CN104426706A - Load simulation system - Google Patents
Load simulation system Download PDFInfo
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- CN104426706A CN104426706A CN201310360379.2A CN201310360379A CN104426706A CN 104426706 A CN104426706 A CN 104426706A CN 201310360379 A CN201310360379 A CN 201310360379A CN 104426706 A CN104426706 A CN 104426706A
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- module
- power
- simulation system
- load simulation
- power consumption
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Abstract
A load simulation system is used for simulating a plurality of loads of a server. The load simulation system comprises a power supply module and a switching module connected with the power supply module. The load simulation system also comprises a power consumption generation module and a temperature control module. The power consumption generation module comprises a plurality of power consumption units, wherein the plurality of power consumption units are electrically connected with the switching module to enable the power supply module to provide power for the plurality of power consumption units. The power consumption generation module has different power values when selecting different power consumption units, and the power values are equivalent to the power of one of the plurality of loads. The temperature control module is electrically connected with the switching module and is for monitoring the temperature of the power consumption generation module.
Description
Technical field
The present invention relates to a kind of load simulation system, the analogue system of a particularly server load.
Background technology
Along with the development of science and technology, type of server gets more and more, and different server has different loads, thus causes different server to have different power consumptions.To in server radiating design process, need the checking carried out repeatedly and amendment, supply to study if directly buy different server mainboard, will design cost be increased.
Summary of the invention
In view of above content, be necessary to provide a cost low, the simple load simulation system of structure.
A kind of load simulation system, in order to some loads of emulating server, the switching module including power supply module and be connected with described power supply module, described load simulation system also includes power consumption and produces module and temperature control module, described power consumption produces module and includes some power-consuming elements, described some power-consuming elements are electrically connected with described switching module respectively, power to described some power-consuming elements to make described power supply module, described power consumption produces module has different size performance number when selecting different power consumption unit, and the power of one of described performance number and described some loads is suitable, described temperature controls module and is electrically connected described switching module, and the temperature value of module is produced in order to monitor described power consumption.
In one execution mode; described temperature controls module and includes sensing cell and temperature control chip; described temperature controls module and includes power control unit; described sensing cell produces the temperature value of module in order to sense described power consumption; described temperature control chip is electrically connected described power control unit; in order to judge whether described temperature value is greater than a preset temperature value; and send a control signal to described power control unit when described temperature value is greater than described preset temperature value; described power control unit disconnects described power supply module, produces module to protect described power.
In one execution mode, described temperature control chip includes record cell, and described load simulation system also includes display module, the temperature value that described recording unit records sensing cell senses, and by described display module displays.
In one execution mode, described temperature control chip passes through I
2c bus connects described sensing cell.
In one execution mode, described power consumption produces module and also includes some switches, each switch connects each power-consuming elements and described switching module, power to described some power-consuming elements to make described power supply module, described power produces module and selects different power-consuming elements when some switches of closed varying number, thus have the performance number of different size, and the power of one of described performance number and described some server loads is suitable.
In one execution mode, each power-consuming elements includes one first resistance and some second resistance, described first resistance and described some second resistor coupled in parallel.
In one execution mode, described some second resistor coupled in parallel.
In one execution mode, described first resistance and described some resistance are aluminum casing resistors.
In one execution mode, described some switches and described some power-consuming elements are arranged on an aluminium sheet.
Compared to prior art, in above-mentioned load simulation system, the power making described power consumption produce module by selecting different power consumption unit equals unequally loaded power, and control by described temperature the temperature value that module reads power consumption generation module, the heating situation of corresponding load is studied for designer, and without the need to directly buying server, thus it is cost-saving, in addition, only need different power-consuming elements to replace the load of different capacity, structure is simple.
Accompanying drawing explanation
One calcspar of load simulation system one of the present invention preferred embodiment during Fig. 1.
During Fig. 2, in Fig. 1, power consumption produces a circuit diagram of module.
Fig. 3 is a flow chart of temperature monitoring method in load simulation system of the present invention.
