CN104493169A - Ceramic particle local reinforced metal heat sink and preparing method thereof - Google Patents
Ceramic particle local reinforced metal heat sink and preparing method thereof Download PDFInfo
- Publication number
- CN104493169A CN104493169A CN201410832026.2A CN201410832026A CN104493169A CN 104493169 A CN104493169 A CN 104493169A CN 201410832026 A CN201410832026 A CN 201410832026A CN 104493169 A CN104493169 A CN 104493169A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- powder
- metal heat
- metal
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The invention discloses a ceramic particle local reinforced metal heat sink and a preparing method thereof, and belongs to the technical field of semiconductor laser chip encapsulation. The ceramic particle local reinforced metal heat sink and the preparing method solve the problems that in the prior art, after ceramic particles are introduced into the metal heat sink, the heat expansion coefficient is reduced, and meanwhile, the heat conduction performance is also obviously reduced. The heat sink consists of a metal heat sink and a local enhanced region embedded into the metal heat sink, wherein the local enhanced region consists of a 10 to 60 volume percent of metal and 40 to 90 volume percent of ceramic particles, the metal is Cu or Al, and the ceramic particles are TiB2, TiC or TiB2-TiC. The ceramic particle local reinforced metal heat sink has the advantages that the heat expansion coefficient of the local reinforced region can be regulated through controlling the content of the ceramic particles, so that the heat expansion coefficient of the local reinforced region is matched with the heat expansion coefficient of a semiconductor laser chip, the internal stress between the chip and the heat sink is reduced, and the service life of a semiconductor laser is prolonged; in addition, the integral heat conduction coefficient of the heat sink is not influenced, the preparation process is simple and convenient, the cost is low, and the heat sink is easy to popularize and apply.
Description
Technical field
The invention belongs to semiconductor laser chip encapsulation and technical field of heat dissipation, relate to a kind of ceramic granule partial and strengthen metal heat sink and preparation method thereof.
Background technology
Metal heat sink, as heat sink in Cu heat sink with Al, owing to having the good capacity of heat transmission, be widely used in encapsulation and the heat radiation of semiconductor laser chip.But, the thermal coefficient of expansion of metal heat sink differs larger with the thermal coefficient of expansion of semiconductor laser chip material, after metal heat sink and chips welding, stress concentration phenomenon is easily produced at weld interface, in laser instrument use procedure, because heat fatigue effect significantly can reduce the service life of laser instrument.Therefore, in order to make heat sink thermal coefficient of expansion and the matched coefficients of thermal expansion of semiconductor laser chip, domestic and international researcher starts to add in metal heat sink and has low-expansion ceramic particle, by controlling the addition of ceramic particle, and then controls heat sink thermal coefficient of expansion.But, although adding of ceramic particle reduces heat sink thermal coefficient of expansion, the matched coefficients of thermal expansion of itself and semiconductor laser chip can be made, but ceramic particle be distributed in whole heat sink in, while reducing heat sink thermal coefficient of expansion, also the heat sink capacity of heat transmission can be significantly reduced, the heat sink requirement meeting high-thermal-conductivity low-expansibility performance cannot be made, be unfavorable for the long-time high power steady operation of semiconductor laser, limit semiconductor laser fast-developing to the integrated direction of high-power height.Therefore, a kind of heat sink heat radiation for semiconductor laser with low-expansion high heat conductivity and the encapsulation that can meet semiconductor laser chip welding and heat radiation is needed badly.
Summary of the invention
The object of the invention is to solve in prior art after metal heat sink introducing ceramic particle, the problem that while thermal coefficient of expansion reduces, heat conductivility also significantly declines, provides a kind of ceramic granule partial to strengthen metal heat sink and preparation method thereof.
The technical scheme that the present invention solves the problems of the technologies described above employing is as follows.
Ceramic granule partial strengthens metal heat sink, the local enhancement district comprising metal heat sink and embed in metal heat sink, and the volume in local enhancement district accounts for the 10-30% that ceramic granule partial strengthens metal heat sink cumulative volume;
Described metal heat sink is Cu or Al;
The exposed surface at metal heat sink, at least one face, described local enhancement district, local enhancement district is made up of the metal of 10-60vol.% and 40-90vol.% ceramic particle, and described metal is Cu or Al, and with the Metal Phase of metal heat sink with, described ceramic particle is TiB
2, TiC or mixture, described mixture is that amount of substance is than the TiB for 2:1
2and TiC.
Preferably, described metal heat sink is cuboid, and local enhancement district is the trihedral be made up of A face, B face and C face, A face and B face are orthogonal two planes, the upper surface of A face and metal heat sink is coplanar, and a side of B face and metal heat sink is coplanar, C face and metal heat sink close contact.
