CN104470267B - A kind of method for improving mixed pressure material HDI plate interlayer alignment precisions - Google Patents
A kind of method for improving mixed pressure material HDI plate interlayer alignment precisions Download PDFInfo
- Publication number
- CN104470267B CN104470267B CN201410755453.5A CN201410755453A CN104470267B CN 104470267 B CN104470267 B CN 104470267B CN 201410755453 A CN201410755453 A CN 201410755453A CN 104470267 B CN104470267 B CN 104470267B
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- China
- Prior art keywords
- daughter board
- plate
- resin
- baking
- different layers
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a kind of method for improving mixed pressure material HDI plate interlayer alignment precisions, belong to circuit board making field.The method for improving mixed pressure material HDI plate interlayer alignment precisions comprises the following steps：By baking sheet after the daughter board filling holes with resin of different layers, when resin is not fully cured, abrasive belt grinding is carried out, polishes off the resin of prominent plate face；Baking sheet is segmented to daughter board again；Measure and record the size of different layers daughter board；Daughter board of the dimensional tolerance range of the daughter board of different layers at ± 50 μm is divided into same group；Daughter board row's plate of same group of different layers is pressed into HDI plates.The present invention can effectively reduce the interlayer off normal caused by material C ET differences, solve the problems, such as that interlayer alignment is inaccurate；Meanwhile plate method is arranged using packet, from itself harmomegathus of sheet material, reduce and positioned using extraneous physical instrument, on the one hand improve aligning accuracy, on the other hand reduce the use of the materials such as rivet, reduce cost.
Description
Technical field
The invention belongs to circuit board making field, is related to a kind of method for improving mixed pressure material HDI plate interlayer alignment precisions.
Background technology
Pressing working procedure is one of process important in multilayer line board manufacturing process, and the quality of pressing directly influences multilayer
The connection of circuit between pcb layer.As most important " contraposition " sub- process in bonding processes, pressing interlayer is directly affects again
The quality of Aligning degree.
Interlayer alignment precision is the Major Difficulties in process, holes of products to linear distance it is smaller when 0.2mm, it is necessary to it is strict
Key-course deviator.Product is pressed if wiring board design is mixing material, the thermal coefficient of expansion of different materials is different, such as：
Materials different CTE, after preceding process (internal layer, AOI, filling holes with resin, abrasive belt grinding etc.) processing, sheet material produces
Harmomegathus amount also can be different, the problem of so as to which aligning accuracy is uncontrolled before causing to press, if pressing is beyond pressing aligning accuracy
It is required that the problems such as then producing interlayer off normal (general to require≤50 μm), internal layer circuit short circuit, internal layer circuit open circuit.
, it is necessary to make filling holes with resin and nog plate processing, its products characteristics is first to complete for machine drilling HDI plates
The making of each daughter board, then turn into a motherboard by pressing to press each daughter board, in daughter board manufacturing process, each operation is to harmomegathus
Have a great influence, such as filling holes with resin, abrasive belt grinding process, the pressure in abrasive band and the effect of pullling；It is general especially in filling holes with resin technique
Logical manufacture craft is：155 DEG C × 60min baking sheets after consent；The complete abrasive bands of 400# after cooling of baking sheet once+600# abrasive bands once+
1000# abrasive band polishings are once polished；Then nog plate, do not specify during nog plate and put plate direction.This way shortcoming is：Once
Property resin is dried, it is necessary to polished using rougher 400# sand paper, and sand paper is more coarse, sheet material harmomegathus is influenceed bigger；Mill
Plate not assigned direction, the direction of sheet material harmomegathus can not be same, influences rear process contraposition, is easy to make deformation of products excessive.
The inclined method of key-course at present, simply increase the positioning such as " fusion ", " riveted ", for example, " 4 points of fusions " is changed into " 4
+ 4 riveteds of point fusion ", "+4 riveteds of 4 points of fusions " are changed to "+6 riveteds of 6 points of fusions " etc..The method is with extraneous auxiliary
The physical means helped, to increase the aligning accuracy between each laminate, but do not take in terms of sheet material harmomegathus and effectively arrange.
