CN104485304A - Chip adhesion detection device - Google Patents
Chip adhesion detection device Download PDFInfo
- Publication number
- CN104485304A CN104485304A CN201510005251.3A CN201510005251A CN104485304A CN 104485304 A CN104485304 A CN 104485304A CN 201510005251 A CN201510005251 A CN 201510005251A CN 104485304 A CN104485304 A CN 104485304A
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- chip
- thickness
- measurement sensor
- thickness measurement
- telecommunication
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention provides a chip adhesion detection device which is arranged on a chip manufacturing device. The chip adhesion detection device comprises at least one thickness measurement sensor, a comparator and a controller, wherein the thickness measurement sensor is used for measuring the thickness of a chip obtained after a chip adhesion working procedure is carried out and correspondingly generating a thickness electric signal, the comparator is connected with the output end of the thickness measurement sensor and used for comparing the value of the thickness electric signal with a preset threshold value and outputting a first triggering electric signal when the value is larger than the threshold value, and the controller is connected with the output end of the comparator and used for controlling the working state of the chip manufacturing device when the first triggering electric signal is received. According to the chip adhesion detection device, the non-contact type thickness measurement sensor is adopted, the double-chip condition can be timely found, batch accidents are accordingly prevented, and the percent of pass is improved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to a kind of chip and stick together checkout gear.
Background technology
In semiconductor fabrication, due to employee undergoes training the different and carelessness of degree can at D/A(Die Attach, chip sticks together) product operated carries out D/A by engineering again.Traditional equipment use voltage sensitive sensor carries out pressure test, its pressure is between 3-4N, be greater than 4N warning to identify, due to BOC(board on chip) product thickness is 250 microns of glue thickness 30 microns, applicable voltage sensitive sensor, but the POP(package on package had at present) its thickness of chip product is at 110 microns, and glue thickness is at 20 microns, voltage sensitive sensor is difficult to identification and causes false alarm or do not report to the police, and produces batch accident and causes qualification rate to decline.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of chip to stick together checkout gear, solves the problem that in above-mentioned prior art, voltage sensitive sensor identification is inaccurate.
For realizing above-mentioned target and other related objectives, the invention provides a kind of chip and stick together checkout gear, be located at chip manufacturing apparatus, comprise: at least one thickness measurement sensor, for measuring the thickness also corresponding generation thickness signal of telecommunication sticking together the chip after operation through chip; Comparator, connects the output of described thickness measurement sensor, for described thickness value of electrical signals being compared with predetermined threshold value, when being greater than described threshold value, exporting first and triggering the signal of telecommunication; Controller, connects the output of described comparator, for when receiving described first and triggering the signal of telecommunication, and the operating state of control chip manufacturing equipment.
Optionally, described thickness measurement sensor is at least two, is respectively used to the thickness measuring difference on described chip, the value of the thickness signal of telecommunication that described comparator also exports for more each described thickness measurement sensor, exports second and trigger the signal of telecommunication when inconsistent; Described controller, also for when receiving described second and triggering the signal of telecommunication, the operating state of control chip manufacturing equipment.
Optionally, described thickness measurement sensor is LVDT displacement transducer.
Optionally, described comparator comprises the integrating circuit connecting described thickness measurement sensor output.
Optionally, the operating state of described chip manufacturing apparatus comprises: closing device power supply.
As mentioned above, the invention provides a kind of chip and stick together checkout gear, be located at chip manufacturing apparatus, comprise: at least one thickness measurement sensor, for measuring the thickness also corresponding generation thickness signal of telecommunication sticking together the chip after operation through chip; Comparator, connects the output of described thickness measurement sensor, for described thickness value of electrical signals being compared with predetermined threshold value, when being greater than described threshold value, exporting first and triggering the signal of telecommunication; Controller, connects the output of described comparator, for when receiving described first and triggering the signal of telecommunication, and the operating state of control chip manufacturing equipment; The present invention adopts contactless thickness measurement sensor, can the generation of Timeliness coverage dual chip, thus prevents batch accident, improves qualification rate.
