CN104470297A - 包覆有硅胶的外壳及使用该外壳的电子装置 - Google Patents

包覆有硅胶的外壳及使用该外壳的电子装置 Download PDF

Info

Publication number
CN104470297A
CN104470297A CN201310431748.2A CN201310431748A CN104470297A CN 104470297 A CN104470297 A CN 104470297A CN 201310431748 A CN201310431748 A CN 201310431748A CN 104470297 A CN104470297 A CN 104470297A
Authority
CN
China
Prior art keywords
silica gel
magnesium alloy
alloy body
adhesive linkage
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310431748.2A
Other languages
English (en)
Other versions
CN104470297B (zh
Inventor
马宏俊
李翰明
严海鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuyu Precision Components Kunshan Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201310431748.2A priority Critical patent/CN104470297B/zh
Priority to TW102134486A priority patent/TWI577544B/zh
Priority to US14/135,475 priority patent/US9298215B2/en
Publication of CN104470297A publication Critical patent/CN104470297A/zh
Application granted granted Critical
Publication of CN104470297B publication Critical patent/CN104470297B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/304Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51Elastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536Hardness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56Damping, energy absorption
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/714Inert, i.e. inert to chemical degradation, corrosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2571/00Protective equipment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/13Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1355Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
    • Y10T428/1359Three or more layers [continuous layer]

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

本发明提供一种外壳,其包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。本发明还提供一种使用该外壳的电子装置。

Description

包覆有硅胶的外壳及使用该外壳的电子装置
技术领域
本发明涉及一种外壳,特别涉及一种包覆有硅胶的外壳及使用该外壳的电子装置。
背景技术
现有的一种外壳采用金属冲压或者压铸而成,为了让使用该外壳的电子装置具有柔和感从而提高手感,通常会对该外壳外表面进行喷漆处理。然而,涂覆在该外壳外表面上的油漆的柔和感往往并不能让人满意而且容易脱落。
发明内容
有鉴于此,有必要提供一种具有改善手感的外壳及一种使用该外壳的电子装置。
一种外壳,其包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
一种电子装置,其包括一外壳及一收容在所述外壳中的电子组件。该外壳包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
本发明提供的外壳通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。
附图说明
图1是本发明实施方式提供的外壳的剖视图。
图2是使用图1中的外壳中的电子装置的立体示意图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
如图1-2所示,本发明实施方式提供的一种电子装置100,其包括一镁合金外壳10及收容在所述外壳10中的至少一电子组件20,例如,硬盘驱动器及电路板。本实施方式中,所述电子装置100为一笔记本电脑。
所述外壳10包括一镁合金本体11、一粘接层12及一硅胶层13。所述粘接层12粘接在所述镁合金本体11和所述硅胶层13之间。
所述镁合金本体11压铸成型而成,其包括一外表面111及一与所述外表面111相对的内表面112。制造所述镁合金本体11的合金是以镁为基础加入其它元素组成的合金,其特点是:密度小,比强度高,弹性模量大,消震性好,承受冲击载荷能力比铝合金大,耐腐蚀性能好。镁在空气中极易被氧化成氧化镁,以在所述镁合金本体11的外表面111形成一层氧化层。主要合金元素有铝、锌、锰、铈、钍以及少量锆或镉等。本实施方式中,所述镁合金为镁铝合金。
所述粘接层12包括,按重量计算,12-30%的硅烷偶联剂,26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。所述硅烷偶联剂能与金属氧化物缩合,并能提高胶体与其它件之间的粘附强度。所述粘接层12为透明体,且其厚度约为0.010-0.015mm。
所述硅胶层13具有良好的电绝缘性、耐氧抗老化性、耐光抗老化性以及防霉性、化学稳定性等,特别是在高温和低温环境中仍保持原有的强度和弹性。所述硅胶层13的肖氏硬度可达10-90,其厚度约为0.5-2.0mm。本实施方式中,所述硅胶层13为有色体,其中掺杂有一定量的色母,从而使所述硅胶层13呈现出不同的色彩。
在组装过程中,先在所述镁合金本体11的外表面111涂覆一层所述粘接层12。所述粘接层12中的硅烷偶联剂与所述镁合金本体11的外表面111的金属氧化物缩合,从而提高了粘附强度。然后在所述粘接层12上直接注塑一层液态硅胶,所述液态硅胶干燥后形成所述硅胶层13。
所述粘接层12的组分为研发人员经过多次配比和实验后得出能有效提高所述镁合金本体11和所述硅胶层13的粘附强度的粘接剂。经过测试,所述镁合金本体11和所述硅胶层13的粘附等级达到5B。
本发明提供的外壳通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (10)

