CN104487395A - Method for polishing glass substrate - Google Patents
Method for polishing glass substrate Download PDFInfo
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- CN104487395A CN104487395A CN201380039310.8A CN201380039310A CN104487395A CN 104487395 A CN104487395 A CN 104487395A CN 201380039310 A CN201380039310 A CN 201380039310A CN 104487395 A CN104487395 A CN 104487395A
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- Prior art keywords
- grinding
- glass substrate
- grinding wheel
- grinding step
- glass
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/02—Wheels in one piece
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Surface Treatment Of Glass (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
A method for polishing a glass substrate comprises a first polishing step of polishing the glass substrate using a first abrasive grinding stone and a second polishing step of polishing the glass substrate using a second abrasive grinding stone having a smaller average grain diameter than that of the first abrasive grinding stone, wherein the second abrasive grinding stone comprises abrasive grinding grains comprising cerium oxide abrasive grains each having a grain diameter of 0.5 to 10 [mu]m and diamond abrasive grains each having a grain diameter of 0.5 to 10 [mu]m and a bond comprising a polyimide resin having an elastic modulus of 2.5 to 3 GPa.
Description
Technical field
The present invention relates to the Ginding process of glass substrate.
Background technology
In recent years, along with the high density recording of disk, the characteristic required glass base plate for magnetic recording carrier is more and more stricter.Particularly when having the major surfaces of discoid glass base plate for magnetic recording carrier of circular port to central part, end face is when grinding, to the precision of the end surface shape of glass substrate, the quality requirements of size with improve the intensity that glass substrate requires.
In addition, with in the portable equipments such as the mobile telephones such as smart mobile phone, portable information terminal (PDA), the demand that for the protection of the protective glass of indicating meter is the indicating meter glass of representative increases.Particularly require the slimming of portable equipment, light-weighted technology, advance lightweight and the thin plate of indicating meter glass.Generally speaking, when sheet glass is thinning, intensity can reduce, therefore, and the indicating meter glass that desired strength is higher than ever.
In order to ensure the intensity of glass substrate, indicating meter glass, such as, as patent documentation 1, have employed the Ginding process grinding and brush grinding that use beveler being carried out combining.
In addition, as the emery wheel used in the grinding of glass, disclose the emery wheel enumerated in patent documentation 2, patent documentation 3, patent documentation 4.
Patent documentation 1: Japanese Unexamined Patent Publication 2010-131679 publication
Patent documentation 2: Japanese Laid-Open Patent Publication 62-130179 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2008-274293 publication
Patent documentation 4: Japanese Unexamined Patent Publication 2010-131679 publication
Summary of the invention
Invent problem to be solved
But in the method for patent documentation 1, be combined with multiple operation, therefore, operation becomes complicated, and there is the problem of Expenses Cost.
Therefore, in present embodiment, provide treatment process simple and glass substrate can be made to have the Ginding process of the glass substrate of sufficient intensity.
For the means of dealing with problems
The invention provides a kind of Ginding process of glass substrate,
Comprise:
The first grinding step using the first grinding wheel to grind glass substrate and
Use the second grinding step that median size second grinding wheel less than the median size of described first grinding wheel grinds described glass substrate,
The bonding agent that described second grinding wheel comprises the grinding abrasive particle containing particle diameter to be the ceria abrasive particles of 0.5 ~ 10 μm and particle diameter the be diamond abrasive grain of 0.5 ~ 10 μm and the polyimide resin that is 2.5 ~ 3GPa by Young's modulus is formed.
Invention effect
According to the present embodiment, treatment process can be provided simple and glass substrate can be made to have the Ginding process of the glass substrate of sufficient intensity.
Accompanying drawing explanation
Fig. 1 be represent chemical enhanced after sheet glass residual stress S thickness direction distribution schematic diagram.
Fig. 2 is the schematic diagram after cutting the sheet glass after chemical enhanced.
Fig. 3 is the sketch chart of an example of the grinding unit of the milling apparatus of present embodiment.
Fig. 4 is the sketch chart of the Ginding process for illustration of present embodiment.
Label declaration
1 axle
2 servosystems
3 housings
4 bearings
5 main shafts
6 emery wheels
7 drivingmotors
8 belt wheels
9 bands
10 guide rails
11 stretchers
20 sheet glass
100 grinding units
Embodiment
Below, in greater detail with reference to the attached drawings present embodiment is described.
