CN104470297A - 包覆有硅胶的外壳及使用该外壳的电子装置 - Google Patents
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Abstract
本发明提供一种外壳,其包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。本发明还提供一种使用该外壳的电子装置。
Description
技术领域
本发明涉及一种外壳,特别涉及一种包覆有硅胶的外壳及使用该外壳的电子装置。
背景技术
现有的一种外壳采用金属冲压或者压铸而成,为了让使用该外壳的电子装置具有柔和感从而提高手感,通常会对该外壳外表面进行喷漆处理。然而,涂覆在该外壳外表面上的油漆的柔和感往往并不能让人满意而且容易脱落。
发明内容
有鉴于此,有必要提供一种具有改善手感的外壳及一种使用该外壳的电子装置。
一种外壳,其包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
一种电子装置,其包括一外壳及一收容在所述外壳中的电子组件。该外壳包括一镁合金本体、一粘接层及一硅胶层。所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间。所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
本发明提供的外壳通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。
附图说明
图1是本发明实施方式提供的外壳的剖视图。
图2是使用图1中的外壳中的电子装置的立体示意图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
如图1-2所示,本发明实施方式提供的一种电子装置100,其包括一镁合金外壳10及收容在所述外壳10中的至少一电子组件20,例如,硬盘驱动器及电路板。本实施方式中,所述电子装置100为一笔记本电脑。
所述外壳10包括一镁合金本体11、一粘接层12及一硅胶层13。所述粘接层12粘接在所述镁合金本体11和所述硅胶层13之间。
所述镁合金本体11压铸成型而成,其包括一外表面111及一与所述外表面111相对的内表面112。制造所述镁合金本体11的合金是以镁为基础加入其它元素组成的合金,其特点是:密度小,比强度高,弹性模量大,消震性好,承受冲击载荷能力比铝合金大,耐腐蚀性能好。镁在空气中极易被氧化成氧化镁,以在所述镁合金本体11的外表面111形成一层氧化层。主要合金元素有铝、锌、锰、铈、钍以及少量锆或镉等。本实施方式中,所述镁合金为镁铝合金。
所述粘接层12包括,按重量计算,12-30%的硅烷偶联剂,26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。所述硅烷偶联剂能与金属氧化物缩合,并能提高胶体与其它件之间的粘附强度。所述粘接层12为透明体,且其厚度约为0.010-0.015mm。
所述硅胶层13具有良好的电绝缘性、耐氧抗老化性、耐光抗老化性以及防霉性、化学稳定性等,特别是在高温和低温环境中仍保持原有的强度和弹性。所述硅胶层13的肖氏硬度可达10-90,其厚度约为0.5-2.0mm。本实施方式中,所述硅胶层13为有色体,其中掺杂有一定量的色母,从而使所述硅胶层13呈现出不同的色彩。
在组装过程中,先在所述镁合金本体11的外表面111涂覆一层所述粘接层12。所述粘接层12中的硅烷偶联剂与所述镁合金本体11的外表面111的金属氧化物缩合,从而提高了粘附强度。然后在所述粘接层12上直接注塑一层液态硅胶,所述液态硅胶干燥后形成所述硅胶层13。
所述粘接层12的组分为研发人员经过多次配比和实验后得出能有效提高所述镁合金本体11和所述硅胶层13的粘附强度的粘接剂。经过测试,所述镁合金本体11和所述硅胶层13的粘附等级达到5B。
本发明提供的外壳通过在该镁合金本体上贴附一层硅胶层,有效提高该外壳的柔和度,从而改善手感。另外,根据该镁合金本体的极易氧化的特性对该粘接层的组分进行特别设计,有效的提高了该镁合金本体和该硅胶层之间的粘附强度。
可以理解的是,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。
Claims (10)
1.一种外壳,其包括一镁合金本体、一粘接层及一硅胶层;所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间;所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
2.如权利要求1所述的外壳,其特征在于:所述硅烷偶联剂与所述镁合金本体表面的金属氧化物缩合。
3.如权利要求1所述的外壳,其特征在于:所述硅胶层的肖氏硬度为10-90,其厚度为0.5-2.0mm。
4.如权利要求1所述的外壳,其特征在于:所述粘接层为透明体,且其厚度为0.010-0.015mm。
