CN104439510B - Ultrasonic focusing device and method for removing sawtooth stuck chips - Google Patents
Ultrasonic focusing device and method for removing sawtooth stuck chips Download PDFInfo
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- CN104439510B CN104439510B CN201410712924.4A CN201410712924A CN104439510B CN 104439510 B CN104439510 B CN 104439510B CN 201410712924 A CN201410712924 A CN 201410712924A CN 104439510 B CN104439510 B CN 104439510B
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Abstract
The invention discloses an ultrasonic focusing device and method for removing sawtooth stuck chips. The ultrasonic focusing device comprises an ultrasonic oscillation power source, an ultrasonic emitting unit and a container. The ultrasonic emitting unit comprises a cylindrical support, sound absorption materials, a first electrode, a second electrode, piezoelectric materials, a matching layer, a power line and a board penetrating connector. The upper bottom face of the cylindrical support is of a concave face structure, the materials of the concave face structure are the piezoelectric materials, the first electrode is plated on the upper bottom face of the piezoelectric materials, the second electrode is plated on the lower bottom face of the piezoelectric materials, the cylindrical support is filled with the sound absorption materials, and the matching layer is arranged on the first electrode. The ultrasonic emitting unit is arranged in the container, the cylindrical support, the container and a working table of a band sawing machine are connected together through the board penetrating connector, and the container is provided with a knife inlet and a knife outlet which correspond to each other. The ultrasonic focusing device is good in machine tool compatibility, can be suitable for workpieces in various sizes and is low in manufacturing cost and obvious in effect.
Description
Technical field：
The present invention relates to the minimizing technology of bands for band sawtooth Integrated Chip and device, it is ultrasonic poly- that more particularly to a kind of sawtooth glues bits
Burnt removal device and method.
Technical background：
With scientific and technological development, ultrasonic technology is increasingly widely used in the fields such as medical war industry.
Band saw machine is directly connected to subsequent handling as the visual plant in machining manufacture, its machining accuracy
Efficiency and quality, but because the technical limitation of existing processing method is so that when band sawing machine works, always have part scrap attached
On band saw, so that stock-removing efficiency is greatly reduced, and accelerate band saw for metal abrasion, increase the sawing load of motor,
Also the roughness of workpiece machining surface can be increased simultaneously.
At present, the device with the viscous bits of saw, the such as patent No. are not removed based on focus ultrasonic sound principle in association area
CN2460061Y discloses a kind of multifocal rotary type ultraphonic focusing arrangement of high intensity ultrasound treatment tumor, and its main body is a ball
Hat, has the ladder circular hole of some radially settings in order on the spherical outside surface of spherical crown, is sequentially arranged with sealing in its big rank circular hole rank
Circle, ultrasonic radiator, screw, each piezoelectric ceramic ultrasonic irradiator perpendicular bisector and corresponding spherical crown centre of sphere line skew 0-6 °, form
Multiple focus points, this device forms multifocal on focusing surface, increases treatment area, mitigates patient scorching hot to health tissues
Sense, but this device is mainly used in medical therapy field, does not have practicality on band sawing machine is anti-dandruff.Patent No. CN201744425U
Disclose a kind of ultrasonic focusing liquid sprayer, this ultrasonic focusing liquid sprayer includes liquid container and located at liquid
The focused transducer of container outer surface, its liquid container is provided with some micro-spraying holes on the chamber wall around focal area, and
It is provided with feed pipe, the focal area of its focused transducer falls on described liquid container wall.This apparatus structure is simple, and focus ultrasonic is imitated
Really good, the spray effect distributing very evenly can be produced, but lack feedback element, therefore sawing machine cannot be suitable for.The present invention
For above deficiency, there is provided a kind of focus ultrasonic is applied to the anti-dandruff device of band sawing machine.
Content of the invention：
The present invention is directed to the technical barrier of Integrated Chip not easy-clear in existing band saw, provide a kind of based on focus ultrasonic
Sawtooth Integrated Chip removal device and method.