1.一种外壳,其包括一镁合金本体、一粘接层及一硅胶层;所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间;所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
2.如权利要求1所述的外壳,其特征在于:所述硅烷偶联剂与所述镁合金本体表面的金属氧化物缩合。
3.如权利要求1所述的外壳,其特征在于:所述硅胶层的肖氏硬度为10-90,其厚度为0.5-2.0mm。
4.如权利要求1所述的外壳,其特征在于:所述粘接层为透明体,且其厚度为0.010-0.015mm。
5.如权利要求1所述的外壳,其特征在于:所述粘接层还包括重量百分比为26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。
6.一种电子装置,其包括一外壳及一收容在所述外壳中的电子组件;所述外壳包括一镁合金本体、一粘接层及一硅胶层;所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间;所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
7.如权利要求6所述的电子装置,其特征在于:所述硅烷偶联剂与所述镁合金本体的外表面的金属氧化物缩合。
8.如权利要求6所述的电子装置,其特征在于:所述硅胶层的肖氏硬度为10-90,其厚度为0.5-2.0mm。
9.如权利要求6所述的电子装置,其特征在于:所述粘接层为透明体,且其厚度为0.010-0.015mm。
10.如权利要求6所述的电子装置,其特征在于:所述粘接层还包括重量百分比为26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。
CN201310431748.2A 2013-09-22 2013-09-22 包覆有硅胶的外壳及使用该外壳的电子装置 Active CN104470297B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201310431748.2A CN104470297B (zh) 2013-09-22 2013-09-22 包覆有硅胶的外壳及使用该外壳的电子装置
TW102134486A TWI577544B (zh) 2013-09-22 2013-09-25 包覆有矽膠的外殼及使用該外殼的電子裝置
US14/135,475 US9298215B2 (en) 2013-09-22 2013-12-19 Casing covered by silicone rubber and electronic device using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310431748.2A CN104470297B (zh) 2013-09-22 2013-09-22 包覆有硅胶的外壳及使用该外壳的电子装置

Publications (2)

Publication Number Publication Date
CN104470297A true CN104470297A (zh) 2015-03-25
CN104470297B CN104470297B (zh) 2018-08-07

Family

ID=52690743

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310431748.2A Active CN104470297B (zh) 2013-09-22 2013-09-22 包覆有硅胶的外壳及使用该外壳的电子装置

Country Status (3)

Country Link
US (1) US9298215B2 (zh)
CN (1) CN104470297B (zh)
TW (1) TWI577544B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105159411A (zh) * 2015-10-13 2015-12-16 太仓市和准电子科技有限公司 一种笔记本电脑外壳
CN107116887A (zh) * 2017-04-28 2017-09-01 合肥联宝信息技术有限公司 壳体制作方法
CN108541234A (zh) * 2016-01-12 2018-09-14 株式会社朝日橡胶 硅橡胶接合体
CN114980604A (zh) * 2022-04-29 2022-08-30 富钰精密组件(昆山)有限公司 壳体结构及其制备方法、电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101272874A (zh) * 2005-08-25 2008-09-24 东洋钢钣株式会社 镁合金成形加工体的制造方法及镁合金成形加工体
CN101370367A (zh) * 2007-08-17 2009-02-18 深圳富泰宏精密工业有限公司 铝合金便携式电子装置机壳及其制造方法
CN102490310A (zh) * 2011-12-14 2012-06-13 昆山易昌泰电子有限公司 金属外壳表面软性胶成型工艺
EP2632122A2 (en) * 2012-02-24 2013-08-28 HTC Corporation Casing of handheld electronic device and method of manufacturing the same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526922A (en) * 1983-04-15 1985-07-02 Union Carbide Corporation Organofunctional silane-siloxane oligomer coupling compositions, curable and cured elastomeric compositions containing same and novel electric cable containing said cured elastomeric compositions
US4618389A (en) * 1983-05-04 1986-10-21 Sws Silicones Corporation Process for bonding heat curable silicone rubber to a substrate using an aqueous primer composition
US5910854A (en) * 1993-02-26 1999-06-08 Donnelly Corporation Electrochromic polymeric solid films, manufacturing electrochromic devices using such solid films, and processes for making such solid films and devices
US5647939A (en) * 1994-12-05 1997-07-15 Integrated Liner Technologies, Inc. Method of bonding a cured elastomer to plastic and metal surfaces
US6409874B1 (en) * 1997-10-23 2002-06-25 Vernay Laboratories, Inc. Rubber to metal bonding by silane coupling agents
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
US6574096B1 (en) * 2000-09-29 2003-06-03 Apple Computer, Inc. Use of titanium in a notebook computer
US20050079364A1 (en) * 2003-10-08 2005-04-14 University Of Cincinnati Silane compositions and methods for bonding rubber to metals
US20050208312A1 (en) * 2004-03-17 2005-09-22 Isidor Hazan One-pack primer surfacer composition for SMC automotive body panels
US20070045893A1 (en) * 2005-08-26 2007-03-01 Himanshu Asthana Multilayer thermoplastic films and methods of making
US8133591B2 (en) * 2006-06-27 2012-03-13 GM Global Technology Operations LLC Adhesion of polymeric coatings to bipolar plate surfaces using silane coupling agents
US7831183B2 (en) * 2006-09-20 2010-11-09 Konica Minolta Business Technologies, Inc. Electrophotograph developing roller and developing apparatus employing the same
US8646637B2 (en) * 2008-04-18 2014-02-11 Apple Inc. Perforated substrates for forming housings
US20100124663A1 (en) * 2008-11-20 2010-05-20 Alpha Technical Research Co. Ltd. Resin composition and sheet using resin composition
JP5267955B2 (ja) * 2010-01-27 2013-08-21 大日本印刷株式会社 電気泳動表示装置の製造方法
US8858854B2 (en) * 2010-04-01 2014-10-14 Flextronics Ap, Llc System and method for plastic overmolding on a metal surface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101272874A (zh) * 2005-08-25 2008-09-24 东洋钢钣株式会社 镁合金成形加工体的制造方法及镁合金成形加工体
CN101370367A (zh) * 2007-08-17 2009-02-18 深圳富泰宏精密工业有限公司 铝合金便携式电子装置机壳及其制造方法
CN102490310A (zh) * 2011-12-14 2012-06-13 昆山易昌泰电子有限公司 金属外壳表面软性胶成型工艺
EP2632122A2 (en) * 2012-02-24 2013-08-28 HTC Corporation Casing of handheld electronic device and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105159411A (zh) * 2015-10-13 2015-12-16 太仓市和准电子科技有限公司 一种笔记本电脑外壳
CN108541234A (zh) * 2016-01-12 2018-09-14 株式会社朝日橡胶 硅橡胶接合体
CN108541234B (zh) * 2016-01-12 2020-07-31 株式会社朝日橡胶 硅橡胶接合体
CN107116887A (zh) * 2017-04-28 2017-09-01 合肥联宝信息技术有限公司 壳体制作方法
CN114980604A (zh) * 2022-04-29 2022-08-30 富钰精密组件(昆山)有限公司 壳体结构及其制备方法、电子设备
CN114980604B (zh) * 2022-04-29 2024-01-26 富钰精密组件(昆山)有限公司 壳体结构及其制备方法、电子设备

