CN104478224A - Method for forming acid-etching quartz pendulous reed flexible beam - Google Patents
Method for forming acid-etching quartz pendulous reed flexible beam Download PDFInfo
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- CN104478224A CN104478224A CN201410689983.4A CN201410689983A CN104478224A CN 104478224 A CN104478224 A CN 104478224A CN 201410689983 A CN201410689983 A CN 201410689983A CN 104478224 A CN104478224 A CN 104478224A
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Abstract
The invention relates to the field of manufacturing of quartz pendulous reeds, and in particular relates to a method for forming an acid-etching quartz pendulous reed flexible beam. The method for forming the acid-etching quartz pendulous reed flexible beam comprises the following steps: 1, putting a well assembled quartz pendulous reed flexible beam into a first hydrofluoric acid solution, and performing fast etching at a first temperature until the quartz pendulous reed flexible beam reaches a first preset thickness; and 2, putting the quartz pendulous reed flexible beam of the first preset thickness into a second hydrofluoric acid solution, and performing slow etching at a second temperature until the quartz pendulous reed flexible beam reaches a second preset thickness, wherein the concentration of the first hydrofluoric acid solution is higher than that of the second hydrofluoric acid solution and is lower than 22mol/L, and the first temperature is higher than the second temperature. By adopting the method for forming the acid-etching quartz pendulous reed flexible beam, the acid-etching time of the quartz pendulous reed flexible beam is shortened; and the method can be used for accurately controlling the thickness of the quartz pendulous reed flexible beam.
Description
Technical field
The present invention relates to quartz pendulous reed flexible beam and manufacture field, especially a kind of manufacturing process of acid etch quartz pendulous reed flexible beam.
Background technology
Quartz pendulous reed flexible beam is the core parts of quartz flexible accelerometer, quartz flexible accelerometer is mainly used in inertial navigation system, its main performance index comprises range, resolving power, is partially worth repeatability, scale factor repeatability and non-linear etc., and the range in its performance index and resolving power are decided by thickness and the surface quality of quartz pendulous reed flexible beam.
At present, known quartz pendulous reed flexible beam manufacturing process utilizes the chemical reaction of hydrofluoric acid and silica glass to make quartz pendulous reed flexible beam reduced thickness, makes its rigidity reduce thus realize flexural buckling.After the needle drawing of pendulum plane; adopt special acid etching mould and trifluoropropyl siloxane mask; the rest part of protection except quartz pendulous reed flexible beam; be placed in the hydrofluoric acid solution of finite concentration and temperature and carry out acid etch; acid etching speed is calculated thus the thickness of estimation quartz pendulous reed flexible beam, i.e. pendulum quartz pendulous reed flexible beam " step " moulding method by the acid etching gauge measuring " accompanying sheet ".The acid etch speed of " single stage method " is about 1.3um/min, and it is 690um that quartz pendulous reed flexible beam adds the thinning amount of man-hour requirement, then need 530min consuming time.The method carries out acid etch quartz pendulous reed flexible beam not only length consuming time, and precision is not high.
Summary of the invention
In order to overcome the deficiency that quartz pendulous reed flexible beam thickness control accuracy is poor and short time consumption is long that the shaping of above-mentioned acid etch quartz pendulous reed flexible beam " single stage method " causes, the invention provides a kind of manufacturing process of acid etch quartz pendulous reed flexible beam, the thickness control accuracy of quartz pendulous reed flexible beam can not only be increased to ± 1um by the method, and greatly can reduce the reaction times.
The object of the invention to solve the technical problems realizes by the following technical solutions.
By a kind of manufacturing process of acid etch quartz pendulous reed flexible beam, comprise the following steps:
The first step: quartz pendulous reed flexible beam good for frock is put into the first hydrofluoric acid solution, under the first temperature condition, etches fast, until described quartz pendulous reed flexible beam reaches the first preset thickness;
Second step: the quartz pendulous reed flexible beam of described first preset thickness is put into the second hydrofluoric acid solution, under the second temperature condition, etches at a slow speed, until described quartz pendulous reed flexible beam reaches the second preset thickness;
Wherein: the concentration of described first hydrofluoric acid solution is greater than the concentration of described second hydrofluoric acid solution, the concentration of described first hydrofluoric acid solution is less than 22mol/L;
Described first temperature is higher than described second temperature.