(glass substrate)
As the glass substrate of Ginding process of glass substrate can applying present embodiment; be not particularly limited; such as TFT (Thin Film Transistor can be applied to; thin film transistor) use substrate, PDP (Plasma Display Panel; plasma display) use the various glass substrates such as glass substrate, FED (Field Emission Display, field-emitter display) glass substrate, glass base plate for magnetic recording carrier, protective glass.
In addition, the glass original substrate can applying the glass substrate of the Ginding process of the glass substrate of present embodiment is made by float glass process, scorification, the method such as method, press forming method that redraws, but present embodiment is at this on the one hand also not circumscribed.
In addition, the Ginding process of the glass substrate of present embodiment also can be applied to and carry out chemical enhanced and chemically reinforced glass that is that obtain to glass substrate.In this case, can be applied to and cut with predetermined size and the chemically reinforced glass that obtains carrying out the chemical enhanced rear purposes according to expecting to glass raw sheet, also can be applied to after glass raw sheet is cut into predetermined size according to the purposes expected, carries out chemical enhanced and chemically reinforced glass that is that obtain.Glass raw sheet is being carried out to the chemical enhanced rear purposes method of cutting with predetermined size according to expecting and carrying out compared with chemical enhanced method after glass raw sheet is cut into predetermined size according to the purposes expected, there is feature that the high but cutting of productivity has difficulties technically usually.
In this specification sheets, as an example, the example for the chemically reinforced glass obtained carrying out the chemical enhanced rear purposes according to expecting to cut with predetermined size to glass raw sheet is described.
Chemically reinforced glass carries out ion-exchange to the surface of glass and defines the glass of the upper layer remaining stress.Specifically, by carrying out ion-exchange to the surface of glass, ion (such as, Li ion, Na ion) little for the ionic radius contained in glass is replaced into the large ion of ionic radius (such as, K ion).Thus, in the remained on surface stress of glass, the intensity of glass improves.
Illustrated in Fig. 1 expression chemical enhanced after sheet glass residual stress S thickness direction distribution schematic diagram.In Fig. 1, S1 represents the maximum residual stress of a upper layer (being called main schedule surface layer) of sheet glass, S2 represents the maximum residual stress (usual S1=S2) of another upper layer (being called back surface layer), D1 represents the thickness of main schedule surface layer, D2 represents the thickness of back surface layer, D represents the thickness of sheet glass, and T represents the average residual tensile stress in the middle layer be present between main schedule surface layer and back surface layer.In addition, the transverse axis in Fig. 1 represents the distance in the thickness of slab direction when using main schedule surface layer as reference point (=0).
As shown in Figure 1, there is the tendency internally reduced gradually from front surface and back surface in the stress remained in main schedule surface layer, back surface layer.On the other hand, as forming the retroaction remaining the main schedule surface layer of stress and back surface layer etc., between main schedule surface layer and back surface layer, the middle layer remaining tensile stress is formed.Now, residual tensile stress constant in the intermediate layer.
In addition, the sketch chart for illustration of the sheet glass after chemical enhanced has been shown in Fig. 2.More specifically, Fig. 2 (a) be chemical enhanced after sheet glass cutting before sketch chart, Fig. 2 (b) be chemical enhanced after sheet glass cutting after sketch chart.
From explanation and Fig. 2 (a) of above-mentioned Fig. 1, main schedule surface layer and the back surface layer of the sheet glass after chemical enhanced become compressive stress layer, and the middle layer be present between main schedule surface layer and back surface layer becomes tensile stress layer.
From the sketch chart after the cutting of the sheet glass after chemical enhanced shown in Fig. 2 (b), after cutting the sheet glass after chemical enhanced, tensile stress layer is exposed to the surface of cut surface.When the tensile stress layer of the sheet glass of stress after cutting, even if than under usually little power, sometimes also can break.Therefore, when the embodiment cut the sheet glass after chemical enhanced, particularly preferably implement grinding by the Ginding process of the glass substrate of present embodiment described later and make glass substrate have sufficient intensity.
(the first grinding step)
Grinding wheel usually comprises grinding abrasive particle and fixes the bonding agent of this grinding abrasive particle.In first grinding step, the grinding wheel comprising the median size grinding abrasive particle larger than the median size of the grinding abrasive particle of the grinding wheel used in the second grinding step described later is used to grind.Usually, the median size of the abrasive particle of the grinding wheel used in the first grinding step is more than 5 ~ 10 μm (counting #2000 with grinding wheel graininess number).