Accompanying drawing explanation
Fig. 1 is shown as the structural representation that chip of the present invention sticks together an embodiment of checkout gear.
Element numbers illustrates:
1-chip sticks together checkout gear;
11-thickness measurement sensor;
12-comparator;
121-integrating circuit;
13-controller.
Embodiment
Below by way of specific instantiation, embodiments of the present invention are described, those skilled in the art the content disclosed by this specification can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by embodiments different in addition, and the every details in this specification also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.
As shown in Figure 1, the invention provides a kind of chip and stick together checkout gear 1, be located at chip manufacturing apparatus, described chip manufacturing apparatus such as comprises the equipment that chip package produces line, can carry out chip and stick together (D/A) operation, described chip sticks together checkout gear 1 and comprises: thickness measurement sensor 11, comparator 12 and controller 13.
Described thickness measurement sensor 11 can be at least one, for measuring the thickness also corresponding generation thickness signal of telecommunication sticking together the chip after operation through chip;
Described comparator 12, connects the output of described thickness measurement sensor 11, for described thickness value of electrical signals being compared with predetermined threshold value, when being greater than described threshold value, exporting first and triggering the signal of telecommunication;
Described controller 13, connects the output of described comparator 12, for when receiving described first and triggering the signal of telecommunication, and the operating state of control chip manufacturing equipment.
All realize by hardware circuit above, described predetermined threshold value is such as the value of electrical signals (such as voltage or current value) that 1 ~ 2 chip thickness is corresponding, when discovery thickness is more than 1, then can think it may is sticked more than two panels, and producing the hostility triggering signal of telecommunication, it can be voltage or current forms.
In one embodiment, that chip is adhered together or chip tilts the thickness that causes and increases to differentiate, described thickness measurement sensor 11 can be at least two, be respectively used to the thickness measuring difference on described chip, the value of the thickness signal of telecommunication that described comparator 12 also exports for more each described thickness measurement sensor 11, export when inconsistent represent that chip tilts second trigger the signal of telecommunication; Described controller 13, also for when receiving described second and triggering the signal of telecommunication, the operating state of control chip manufacturing equipment; The described second triggering signal of telecommunication is also voltage or current forms, and it is not different from described first on an equal basis by amplitude or frequency and triggers the signal of telecommunication.
In one embodiment, described thickness measurement sensor 11 is LVDT displacement transducers, LVDT(Linear Variable Differential Transformer) be linear variable difference transformer abbreviation, belong to linear displacement transducer; The structure of LVDT is made up of iron core, armature, primary coil, secondary coil, and as shown at right, primary coil, secondary coil are distributed on coil rack, the shaft-like armature that coil inside has one can move freely.When armature mediates, the induced electromotive force of two secondary coil generations is equal, and such output voltage is 0; When portion moves and departs from center armature in coil, not etc., have voltage to export, its voltage swing does not depend on the size of displacement to the induced electromotive force that two coils produce.In order to improve the sensitivity of transducer, improve the linearity of transducer, increase the range of linearity of transducer, during design, two coils are played a reversed role connect, the polarity of voltage of two secondary coils is contrary, the voltage that LVDT exports is the difference of the voltage of two secondary coils, and this magnitude of voltage exported is linear with displacement unshakable in one's determination.
The advantage of LVDT is:
1, without rub measurement
Usually do not have material contact between the movable core of LVDT and coil, that is LVDT is the parts not having to rub.It is used to bear lightweight iron core load, but cannot bear the important measurement of friction load.Such as, the dynamic deflection of precise materials or vibration-testing, the stretching of fiber or other elastomer material or creep test.