Preferably,
18 ~ 22mol/L of the concentration of described first hydrofluoric acid solution;
The concentration of described second hydrofluoric acid solution is 10 ~ 15mol/L.
Preferably,
Described first temperature is 50 ~ 70 DEG C;
Described second temperature is 20 ~ 30 DEG C.
Preferably,
In described quick etching process, in described first hydrofluoric acid solution, put into the first glass accompany sheet, by calculating the first acid etch speed that described first glass accompanies sheet in described first hydrofluoric acid solution, carry out the first Preset Time estimating described first preset thickness of test;
In described etching process at a slow speed, in described second hydrofluoric acid solution, put into the second glass accompany sheet, by calculating the second acid etch speed that described second glass accompanies sheet in described second hydrofluoric acid solution, carry out the second Preset Time estimating described second preset thickness of test.
Preferably,
Described first Preset Time is 180 ~ 300min;
Described second Preset Time is 30 ~ 50min.
Preferably,
By fiber spectrum measuring thickness device, measure the first preset thickness and second preset thickness of described quartz pendulous reed flexible beam;
Described fiber spectrum measuring thickness device comprises fiber spectrometer, light source, mould firm banking and optical fiber measurement probe, described fiber spectrometer and light source to be popped one's head in described optical fiber measurement through optical fiber respectively and are connected, described mould firm banking is used for fixing described quartz pendulous reed around property beam, and described optical fiber measurement probe vertical is arranged on and is fixed on described quartz pendulous reed on described mould firm banking around the side of property beam.
Preferably,
Described first preset thickness is 40 ~ 60 μm;
Described second preset thickness is 24 ~ 28 μm.
Preferably,
By trifluoropropyl siloxane mask by die-filling for described quartz pendulous reed flexible beam, form the quartz pendulous reed flexible beam that frock is good.
Preferably,
When the quartz pendulous reed flexible beam of the first preset thickness is put into the second hydrofluoric acid solution, use deionized water rinsing to remain acid solution, and blot quartz pendulous reed flexible beam surface-moisture with non-dust cloth.
Preferably,
When etching fast, described quartz pendulous reed flexible beam is vertically placed in described first hydrofluoric acid solution;
When etching at a slow speed, described quartz pendulous reed flexible beam is vertically placed in described second hydrofluoric acid solution.
By technique scheme, the manufacturing process of a kind of acid etch quartz pendulous reed flexible beam that the present invention proposes at least has following advantages:
1) the quartz pendulous reed flexible beam acid etch time is shortened;
2) the acid-soluble quartz pendulous reed flexible beam uneven thickness that causes of rubber mask and glass edge burr is avoided;
3) accurately can control quartz pendulous reed flexible beam thickness.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technique means of the present invention, and can be implemented according to the content of specification sheets, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing explanation
Fig. 1 is process flow sheet of the present invention;
Fig. 2 is trifluoropropyl siloxane mask of the present invention and the tool structure figure with quartz pendulous reed flexible beam;
Fig. 3 is the structural representation of thickness measurement online device of the present invention.
Embodiment
For further setting forth the present invention for the technique means reaching predetermined goal of the invention and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the manufacturing process of a kind of acid etch quartz pendulous reed flexible beam proposed according to the present invention, be described in detail as follows.
The manufacturing process (concrete technology flow process is see Fig. 1) of a kind of acid etch quartz pendulous reed flexible beam provided by the invention, comprises the following steps:
The first step: quartz pendulous reed flexible beam good for frock is put into the first hydrofluoric acid solution, under the first temperature condition, etches fast, until described quartz pendulous reed flexible beam reaches the first preset thickness;
Second step: the quartz pendulous reed flexible beam of described first preset thickness is put into the second hydrofluoric acid solution, under the second temperature condition, etches at a slow speed, until described quartz pendulous reed flexible beam reaches the second preset thickness; Wherein: the concentration of described first hydrofluoric acid solution is greater than the concentration of described second hydrofluoric acid solution, the concentration of described first hydrofluoric acid solution is less than 22mol/L; Described first temperature is higher than described second temperature.