Ceramic granule partial strengthens the preparation method of metal heat sink, comprises the following steps:
Step one, the metal powder material of 10-60vol.% and 40-90vol.% mixed powder are added in batch mixer, after mixing, add in mould, compressing, obtain pressed compact;
Described metal powder material is Cu powder or Al powder, and the granularity of Cu powder and Al powder is all less than or equal to 50 μm;
Described mixed powder is the mixture of the mixture of Ti powder and B powder, Ti powder and C powder, Ti powder and B
4one in the mixture of C powder, the mol ratio of described Ti powder and B powder is the mol ratio of 1:2, Ti powder and C powder is 1:1, Ti powder and B
4the mol ratio of C powder is that the granularity of 3:1, Ti powder is less than or equal to 25 μm, B powder, C powder and B
4the granularity of C powder is all less than or equal to 5 μm;
Step 2, pressed compact step one obtained are placed in the graphite jig in sintering furnace, after vacuumizing, are filled with more than 1 atmospheric inert gas to sintering furnace, sintering furnace are heated to 300 DEG C of insulation more than 30min;
Step 3, to be cast to by the molten metal of melting and to be placed with in the graphite jig of pressed compact after preheating, flood pressed compact, the powder in pressed compact reacts, and generates local enhancement district, is cooled to room temperature, obtains the metal heat sink being embedded with local enhancement district;
When in step one, described metal powder material is copper powder, and the molten metal of melting described in step 3 is the copper liquid of melting, and when in step one, described metal powder material is aluminium powder, and the molten metal of melting described in step 3 is the aluminium liquid of melting;
Step 4, take out from graphite jig and be embedded with the metal heat sink in local enhancement district, cutting, make the exposed surface at metal heat sink, at least one face, local enhancement district, and the volume in local enhancement district after cutting accounts for the 10-30% of the local enhancement district after cutting and the metal heat sink cumulative volume after cutting, obtains ceramic granule partial and strengthens metal heat sink.
Preferably, the incorporation time of described step one is more than 6h, and the rotating speed of batch mixer is 10-60r/min; It is further preferred that described incorporation time is 6-8h.
Preferably, in described step 2, insulation 30-40min.
Preferably, in described step 2, be filled with 1-1.5 atmospheric inert gas.
Preferably, in described step 2, pressed compact is cylindrical, and graphite jig is cylindrical, and pressed compact is placed on after in the graphite jig in sintering furnace, the central shaft conllinear of pressed compact and graphite jig.
Preferably, after the described metal heat sink being embedded with local enhancement district cuts, metal heat sink is cuboid, local enhancement district becomes the trihedral be made up of A face, B face and C face, A face and B face are orthogonal two planes, A face and metal heat sink upper surface coplanar, a side of B face and metal heat sink is coplanar, C face and metal heat sink close contact.
Compared with prior art, the invention has the beneficial effects as follows:
1, ceramic granule partial enhancing metal heat sink of the present invention has the heat sink local enhancement district of ceramic-metal in chips welding district, semiconductor laser chip after can making heat sink thermal coefficient of expansion by regulating the ceramic particle content introducing local enhancement district and weld mates, stress can not be caused to concentrate, in laser instrument use procedure, the service life of laser instrument can be significantly improved; And this local enhancement district embeds in metal heat sink, while reducing the thermal coefficient of expansion of metal heat sink, ensure that the capacity of heat transmission of metal heat sink, be conducive to the long-time high power steady operation of semiconductor laser, save pottery, reduce production cost, and the metal (Cu in local enhancement district, Al) identical with the parent metal infiltrated in course of reaction, the interface cohesion of metal heat sink and enhancement region, local is metallurgical binding, effectively can avoid the brittle fracture between local enhancement district and matrix;
2, the reaction that the preparation method that ceramic granule partial of the present invention strengthens metal heat sink utilizes the molten metal of melting to ignite in pressed compact between powder, formed in heat sink chips welding district and there is low-expansion local enhancement district, simple and reliable process, with low cost and be easy to apply, can be used in semiconductor laser chip heat radiation and encapsulation.
Accompanying drawing explanation
Fig. 1 is the structural representation that ceramic granule partial of the present invention strengthens metal heat sink;
Fig. 2 is the heat sink micro-organization chart of local enhancement district under ESEM of the embodiment of the present invention 1 Al containing 90vol.%TiC;
Fig. 3 is that the embodiment of the present invention 2 is containing 60vol.%TiB
2the heat sink pattern of local enhancement district under Flied emission Electronic Speculum of Al;
Fig. 4 is that the embodiment of the present invention 3 is containing 50vol.%TiB
2the X-ray diffracting spectrum in the local enhancement district that the Al of-TiC is heat sink;
Fig. 5 is the heat sink micro-organization chart of local enhancement district under ESEM of the embodiment of the present invention 4 Cu containing 70vol.%TiC;
Fig. 6 is that the embodiment of the present invention 5 is containing 80vol.%TiB
2the X-ray diffracting spectrum in the heat sink local enhancement district of Cu;
Fig. 7 is that the embodiment of the present invention 6 is containing 40vol.%TiB
2the X-ray diffracting spectrum in the local enhancement district that the Cu of-TiC is heat sink;
In figure, 1, metal heat sink, 2, local enhancement district, 21, A face, 22, B face, 23, C face.