A kind of sawtooth glues bits focus ultrasonic removal device, including sonic oscillation power supply, ultrasound emission unit and container,
Described ultrasound emission unit include cylindrical stent, sound-absorbing material, first electrode, second electrode, piezoelectric,
Matching layer, power line and BULKHEAD UNION；
Described cylindrical stent upper bottom surface is concave structure, and the material of concave structure is piezoelectric, piezoelectric
Upper bottom surface is coated with first electrode, and bottom surface is coated with second electrode, the internal filling sucting sound material of cylindrical stent, and first electrode sets
Put matching layer；
Described ultrasound emission unit is arranged in container, and cylindrical stent, container and band sawing machine are worked by BULKHEAD UNION
Platform three link together；
Described container has two corresponding entering the edge of a knife and go out the edge of a knife；
Described sonic oscillation power supply is connected with first electrode and second electrode by power line.
Described matching layer is acoustic lens, and the curvature of matching layer and cylindrical stent upper bottom surface are the curvature one of concave structure
Cause.
Described piezoelectric is piezoelectric ceramics.
A kind of sawtooth glues the anti-dandruff method of bits focus ultrasonic removal device, specifically includes following steps：
Step（1）Ultrasonic electromagnetic pulse is produced based on feedback；
According to liquid level sensor feedback information and working condition, select sonic oscillation power supply, according to actual original state, if
Put the initial output parameter of ultrasonic focusing system, after sawing machine is started working, the output parameter of sonic oscillation power supply is subject to liquid level anti-
Feedforward information and the regulation of industrial computer；
Step（2）Mechanical vibration are converted to by electromagnetic pulse；
The ultrasonic signal of telecommunication producing is added in formation path on electrode by sonic oscillation power supply, and electric current flows through piezoelectric, produces
Raw high frequency sound signal, i.e. so-called ultrasonic signal, thus realize converting electrical energy into mechanical energy；
Step（3）Realize focusing ultrasonic wave；
Ultrasonic electromagnetic pulse changes into mechanical vibration by the signal of telecommunication after transducer, using the focusing of matching layer concave structure
Effect, is focused to the ultrasound wave of ultrasonic transducer output；
Step（4）Focus ultrasonic is realized anti-dandruff；
In workpiece sawing process, the signal of telecommunication that sonic oscillation power supply produces focuses on bands for band by focus ultrasonic device
Sawtooth glues on bits, by the broken Integrated Chip that shakes thus realizing anti-dandruff；During band sawing machine feeding, under in reaction vessel, liquid level is continuous
Fall, liquid level sensor is fed back to real-time level information in industrial computer, is processed by internal processes, changes energy transducer focus position
Put so that band saw is near focal point all the time, reach preferably anti-dandruff effect.
It is an advantage of the invention that：Good to the compatibility of lathe, adapt to the workpiece of all size, and cost of manufacture is relatively low,
Effect is obvious.Sonic oscillation power output signal parameter can follow the tracks of change it is ensured that vernier focusing with actual condition change.Pass through
Specific reaction vessel, by focus ultrasonic in band saw saw blade portion, bombards principle based on ultrasonic energy, realizes removing sawtooth Integrated Chip
Method, can improve stock-removing efficiency, extend band saw for metal service life, reduce the sawing load of motor, also make work simultaneously
The roughness of part finished surface is greatly improved.
Brief description：
Fig. 1 is the structural representation of the specific embodiment of the invention；
Fig. 2 is focus ultrasonic concrete structure schematic diagram involved in the present invention；
Fig. 3 is the band saw machine workflow of workpiece additional ultrasound focusing arrangement.