By the first hydrofluoric acid solution, described quartz pendulous reed flexible beam is etched fast, the reaction times that described quartz pendulous reed flexible beam is etched to the second preset thickness can be accelerated.By the second hydrofluoric acid solution, described quartz pendulous reed flexible beam is etched at a slow speed, effectively can control the precision of described quartz pendulous reed flexible beam to the second preset thickness.
Preferably, 18 ~ 22mol/L of the concentration of described first hydrofluoric acid solution.
Preferably, the concentration of described second hydrofluoric acid solution is 10 ~ 15mol/L.
Preferably, in the present invention, described first hydrofluoric acid solution and described second hydrofluoric acid solution, all adopt top grade pure (GR) hydrofluoric acid solution to be configured.
Preferably, content >=40% of described top grade pure (GR) hydrofluoric acid solution, concentration is about 22.8mol/L.By pure for described top grade (GR) hydrofluoric acid solution and water or other solvent cuts to desired concn; Described top grade pure (GR) hydrofluoric acid solution after heating dilution also fully stirs, and makes described top grade pure (GR) hydrofluoric acid solution concentration, uniformity of temperature profile in acid etching container; After described top grade pure (GR) hydrofluoric acid solution homo(io)thermism, (fluctuation < ± 0.5 DEG C) can carry out acid etching rate self-calibration, then carries out the acid etch processing of described quartz pendulous reed flexible beam.
Preferably, described first temperature is 50 ~ 70 DEG C.
Preferably, described second temperature is 20 ~ 30 DEG C.
Reaction times is decided by hydrofluoric acid concentration and temperature of reaction, the first step selects 18 ~ 22mol/L, 50 ~ 70 DEG C, shorten the time of acid etch under high temperature height hydrofluoric acid concentration as far as possible, by acid etch time controling within 5 hours, be save time than single stage method on the one hand, the more important thing is and reduce rubber mask because be immersed in the acid-soluble phenomenon caused in acid solution for a long time.It is consider rubber acid-soluble quickening at high temperature that temperature is not suitable for higher than 70 DEG C.Second step selective temperature 20 ~ 30 DEG C, hydrofluoric acid concentration is 10 ~ 15mol/L, and acid etch speed is slow, and object is to improve the control accuracy to final flexible beam thickness.
Existing single stage method, the concentration of general hydrofluoric acid is 15.6mol/L, temperature is 40 DEG C, the flexible beam of acid etch pendulum needs about 9 ~ 10 hours under this condition, rubber mask soaks 9 ~ 10 hours with this understanding, acid-soluble size can reach 2mm, and the irregular burr of flexible beam etching posterior border caused like this is many.And, thickness requirement due to quartz pendulous reed flexible beam is 24 ~ 28um, its thickness can not be accurately controlled with above-mentioned etch rate estimation gained etching time, very easily occur to arrive and take out rear pendulum quartz pendulous reed flexible beam thickness computing time not within the scope of 24 ~ 28um, cause pendulum quartz pendulous reed flexible beam processed finished products rate low; In addition trifluoropropyl siloxane mask soak in a solution of hydrofluoric acid 530min occur acid-soluble, causing mask edge to ooze acid on the one hand makes glass edge occur burr, the acid-soluble colloid of another aspect sticks to quartz pendulous reed flexible beam surface and causes acid etching uneven, causes quartz pendulous reed flexible beam thickness evenness poor.
When etching fast, described rubber mask, at 18 ~ 22mol/L, also can occur acid-soluble under the condition of 50 ~ 70 DEG C, but due to its soak time short, there is acid-soluble size and be about 0.5mm.When etching at a slow speed, at 10 ~ 15mol/L, 20 ~ 30 DEG C of conditions, because its temperature, hydrofluoric acid concentration are low, and soak time is less than 1 hour, does not almost observe acid-soluble phenomenon.
