CN104465282A - Ion beam etching machine working table with cooling structure - Google Patents
Ion beam etching machine working table with cooling structure Download PDFInfo
- Publication number
- CN104465282A CN104465282A CN201410626704.XA CN201410626704A CN104465282A CN 104465282 A CN104465282 A CN 104465282A CN 201410626704 A CN201410626704 A CN 201410626704A CN 104465282 A CN104465282 A CN 104465282A
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- CN
- China
- Prior art keywords
- retainer
- ion beam
- beam etching
- cooling
- etching machine
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses an ion beam etching machine working table with a cooling structure. The ion beam etching machine working table with the cooling structure comprises a fixed base, a driving base and substrate tables, wherein the fixed base, the driving base and the substrate tables are fixed inside a vacuum cavity of an ion beam etching machine. A swinging mechanism and the driving base are installed on the fixed base, wherein the driving base is driven by the swinging mechanism through a gear pair. A water-passing shaft and multiple planetary shafts are installed on the driving base through bearings, a sun gear is installed on the water-passing shaft, and the corresponding substrate table is installed at one end of each planetary shaft. A cooling water channel is formed between the substrate tables and the driving base and communicated with the water-passing shaft in series. The water-passing shaft is communicated with a water inlet pipeline and a water outlet pipeline to form a cooling water loop together with the cooling water channel. The ion beam etching machine working table is compact in structure and easy to install in the vacuum cavity, the cooling effect of the substrate tables is good, and the evenness of ion beam etching is improved.
Description
Technical field
The present invention relates to water-cooled and the rotary seal of the swingable Gear Planet Transmission work stage in a kind of semiconductor equipment, be specifically related to a kind of ion beam etching machine worktable with cooling structure, be mainly used in improving the etching homogeneity of Micropicture transfer equipment-ion bean etcher in semiconductor device technology.
Background technology
Ion bean etcher is a kind of high vacuum etching apparatus, adopt physical etchings mode, special ion source is utilized to produce ion beam, ion beam through accelerating realizes anisotropic etching to any material, surface of the work has one deck mask material, it there is the figure that photoetching is good, workpiece to be removed part mask material to remove, the part bombardment of not blocked by mask material is fallen by ion beam, is mainly used in carrying out dry etching to the metallic film such as gold (Au), platinum (Pt), NiCr alloy, copper (Cu).
Carrying out in etching process at ion beam to substrate, the temperature of chip bench raises, and the uniformity of variations in temperature to etching can have an impact, and in order to improve the uniformity of ion beam etching, must carry out water-cooled to chip bench; Etching technics must carry out in vacuum cavity, to rotation and revolution chip bench water-cooled must carry out rotary seal.At present, the etching homogeneity of domestic ion bean etcher is: in sheet ± 5%, between sheet ± 3%.
Summary of the invention
The present invention aims to provide a kind of ion beam etching machine worktable with cooling structure, and this water-cooled and rotary sealing appts can improve the uniformity of ion bean etcher effectively.
To achieve these goals, the technical solution adopted in the present invention is:
Have an ion beam etching machine worktable for cooling structure, its design feature is, comprises the firm banking, retainer and the chip bench that are fixed in ion bean etcher vacuum cavity; A swing mechanism described firm banking is equipped with, and by the retainer of swing mechanism by gear pair transmission; Described retainer is equipped with water flowing axle and Duo Gen planet axis by bearing, described water flowing axle is equipped with central gear, described chip bench is equipped with in one end of described planet axis; The cooling water channel with described water flowing axle serial communication is formed between chip bench and described retainer; Described water flowing axle is communicated with an inlet pipeline respectively and forms chilled(cooling) water return (CWR) with an outlet pipeline together with described cooling water channel.
Thus, when etching work is carried out, cooling water enters in water flowing axle by inlet pipeline, then cools each chip bench by cooling water channel, then flows out from outlet pipeline, reaches the object to chip bench cooling, thus improves the uniformity of ion bean etcher.
Be below the technical scheme of further improvement of the present invention:
Described swing mechanism comprises and is contained in firm banking built with being driven the swinging axle rotated by oscillating motor, and this swinging axle top is equipped with the Connection Block that is connected with described retainer and retainer is swung around swinging axle under the driving of swinging axle; Described firm banking is equipped with by the travelling gear of a driving gear engaged transmission, this travelling gear be contained in the bevel gear engaged transmission of retainer and drive retainer to rotate around water flowing axle.