As the kind of the abrasive particle of the grinding wheel that can use in the first grinding step, be not particularly limited, can use such as: cerium dioxide, silicon-dioxide, diamond, chromic oxide, aluminum oxide, zirconium white, silicon carbide etc.
In addition, as the kind of the bonding agent that can use in the first grinding step, be not particularly limited, can use such as: ceramic bond, metallic bond, resinoid bond, the electroplating abrasion wheel etc. formed by bound abrasive grains.
First grinding step is preferably the dimensioning grinding step carrying out grinding while pressing the power of above-mentioned first grinding wheel according to the major surfaces of glass substrate or the alteration of form of end face (outer circumferential side face, periphery chamfered section etc.).Comprise in the first grinding step of the grinding wheel of the median size grinding abrasive particle larger than the median size of the grinding abrasive particle of the grinding wheel used in the second grinding step described later in use, the size of abrading glass is exactly ground by dimensioning, thus, accurate size control is not needed, therefore preferably in the grinding of the second grinding step afterwards.In addition, outer circumferential side described herein face and periphery chamfered section refer to be positioned at the outer circumferential side of sheet glass, and the uneven all surface of major surfaces of sheet glass, its shape can be flexure plane.In addition, in the first grinding step, chamfering and grinding can be implemented simultaneously.
(the second grinding step)
After above-mentioned first grinding step, implement the second grinding step as finishing step.
As the kind of the grinding abrasive particle that can use in the second grinding step, the abrasive particle of the grinding abrasive particle that be mixed with median size that to be the ceria abrasive particles of 0.5 ~ 10 μm and median size the be diamond abrasive grain of 0.5 ~ 10 μm is obtained by mixing can be enumerated.In addition, the median size of grinding abrasive particle can use such as laser diffraction formula particle size measurement device etc. to measure.By making the median size of each abrasive particle in above-mentioned scope, the scar removing of the chamfered section of grinding and the end face of glass substrate can be implemented in the first grinding step, can be ground to and reach sufficient intensity.
In addition, as the bonding agent that can use in the second grinding step, the polyimide resin that Young's modulus is 2.5 ~ 3GPa at 20 DEG C can be enumerated.In addition, the Young's modulus of bonding agent can use such as dynamic viscoelastic modulus measurements device etc. to measure.
In the past, after the chamfering process, rough grinding operation of the first operation, in order to improve intensity further, have employed brush polishing, using emery wheel to carry out the method etc. of grinding further.But, in brush polishing, there is the problem that conveying of glass substrate etc. is numerous and diverse.On the other hand, the method using emery wheel to carry out further grinding just can be implemented by means of only changing emery wheel after the first operation, but the treatment time extends, and there is unpractical problem.In addition, if carry out the second grinding step to the glass not implementing the first grinding step, then the life-span of emery wheel can extremely shorten, therefore not preferred.
The present inventor finds, utilizing Young's modulus to be the grinding wheel of polyimide resin as bonding agent of 2.5 ~ 3GPa, in the Ginding process using emery wheel, can improve the intensity of glass substrate at short notice by using.Specifically, by using above-mentioned grinding wheel to grind, can process and there is the glass substrate that flexural strength is the intensity of more than 500MPa.When Young's modulus is greater than above-mentioned scope, the treatment time extends, when being less than above-mentioned scope, and the lost of life of grinding wheel, impracticable, therefore not preferred.In addition, the possibility that can not get the glass substrate with abundant intensity after grinding is also deposited.
The content (V1) of the diamond abrasive grain in bonding agent is preferably 10 volume % ~ 20 volume %, and the content (V2) of the ceria abrasive particles in bonding agent is preferably 5 volume % ~ 30 volume %.V1 lower than during 10 volume % or V2 lower than 5 volume % time, sometimes sufficient amount of grinding cannot be guaranteed, therefore, preferably include the ceria abrasive particles that utilizes chemical reaction to carry out grinding at above-mentioned pre-determined range and carried out the diamond abrasive grain that grinds by mechanical effect respectively.In addition, when V1 and V2 sum is more than 30 volume %, the nonferromagnetic substance as grinding wheel reduces sometimes, therefore, more preferably makes V1+V2≤30%.