Main element symbol description
| Power supply module | 100 |
| Switching module | 200 |
| Power control unit | 210 |
| Power consumption produces module | 400 |
| Switch | 410 |
| Power-consuming elements | 420 |
| Temperature controls module | 500 |
| Sensing cell | 510 |
| Temperature control chip | 520 |
| Record cell | 521 |
| Setting unit | 522 |
| Judging unit | 523 |
| Aluminium sheet | 600 |
| Display module | 800 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, in a better embodiment of the present invention, one load simulation system, in order to simulate some server loads, and includes power supply module 100, switching module 200, power consumption generation module 400, temperature control module 500 and a display module 800.Described power supply module 100 is powered in order to produce module 400 to described power consumption, and connects described power consumption generation module 400 by described switching module 200.Described temperature controls module 500 produces module 400 temperature value in order to sense described power consumption, and records temperature value.Described display module 800 is in order to show described temperature value.
Described switching module 200 includes a power control unit 210.Described power control unit 210 produces module 400 in order to disconnect or to connect described power supply module 100 with described power consumption.
Please together with reference to Fig. 2, described power consumption produces module 400 and is arranged on an aluminium sheet 600, and includes some switches 410 and some power-consuming elements 420.Described some switches 410 are in parallel, and connect described some power-consuming elements 420 respectively.In the present embodiment, described some switches 410 are five, and described some power-consuming elements 420 are five, can in order to simulate the server of five kinds of different capacities.
Described some power-consuming elements 420 are in parallel, and one end of each power-consuming elements 420 connects corresponding switch 410, other end ground connection.Each power-consuming elements 420 also includes one first resistance R16 and 3 second resistance R1 ~ R3.Described 3 second resistance R1 ~ R3 are in parallel, and in parallel with described first resistance R16.In the present embodiment, the resistance of described 3 second resistance R1 ~ R3 is 5 ohm, and the resistance of described first resistance R16 is 10 ohm, and the power of each power-consuming elements 420 is roughly 100W, and described 3 second resistance R1 ~ R3 and described first resistance R16 are aluminum casing resistor.
Described temperature controls module 500 and is arranged on described aluminium sheet 600, and includes sensing cell 510 and a temperature control chip 520.Described temperature controls module 500 and is also circumscribed with an operating voltage (not shown).In one embodiment, described sensing cell 510 is a temperature-sensitive sticker.Described temperature control chip 520 passes through I
2c bus connects described sensing cell 510, and connects described switching module 200.Described temperature control chip 520 includes record cell 521, setting unit 522 and a judging unit 523.Described sensing cell 510 produces the temperature value of module 400 in order to detect described power consumption.The temperature value that described record cell 521 senses in real time for recording described sensing cell 510, and it is outputted to described display module 800 by described setting unit 522.Described judging unit 523 is in order to judge whether described temperature value is greater than a predetermined maximum temperature value, when described temperature value is greater than described predetermined maximum temperature value, described judging unit 523 sends one and controls signal to described power control unit 210, described power control unit 210 disconnects described power supply module 100 and produces module 400 with described power consumption, produces module 400 to protect described power consumption; When described temperature value is less than or equal to predetermined minimum temperature value, described power control unit 210 connects described power supply module 100 and produces module 400 with described power consumption, continues to produce module 400 to described power consumption power to make described power supply module 100.Described setting unit 522 is in order to arrange described preset temperature value.
When need in order to analyze the heating situation of the load of 100W time, described power consumption produces any one switch 410 in module 400 and closes, three switches 410 in addition disconnect, thus the power-consuming elements 420 of correspondence works and generates heat, described temperature control chip 520 records temperature value, for having the heat abstractor of the server of 100W load for design.
When need in order to analyze the heating situation of the load of 200W time, described power consumption produces any two switches 410 in module 400 and closes, two switches 410 in addition disconnect, thus the power-consuming elements 420 of correspondence is started working and generates heat, described temperature control chip 520 real time record temperature value, for having the heat abstractor of the server of the load of 200W for design.In addition, described load simulation system also can work and generate heat under the state of 300W, 400W, 500W, thus analyzes 300W, 400W, the server heating situation of 500W load.
Refer to Fig. 3, when after the load choosing Water demand, the temperature-controlled process in this load simulation system comprises the following steps:
S701: read the temperature value T1 that described power consumption produces module 400.
S702: judge whether described temperature value T1 is greater than predetermined maximum temperature value, when described temperature value T1 is greater than described predetermined maximum temperature value, then enters step S703; When described temperature value T1 is less than described predetermined maximum temperature value, then enter step S701.
S703: send power down control signal to described power control unit 210, described power control unit 210 disconnects described power supply module 100.
S704: read temperature value T2 when power consumption generation module quits work.