5.如权利要求1所述的外壳,其特征在于:所述粘接层还包括重量百分比为26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。
6.一种电子装置,其包括一外壳及一收容在所述外壳中的电子组件;所述外壳包括一镁合金本体、一粘接层及一硅胶层;所述粘接层粘接在所述镁合金本体的外表面和所述硅胶层之间;所述粘接层包括重量百分比为12-30%的硅烷偶联剂。
7.如权利要求6所述的电子装置,其特征在于:所述硅烷偶联剂与所述镁合金本体的外表面的金属氧化物缩合。
8.如权利要求6所述的电子装置,其特征在于:所述硅胶层的肖氏硬度为10-90,其厚度为0.5-2.0mm。
9.如权利要求6所述的电子装置,其特征在于:所述粘接层为透明体,且其厚度为0.010-0.015mm。
10.如权利要求6所述的电子装置,其特征在于:所述粘接层还包括重量百分比为26-38%的乙醇,4-11%的异丙醇和18-22%石油醚。
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CN201310431748.2A CN104470297B (zh) | 2013-09-22 | 2013-09-22 | 包覆有硅胶的外壳及使用该外壳的电子装置 |
TW102134486A TWI577544B (zh) | 2013-09-22 | 2013-09-25 | 包覆有矽膠的外殼及使用該外殼的電子裝置 |
US14/135,475 US9298215B2 (en) | 2013-09-22 | 2013-12-19 | Casing covered by silicone rubber and electronic device using same |
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Cited By (4)
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CN105159411A (zh) * | 2015-10-13 | 2015-12-16 | 太仓市和准电子科技有限公司 | 一种笔记本电脑外壳 |
CN107116887A (zh) * | 2017-04-28 | 2017-09-01 | 合肥联宝信息技术有限公司 | 壳体制作方法 |
CN108541234A (zh) * | 2016-01-12 | 2018-09-14 | 株式会社朝日橡胶 | 硅橡胶接合体 |
CN114980604A (zh) * | 2022-04-29 | 2022-08-30 | 富钰精密组件(昆山)有限公司 | 壳体结构及其制备方法、电子设备 |
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2013
- 2013-09-22 CN CN201310431748.2A patent/CN104470297B/zh active Active
- 2013-09-25 TW TW102134486A patent/TWI577544B/zh active
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CN105159411A (zh) * | 2015-10-13 | 2015-12-16 | 太仓市和准电子科技有限公司 | 一种笔记本电脑外壳 |
CN108541234A (zh) * | 2016-01-12 | 2018-09-14 | 株式会社朝日橡胶 | 硅橡胶接合体 |
CN108541234B (zh) * | 2016-01-12 | 2020-07-31 | 株式会社朝日橡胶 | 硅橡胶接合体 |
CN107116887A (zh) * | 2017-04-28 | 2017-09-01 | 合肥联宝信息技术有限公司 | 壳体制作方法 |
CN114980604A (zh) * | 2022-04-29 | 2022-08-30 | 富钰精密组件(昆山)有限公司 | 壳体结构及其制备方法、电子设备 |
CN114980604B (zh) * | 2022-04-29 | 2024-01-26 | 富钰精密组件(昆山)有限公司 | 壳体结构及其制备方法、电子设备 |
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US20150085434A1 (en) | 2015-03-26 |
US9298215B2 (en) | 2016-03-29 |
TW201522032A (zh) | 2015-06-16 |
CN104470297B (zh) | 2018-08-07 |
TWI577544B (zh) | 2017-04-11 |
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