Second grinding step can for the dimensioning grinding step carrying out grinding while the power of above-mentioned second grinding wheel of alteration of form pressing according to the major surfaces of glass substrate or end face, also can for above-mentioned second grinding wheel to be pressed into the constant-pressure grinding step major surfaces of glass substrate or end face carrying out grind with certain power.
In addition, in the second grinding step, although also depend on the kind of used glass substrate, the surface roughness Ra preferably implementing the major surfaces or end face that are ground to glass substrate reaches below 8nm.
(grinding unit)
Then, the example of grinding unit of the Ginding process can implementing present embodiment is described.But, in present embodiment, as long as comprise the first grinding step that use first grinding wheel grinds glass substrate and the second grinding step using median size second grinding wheel less than the median size of above-mentioned first grinding wheel to grind above-mentioned glass substrate, and the bonding agent that above-mentioned second grinding wheel comprises the grinding abrasive particle containing median size to be the ceria abrasive particles of 0.5 ~ 10 μm and median size the be diamond abrasive grain of 0.5 ~ 10 μm and the polyimide resin that is 2.5 ~ 3GPa by Young's modulus is formed, then be not limited to the grinding unit of following formation.
In addition, in the first grinding step and the second grinding step, different milling apparatuss can be used implement grinding, also can after the first grinding step, the first grinding wheel be changed to the second grinding wheel and use identical milling apparatus to implement grinding.
The sketch chart of one example of the grinding unit of the milling apparatus of present embodiment has been shown in Fig. 3.Grinding unit 100 is arranged on axle 1 by the not shown horizontal rotating arm etc. of not shown milling apparatus main body.Axle 1 is by servosystem 2 rotary actuation.
In the housing 3 of grinding unit 100, be vertically configured with bearing 4, axle supporting is carried out to main shaft 5.
In the front end of main shaft 5, emery wheel 6 is installed, in addition, is connected on the axle of drivingmotor 7 in the outside being arranged on housing by belt wheel 8a, 8b and band 9 in rear end.
Bearing 4 is arranged in housing 3 in the mode be free to slide in the horizontal direction by guide rail 10.In addition, bearing 4 can for the formation that can be subjected to displacement in the horizontal direction by the flexible grade of not shown pneumatic cylinder.The stretcher 11 that this side is pressed is provided with in the side of band 9.Along with the movement of bearing 4, stretcher 11 becomes the formation of the variable quantity of the span length of absorption band 9.
(example 1 ~ example 8)
Then, reference example is described for the embodiment ground the periphery chamfered section of sheet glass.In addition, in the present embodiment, the method for grinding the periphery chamfered section of sheet glass is described, but present embodiment is at this one side not circumscribed.Such as, the Ginding process of present embodiment can be applied to the method etc. that major surfaces, outer circumferential side face etc. to glass substrate grind.
The condition of the grinding wheel used in the second grinding step in example 1 ~ example 8 is shown in Table 1.Example 1 in table 1 is the condition of the Ginding process of present embodiment, and example 2 ~ example 7 is the condition of the Ginding process of reference example.In addition, about the grinding wheel graininess number in table 1, #3000 is median size 4 ~ 8 μm, and #2000 is median size 5 ~ 10 μm, and #1000 is median size 14 ~ 22 μm, and the Young's modulus of bonding agent measures at 21 DEG C.
In addition, in table 1, the content of the grinding abrasive particle 1 of the emery wheel of example 1 ~ example 3 is set as 20 % by weight, the content of grinding abrasive particle 2 is set as 5 % by weight, and the content of the grinding abrasive particle 1 of the emery wheel of example 4 ~ example 8 is set as 25 % by weight.
[table 1]
The sketch chart of the Ginding process for illustration of present embodiment has been shown in Fig. 4.More specifically, Fig. 4 is the figure for illustration of the method for grinding the periphery chamfered section of the sheet glass 20 as raw sheet, be Fig. 3 grinding wheel 6 around sketch chart.
The periphery 31 of grinding wheel 6 is formed the grind reliefs 32 of ring-type circumferentially.The wall portion of grind reliefs 32 is equivalent to abrasive particle part.
In present embodiment, first, as the grinding wheel 6 used in the first grinding step, installation kit contains the grinding wheel 6 of the median size grinding abrasive particle larger than the median size of the grinding abrasive particle of the grinding wheel used in the second grinding step afterwards, grinds the periphery chamfered section of sheet glass 20.Specifically, in example 1 ~ example 8, installation kit is the grinding wheel of the adamantine grinding abrasive particle of 14 ~ 22 μm and the bonding agent of polyimide and metal containing median size, grinds the periphery chamfered section of sheet glass 20.