Preferably, in described quick etching process, in described first hydrofluoric acid solution, putting into the first glass accompany sheet, by calculating the first acid etch speed that described first glass accompanies sheet in described first hydrofluoric acid solution, carrying out the first Preset Time estimating described first preset thickness of test;
Preferably, in described etching process at a slow speed, in described second hydrofluoric acid solution, putting into the second glass accompany sheet, by calculating the second acid etch speed that described second glass accompanies sheet in described second hydrofluoric acid solution, carrying out the second Preset Time estimating described second preset thickness of test.
Particularly, described first Preset Time is 180 ~ 300min; Described second Preset Time is 30 ~ 50min.
Thus, greatly can shorten described quartz pendulous reed flexible beam and add the required man-hour consumed in man-hour.
Preferably, described first preset thickness is 40 ~ 60 μm.
Preferably, described second preset thickness is 24 ~ 28 μm.
Preferably, by fiber spectrum measuring thickness device or milscale, measure the first preset thickness and second preset thickness of described quartz pendulous reed flexible beam.
Preferably, by trifluoropropyl siloxane mask by die-filling for described quartz pendulous reed flexible beam, form the quartz pendulous reed flexible beam that frock is good.
Described trifluoropropyl siloxane mask and the tool structure (see Fig. 2) with described quartz pendulous reed flexible beam, described trifluoropropyl siloxane mask 2 is close to described quartz pendulous reed flexible beam 1 surface, only in described quartz pendulous reed flexible beam 1 place hollow out, make it be exposed in described first hydrofluoric acid solution and described second hydrofluoric acid solution and chemical reaction occurs, thus thickness thinning.
Preferably, first with special acid etching mould and trifluoropropyl siloxane mask by die-filling for quartz pendulous reed flexible beam.For ensureing described quartz pendulous reed flexible beam dimensional precision and surface quality, need in die-filling process to ensure described acid etching mould, trifluoropropyl siloxane mask, the positioning precision of described quartz pendulous reed flexible beam three and the cleanliness factor on described quartz pendulous reed flexible beam surface.
Preferably, when the quartz pendulous reed flexible beam of the first preset thickness is put into the second hydrofluoric acid solution, use deionized water rinsing to remain acid solution, and blot quartz pendulous reed flexible beam surface-moisture with non-dust cloth.Thus the quartz pendulous reed flexible beam that takes out from described first hydrofluoric acid solution can be avoided, due to the first hydrofluoric acid solution of remained on surface, and affect the concentration of described second hydrofluoric acid solution.
Preferably, in described quick etching process, in described first hydrofluoric acid solution, putting into the first glass accompany sheet, by calculating the first acid etch speed that described first glass accompanies sheet in described first hydrofluoric acid solution, carrying out the time estimating described first preset thickness of test;
Preferably, in described etching process at a slow speed, in described second hydrofluoric acid solution, putting into the second glass accompany sheet, by calculating the second acid etch speed that described second glass accompanies sheet in described second hydrofluoric acid solution, carrying out the time estimating described second preset thickness of test.
Preferably, when etching fast, described quartz pendulous reed flexible beam is vertically placed in described first hydrofluoric acid solution.
Preferably, when etching at a slow speed, described quartz pendulous reed flexible beam is vertically placed in described second hydrofluoric acid solution, thus ensures that flexible beam both sides reaction product evenly spreads.