Thus, water flowing axle one end is locked and can not rotation, therefore, central gear and water flowing axle only swing and do not rotate, planet axis is rotated around water flowing axle with retainer, and make chip bench around the revolution of water flowing axle, transmitting gear is around central gear engaged transmission, planet axis is own rotation under the drive of transmitting gear, and then drives chip bench rotation; Arrange swing mechanism work stage can be made to swing to the position in 90 ° with ion beam carry out polishing, swing to suitable angle after polishing completes, work stage carries out lithography while rotation and revolution.
As a kind of concrete version, described cooling water channel is docked by the tank and the tank be opened on chip bench that are opened in retainer end face and forms.
The axis body of described water flowing axle and planet axis is all equipped with O RunddichtringO and oil sealing.
According to embodiments of the invention, described planet axis has three, and a chip bench is equipped with in every root planet axis termination, and the cooling water channel of each chip bench is by the cooling water channel serial communication on retainer.
Described driving gear loads on driving shaft, and the output shaft of this driving shaft and a rotary electric machine is connected.
Above structure, the special construction (can revolve round the sun and rotation, can swing again) that the present invention is directed to chip bench on ion bean etcher can realize water-cooled and rotary seal, improves the etching homogeneity of substrate.
Retainer of the present invention offers cooling water channel, cooling water enters from water flowing axle center, by the water channel in retainer, planet water flowing axle, enter the chip bench back side, cooling water flows through the chip bench back side and enters another chip bench by water channel, finally flow out from water flowing axle clamp layer, realize the water cooling of chip bench.
Described rotary sealing appts, is characterized in that being respectively equipped with O RunddichtringO on described water flowing axle and the delivery port of planet axis and the axis body of water inlet both sides, is provided with oil sealing, thus realizes the rotary seal of water inside the bearing on described fixed axis and planet axis.
Described inlet pipeline and outlet pipeline, requirement can swing within the scope of 0-90 ° with epicyclic transmission mechanism, therefore adopts hose form.
The recirculated water that the labyrinth that O RunddichtringO described in patent utilization of the present invention adds oil sealing realizes in vacuum chamber seals, and makes the thrust of sealing ring circumference even with round nut, thus ensures that the water-stop in vacuum chamber is safe and reliable.
Compared with prior art, the invention has the beneficial effects as follows: compact conformation of the present invention, be easy to the water-cooled realizing substrate in vacuum chamber, effectively improve the uniformity of ion bean etcher.
Below in conjunction with drawings and Examples, the present invention is further elaborated.
Accompanying drawing explanation
Fig. 1 is the sectional structure schematic diagram of a kind of embodiment of patent of the present invention;
Fig. 2 is retainer inner loop water channel schematic diagram, and the water channel flowing to chip bench from planetary center is the independent water channel staggered with the water channel flowing back to planetary center from chip bench.
In the drawings
1-vacuum cavity; 2-rotary electric machine; 3-oscillating motor; 4-firm banking; 5-swing mechanism; 6-retainer; 7-round nut; 8-chip bench; 9-planet axis; 10-O RunddichtringO; 11-oil sealing; 12-rolling bearing; 13-water flowing axle; 14-inlet pipeline; 15-outlet pipeline; 16-bevel gear; 17-driving cog; 18-driving gear; 19-swinging axle; 20-Connection Block; 21-central gear; 22-planetary gear; 23-cooling water channel; 24-water flowing axis hole; 25-planet axis hole.
Embodiment
The embodiment of patent of the present invention is described in detail below in conjunction with accompanying drawing.It should be noted that figure number only represents the main parts size of the present embodiment, other does not have example one by one to go out.
A kind of ion beam etching machine worktable with cooling structure, as shown in Figure 1, firm banking 4 is arranged on vacuum cavity 1, swing mechanism 5 is arranged on firm banking 4, swing mechanism 5 is installed retainer 6, mounted substrate platform 8 in the planet axis 9 on retainer 6 is arranged on by rolling bearing, water flowing axle 13 is arranged on retainer 6 center, inlet pipeline 14 on connection water flowing axle 13 axle, outlet pipeline 15 requirement can swing within the scope of 0-90 °, therefore employing hose form, water flowing axle 13 is designed to sandwich passage version, water inlet namely, interlayer water outlet.