Also Published As

Publication number Publication date
US20150085434A1 (en) 2015-03-26
US9298215B2 (en) 2016-03-29
TW201522032A (zh) 2015-06-16
CN104470297B (zh) 2018-08-07
TWI577544B (zh) 2017-04-11

Similar Documents

Publication Publication Date Title
CN104470297A (zh) 包覆有硅胶的外壳及使用该外壳的电子装置
WO2008108206A1 (ja) 表示デバイス用透明電極およびその製造方法
FI3780568T3 (fi) Kannettava elektroninen laite
WO2010030890A3 (en) Thermal resistor material
CN103781338A (zh) 多功能薄层片材及其制备方法
CN205590610U (zh) 一种2.5d和3d钢化膜用厚型ab双面胶
WO2006001923A3 (en) Bistable nanoparticle- polymer composite for use in memory devices
EP1586538A3 (en) Modified stannic oxide-zirconium oxide complex sol and method for preparing same
CN201258438Y (zh) 不干胶底纸
WO2018077074A1 (zh) 一种3d曲面钢化玻璃ab胶全贴合工艺
WO2007106910A3 (en) Metal film encapsulation
CN202953975U (zh) 一种金属薄膜胶带
CN204288867U (zh) 一种防腐型屏蔽膜及海底电缆
CN2659097Y (zh) 一种具有多功能防护的方便贴膜
CN209264006U (zh) 一种用于公路健康监测和交通动态监测的埋入式传感器
CN207302772U (zh) 一种凹形磁铁
WO2011094991A1 (zh) 环保玻璃镜
CN207560114U (zh) 一种手机用亚克力盖板
CN109216744A (zh) 电芯极片、电芯、电池以及电子设备
CN205211451U (zh) 一种中和汽车尾气的六芯传感线
CN208806853U (zh) 一种具有超防水功能的手机壳材料
CN213085876U (zh) 一种新型玻璃膜
CN216400798U (zh) 手机中板用铝材
CN204014375U (zh) 石墨复合材料
CN213241958U (zh) 一种防水型电子元件导电膜

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20171221

Address after: 215316 Foxconn road 889, Yushan Town, Kunshan, Jiangsu

Applicant after: Fuyu precise component (Kunshan) Co., Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd.

Applicant before: Hon Hai Precision Industry Co., Ltd.

GR01 Patent grant
GR01 Patent grant