Concrete algorithm comprises: accompany sheet to put into described first hydrofluoric acid solution quartz pendulous reed flexible beam good for frock and the first glass, etch fast under described first temperature condition, etch after 1 hour, sheet is accompanied to take out in the first glass, measure the thickness that sheet accompanied by described first glass, calculate quick etch rate v1 with this; Estimate that described quartz pendulous reed flexible beam is thinned to the quick etching time t1 of 40 ~ 60 μm according to v1, after quick etching time t1 reaches, it is taken out from the first hydrofluoric acid solution, clean with deionized water rinsing, and blot described quartz pendulous reed flexible beam surface-moisture with non-dust cloth; Measure the thickness of described quartz pendulous reed flexible beam, as measuring result be greater than 60 μm then put back to as described in continue acid etching in the first hydrofluoric acid solution; If measuring result within the scope of 40 ~ 60 μm, then etches at a slow speed.When etching at a slow speed, accompanying sheet to put into the second hydrofluoric acid solution the described quartz pendulous reed flexible beam of arrival first preset thickness after etching fast and the second glass, under the second temperature condition, reacting.Etch after 10 minutes, take out described second glass and accompany sheet, measure described second glass and accompany sheet thickness, calculate etch rate v2 at a slow speed with this; Estimate that described quartz pendulous reed flexible beam is thinned to the etching time t2 of 24 ~ 28 μm according to v2, when after arrival second step etching time t2, described quartz pendulous reed flexible beam is taken out from described second hydrofluoric acid solution, clean with deionized water rinsing, and blot quartz pendulous reed flexible beam surface-moisture with non-dust cloth, measure the thickness of described quartz pendulous reed flexible beam, then put back in the second hydrofluoric acid solution continue acid etching as measuring result is greater than 28 μm; If measuring result is within the scope of 24 ~ 28um, then etch at a slow speed.Described quartz pendulous reed flexible beam is taken apart from described acid etching mould and described rubber mask, and cleans up storage.
Described etch rate (v1 and v2) refers to the removal amount of quartz pendulous reed flexible beam double thickness in the unit time, and unit is μm/min.
By the manufacturing process of a kind of acid etch quartz pendulous reed flexible beam provided by the present invention, greatly can not only shorten described quartz pendulous reed flexible beam and add the required man-hour consumed in man-hour, and accurately can control the thickness of described quartz pendulous reed flexible beam, reduce fraction defective in the processing of described quartz pendulous reed flexible beam, the pendulum thickness repeatability of different batches processing is high.On the other hand, described trifluoropropyl siloxane mask edge can be reduced ooze acid and make glass edge occur the phenomenon of burr, and acid-soluble colloid can be reduced stick to described quartz pendulous reed flexible beam surface and cause the phenomenon of acid etching inequality, thus the described quartz pendulous reed flexible beam thickness that acid etch can be made to complete evenly, edge defect reduces.
The present invention is used for the method for the thickness measuring described quartz pendulous reed flexible beam, can measure, also can measure with milscale with optical fiber.
Be the quartz pendulous reed flexible beam of 720 μm below with thickness, be further described.By the quartz pendulous reed flexible beam that thickness good for frock is 720 μm, react according to above-mentioned technical process, concrete reaction conditions is:
Embodiment 1: the concentration of described first hydrofluoric acid solution is 18.4mol/L, the concentration of described second hydrofluoric acid solution is 13.5mol/L; Described first temperature is 50 DEG C, and described second temperature is 30 DEG C; Described first preset thickness is 50 μm, and described second preset thickness is 26 μm.
Can learn by calculating, described quick etch rate v1 is 2.65 μm/min, and the described v2 of etch rate is at a slow speed 0.75 μm/min.
Under these conditions, reaching the time t1 that the first preset thickness consumes in quick etching process is 252min, and reaching at a slow speed the time t2 that the second preset thickness consumes in etching process is 32min.Be the quartz pendulous reed flexible beam acid etch to 26 μm of 720 μm by thickness, the time of wastage in bulk or weight is 284min.
Embodiment 2: the concentration of described first hydrofluoric acid solution is 18.4mol/L, the concentration of described second hydrofluoric acid solution is 13.5mol/L; Described first temperature is 60 DEG C, and described second temperature is 25 DEG C; Described first preset thickness is 50 μm, and described second preset thickness is 26 μm.
Can learn by calculating, described quick etch rate v1 is 3.23 μm/min, and the described v2 of etch rate is at a slow speed 0.5 μm/min.