Detailed description of the invention
In order to understand the present invention further, below in conjunction with detailed description of the invention, the preferred embodiments of the invention are described, but should be appreciated that these describe just to further illustrate the features and advantages of the present invention instead of limiting to the claimed invention.
Ceramic granule partial strengthens metal heat sink, this is heat sink comprises metal heat sink 1 and the local enhancement district 2 embedding metal heat sink 1 inside, wherein, the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, this exposed local enhancement district 2 is chips welding district, local enhancement district 2 is made up of the metal of 10-60vol.% and 40-90vol.% ceramic particle, and ceramic particle is TiB
2, TiC or mixture, mixture is that amount of substance is than the TiB for 2:1
2and TiC; Metal is Cu, and the material of metal heat sink 1 is also Cu, or metal is Al, and the material of metal heat sink 1 is also Al.Namely the metal material of metal heat sink 1 is identical with the metal material in local enhancement district 2.The interface that metal heat sink 1 and enhancement region 2, local contact is metallurgical binding.
Ceramic granule partial of the present invention strengthens metal heat sink, the volume in local enhancement district 2 accounts for the 10-30% that ceramic granule partial strengthens metal heat sink cumulative volume, volume is less than 10%, and chip cannot all be welded in local enhancement district 2, does not have the effect of matched coefficients of thermal expansion; Volume is greater than 30%, and ceramic particle is too much, affects the capacity of heat transmission of heat sink entirety.
Ceramic granule partial of the present invention strengthens metal heat sink, and ceramic particle is TiB
2local enhancement district 2 by Cu/Al-Ti-B system reaction generate; Ceramic particle is that the local enhancement district 2 of TiC generates by the reaction of Cu/Al-Ti-C system; Ceramic particle is TiB
2the local enhancement district 2 of-TiC is by Cu/Al-Ti-B
4the reaction of C system generates.
As shown in Figure 1, in present embodiment, metal heat sink 1 and enhancement region 2, local are all solid construction, and metal heat sink 1 can be cuboid, local enhancement district 2 is the trihedral be made up of A face, B face and C face, A face and B face are orthogonal two planes, and the upper surface of A face and metal heat sink 1 is coplanar, and a side of B face and metal heat sink 1 is coplanar, C face is curved surface, approximate sphere, C face and metal heat sink 1 close contact, both metallurgical binding.
Ceramic granule partial strengthens the preparation method of metal heat sink, comprises the following steps:
Prepared by step one, pressed compact:
The metal powder material of 10-60vol.% and 40-90vol.% mixed powder are added in batch mixer, after mixing, adds in stainless steel mould, compressing, obtain pressed compact;
Wherein, metal powder material is Cu powder or Al powder, and mixed powder is the mixture of the mixture of Ti powder and B powder, Ti powder and C powder, Ti powder and B
4one in the mixture of C powder, when mixed powder is the mixture of Ti powder and B powder, the amount of substance of Ti powder and B powder is than being 1:2; When mixed powder is the mixture of Ti powder and C powder, the amount of substance of Ti powder and C powder is than being 1:1; When mixed powder is Ti powder and B
4during the mixture of C powder, by reaction equation: 3Ti+B
4c=2TiB
2+ TiC is known, Ti powder and B
4the amount of substance of C powder is than being 3:1, the TiB of generation
2be 2:1 with the mol ratio of TiC; The granularity of Cu powder and Al powder is all less than or equal to 50 μm, and the granularity of Ti powder is less than or equal to 25 μm, B powder, C powder and B
4the granularity of C powder is all less than or equal to 5 μm.The diffusion velocity of the less powder of granularity is faster, more easily reacts, and reacts more complete, if powder particles is greater than above-mentioned size, because diffusion rate is lower admittedly, can cause reacting not exclusively between powder in later stage heating process, also just cannot prepare of the present invention heat sink; Cu powder, Al powder, Ti powder, B powder, C powder and B
4the purity of C powder is all greater than 99%, does not have other special restrictions, obtains by mode as well known to those skilled in the art;
Batch mixing evenly generally needs more than 6h, and wherein the rotating speed of batch mixer is 10-60r/min, considers production cost and production efficiency, general mixing 6-8h, if mixing time is lower than 6h, batch mixing is uneven, thermal coefficient of expansion and the thermal conductivity factor of the heat sink diverse location of preparation there will be deviation;
Step 2, molten metal bath are cast:
A. dry and preheating: pressed compact step one prepared is placed in the graphite jig in sintering furnace, is filled with more than 1 atmospheric inert gas protects sintering furnace after vacuumizing, and subsequently, sintering furnace is heated to 300 DEG C and carries out preheating, insulation more than 30min;
Wherein, being filled with inert gas is volatilization in order to suppress metal powder material, is filled with more than 1 atmospheric inert gas and just can effectively suppresses it to volatilize under vacuum condition, considers production cost, general employing 1-1.5 atmospheric pressure, inert gas can adopt high-purity argon gas or nitrogen;
The object of preheating removes the steam in pressed compact, molten metal bath in casting cycle is avoided to splash or form pore at material internal, can promote that combustion synthesis reaction is thorough simultaneously, can ensure after preheating 30min that the steam in pressed compact is completely removed, consider production cost and production efficiency, preheating time is generally 30-40min;