Grinding wheel 6 along the outer rim relative movement of sheet glass 20, utilizes the periphery chamfered section of the wall of grind reliefs 32 to sheet glass 20 to grind while rotating centered by the medullary ray of grinding wheel 6.Now, grind preferably by the dimensioning of carrying out grinding while the power of the alteration of form pressing grinding wheel 6 according to above-mentioned glass substrate.In addition, when grinding, the cooling fluids such as water can be used.
Then, grinding wheel 6 is changed to the second grinding wheel 6 comprising grinding abrasive particle and bonding agent shown in table 1.
In second grinding step, grinding wheel 6 also while rotating centered by the medullary ray of grinding wheel 6 along the outer rim relative movement of sheet glass 20, utilize the periphery chamfered section of the wall of grind reliefs 32 to sheet glass 20 to grind.Now, can being ground by the dimensioning of carrying out grinding while the power of the alteration of form pressing grinding wheel 6 according to above-mentioned glass substrate, also can grind by above-mentioned second grinding wheel being pressed into the constant-pressure that above-mentioned glass substrate carries out grinding with certain power.In addition, in the second grinding step, when grinding, also the cooling fluids such as water can be used.
In second grinding step, the surface roughness Ra carrying out being ground to glass substrate preferably reaches below 8nm, terminates grinding.
(evaluation)
Flexural strength
In present embodiment, flexural strength is measured by four-point bending test.Specifically, V-notch is formed at the central part of the test film of thickness 0.7mm, width 50mm, length 100mm.Use universal tensile strength test device, the mode of stable fracture occurs according to the notch tip from the test film supported with the span of 30mm, carries out pliability test with the pinblock speed of 1mm/ minute.In addition, the upper span in four-point bending test is 10mm.
Arithmetic mean surface roughness Ra
The surfaceness of glass substrate uses contact pin type surface roughness meter (the Multimode V SPM-Nanoscope V controller that Veeco company manufactures) to measure.In addition, about measured value, measure the surfaceness at any 6 positions from sheet glass, represent measured value with its mean value.
The result of being undertaken evaluating by above-mentioned evaluation method of the glass substrate obtained by example 1 to example 8 is also shown in Table 1.
As shown in Table 1, by the Ginding process (example 1) of present embodiment, within the short treatment time (milling time), the glass substrate with sufficient flexural strength is obtained.
Known on the other hand, in the Ginding process of the reference example of example 2 ~ example 5, long, impracticable for the treatment time (milling time) obtained needed for sufficient flexural strength.In addition, the surfaceness of the glass substrate obtained by the Ginding process of example 6 ~ example 8 is large, and flexural strength is also not enough.
To sum up, according to the present embodiment, by utilizing following Ginding process, glass substrate is ground, can glass substrate be made to have sufficient intensity with simple treatment process, described Ginding process comprises the first grinding step that use first grinding wheel grinds glass substrate and the second grinding step using median size second grinding wheel less than the median size of above-mentioned first grinding wheel to grind above-mentioned glass substrate, the bonding agent that above-mentioned second grinding wheel comprises the grinding abrasive particle containing median size to be the ceria abrasive particles of 0.5 ~ 10 μm and median size the be diamond abrasive grain of 0.5 ~ 10 μm and the polyimide resin that is 2.5 ~ 3GPa by Young's modulus is formed.
This application claims the right of priority of No. 2012-197742, the Japanese Patent Application submitted to the Japanese Patent Room based on September 7th, 2012, the full content of No. 2012-197742, Japanese Patent Application is quoted in the application.
Claims (6)
1. a Ginding process for glass substrate,
Comprise:
The first grinding step using the first grinding wheel to grind glass substrate and
Use the second grinding step that median size second grinding wheel less than the median size of described first grinding wheel grinds described glass substrate,
The bonding agent that described second grinding wheel comprises the grinding abrasive particle containing median size to be the ceria abrasive particles of 0.5 ~ 10 μm and median size the be diamond abrasive grain of 0.5 ~ 10 μm and the polyimide resin that is 2.5 ~ 3GPa by Young's modulus is formed.