Under these conditions, reaching the time t1 that the first preset thickness consumes in quick etching process is 207min, and reaching at a slow speed the time t2 that the second preset thickness consumes in etching process is 48min.Be the quartz pendulous reed flexible beam acid etch to 26 μm of 720 μm by thickness, the time of wastage in bulk or weight is 255min.
Embodiment 3: the concentration of described first hydrofluoric acid solution is 20.7mol/L, the concentration of described second hydrofluoric acid solution is 13.5mol/L; Described first temperature is 65 DEG C, and described second temperature is 25 DEG C; Described first preset thickness is 50 μm, and described second preset thickness is 26 μm.
Can learn by calculating, described quick etch rate v1 is 3.64 μm/min, and the described v2 of etch rate is at a slow speed 0.5 μm/min.
Under these conditions, reaching the time t1 that the first preset thickness consumes in quick etching process is 184min, and reaching at a slow speed the time t2 that the second preset thickness consumes in etching process is 48min.Be the quartz pendulous reed flexible beam acid etch to 26 μm of 720 μm by thickness, the time of wastage in bulk or weight is 232min.
Thus we can be clearly seen that, the manufacturing process of a kind of acid etch quartz pendulous reed flexible beam disclosed in this invention, be the quartz pendulous reed flexible beam acid etch to 26 μm of 720 μm by thickness, the time consumed is 210min ~ 350min.Be far smaller than the time that the quartz pendulous reed flexible beam that carries out acid etch same thickness by " single stage method " consumes.
The manufacturing process of a kind of acid etch quartz pendulous reed flexible beam disclosed in this invention, etch rate is comparatively slow at a slow speed, so at a slow speed in etch step, reach the time of the second preset thickness than to be easier to described in control.The thickness control accuracy of described quartz pendulous reed flexible beam can be increased to ± 1 μm.
And the time of reacting in described first hydrofluoric acid solution is shorter, thus the acid-soluble quartz pendulous reed flexible beam uneven thickness that causes of rubber mask and glass edge burr can be avoided.
The equipment being undertaken measuring by optical fiber in the present invention is online measurer for thickness (specifically referring to Fig. 3), described fiber spectrum measuring thickness device comprises fiber spectrometer 6, light source 5, mould firm banking and optical fiber measurement probe 3, described fiber spectrometer 6 and light source are popped one's head in through optical fiber 4 and described optical fiber measurement respectively and 3 to be connected, described mould firm banking is used for fixing described quartz pendulous reed around property beam 1, and described optical fiber measurement probe 3 is vertically set on and is fixed on described quartz pendulous reed on described mould firm banking around the side of property beam 1.The equal reflection source in two sides before and after described quartz pendulous reed flexible beam 1, reflected signal conducts to described fiber spectrometer 6 through described optical fiber 4, just the thickness of described quartz pendulous reed flexible beam 1 can be obtained through computing, its value shows and is stored in described computer, inputs described acid etch speed and just can calculate the first Preset Time and the second Preset Time.
Particularly, the optical fiber 4 connecting described fiber spectrometer 6 and described optical fiber measurement probe 3 is the first optical fiber, the optical fiber 4 connecting described light source 5 and described optical fiber measurement probe 3 is the second optical fiber, described second optical fiber is light-conductive optic fibre, thus, the light that described light source 5 sends can be delivered to described optical fiber measurement and pop one's head in 3 places.Described optical fiber measurement pops one's head in the rayed at 3 places when described quartz pendulous reed is on property beam 1, a part reflects through the first surface of described quartz pendulous reed around property beam 1, described reflective information passes to described optical fiber measurement probe 3, then fiber spectrometer 6 is passed to through the first optical fiber, a part is through second reflection of described quartz pendulous reed around property beam 1, described reflective information also passes to fiber spectrometer 6 through the first optical fiber, then pass to computer 7, computer 7 calculates the thickness of described quartz pendulous reed around property beam 1 according to above-mentioned reflective information.