B. molten metal fusing: Cu ingot or Al ingot are heated to melting in smelting furnace, obtain the molten metal of melting, when the metal powder material in step one is copper powder, in b, melting is Cu ingot, and when the metal powder material in step one is aluminium powder, in b, melting is Al ingot;
C. cast: be placed with in the graphite jig of pressed compact after the molten metal of melting is cast to preheating, flood pressed compact, powder in pressed compact is by the molten metal ignition reaction of melting, pressed compact reaction generates local enhancement district 2, the molten metal of melting forms metal pressed compact 1, the contact interface of molten metal bath and pressed compact is combined into metallurgical binding, is cooled to room temperature, obtains the metal heat sink 1 being embedded with local enhancement district 2;
Usually, in step one, the pressed compact of preparation is cylindrical, and graphite jig is also adopted as cylindrical, and when placing pressed compact, pressed compact is coaxial with graphite jig, and after reaction, local enhancement district 2 is near hemispherical;
D. machine-shaping: take out the metal heat sink 1 being embedded with local enhancement district 2 from graphite jig, cutting, make the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, and the volume in local enhancement district after cutting accounts for the 10-30% of the local enhancement district after cutting and the metal heat sink cumulative volume after cutting, obtains ceramic granule partial and strengthens metal heat sink;
Wherein, concrete percent by volume controls by the casting amount controlling molten metal bath in step 3, if filled by graphite jig, can control by controlling graphite jig volume.
In above-mentioned preparation method, during cutting, metal heat sink 1 can be cut into cuboid, local enhancement district 2 is cut into the trihedral be made up of A face 21, B face 22 and C face 23, and A face 21 and B face 22 are orthogonal two planes, and A face 21 is coplanar with the upper surface of the rear metal heat sink 1 of cutting, B face 22 is coplanar with a side of the rear metal heat sink 1 of cutting, C face 23, for being curved surface, is similar to sphere, C face 23 and metal heat sink 1 close contact after cutting.
In the present invention, the volume in local enhancement district 2 after cutting makes cutting accounts in the process of the 10-30% of metal heat sink 1 cumulative volume after the local enhancement district 2 after cutting and cutting, can obtain by analyzing the structure be embedded with in the metal heat sink 1 in local enhancement district 2; The volume of the metal heat sink 1 being embedded with local enhancement district 2 that the volume of the pressed compact that also can obtain according to step one and step 3 obtain carries out calculating and obtains, and in computational process, can ignore the distortion of pressed compact.
The present invention is further illustrated below in conjunction with embodiment.
Embodiment 1
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Al, and local enhancement district 2 consists of: the Al of TiC and 10vol.% of 90vol.%, and the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 20%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Al powder, the 75.38g granularity of 50 μm by 5.77g granularity the be Ti powder of 25 μm and 18.85g granularity are that the C powder of 5 μm loads batch mixing 6h in batch mixer (rotating speed is 60r/min), make it to mix, then powder is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1 atmospheric high-purity argon gas after vacuumizing and protect, pressed compact is heated to 300 DEG C and carries out preheating insulation 30min;
Step 3, Al ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Al liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, metal heat sink 1 is cut into cuboid, local enhancement district 2 is cut into the trihedral be made up of A face 21, B face 22 and C face 23, A face 21 and B face 22 are orthogonal two planes, A face 21 is coplanar with the upper surface of the rear metal heat sink 1 of cutting, B face 22 is coplanar with a side of the rear metal heat sink 1 of cutting, C face 23 and metal heat sink 1 close contact after cutting; And the volume in local enhancement district 2 after cutting accounts for 20% of the local enhancement 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes the preparation that TiC ceramic granule partial REINFORCED Al is heat sink.
Fig. 2 is the heat sink microscopic structure of local enhancement district 2 under ESEM of Al prepared by embodiment 1, as can be seen from Figure 2, the local enhancement district 2 that the Al of embodiment 1 preparation is heat sink is dense, and ceramic particle and metal heat sink 1 interface cohesion in local enhancement district 2 are good.
Embodiment 2
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Al, and local enhancement district 2 consists of: the TiB of 60vol.%
2with the Al of 40vol.%, the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 30%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Al powder, the 48.94g granularity of 45 μm by 28.57g granularity the be Ti powder of 25 μm and 22.49g granularity are that the B powder of 2.5 μm loads batch mixing 7h (rotating speed is 50r/min) in batch mixer, make it to mix, then powder is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1.2 atmospheric high-purity argon gas after vacuumizing and protect, pressed compact is heated to 300 DEG C and carries out preheating insulation 35min;
Step 3, Al ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Al liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, cutting, make the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, and the volume in local enhancement district 2 after cutting accounts for 30% of the local enhancement 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes TiB
2the preparation that ceramic granule partial REINFORCED Al is heat sink.
