The inner side of clamping part 3 arranges circular arc draw-in groove 31.The surface of circular arc draw-in groove 31 arranges rubber, for increasing clamping part 3 and the frictional force of wafer peripheral, wafer stabilizing is clamped in circular arc draw-in groove 31.
The position that described chute 5 is grabbed on bar 2 at three arcs is identical, and garter spring 4 can slide up and down at chute 5.Described garter spring 4 arranges buckle 6 with chute 5 intersection, when garter spring 4 is located on chute 5, closes buckle 6, garter spring 4 is positioned on chute 5.
The diameter of described flexible annulus 1 is adjustable, thus clamping device lower end dimension adjustable, to adapt to the wafer of 5,6,8,12 cun.
Flexible annulus 1, arc grab bar 2, garter spring 4, clamping part 3 material be plastics.
The present embodiment implementation process: when clamping device is in releasing orientation, garter spring 4 is positioned at the top of chute 5; The clamping part 3 of clamping device is placed in wafer peripheral, slide downward garter spring 4, clamping part 3 is made to fix wafer, when wafer is by lock ring, close buckle 6, then clamping device is moved to wafer receiver or other places, unclamps buckle 6, garter spring 4 automatic fall-back to the top of chute 5, clamping part 3 and then wafer is unclamped.
The present invention changes the lower end size of clamping device to adapt to the wafer of different size by flexible annulus, clamping part is fixed by garter spring and chute, buckle or is unclamped wafer; Structure is simple, accurately can fix wafer, adapts to the wafer of different size, convenient and practical.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.
Claims (7)
1. adapt to a clamping device for different size wafer, it is characterized in that, comprise and grab bar, clamping part (3), flexible annulus (1), described in grab bar and comprise the arc that three upper ends are connected on described flexible annulus (1) and grab bar (2); The lower end that described arc grabs bar (2) connects described clamping part (3); The described arc middle part of grabbing on bar (2) is provided with chute (5); Described chute (5) is arranged garter spring (4).
2. a kind of clamping device adapting to different size wafer according to claim 1, is characterized in that, described clamping part (3) is the supporting rod in circular arc.
3. a kind of clamping device adapting to different size wafer according to claim 1, is characterized in that, the inner side of described clamping part (3) arranges circular arc draw-in groove (31).
4. a kind of clamping device adapting to different size wafer according to claim 3, is characterized in that, the surface of described circular arc draw-in groove (31) arranges rubber.
5. a kind of clamping device adapting to different size wafer according to claim 1, is characterized in that, the position that described chute (5) is grabbed on bar (2) at three arcs is identical.
6. a kind of clamping device adapting to different size wafer according to claim 5, is characterized in that, described garter spring (4) and chute (5) intersection arrange buckle (6).
7. a kind of clamping device adapting to different size wafer according to claim 1, is characterized in that, the diameter of described flexible annulus (1) is adjustable, to adapt to the wafer of 5,6,8,12 cun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410818866.3A CN104493690A (en) | 2014-12-25 | 2014-12-25 | Clamping device suitable for wafers of different sizes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410818866.3A CN104493690A (en) | 2014-12-25 | 2014-12-25 | Clamping device suitable for wafers of different sizes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104493690A true CN104493690A (en) | 2015-04-08 |
Family
ID=52935190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410818866.3A Pending CN104493690A (en) | 2014-12-25 | 2014-12-25 | Clamping device suitable for wafers of different sizes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104493690A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105148790A (en) * | 2015-07-17 | 2015-12-16 | 浙江埃拉建筑节能科技有限公司 | Diameter-varying feeding device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050031497A1 (en) * | 2003-08-07 | 2005-02-10 | Sonke Siebert | Holding device for disk-shaped objects |
| CN202495435U (en) * | 2011-12-31 | 2012-10-17 | 上海新阳半导体材料股份有限公司 | Wafer clamping device |
| CN103094174A (en) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | Wafer clamp simple to operate |
| CN103466437A (en) * | 2013-09-11 | 2013-12-25 | 颜从均 | Special lifting device for cylindrical pieces |
| CN203792153U (en) * | 2014-03-28 | 2014-08-27 | 武汉新芯集成电路制造有限公司 | Wafer grabbing tool |
| CN204504987U (en) * | 2014-12-25 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of clamping device adapting to different size wafer |
-
2014
- 2014-12-25 CN CN201410818866.3A patent/CN104493690A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050031497A1 (en) * | 2003-08-07 | 2005-02-10 | Sonke Siebert | Holding device for disk-shaped objects |
| CN202495435U (en) * | 2011-12-31 | 2012-10-17 | 上海新阳半导体材料股份有限公司 | Wafer clamping device |
| CN103094174A (en) * | 2012-12-21 | 2013-05-08 | 东莞市中镓半导体科技有限公司 | Wafer clamp simple to operate |
| CN103466437A (en) * | 2013-09-11 | 2013-12-25 | 颜从均 | Special lifting device for cylindrical pieces |
| CN203792153U (en) * | 2014-03-28 | 2014-08-27 | 武汉新芯集成电路制造有限公司 | Wafer grabbing tool |
| CN204504987U (en) * | 2014-12-25 | 2015-07-29 | 苏州凯锝微电子有限公司 | A kind of clamping device adapting to different size wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105148790A (en) * | 2015-07-17 | 2015-12-16 | 浙江埃拉建筑节能科技有限公司 | Diameter-varying feeding device |
| CN105148790B (en) * | 2015-07-17 | 2018-04-27 | 浙江埃拉建筑节能科技有限公司 | A kind of feeding device of reducing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150408 |
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| RJ01 | Rejection of invention patent application after publication |