CN104439603A - Selective wave-soldering nozzle - Google Patents
Selective wave-soldering nozzle Download PDFInfo
- Publication number
- CN104439603A CN104439603A CN201410625413.9A CN201410625413A CN104439603A CN 104439603 A CN104439603 A CN 104439603A CN 201410625413 A CN201410625413 A CN 201410625413A CN 104439603 A CN104439603 A CN 104439603A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- soldering
- tin
- nozzle body
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention relates to a selective wave-soldering nozzle which comprises a nozzle body. The nozzle body is tubular and has a rectangular cross section. The cross section of the nozzle body is matched with an area, in which tin is to be sprayed, of a PCB, a plurality of nozzle openings are formed in the nozzle body, and the positions of the nozzle openings are matched with the pin positions, on which the tin is to be sprayed, of the PCB. The selective wave-soldering nozzle has the advantages that the shape of the nozzle and the nozzle openings are designed according to the pin area, in which the tin is to be sprayed, of the PCB on which the tin is to be sprayed, and the whole soldering time is shortened by shortening the moving time of a soldering head and expanding the one-time soldering area. An original single point circular soldering nozzle is changed into the multi-point soldering nozzle, the size of the nozzle is identical to the size of the largest soldering area, and another corresponding area can be soldered by vertically moving the nozzle through a carrier after one area is soldered. The tin can be sprayed on multiple local point positions at the same time in work, so that the production efficiency is improved, and meanwhile the precision is high.
Description
Technical field
The invention belongs to wave-soldering nozzle technology field, particularly relate to a kind of selective wave-soldering nozzle.
Background technology
Existing wave-soldering is all the design of single spout, moves as required at work along PCB stitch point position, pointwise spray tin.Although this working method can be applied on the pcb board of various design, because a position is many, route is long, is difficult to enhance productivity.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of selective wave-soldering nozzle, according to profile and the spout of tin pin field design nozzle to be painted on tin pcb board to be painted, by shortening plumb joint traveling time, an expansion welding region shortens whole weld interval.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of selective wave-soldering nozzle, comprise nozzle body, described nozzle body is the tubulose that cross section is rectangle, in described nozzle body cross section and PCB, tin region to be painted matches, be provided with spout in described nozzle body, described spout has the pin position of tin to be painted in multiple and position and PCB to match.
Described nozzle body bottom is connected and installed bayonet socket, described installation bayonet socket and streamline sprays Xi Kou and matches.
Electric heater and thermocouple described nozzle body be equipped with.
Beneficial effect
The invention has the advantages that, according to profile and the spout of band spray tin pin design nozzle on tin pcb board to be painted, according to profile and the spout of tin pin field design nozzle to be painted on tin pcb board to be painted, by shortening plumb joint traveling time, an expansion welding region shortens whole weld interval.Original single-point circular weld nozzle is changed into multiple spot rectangular solder nozzle, the size of nozzle and the in the same size of maximum welding region, after having welded a region, only carrier need be moved up and down the region that nozzle can weld another correspondence.Once just can spray tin to multiple some positions of local at work simultaneously, enhance productivity, accuracy is high simultaneously.
Accompanying drawing explanation
Fig. 1 is the view that the present invention is installed on streamline spray Xi Kou.
Fig. 2 is topology view of the present invention.
Fig. 3 is viewing angle constructions schematic diagram above the present invention.
Fig. 4 is front of the present invention viewing angle constructions schematic diagram.
Fig. 5 is visual angle configuration diagram below the present invention.
Detailed description of the invention
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.In addition should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the present invention's instruction.
As shown in Fig. 1 to 5, a kind of selective wave-soldering nozzle, comprise nozzle body 1, described nozzle body 1 is the tubulose of rectangle in cross section, in described nozzle body 1 cross section and PCB, tin region to be painted matches, be provided with spout 3 in described nozzle body 1, described spout 3 has the pin position of tin to be painted in multiple and position and PCB to match.
Described nozzle body 1 bottom is connected and installed bayonet socket 2, described installation bayonet socket 2 and streamline sprays Xi Kou and matches.
Described nozzle body 1 is equipped with electric heater and thermocouple.
In actual production, spraying according to tin pcb board to be painted needs the maximum region design nozzle body 1 inhaled, in process of production, for not needing the position coating of spraying tin to keep away tin coating, then removing in follow-up cleaning process; And in spray tin process, disposablely can carry out multiple spot spray tin to the local location on pcb board, precision is high, speed is fast, effectively enhances productivity.
Claims (3)
1. a selective wave-soldering nozzle, comprise nozzle body (1), it is characterized in that, described nozzle body (1) is the tubulose of rectangle in cross section, in described nozzle body (1) cross section and PCB, tin region to be painted matches, be provided with spout (3) in described nozzle body (1), described spout (3) has the pin position of tin to be painted in multiple and position and PCB to match.