Fig. 3 is the pattern of ceramic particle under Flied emission Electronic Speculum in the heat sink local enhancement district 2 of Al prepared by embodiment 2, can find out, TiB
2particle is hexa-prism, clean interfaces.
Embodiment 3
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Al, and local enhancement district 2 consists of: the TiC-TiB of 50vol.%
2with the Al of 50vol.%, the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 20%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Al powder, the 45.52g granularity of 50 μm by 36.78g granularity the be Ti powder of 20 μm and 17.70g granularity are the B of 1 μm
4c powder loads batch mixing 6.5h in batch mixer (rotating speed is 60r/min), makes it to mix; Then powder is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1 atmospheric high pure nitrogen after vacuumizing and protect, pressed compact is heated to 300 DEG C and carries out preheating insulation 30min;
Step 3, Al ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Al liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, cutting, make the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, and the volume in local enhancement district 2 after cutting accounts for 20% of the local enhancement district 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes TiC-TiB
2the preparation that ceramic granule partial REINFORCED Al is heat sink.
Fig. 4 is the X ray diffracting spectrum in the heat sink local enhancement district 2 of Al prepared by embodiment 3, and as can be seen from Figure 4, Al prepared by embodiment 3 is heat sink by Al, TiC and TiB
2phase composition, illustrates that the present invention reacts completely, products pure.
The thermal coefficient of expansion in the heat sink local enhancement district 2 for chips welding of Al prepared by embodiment 3 is 9.37 × 10
-6/ K, with the thermal coefficient of expansion (23.6 × 10 of pure Al
-6/ K) compare, obtain remarkable reduction; The thermal conductivity factor in local enhancement district 2 is: 163W.m
-1.K
-1although, with the thermal conductivity factor (202W.m of pure Al
-1.K
-1) compare and also decrease, but, because local enhancement district 2 only accounts for the heat sink sub-fraction of monoblock Al, so the heat sink capacity of heat transmission of monoblock Al can not be affected.After illustrating that Al of the present invention is heat sink and solving the heat sink introducing ceramic particle of Al in prior art, the problem that while thermal coefficient of expansion reduces, heat conductivility also significantly declines.
Embodiment 4
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Cu, and local enhancement district 2 consists of: the Cu of TiC and 30vol.% of 70vol.%, and the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 10%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Cu powder, the 45.00g granularity of 25 μm by 43.74g granularity the be Ti powder of 20 μm and 11.26g granularity are that the C powder of 5 μm loads batch mixing 8h in batch mixer (rotating speed is 10r/min), make it to mix; Then powder is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1 atmospheric high pure nitrogen after vacuumizing and protect, pressed compact is heated to 300 DEG C and carries out preheating insulation 35min;
Step 3, Cu ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Cu liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, cutting, make the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, and the volume in local enhancement district 2 after cutting accounts for 10% of the local enhancement district 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes the preparation that TiC ceramic granule partial Reinforced Cu is heat sink.
Fig. 5 is the heat sink microscopic structure of local enhancement district 2 under ESEM of Cu prepared by embodiment 4, and as can be seen from Figure 5, the local enhancement district 2 that the Cu for preparing of embodiment 4 is heat sink is dense, and ceramic particle is combined well with Cu basal body interface.
Embodiment 5
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Cu, the TiB consisting of 80vol.% in local enhancement district 2
2with the Cu of 20vol.%, the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 30%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Cu powder, the 45.85g granularity of 45 μm by 33.14g granularity the be Ti powder of 20 μm and 21.01g granularity are that the B powder of 1 μm loads batch mixing 8h in batch mixer (rotating speed is 30r/min); Then the powder mixed is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1.3 atmospheric high-purity argon gas after vacuumizing and protect, sintering furnace is heated to 300 DEG C and carries out preheating insulation 30min;
Step 3, Cu ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Cu liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, metal heat sink 1 is cut into cuboid, local enhancement district 2 is cut into the trihedral be made up of A face 21, B face 22 and C face 23, A face 21 and B face 22 are orthogonal two planes, A face 21 is coplanar with the upper surface of the rear metal heat sink 1 of cutting, B face 22 is coplanar with a side of the rear metal heat sink 1 of cutting, C face 23 and metal heat sink 1 close contact after cutting; And the volume in local enhancement district 2 after cutting accounts for 30% of the local enhancement district 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes TiB
2the preparation that ceramic granule partial Reinforced Cu is heat sink.
Fig. 6 is the heat sink X ray diffracting spectrum of Cu prepared by embodiment 5, as can be seen from Figure 6, is Cu and TiB during the Cu for preparing of embodiment 5 is heat sink
2phase, reacts completely, products pure.
Embodiment 6
Ceramic granule partial strengthens metal heat sink: metal heat sink 1 is Cu, and local enhancement district 2 consists of: the TiC-TiB of 40vol.%
2with the Cu of 60vol.%, the volume in local enhancement district 2 accounts for ceramic granule partial strengthens metal heat sink cumulative volume 20%.