Described water flowing axle 22 is horizontal through retainer 6, and water flowing axle 22 one end is locked and limits himself rotation, and rotating mechanism drives retainer 6 to rotate around water flowing axle 22, and 3 planet axis 19 also can be rotated with retainer 6 horizontal through retainer 6.Described chip bench 19 is arranged on one end of planet axis 19, and the other end of planet axis 19 is equipped with planetary gear 22, the central gear 21 with described planetary gear 22 engaged transmission described water flowing axle 22 is equipped with, connect inlet pipeline 14 and outlet pipeline 15 in this water flowing axle 22, and inlet pipeline 14 and outlet pipeline 15 are flexible pipe; Described work stage is also provided with the swing mechanism driving retainer 6 to swing around vertical swinging axle 19.
Swing mechanism comprise firm banking 4, oscillating motor 3, for connecting the Connection Block 20 of swinging axle 19 and retainer 6, described swinging axle 19 is arranged in firm banking 4 by the first rolling bearing, the output shaft of described oscillating motor 3 is connected with one end of swinging axle 19, and the other end of swinging axle 19 is connected with Connection Block 20, described Connection Block 20 is connected with retainer 6 by the second rolling bearing.
Firm banking 4 is arranged on vacuum cavity 1 top, and retainer 6 is positioned at the top of firm banking 4.
Described rotating mechanism comprises rotary electric machine 2, driving gear set, driving gear set comprises the driving gear 18 of engaged transmission in turn, travelling gear 17 and bevel gear 16, the output shaft of described rotary electric machine 2 is connected with the central shaft of driving gear 18, and travelling gear 17 is sleeved on firm banking 4 outer wall by rolling bearing, described bevel gear 16 is sleeved on retainer 6 outer wall, and adopts key to be connected between bevel gear 16 with retainer 6.
There is described in introducing below the concrete technology flow process of the ion beam etching machine worktable work of cooling structure, carrying out in etching process to the workpiece on chip bench, workpiece rotation, revolution is carried out simultaneously, water enters vacuum cavity 1 by inlet pipeline 14 and arrives water flowing axle 13 center, by the water channel in retainer 6, planet axis 9, enter chip bench 8 back side, cooling water flows through chip bench 8 back side and enters another chip bench 8 by retainer 6 water channel, finally flow out from water flowing axle 13 interlayer, be connected to outside vacuum chamber by outlet pipeline 15, realize the water cooling to chip bench, described water flowing axle 13 and the delivery port of planet axis 9 and the axis body of water inlet both sides are respectively equipped with O RunddichtringO 10, oil sealing is provided with inside bearing on described 13 with planet axis 9.Described O RunddichtringO and oil sealing all adopt commercially available prod.
The foregoing is only the embodiment of patent of the present invention, be not intended to limit the protection range of patent of the present invention, but for illustration of patent of the present invention.Within all spirit in patent of the present invention and principle, any amendment done, equivalent replacement, improvement etc., within the protection range that all should be included in patent of the present invention.
Claims (6)
1. there is an ion beam etching machine worktable for cooling structure, it is characterized in that, comprise the firm banking (4) be fixed in ion bean etcher vacuum cavity (1), retainer (6) and chip bench (8); A swing mechanism (5) described firm banking (4) is equipped with, and by the retainer (6) of swing mechanism (5) by gear pair transmission; Described retainer (6) is equipped with water flowing axle (13) and many planet axis (9) by bearing, described water flowing axle (13) is equipped with central gear (21), described chip bench (8) is equipped with in one end of described planet axis (9); The cooling water channel (23) with described water flowing axle (13) serial communication is formed between chip bench (8) and described retainer (6); Described water flowing axle (13) is communicated with an inlet pipeline (14) and an outlet pipeline (15) respectively and forms chilled(cooling) water return (CWR) together with described cooling water channel (23).