2. the selective wave-soldering nozzle of one according to claim 1, is characterized in that, described nozzle body (1) bottom is connected and installed bayonet socket (2), described installation bayonet socket (2) and streamline sprays Xi Kou and matches.
3. the selective wave-soldering nozzle of one according to claim 1, is characterized in that, (1) is equipped with electric heater and thermocouple to described nozzle body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410625413.9A CN104439603A (en) | 2014-11-07 | 2014-11-07 | Selective wave-soldering nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410625413.9A CN104439603A (en) | 2014-11-07 | 2014-11-07 | Selective wave-soldering nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104439603A true CN104439603A (en) | 2015-03-25 |
Family
ID=52886783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410625413.9A Pending CN104439603A (en) | 2014-11-07 | 2014-11-07 | Selective wave-soldering nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104439603A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135614A (en) * | 2017-05-25 | 2017-09-05 | 杭州晶志康电子科技有限公司 | Printed circuit board (PCB) paster processing technology |
| CN108031943A (en) * | 2017-11-20 | 2018-05-15 | 深圳市浩宝自动化设备有限公司 | One kind automation wave soldering device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340940A (en) * | 1999-05-27 | 2000-12-08 | Matsushita Electric Ind Co Ltd | Wave soldering device |
| CN1684789A (en) * | 2002-09-30 | 2005-10-19 | 斯皮德莱技术公司 | Selective gas knife for wave soldering |
| CN2877938Y (en) * | 2006-03-01 | 2007-03-14 | 广达电脑股份有限公司 | Wave soldering equipment |
| CN2882873Y (en) * | 2006-03-20 | 2007-03-28 | 佛山市顺德区顺达电脑厂有限公司 | Region adjustable wave welding nozzle structure |
| CN101600305A (en) * | 2009-06-29 | 2009-12-09 | 深圳创维－Rgb电子有限公司 | A kind of crest tin soldering machine and crest nozzle thereof, tin stove |
| CN102548241A (en) * | 2011-01-03 | 2012-07-04 | 西安中科麦特电子技术设备有限公司 | Selective wave soldering equipment of PCBs (printed circuit boards) |
| CN202517159U (en) * | 2011-11-16 | 2012-11-07 | 西安中科麦特电子技术设备有限公司 | Table selective wave soldering device |
-
2014
- 2014-11-07 CN CN201410625413.9A patent/CN104439603A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340940A (en) * | 1999-05-27 | 2000-12-08 | Matsushita Electric Ind Co Ltd | Wave soldering device |
| CN1684789A (en) * | 2002-09-30 | 2005-10-19 | 斯皮德莱技术公司 | Selective gas knife for wave soldering |
| CN2877938Y (en) * | 2006-03-01 | 2007-03-14 | 广达电脑股份有限公司 | Wave soldering equipment |
| CN2882873Y (en) * | 2006-03-20 | 2007-03-28 | 佛山市顺德区顺达电脑厂有限公司 | Region adjustable wave welding nozzle structure |
| CN101600305A (en) * | 2009-06-29 | 2009-12-09 | 深圳创维－Rgb电子有限公司 | A kind of crest tin soldering machine and crest nozzle thereof, tin stove |
| CN102548241A (en) * | 2011-01-03 | 2012-07-04 | 西安中科麦特电子技术设备有限公司 | Selective wave soldering equipment of PCBs (printed circuit boards) |
| CN202517159U (en) * | 2011-11-16 | 2012-11-07 | 西安中科麦特电子技术设备有限公司 | Table selective wave soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135614A (en) * | 2017-05-25 | 2017-09-05 | 杭州晶志康电子科技有限公司 | Printed circuit board (PCB) paster processing technology |
| CN108031943A (en) * | 2017-11-20 | 2018-05-15 | 深圳市浩宝自动化设备有限公司 | One kind automation wave soldering device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI XINGUANG AUTOELECTRIC CO., LTD. Free format text: FORMER OWNER: HT-SAAE AUTOMOTIVE ELECTRONIC TECHNICAL CENTER Effective date: 20150414 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 200125 PUDONG NEW AREA, SHANGHAI |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20150414 Address after: 200125 Shanghai city Pudong New Area six Industrial Zone North Ai Road No. 1111 Applicant after: Shanghai Xinguang Automotive Electric Appliance Co., Ltd. Address before: 201206 Shanghai city Pudong New Area Jinji Road No. 568 Applicant before: AUTOMOBILE ELECTROMECHANICAL BRANCH, SHANGHAI AEROSPACE AUTOMOBILE ELECTROMECHANICAL CO., LTD. |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
|
| RJ01 | Rejection of invention patent application after publication |