Above-mentioned ceramic granule partial strengthens the preparation method of metal heat sink:
Step one, to be Cu powder, the 18.63g granularity of 25 μm by 74.22g granularity the be Ti powder of 20 μm and 7.15g granularity are the B of 5 μm
4c powder loads batch mixing 7.5h in batch mixer (rotating speed is 60r/min); Then the powder mixed is put into stainless steel mould, be pressed into base, obtain pressed compact;
Step 2, be placed on pressed compact in sintering furnace graphite jig, pass into 1.5 atmospheric high pure nitrogens after vacuumizing and protect, sintering furnace is heated to 300 DEG C and carries out preheating insulation 40min;
Step 3, Cu ingot is heated to melting in smelting furnace after, be placed with in the graphite jig of pressed compact after the Cu liquid of melting is cast to preheating, flood pressed compact, be cooled to room temperature, obtain the metal heat sink 1 being embedded with local enhancement district 2;
The metal heat sink 1 being embedded with local enhancement district 2 of step 4, taking-up preparation from graphite jig, cutting, make the exposed surface at metal heat sink 1, at least one face, local enhancement district 2, and the volume in local enhancement district 2 after cutting accounts for 20% of the local enhancement district 2 after cutting and metal heat sink 1 cumulative volume after cutting, completes TiC-TiB
2the preparation that ceramic granule partial Reinforced Cu is heat sink.
Fig. 7 is the heat sink X ray diffracting spectrum of Cu prepared by embodiment 6, as can be seen from Figure 7, is Cu, TiC and TiB during the Cu for preparing of embodiment 6 is heat sink
2phase, reacts completely, products pure.
The thermal coefficient of expansion in the heat sink local enhancement district 2 for chips welding of Cu prepared by embodiment 6 is 9.32 × 10
-6/ K, with the thermal coefficient of expansion (16.8 × 10 of pure Cu
-6/ K) compare, obtain remarkable reduction; The thermal conductivity factor in local enhancement district 2 is: 154W.m
-1.K
-1although, with the thermal conductivity factor (394W.m of pure Cu
-1.K
-1) compare and also decrease, but, because local enhancement district 2 only accounts for the heat sink sub-fraction of monoblock Cu, so the heat sink capacity of heat transmission of monoblock Cu can not be affected.After illustrating that Cu prepared by the present invention is heat sink and solving the heat sink introducing ceramic particle of Cu in prior art, the problem that while thermal coefficient of expansion reduces, heat conductivility also significantly declines.
Obviously, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping.It should be pointed out that the those of ordinary skill for described technical field, under the premise without departing from the principles of the invention, can also carry out some improvement and modification to the present invention, these improve and modify and also fall in the protection domain of the claims in the present invention.
Claims (9)
1. ceramic granule partial strengthens metal heat sink, it is characterized in that, the local enhancement district (2) comprising metal heat sink (1) and embed in metal heat sink (1), the volume of local enhancement district (2) accounts for the 10-30% that ceramic granule partial strengthens metal heat sink cumulative volume;
Described metal heat sink (1) is Cu or Al;
The exposed surface in metal heat sink (1), described at least one face of local enhancement district (2), local enhancement district (2) is made up of the metal of 10-60vol.% and 40-90vol.% ceramic particle, described metal is Cu or Al, and same with the Metal Phase of metal heat sink (1), described ceramic particle is TiB
2, TiC or mixture, described mixture is that amount of substance is than the TiB for 2:1
2and TiC.
2. ceramic granule partial according to claim 1 strengthens metal heat sink, it is characterized in that, described metal heat sink (1) is cuboid, local enhancement district (2) is the trihedral be made up of A face (21), B face (22) and C face (23), A face (21) and B face (22) are orthogonal two planes, A face (21) is coplanar with the upper surface of metal heat sink (1), B face (22) is coplanar with a side of metal heat sink (1), C face (23) and metal heat sink (1) close contact.
3. ceramic granule partial strengthens the preparation method of metal heat sink, it is characterized in that, comprises the following steps:
Step one, the metal powder material of 10-60vol.% and 40-90vol.% mixed powder are added in batch mixer, after mixing, add in mould, compressing, obtain pressed compact;
Described metal powder material is Cu powder or Al powder, and the granularity of Cu powder and Al powder is all less than or equal to 50 μm;
Described mixed powder is the mixture of the mixture of Ti powder and B powder, Ti powder and C powder, Ti powder and B
4one in the mixture of C powder, the mol ratio of described Ti powder and B powder is the mol ratio of 1:2, Ti powder and C powder is 1:1, Ti powder and B
4the mol ratio of C powder is that the granularity of 3:1, Ti powder is less than or equal to 25 μm, B powder, C powder and B
4the granularity of C powder is all less than or equal to 5 μm;
Step 2, pressed compact step one obtained are placed in the graphite jig in sintering furnace, after vacuumizing, are filled with more than 1 atmospheric inert gas to sintering furnace, sintering furnace are heated to 300 DEG C of insulation more than 30min;
Step 3, the molten metal of melting is cast to is placed with in the graphite jig of pressed compact after preheating, flood pressed compact, the powder in pressed compact reacts, and generates local enhancement district (2), be cooled to room temperature, obtain the metal heat sink (1) being embedded with local enhancement district (2);
When in step one, described metal powder material is copper powder, and the molten metal of melting described in step 3 is the copper liquid of melting, and when in step one, described metal powder material is aluminium powder, and the molten metal of melting described in step 3 is the aluminium liquid of melting;
Step 4, take out from graphite jig and be embedded with the metal heat sink (1) of local enhancement district (2), cutting, make the exposed surface in metal heat sink (1), local enhancement district (2) at least one face, and the volume in local enhancement district (2) after cutting accounts for the 10-30% of the local enhancement district (2) after cutting and metal heat sink (1) cumulative volume after cutting, obtains ceramic granule partial enhancing metal heat sink.