2. the Ginding process of glass substrate as claimed in claim 1, wherein, the content of in described bonding agent, described diamond abrasive grain is 10 volume % ~ 20 volume %, and the content of described ceria abrasive particles is 5 volume % ~ 30 volume %.
3. the Ginding process of glass substrate as claimed in claim 2, wherein, the content of in described bonding agent, described diamond abrasive grain and the content sum of described ceria abrasive particles are 30 below volume %.
4. the Ginding process of glass substrate as claimed any one in claims 1 to 3, wherein,
Described first grinding step is the dimensioning grinding step carrying out grinding while the power of described first grinding wheel of alteration of form pressing according to described glass substrate,
Described second grinding step is that described second grinding wheel is pressed into the constant-pressure grinding step described glass substrate carrying out grind with certain power.
5. the Ginding process of glass substrate as claimed any one in claims 1 to 3, wherein,
Described first grinding step is the dimensioning grinding step carrying out grinding while the power of described first grinding wheel of alteration of form pressing according to described glass substrate,
The dimensioning grinding step of described second grinding step also for carrying out grinding while the power of described second grinding wheel of alteration of form pressing according to described glass substrate.
6. the Ginding process of the glass substrate according to any one of claim 1 to 5, wherein,
The surface roughness Ra of described glass substrate is made to be below 8nm by described second grinding step.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-197742 | 2012-09-07 | ||
| JP2012197742 | 2012-09-07 | ||
| PCT/JP2013/070777 WO2014038320A1 (en) | 2012-09-07 | 2013-07-31 | Method for polishing glass substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104487395A true CN104487395A (en) | 2015-04-01 |
Family
ID=50236938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380039310.8A Pending CN104487395A (en) | 2012-09-07 | 2013-07-31 | Method for polishing glass substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6011627B2 (en) |
| KR (1) | KR20150053745A (en) |
| CN (1) | CN104487395A (en) |
| TW (1) | TW201414575A (en) |
| WO (1) | WO2014038320A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108883518A (en) * | 2016-03-25 | 2018-11-23 | 阪东化学株式会社 | Grind material |
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| TW201841857A (en) * | 2017-01-24 | 2018-12-01 | 美商康寧公司 | Methods and apparatus for finishing edges of glass sheets |
| JP7022330B2 (en) * | 2018-03-26 | 2022-02-18 | 日本電気硝子株式会社 | Sheet glass manufacturing method and manufacturing equipment |
| JP7022329B2 (en) * | 2018-03-26 | 2022-02-18 | 日本電気硝子株式会社 | Sheet glass manufacturing method and manufacturing equipment |
| JP7074644B2 (en) * | 2018-10-31 | 2022-05-24 | 信越化学工業株式会社 | A method for manufacturing abrasive particles for polishing a synthetic quartz glass substrate, and a method for polishing a synthetic quartz glass substrate. |
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2013
- 2013-07-31 KR KR1020157000095A patent/KR20150053745A/en not_active Application Discontinuation
- 2013-07-31 JP JP2014534246A patent/JP6011627B2/en not_active Expired - Fee Related
- 2013-07-31 WO PCT/JP2013/070777 patent/WO2014038320A1/en active Application Filing
- 2013-07-31 CN CN201380039310.8A patent/CN104487395A/en active Pending
- 2013-08-22 TW TW102130084A patent/TW201414575A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030077983A1 (en) * | 2001-10-12 | 2003-04-24 | International Business Machines Corporation | Cleaning polish etch composition and process for a superfinished surface of a substrate |
| CN1384166A (en) * | 2002-05-16 | 2002-12-11 | 深圳市纳科实业有限公司 | Polishing composition for polishing surface of memory, hard disk and magnetic head and its polihsing method |
| CN102554763A (en) * | 2010-10-22 | 2012-07-11 | 昭和电工株式会社 | Method of manufacturing glass substrate for magnetic recording media |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108883518A (en) * | 2016-03-25 | 2018-11-23 | 阪东化学株式会社 | Grind material |
| US11819978B2 (en) | 2016-03-25 | 2023-11-21 | Bando Chemical Industries, Ltd. | Grinding material |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150053745A (en) | 2015-05-18 |
| JP6011627B2 (en) | 2016-10-19 |
| WO2014038320A1 (en) | 2014-03-13 |
| TW201414575A (en) | 2014-04-16 |
| JPWO2014038320A1 (en) | 2016-08-08 |
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