Specific embodiment：
With specific embodiment, the present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1 and Figure 2, a kind of sawtooth glues bits focus ultrasonic removal device, including sonic oscillation power supply, ultrasound emission
Unit 12 and container 8,
Described ultrasound emission unit includes cylindrical stent, sound-absorbing material 1, first electrode 2, second electrode 3, piezoresistive material
Material 4, matching layer 5, power line 6 and BULKHEAD UNION 7；
Described cylindrical stent upper bottom surface is concave structure, and the material of concave structure is piezoelectric 4, piezoelectric
Upper bottom surface is coated with first electrode 2, and bottom surface is coated with second electrode 3, the internal filling sucting sound material 1 of cylindrical stent, first electrode
Upper setting matching layer 5；
Described ultrasound emission unit is arranged in container 8, and BULKHEAD UNION 7 is by cylindrical stent, container 8 and band sawing machine work
Station three link together；
Described container 8 has two corresponding entering the edge of a knife 9 and go out the edge of a knife 10；
Described sonic oscillation power supply is connected with first electrode 2 and second electrode 3 by power line 6；
Described matching layer is acoustic lens, and the curvature of matching layer and cylindrical stent upper bottom surface are the curvature one of concave structure
Cause；
A kind of sawtooth glues bits focus ultrasonic minimizing technology, specifically includes following steps：
Step（1）Ultrasonic electromagnetic pulse is produced based on feedback；
According to liquid level sensor feedback information and working condition, select sonic oscillation power supply, according to actual original state, if
Put the initial output parameter of ultrasonic focusing system, after sawing machine is started working, the output parameter of sonic oscillation power supply is subject to liquid level anti-
Feedforward information and the regulation of industrial computer；
Step（2）Mechanical vibration are converted to by electromagnetic pulse；
The ultrasonic signal of telecommunication producing is added in formation path on electrode by sonic oscillation power supply, and electric current flows through piezoelectric ceramics, produces
Raw high frequency sound signal 11, i.e. so-called ultrasonic signal, thus realize converting electrical energy into mechanical energy；
Step（3）Realize focusing ultrasonic wave；
Ultrasonic electromagnetic pulse changes into mechanical vibration by the signal of telecommunication after transducer, and the effect due to now vibrating cannot expire
Sufficient actual requirement is it is therefore desirable to focus on vibrational energy；The design of matching layer concave structure mainly utilizes its focusing effect, to super
The ultrasound wave of sonic transducer output is focused, and makes the vibration of output reach the anti-dandruff requirement of sawtooth；
Step（4）Focus ultrasonic is realized anti-dandruff；
In workpiece sawing process, the signal of telecommunication that sonic oscillation power supply produces focuses on bands for band by focus ultrasonic device
Sawtooth glues on bits, by the broken Integrated Chip that shakes thus realizing anti-dandruff；During band sawing machine feeding, under in reaction vessel, liquid level is continuous
Fall, liquid level sensor is fed back to real-time level information in industrial computer, is processed by internal processes, changes energy transducer focus position
Put so that band saw is near focal point all the time, reach preferably anti-dandruff effect.
Build ultrasonic focusing system in the technology being instantly comparative maturity.
A kind of sawtooth Integrated Chip removal device based on focus ultrasonic, including ultrasonic-frequency power supply, ultrasound emission unit and band sawing machine
Body.Heretofore described ultrasound emission unit, has focusing surface, and focusing surface is spherical structure so that described ultrasonic generator
The ultrasound wave of transmitting forms focus ultrasonic region on the axis of focusing surface, and this focus ultrasonic region is along ultrasonic acoustic axis direction
Extend and focus on the viscous bits before band sawing machine sawtooth 15.
Embodiment：
As shown in figures 1 and 3, container 8 both sides containing focus ultrasonic device 12 are left into the edge of a knife 9 and are gone out the edge of a knife 10, knife
To be advisable slightly larger than bands for band thickness, container content has water to mouth width, and whole device is fixed on saw bench face, sawing machine 14
During feeding, by water pump constantly from water tank to water filling in container, to ensure band saw 15 part all the time and the water surface
Contact, the water overflowing from the edge of a knife flows into water tank by retracting device, so that water energy enough recycles, is contained in the liquid level of outside of containers
Sensor 13 is by real-time detection water surface elevation, and result is fed back in industrial computer, is processed by internal processes, adjusts ultrasonic electric
Source forcing signal parameter attribute, thus changing energy transducer focus position so that band saw is near focal point all the time, reaches relatively
Good anti-dandruff effect.
Claims (4)
1. a kind of sawtooth glues bits focus ultrasonic removal device, including sonic oscillation power supply, ultrasound emission unit and container,
It is characterized in that：Described ultrasound emission unit includes cylindrical stent, sound-absorbing material, first electrode, second electrode, pressure
Electric material, matching layer, power line and BULKHEAD UNION；
Described cylindrical stent upper bottom surface is concave structure, and the material of concave structure is piezoelectric, the upper bottom of piezoelectric
Face is coated with first electrode, and bottom surface is coated with second electrode, the internal filling sucting sound material of cylindrical stent, setting in first electrode
Join layer；
Described ultrasound emission unit is arranged in container, and BULKHEAD UNION is by cylindrical stent, container and band sawing machine workbench three
Person links together；
Described container has two corresponding entering the edge of a knife and go out the edge of a knife；
Described sonic oscillation power supply is connected with first electrode and second electrode by power line.