4. ceramic granule partial according to claim 3 strengthens the preparation method of metal heat sink, and it is characterized in that, the incorporation time of described step one is more than 6h, and the rotating speed of batch mixer is 10-60r/min.
5. ceramic granule partial according to claim 4 strengthens the preparation method of metal heat sink, and it is characterized in that, described incorporation time is 6-8h.
6. ceramic granule partial according to claim 3 strengthens the preparation method of metal heat sink, it is characterized in that, in described step 2, and insulation 30-40min.
7. ceramic granule partial according to claim 3 strengthens the preparation method of metal heat sink, it is characterized in that, in described step 2, is filled with 1-1.5 atmospheric inert gas.
8. ceramic granule partial according to claim 3 strengthens the preparation method of metal heat sink, it is characterized in that, in described step 2, pressed compact is cylindrical, graphite jig is cylindrical, and pressed compact is placed on after in the graphite jig in sintering furnace, the central shaft conllinear of pressed compact and graphite jig.
9. ceramic granule partial according to claim 3 strengthens the preparation method of metal heat sink, it is characterized in that, after the described metal heat sink (1) being embedded with local enhancement district (2) cuts, metal heat sink (1) is cuboid, local enhancement district (2) becomes the trihedral be made up of A face, B face and C face, A face and B face are orthogonal two planes, A face and metal heat sink (1) upper surface coplanar, a side of B face and metal heat sink (1) is coplanar, C face and metal heat sink (1) close contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410832026.2A CN104493169A (en) | 2014-12-26 | 2014-12-26 | Ceramic particle local reinforced metal heat sink and preparing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410832026.2A CN104493169A (en) | 2014-12-26 | 2014-12-26 | Ceramic particle local reinforced metal heat sink and preparing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104493169A true CN104493169A (en) | 2015-04-08 |
Family
ID=52934669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410832026.2A Pending CN104493169A (en) | 2014-12-26 | 2014-12-26 | Ceramic particle local reinforced metal heat sink and preparing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104493169A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744058A (en) * | 2019-11-01 | 2020-02-04 | 昆明理工大学 | Preparation method for in-situ synthesis of copper-based composite material |
| CN116683278A (en) * | 2023-08-01 | 2023-09-01 | 中国科学院西安光学精密机械研究所 | Heat sink and chip packaging structure and method for improving COD threshold of semiconductor laser |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212438A (en) * | 1998-09-18 | 1999-03-31 | 北京工业大学 | Metal base composite electric packaging heat sink material and its preparing method |
| CN1396291A (en) * | 2002-01-27 | 2003-02-12 | 吉林大学 | Process for preparing steel-base composite feinforced by particles generated in-situ locally |
| US20030142711A1 (en) * | 2002-01-29 | 2003-07-31 | Hans-Georg Treusch | CTE compensation of semiconductor laser bars |
| JP2003249695A (en) * | 2002-02-22 | 2003-09-05 | Kyocera Corp | Thermoelectric conversion module |
| CN101219470A (en) * | 2008-01-16 | 2008-07-16 | 吉林大学 | Production method for reacting to synthesize Ti5Si3 particle gradient reinforcing cast aluminum base composite material |
| CN101376171A (en) * | 2008-10-09 | 2009-03-04 | 上海交通大学 | Method for preparing reinforced aluminum-base compound material with locally distributed granule |
| EP2110903A2 (en) * | 2008-04-17 | 2009-10-21 | Lasertel Inc. | Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials |
| CN102260814A (en) * | 2011-07-26 | 2011-11-30 | 吉林大学 | In situ nano TiC ceramic particle reinforced aluminum based composite material and preparation method thereof |
| CN103203446A (en) * | 2013-03-23 | 2013-07-17 | 广州有色金属研究院 | Preparation method for local ceramic reinforced aluminum matrix composite wear-resistant part |
| CN103831421A (en) * | 2014-03-26 | 2014-06-04 | 铜仁学院 | Method for preparing local enhancement aluminum matrix composite |
-
2014
- 2014-12-26 CN CN201410832026.2A patent/CN104493169A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212438A (en) * | 1998-09-18 | 1999-03-31 | 北京工业大学 | Metal base composite electric packaging heat sink material and its preparing method |
| CN1396291A (en) * | 2002-01-27 | 2003-02-12 | 吉林大学 | Process for preparing steel-base composite feinforced by particles generated in-situ locally |