2, unlimited mechanical endurance
Due to not friction and contacting between the coil of LVDT and iron core thereof, therefore any wearing and tearing can not be produced.The mechanical endurance of such LVDT is endless in theory.Carrying out materials and structures in the application such as testing fatigue, this is very important technical requirement.In addition, unlimited mechanical endurance is important for the high reliability mechanical device in aircraft, guided missile, spaceship and essential industry equipment too.
3, unlimited resolution
LVDT makes it possess two significant characteristics without friction running and principle of induction thereof.First characteristic has real unlimited resolution.This means that LVDT the motion the most small to iron core can respond and generate output.The readability of external electronic device is the unique restriction to resolution.
4, zero-bit is repeatable
LVDT constructs symmetry, and zero-bit can be replied.The electrical null position repeatability of LVDT is high, and extremely stable.Be used in closed-loop control system, LVDT is very outstanding electrical null position indicating device.
5, radial insensitive
LVDT is very responsive for the axial motion of iron core, and radial motion is relatively blunt.Like this, it is not object according to accurate rectilinear motion that LVDT may be used for measuring, and such as, LVDT can be coupled to the end gaging pressure of Bourdon tube.
6, I/O is isolated
LVDT is considered to the one of transformer, because its excitation input (elementary) and output (secondary) are completely isolated.LVDT, without the need to buffer amplifier, can think that it is a kind of effective analog signal element.Requiring in the measurement that holding wire and power ground are isolated and control loop, it very easy to use.
7, sturdy and durable
Manufacturing LVDT material used and engaging these materials technique used makes it become robust transmitter.Even if be subject to the powerful impact often had in industrial environment, jumbo vibration, LVDT also can continue to play a role.Iron core be separated LVDT iron core with coil and coil separated from one another, between iron core and coil inwall, insert non-magnetic spacers, can pressurization, corrosivity or akaline liquid and coil groups keep apart.Like this, coil groups realizes hermetic seal, no longer needs to carry out dynamic seal (packing) to moving link.For the coil groups in compression system, only static sealing need be used.
8, environmental suitability
LVDT is one of a few transmitter that can work in multiple adverse circumstances.Such as, closed type LVDT adopts stainless steel casing, can be placed in corrosive liquids or gas.Sometimes, LVDT is required to work under exceedingly odious environment.Such as, in the low temperature environment of similar liquid nitrogen or nuclear radiation environment.Although in most of the cases, LVDT has unlimited working life (in theory), is placed in the LVDT under adverse circumstances, and working life is different because environment is different.
In one embodiment, described comparator 12 comprises the integrating circuit 121 connecting described thickness measurement sensor 11 output; As shown in the figure, the electric capacity such as connecting amplifier positive pole and resistance that the other end connects described thickness measurement sensor 11 output and the positive pole and output that connect described amplifier by amplifier, one end formed, and integrating circuit 121 is mainly used in the integral compensation etc. in waveform transformation, the elimination of amplifying circuit offset voltage and FEEDBACK CONTROL.
In one embodiment, the operating state of described chip manufacturing apparatus comprises: closing device power supply, and the problem that namely occurs can stop producing; Certainly can adopt other existing automation procedures, those skilled in the art should be realized in conjunction with prior art with reference to teaching of the present invention.
In sum, the invention provides a kind of chip and stick together checkout gear, be located at chip manufacturing apparatus, comprise: at least one thickness measurement sensor, for measuring the thickness also corresponding generation thickness signal of telecommunication sticking together the chip after operation through chip; Comparator, connects the output of described thickness measurement sensor, for described thickness value of electrical signals being compared with predetermined threshold value, when being greater than described threshold value, exporting first and triggering the signal of telecommunication; Controller, connects the output of described comparator, for when receiving described first and triggering the signal of telecommunication, and the operating state of control chip manufacturing equipment; The present invention adopts contactless thickness measurement sensor, can the generation of Timeliness coverage dual chip, thus prevents batch accident, improves qualification rate.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (5)
1. chip sticks together a checkout gear, is located at chip manufacturing apparatus, it is characterized in that, comprising:
At least one thickness measurement sensor, for measuring the thickness also corresponding generation thickness signal of telecommunication sticking together the chip after operation through chip;
Comparator, connects the output of described thickness measurement sensor, for described thickness value of electrical signals being compared with predetermined threshold value, when being greater than described threshold value, exporting first and triggering the signal of telecommunication;
Controller, connects the output of described comparator, for when receiving described first and triggering the signal of telecommunication, and the operating state of control chip manufacturing equipment.