2. the ion beam etching machine worktable with cooling structure according to claim 1, it is characterized in that, described swing mechanism comprises and is contained in firm banking (4) built with being driven the swinging axle (19) rotated by oscillating motor (3), and this swinging axle (19) top is equipped with the Connection Block (20) that is connected with described retainer (6) and retainer (6) is swung around swinging axle (19) under the driving of swinging axle (19); Described firm banking (4) is equipped with by the travelling gear (17) of a driving gear (18) engaged transmission, this travelling gear (17) be contained in the bevel gear engaged transmission of retainer (6) and drive retainer (6) to rotate around water flowing axle (13).
3. the ion beam etching machine worktable with cooling structure according to claim 1, is characterized in that, described cooling water channel (23) is docked by the tank and the tank be opened on chip bench (8) that are opened in retainer (6) end face and forms.
4. the ion beam etching machine worktable with cooling structure according to claim 1, is characterized in that, described water flowing axle (13) and the axis body of planet axis (9) are all equipped with O RunddichtringO and oil sealing.
5. according to the ion beam etching machine worktable with cooling structure one of claim 1-4 Suo Shu, it is characterized in that, described planet axis (9) has three, a chip bench (8) is equipped with in every root planet axis (9) termination, and the cooling water channel of each chip bench (8) is by the cooling water channel serial communication on retainer (6).
6. the ion beam etching machine worktable with cooling structure according to claim 1, is characterized in that, described driving gear (18) loads on driving shaft, and the output shaft of this driving shaft and a rotary electric machine (12) is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626704.XA CN104465282B (en) | 2014-11-10 | 2014-11-10 | A kind of ion beam etching machine worktable with cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410626704.XA CN104465282B (en) | 2014-11-10 | 2014-11-10 | A kind of ion beam etching machine worktable with cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104465282A true CN104465282A (en) | 2015-03-25 |
| CN104465282B CN104465282B (en) | 2016-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410626704.XA Active CN104465282B (en) | 2014-11-10 | 2014-11-10 | A kind of ion beam etching machine worktable with cooling structure |
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| Country | Link |
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| CN (1) | CN104465282B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428276A (en) * | 2015-11-11 | 2016-03-23 | 中国电子科技集团公司第四十八研究所 | Indirect water cooling planetary transmission working stage |
| CN106903449A (en) * | 2017-03-02 | 2017-06-30 | 北京创世威纳科技有限公司 | A kind of device etched for taper or spherical workpiece |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303127A (en) * | 2004-04-14 | 2005-10-27 | Hitachi High-Technologies Corp | Electron beam lithographic apparatus |
| CN201133527Y (en) * | 2007-12-17 | 2008-10-15 | 中国电子科技集团公司第四十八研究所 | Recirculated water-cooling rotating seal work platform for vacuum chamber |
| CN103730393A (en) * | 2013-12-19 | 2014-04-16 | 中国电子科技集团公司第四十八研究所 | Gas intake device of plasma etching equipment |
| CN103762145A (en) * | 2013-12-23 | 2014-04-30 | 中国电子科技集团公司第四十八研究所 | High-temperature target chamber system with rotary disk |
-
2014
- 2014-11-10 CN CN201410626704.XA patent/CN104465282B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303127A (en) * | 2004-04-14 | 2005-10-27 | Hitachi High-Technologies Corp | Electron beam lithographic apparatus |
| CN201133527Y (en) * | 2007-12-17 | 2008-10-15 | 中国电子科技集团公司第四十八研究所 | Recirculated water-cooling rotating seal work platform for vacuum chamber |
| CN103730393A (en) * | 2013-12-19 | 2014-04-16 | 中国电子科技集团公司第四十八研究所 | Gas intake device of plasma etching equipment |
| CN103762145A (en) * | 2013-12-23 | 2014-04-30 | 中国电子科技集团公司第四十八研究所 | High-temperature target chamber system with rotary disk |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428276A (en) * | 2015-11-11 | 2016-03-23 | 中国电子科技集团公司第四十八研究所 | Indirect water cooling planetary transmission working stage |
| CN106903449A (en) * | 2017-03-02 | 2017-06-30 | 北京创世威纳科技有限公司 | A kind of device etched for taper or spherical workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104465282B (en) | 2016-10-19 |
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