| US20030142711A1 (en) * | 2002-01-29 | 2003-07-31 | Hans-Georg Treusch | CTE compensation of semiconductor laser bars |
| JP2003249695A (en) * | 2002-02-22 | 2003-09-05 | Kyocera Corp | Thermoelectric conversion module |
| CN101219470A (en) * | 2008-01-16 | 2008-07-16 | 吉林大学 | Production method for reacting to synthesize Ti5Si3 particle gradient reinforcing cast aluminum base composite material |
| EP2110903A2 (en) * | 2008-04-17 | 2009-10-21 | Lasertel Inc. | Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials |
| CN101376171A (en) * | 2008-10-09 | 2009-03-04 | 上海交通大学 | Method for preparing reinforced aluminum-base compound material with locally distributed granule |
| CN102260814A (en) * | 2011-07-26 | 2011-11-30 | 吉林大学 | In situ nano TiC ceramic particle reinforced aluminum based composite material and preparation method thereof |
| CN103203446A (en) * | 2013-03-23 | 2013-07-17 | 广州有色金属研究院 | Preparation method for local ceramic reinforced aluminum matrix composite wear-resistant part |
| CN103831421A (en) * | 2014-03-26 | 2014-06-04 | 铜仁学院 | Method for preparing local enhancement aluminum matrix composite |
Non-Patent Citations (2)
| Title |
|---|
| 轩倩倩: "高体积分数TiC_x/TiB_2/TiC_x-TiB_2增强铝基复合材料的", 《中国优秀硕士学位论文全文数据库(工程科技Ⅰ辑)》 * |
| 陆建邦: "TiB_2/TiC_x-TiB_2增强Cu基复合材料的制备与性能", 《中国优秀硕士学位论文全文数据库（工程科技Ⅰ辑）》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744058A (en) * | 2019-11-01 | 2020-02-04 | 昆明理工大学 | Preparation method for in-situ synthesis of copper-based composite material |
| CN116683278A (en) * | 2023-08-01 | 2023-09-01 | 中国科学院西安光学精密机械研究所 | Heat sink and chip packaging structure and method for improving COD threshold of semiconductor laser |
| CN116683278B (en) * | 2023-08-01 | 2023-12-08 | 中国科学院西安光学精密机械研究所 | Heat sink and chip packaging structure and method for improving COD threshold of semiconductor laser |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100455694C (en) | Method for preparing elconite | |
| CN105506345B (en) | High heat-conductive diamond/copper composite encapsulating material and preparation method thereof | |
| CN106435319B (en) | Tungsten-copper alloy and preparation method thereof | |
| CN101545057B (en) | Method for preparing diamond/Cu composite material with high heat conductivity | |
| US20180272476A1 (en) | Preparation of Sn-based silver-graphene lead-free composite solders | |
| CN110157932A (en) | A kind of preparation method of the graphene Modified Cu base electric contact material based on fabricated in situ | |
| CN105252169A (en) | Active amorphous brazing filler metal for brazing ZrB2-SiC ceramic materials, preparation method for active amorphous brazing filler metal and brazing process | |
| CN103526060A (en) | Rapid preparation method of copper-tungsten alloy | |
| CN101445882A (en) | Method for preparing aluminum-silicon alloy with high silicon content | |
| CN104630527A (en) | Method for preparing copper-based diamond composite material | |
| CN114525438B (en) | Tungsten copper composite material and preparation method thereof | |
| CN101139666A (en) | Method for preparing SiC particle reinforced foamed aluminium radical composite material | |
| CN109759596A (en) | A kind of heterogeneous gradient composites and preparation method thereof | |
| CN102628149A (en) | Preparation method of graphite whisker reinforced copper base composite material | |
| CN110423922A (en) | A kind of silico-aluminum and its preparation method and application for Electronic Packaging | |
| CN111676385A (en) | Preparation method of low-cost high-thermal-conductivity diamond copper composite material | |
| CN101538661A (en) | Method for preparing high thermal conductive diamond/Al composite material | |
| CN111299898A (en) | Brazing flux-free vacuum brazing paste brazing filler metal, and preparation method and use method thereof | |
| CN104493169A (en) | Ceramic particle local reinforced metal heat sink and preparing method thereof | |
| CN101624662B (en) | Method for preparing W-Cu alloy in microwave infiltration way | |
| CN113977133A (en) | Corrosion-resistant composite brazing filler metal for copper-aluminum transition wire clamp and preparation method thereof | |
| CN107841669B (en) | High-thermal-conductivity active composite packaging material and preparation method thereof | |
| CN107299269B (en) | A kind of W-Cr-Al composite material and preparation method of resistance to high temperature oxidation | |
| CN110144506B (en) | Preparation method of diamond copper-based composite material | |
| CN108346498A (en) | A method of mutually improving LaFeSi magnetic heating performances by adding LaAl low melting points |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150408 |