2. chip according to claim 1 sticks together checkout gear, it is characterized in that, described thickness measurement sensor is at least two, be respectively used to the thickness measuring difference on described chip, the value of the thickness signal of telecommunication that described comparator also exports for more each described thickness measurement sensor, exports second and triggers the signal of telecommunication when inconsistent; Described controller, also for when receiving described second and triggering the signal of telecommunication, the operating state of control chip manufacturing equipment.
3. chip according to claim 1 sticks together checkout gear, it is characterized in that, described thickness measurement sensor is LVDT displacement transducer.
4. chip according to claim 1 sticks together checkout gear, it is characterized in that, described comparator comprises the integrating circuit connecting described thickness measurement sensor output.
5. chip according to claim 1 and 2 sticks together checkout gear, it is characterized in that, the operating state of described chip manufacturing apparatus comprises: closing device power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510005251.3A CN104485304B (en) | 2015-01-07 | 2015-01-07 | A kind of chip sticks together detection means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510005251.3A CN104485304B (en) | 2015-01-07 | 2015-01-07 | A kind of chip sticks together detection means |
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| Publication Number | Publication Date |
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| CN104485304A true CN104485304A (en) | 2015-04-01 |
| CN104485304B CN104485304B (en) | 2018-03-20 |
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| CN201510005251.3A Active CN104485304B (en) | 2015-01-07 | 2015-01-07 | A kind of chip sticks together detection means |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116013803A (en) * | 2023-03-30 | 2023-04-25 | 深圳新控半导体技术有限公司 | Temperature sensing type detection device for chip adhesion and detection method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050056947A1 (en) * | 2003-09-12 | 2005-03-17 | Patrick Blessing | Apparatus and method for mounting or wiring semiconductor chips |
| CN1668715A (en) * | 2002-07-15 | 2005-09-14 | 陶氏康宁东丽硅氧烷株式会社 | Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device |
| CN101979979A (en) * | 2010-09-21 | 2011-02-23 | 力帆实业(集团)股份有限公司 | Pressure sensor detection system and method |
| CN204303770U (en) * | 2015-01-07 | 2015-04-29 | 海太半导体（无锡）有限公司 | A kind of chip sticks together checkout gear |
-
2015
- 2015-01-07 CN CN201510005251.3A patent/CN104485304B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1668715A (en) * | 2002-07-15 | 2005-09-14 | 陶氏康宁东丽硅氧烷株式会社 | Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device |
| US20050056947A1 (en) * | 2003-09-12 | 2005-03-17 | Patrick Blessing | Apparatus and method for mounting or wiring semiconductor chips |
| CN101979979A (en) * | 2010-09-21 | 2011-02-23 | 力帆实业(集团)股份有限公司 | Pressure sensor detection system and method |
| CN204303770U (en) * | 2015-01-07 | 2015-04-29 | 海太半导体（无锡）有限公司 | A kind of chip sticks together checkout gear |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116013803A (en) * | 2023-03-30 | 2023-04-25 | 深圳新控半导体技术有限公司 | Temperature sensing type detection device for chip adhesion and detection method thereof |
| CN116013803B (en) * | 2023-03-30 | 2023-06-20 | 深圳新控半导体技术有限公司 | Temperature sensing type detection device for chip adhesion and detection method thereof |
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| Publication number | Publication date |
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| CN104485304B (en) | 2018-03-20 |
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