By the setting of described Detection of Thin Film Thickness device, enforcement measurement can be carried out to described quartz pendulous reed around the thickness of property beam 1, described quartz pendulous reed can be increased to around the thickness measurement precision of property beam 1 ± 1 μm.
The above, it is only preferred embodiment of the present invention, not do any pro forma restriction to the present invention, any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. a manufacturing process for acid etch quartz pendulous reed flexible beam, is characterized in that, comprises the following steps:
The first step: quartz pendulous reed flexible beam good for frock is put into the first hydrofluoric acid solution, under the first temperature condition, etches fast, until described quartz pendulous reed flexible beam reaches the first preset thickness;
Second step: the quartz pendulous reed flexible beam of described first preset thickness is put into the second hydrofluoric acid solution, under the second temperature condition, etches at a slow speed, until described quartz pendulous reed flexible beam reaches the second preset thickness;
Wherein: the concentration of described first hydrofluoric acid solution is greater than the concentration of described second hydrofluoric acid solution, the concentration of described first hydrofluoric acid solution is less than 22mol/L;
Described first temperature is higher than described second temperature.
2. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
18 ~ 22mol/L of the concentration of described first hydrofluoric acid solution;
The concentration of described second hydrofluoric acid solution is 10 ~ 15mol/L.
3. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
Described first temperature is 50 ~ 70 DEG C;
Described second temperature is 20 ~ 30 DEG C.
4. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
In described quick etching process, in described first hydrofluoric acid solution, put into the first glass accompany sheet, by calculating the first acid etch speed that described first glass accompanies sheet in described first hydrofluoric acid solution, carry out the first Preset Time estimating described first preset thickness of test;
In described etching process at a slow speed, in described second hydrofluoric acid solution, put into the second glass accompany sheet, by calculating the second acid etch speed that described second glass accompanies sheet in described second hydrofluoric acid solution, carry out the second Preset Time estimating described second preset thickness of test.
5. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 4, is characterized in that,
Described first Preset Time is 180 ~ 300min;
Described second Preset Time is 30 ~ 50min.
6. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
By fiber spectrum measuring thickness device, measure the first preset thickness and second preset thickness of described quartz pendulous reed flexible beam;
Described fiber spectrum measuring thickness device comprises fiber spectrometer, light source, mould firm banking and optical fiber measurement probe, described fiber spectrometer and light source to be popped one's head in described optical fiber measurement through optical fiber respectively and are connected, described mould firm banking is used for fixing described quartz pendulous reed around property beam, and described optical fiber measurement probe vertical is arranged on and is fixed on described quartz pendulous reed on described mould firm banking around the side of property beam.
7. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
Described first preset thickness is 40 ~ 60 μm;
Described second preset thickness is 24 ~ 28 μm.
8. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
By trifluoropropyl siloxane mask by die-filling for described quartz pendulous reed flexible beam, form the quartz pendulous reed flexible beam that frock is good.
9. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
When the quartz pendulous reed flexible beam of the first preset thickness is put into the second hydrofluoric acid solution, use deionized water rinsing to remain acid solution, and blot quartz pendulous reed flexible beam surface-moisture with non-dust cloth.
10. the manufacturing process of acid etch quartz pendulous reed flexible beam according to claim 1, is characterized in that,
When etching fast, described quartz pendulous reed flexible beam is vertically placed in described first hydrofluoric acid solution;
When etching at a slow speed, described quartz pendulous reed flexible beam is vertically placed in described second hydrofluoric acid solution.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111751574A (en) * | 2020-07-30 | 2020-10-09 | 保定开拓精密仪器制造有限责任公司 | Preparation method of temperature acceleration composite quartz pendulous reed |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111751574A (en) * | 2020-07-30 | 2020-10-09 | 保定开拓精密仪器制造有限责任公司 | Preparation method of temperature acceleration composite quartz pendulous reed |
| CN111751574B (en) * | 2020-07-30 | 2022-01-28 | 保定开拓精密仪器制造有限责任公司 | Preparation method of temperature acceleration composite quartz pendulous reed |
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