S705: judge whether described temperature value T2 is less than a predetermined minimum temperature value, when described temperature value T2 is less than described minimum temperature value, then enter step S705; When described temperature value T2 is more than or equal to described minimum temperature value, then enter step S704.
S706: sending powers on controls signal to described power control unit 210, and described power control unit 210 connects described power supply module 100, produces module 400 to give described power consumption and powers.
By above-mentioned load simulation system, can in order to simulate different loads, thus when this load simulation system works, record heating temp value, the heat abstractor of corresponding server is designed for designer, and without the need to directly carrying out on the server studying and designing, cost-saving.
Claims (9)
1. a load simulation system, in order to some loads of emulating server, the switching module including power supply module and be connected with described power supply module, it is characterized in that: described load simulation system also includes power consumption and produces module and temperature control module, described power consumption produces module and includes some power-consuming elements, described some power-consuming elements are electrically connected with described switching module respectively, power to described some power-consuming elements to make described power supply module, described power consumption produces module has different size performance number when selecting different power consumption unit, and the power of one of described performance number and described some loads is suitable, described temperature controls module and is electrically connected described switching module, and the temperature value of module is produced in order to monitor described power consumption.
2. load simulation system as claimed in claim 1, it is characterized in that: described temperature controls module and includes sensing cell and temperature control chip, described temperature controls module and includes power control unit, described sensing cell produces the temperature value of module in order to sense described power consumption, described temperature control chip is electrically connected described power control unit, in order to judge whether described temperature value is greater than a preset temperature value, and send a control signal to described power control unit when described temperature value is greater than described preset temperature value, described power control unit disconnects described power supply module, module is produced to protect described power.
3. load simulation system as claimed in claim 2, it is characterized in that: described temperature control chip includes record cell, described load simulation system also includes display module, the temperature value that described recording unit records sensing cell senses, and by described display module displays.
4. load simulation system as claimed in claim 2, is characterized in that: described temperature control chip passes through I
2c bus connects described sensing cell.
5. load simulation system as claimed in claim 1, it is characterized in that: described power consumption produces module and also includes some switches, each switch connects each power-consuming elements and described switching module, power to described some power-consuming elements to make described power supply module, described power produces module and selects different power-consuming elements when some switches of closed varying number, thus have the performance number of different size, and the power of one of described performance number and described some server loads is suitable.
6. load simulation system as claimed in claim 5, is characterized in that: each power-consuming elements includes one first resistance and some second resistance, described first resistance and described some second resistor coupled in parallel.
7. load simulation system as claimed in claim 6, is characterized in that: described some second resistor coupled in parallel.
8. load simulation system as claimed in claim 6, is characterized in that: described first resistance and described some resistance are aluminum casing resistors.
9. load simulation system as claimed in claim 1, is characterized in that: described some switches and described some power-consuming elements are arranged on an aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310360379.2A CN104426706A (en) | 2013-08-19 | 2013-08-19 | Load simulation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310360379.2A CN104426706A (en) | 2013-08-19 | 2013-08-19 | Load simulation system |
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| Publication Number | Publication Date |
|---|---|
| CN104426706A true CN104426706A (en) | 2015-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310360379.2A Pending CN104426706A (en) | 2013-08-19 | 2013-08-19 | Load simulation system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108427048A (en) * | 2018-03-07 | 2018-08-21 | 中国商用飞机有限责任公司北京民用飞机技术研究中心 | A kind of load simulating device |
| US20240004440A1 (en) * | 2022-07-01 | 2024-01-04 | Lenovo Enterprise Solutions (Singapore) Pte Ltd. | Relative thermal efficiency values for controlling operation of adapter modules |
-
2013
- 2013-08-19 CN CN201310360379.2A patent/CN104426706A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108427048A (en) * | 2018-03-07 | 2018-08-21 | 中国商用飞机有限责任公司北京民用飞机技术研究中心 | A kind of load simulating device |
| US20240004440A1 (en) * | 2022-07-01 | 2024-01-04 | Lenovo Enterprise Solutions (Singapore) Pte Ltd. | Relative thermal efficiency values for controlling operation of adapter modules |
| US12013733B2 (en) * | 2022-07-01 | 2024-06-18 | Lenovo Enterprise Solutions (Singapore) Pte Ltd. | Relative thermal efficiency values for controlling operation of adapter modules |
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Application publication date: 20150318 |