On the one hand this mode is added Material Cost, on the other hand, failed from plate using the physical means of extraneous auxiliary
The harmomegathus of material itself, which is set out, considers the inclined control method of layer, so in real process, is still not able to reach highly desirable effect.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of HDI plate lamination contraposition systems that can be applied to the drilling of mixed pressure material mechanical
Make method, concrete scheme is as follows：
A kind of method for improving mixed pressure material HDI plate interlayer alignment precisions, comprises the following steps：
S1：By 130 ± 2 DEG C of baking sheet 15min after the daughter board filling holes with resin of different layers, when resin is not fully cured, enter
Row abrasive belt grinding, polish off the resin of prominent plate face；
S2：Daughter board after nog plate carries out segmentation baking sheet；Segmentation baking sheet tune part be followed successively by 60 ± 3 DEG C baking 30min, 70 ±
3 DEG C of baking 30min, 80 ± 3 DEG C of baking 30min, 90 ± 3 DEG C of baking 30min, 110 ± 3 DEG C of baking 30min, 130 ± 3 DEG C are toasted
30min, 155 ± 5 DEG C of baking 55min；
S3：After daughter board is cooled to room temperature, measures and record the size of daughter board；
S4：Daughter board of the correspondingly-sized margin of tolerance of different layers daughter board at ± 50 μm is divided into same group；
S5：Daughter board row's plate of same group of different layers is pressed into HDI plates.
In described step S1, for filling holes with resin using filling holes with resin technique is vacuumized, technological parameter is as shown in table 1 below：
Table 1
In described step S1, the method for described abrasive belt grinding is：Disposably plate face is protruded using 600# abrasive bands
Resin is all ground off, and to reduce abrasive belt grinding number, is reduced the harmomegathus amount of plate, is reused 1000# abrasive band polishings once.
In described step S1, during abrasive belt grinding, the number of the daughter board nog plate of different layers, direction, top and bottom must be consistent,
It is different to prevent that plate from being acted on by external force, elongates ratio.
In described step S2, the size of daughter board is measured by X-ray machines.
The method of the improvement mixed pressure material HDI plate interlayer alignment precisions of the present invention, for the high interconnection of machine drilling density
Printed board by " nog plate ", " baking sheet " method adjust, can effectively reduce the interlayer off normal caused by material C ET differences,
Solve the problems, such as that interlayer alignment is inaccurate；Meanwhile plate method is arranged using packet, from itself harmomegathus of sheet material, reduce and use
Extraneous physical instrument is positioned, and is on the one hand improved aligning accuracy, is on the other hand reduced the use of the materials such as rivet, reduce
Cost.
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is entered with reference to specific embodiment
One step introduction and explanation.
Embodiment
It will drill, 130 DEG C of baking sheet 15min after the L1-L2 daughter board filling holes with resin that plating is completed, treat that resin is not fully cured
When, disposably the resin that plate face protrudes all is ground off using 600# abrasive bands, reuses 1000# abrasive band polishings once, it is all
L1-L2 daughter boards face up, nog plate clockwise；Daughter board is carried out to 60 DEG C of baking 30min, 70 DEG C of bakings successively after nog plate
30min, 80 DEG C of baking 30min, 90 DEG C of baking 30min, 110 DEG C of baking 0min, 130 DEG C of baking 30min, 155 DEG C are toasted
55min。
It will drill, 130 DEG C of baking sheet 15min after the L3-L4 daughter board filling holes with resin that plating is completed, treat that resin is not fully cured
When, disposably the resin that plate face protrudes all is ground off using 600# abrasive bands, reuses 1000# abrasive band polishings once, it is all
L3-L4 daughter boards face up, nog plate clockwise；Daughter board is carried out to 60 DEG C of baking 30min, 70 DEG C of bakings successively after nog plate
30min, 80 DEG C of baking 30min, 90 DEG C of baking 30min, 110 DEG C of baking 0min, 130 DEG C of baking 30min, 155 DEG C are toasted
55min。
It will drill, 130 DEG C of baking sheet 15min after the L4-L6 daughter board filling holes with resin that plating is completed, treat that resin is not fully cured
When, disposably the resin that plate face protrudes all is ground off using 600# abrasive bands, reuses 1000# abrasive band polishings once, it is all
L5-L6 daughter boards face up, nog plate clockwise；Daughter board is carried out to 60 DEG C of baking 30min, 70 DEG C of bakings successively after nog plate
30min, 80 DEG C of baking 30min, 90 DEG C of baking 30min, 110 DEG C of baking 0min, 130 DEG C of baking 30min, 155 DEG C are toasted
55min；
After each straton plate is cooled to room temperature, to all L1-L2 daughter boards numberings (1., 2., 3. ... N), pass through X-
Ray machines measure and record the size (length and width) of each L1-L2 daughter boards；To all L3-L4 daughter boards numberings (1., 2., 3. ...