2. a kind of sawtooth according to claim 1 glue bits focus ultrasonic removal device it is characterised in that：Described matching layer
For acoustic lens, the curvature that the curvature of matching layer is concave structure with cylindrical stent upper bottom surface is consistent.
3. a kind of sawtooth according to claim 1 glue bits focus ultrasonic removal device it is characterised in that：Piezoelectric is pressure
Electroceramics.
4. a kind of sawtooth according to claim 1 glue bits focus ultrasonic removal device anti-dandruff method it is characterised in that：Tool
Body comprises the following steps：
Step (1) is based on feedback and produces ultrasonic electromagnetic pulse；
According to liquid level sensor feedback information and working condition, select sonic oscillation power supply, according to actual original state, setting is super
The initial output parameter of sound focusing system, after sawing machine is started working, the output parameter of sonic oscillation power supply is subject to liquid level feedback letter
Breath and the regulation of industrial computer；
Step (2) is converted to mechanical vibration by electromagnetic pulse；
The ultrasonic signal of telecommunication producing is added in formation path on electrode by sonic oscillation power supply, and electric current flows through piezoelectric, produces high
Frequency acoustical signal, i.e. so-called ultrasonic signal, thus realize converting electrical energy into mechanical energy；
Step (3) realizes focusing ultrasonic wave；
Ultrasonic electromagnetic pulse changes into mechanical vibration by the signal of telecommunication after transducer, using the focusing effect of matching layer concave structure
Really, the ultrasound wave of ultrasonic transducer output is focused；
Step (4) focus ultrasonic is realized anti-dandruff；
In workpiece sawing process, the signal of telecommunication that sonic oscillation power supply produces focuses on bands for band sawtooth by focus ultrasonic device
On viscous bits, by the broken Integrated Chip that shakes thus realizing anti-dandruff；During band sawing machine feeding, in container, liquid level constantly declines, and liquid level passes
Sensor feeds back to real-time level information in industrial computer, is processed by internal processes, changes energy transducer focus position so that band is sawed
Sawtooth is near focal point all the time, reaches preferably anti-dandruff effect.
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| CN201410712924.4A CN104439510B (en) | 2014-11-28 | 2014-11-28 | Ultrasonic focusing device and method for removing sawtooth stuck chips |
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| CN201410712924.4A CN104439510B (en) | 2014-11-28 | 2014-11-28 | Ultrasonic focusing device and method for removing sawtooth stuck chips |
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| CN104439510B true CN104439510B (en) | 2017-02-22 |
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| CN105425493B (en) | 2016-01-11 | 2018-10-23 | 京东方科技集团股份有限公司 | A kind of array substrate and preparation method thereof, display panel |
| CN111854282A (en) * | 2020-07-20 | 2020-10-30 | 珠海格力电器股份有限公司 | Freezing and thawing refrigerator and freezing and thawing method |
| CN112025006B (en) * | 2020-09-02 | 2022-01-04 | 湖南泰嘉新材料科技股份有限公司 | Band saw blade surface treatment device |
| CN111958047A (en) * | 2020-09-02 | 2020-11-20 | 湖南泰嘉新材料科技股份有限公司 | Band saw blade accumulated chip removing device and removing method |
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| JP2946554B2 (en) * | 1989-09-20 | 1999-09-06 | 日本電気株式会社 | Grinding cutting method |
| CN2682531Y (en) * | 2004-02-12 | 2005-03-02 | 北京航空航天大学 | Acoustic focusing transducer |
| KR100803242B1 (en) * | 2004-03-01 | 2008-02-14 | 가부시키가이샤 아마다 | Chip removing device of band saw machine |
| CN101879493A (en) * | 2010-07-02 | 2010-11-10 | 苏州英诺迅科技有限公司 | Ultrasonic focusing liquid sprayer |
| US20130206163A1 (en) * | 2011-08-18 | 2013-08-15 | Memc Electronic Materials, Spa | Methods and Systems For Removing Contaminants From A Wire Of A Saw |
| CN102601687A (en) * | 2012-03-06 | 2012-07-25 | 中国科学院长春光学精密机械与物理研究所 | Phased-array ultrasound focused fluid vibration polishing device |
| CN203380150U (en) * | 2013-07-01 | 2014-01-08 | 杭州朗格锯链有限公司 | Foreign matter removing device for saw chain |
| CN103962642B (en) * | 2014-04-23 | 2016-11-23 | 杭州电子科技大学 | A kind of band saw for metal ultrasonic Cutting indexes method |
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