N), measured by X-ray machines and record the size (length and width) of each L1-L2 daughter boards；To all L5-L4 daughter boards numberings (1., 2.,
3. ... N), measured by X-ray machines and record the size (length and width) of each L1-L2 daughter boards；It is as shown in table 2 to record result：
Table 2
" packet " method of use, by L1-L2 daughter boards, L3-L4 daughter boards, L5-L6 daughter boards dimensional tolerance range in ± 50 μm of (bags
Containing) plate number be divided into one group, group result is as shown in table 3：
Table 3
It is grouped according to table 3, the L1-L2 daughter boards, L3-L4 daughter boards, L5-L6 daughter boards of each group is arranged into plate, are pressed into 6 layers of HDI
Plate.
It should be noted that these are only as the example of 6 layers of HDI plates, packet row's plate method of multilayer board can be with
This analogizes.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (4)
- A kind of 1. method for improving mixed pressure material HDI plate interlayer alignment precisions, it is characterised in that comprise the following steps：S1：By 130 ± 2 DEG C of baking sheet 15min after the daughter board filling holes with resin of different layers, when resin is not fully cured, sand is carried out Band nog plate, polish off the resin of prominent plate face；S2：Daughter board after nog plate carries out segmentation baking sheet；Segmentation baking sheet condition be followed successively by 60 ± 3 DEG C baking 30min, 70 ± 3 DEG C 30min is toasted, 80 ± 3 DEG C of baking 30min, 90 ± 3 DEG C of baking 30min, 110 ± 3 DEG C of baking 30min, 130 ± 3 DEG C are toasted 30min, 155 ± 5 DEG C of baking 55min；S3：After daughter board is cooled to room temperature, measures and record the length and width size of daughter board；S4：The corresponding length and width dimensional tolerance range of different layers daughter board is divided into same group in ± 50 μm of daughter board；S5：The daughter board typesetting of same group of different layers is pressed into HDI plates.
- 2. the method according to claim 1 for improving mixed pressure material HDI plate interlayer alignment precisions, it is characterised in that described Step S1 in, the method for described abrasive belt grinding is：Disposably the resin that plate face protrudes all is ground off using 600# abrasive bands, Reuse 1000# abrasive band polishings once.
- 3. the method according to claim 2 for improving mixed pressure material HDI plate interlayer alignment precisions, it is characterised in that described Step S1 in, during abrasive belt grinding, the number of the daughter board nog plate of different layers, direction, top and bottom are consistent.
- 4. the method according to claim 1 for improving mixed pressure material HDI plate interlayer alignment precisions, it is characterised in that described Step S3 in, the length and width size of daughter board is measured by X-ray machines.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410755453.5A CN104470267B (en) | 2014-12-10 | 2014-12-10 | A kind of method for improving mixed pressure material HDI plate interlayer alignment precisions |
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|---|---|---|---|
| CN201410755453.5A CN104470267B (en) | 2014-12-10 | 2014-12-10 | A kind of method for improving mixed pressure material HDI plate interlayer alignment precisions |
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| CN104470267A CN104470267A (en) | 2015-03-25 |
| CN104470267B true CN104470267B (en) | 2017-12-01 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392304B (en) * | 2015-10-21 | 2017-12-05 | 胜宏科技（惠州）股份有限公司 | A kind of circuit board pressing method |
| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN107087346A (en) * | 2017-06-16 | 2017-08-22 | 东莞职业技术学院 | A kind of method in pressing cavity in use screen printing technique prevention pcb board |
| CN109121303B (en) * | 2018-09-28 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Board splitting method of pre-formed board, drilling method of pre-formed board and circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378629A (en) * | 2008-09-28 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for processing resistance welding milling point |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11284341A (en) * | 1998-03-31 | 1999-10-15 | Hitachi Chem Co Ltd | Manufacture of multi-layer printed circuit board |
| JP2009004664A (en) * | 2007-06-25 | 2009-01-08 | Panasonic Corp | Manufacturing method for board with built-in components |
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2014
- 2014-12-10 CN CN201410755453.5A patent/CN104470267B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378629A (en) * | 2008-09-28 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for processing resistance welding milling point |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
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