CN104406984A - Consistency image detection method of server mainboard material - Google Patents
Consistency image detection method of server mainboard material Download PDFInfo
- Publication number
- CN104406984A CN104406984A CN201410775339.9A CN201410775339A CN104406984A CN 104406984 A CN104406984 A CN 104406984A CN 201410775339 A CN201410775339 A CN 201410775339A CN 104406984 A CN104406984 A CN 104406984A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- pixel
- master board
- server master
- datum plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention in particular relates to a consistency image detection method of a server mainboard material. The consistency image detection method of the server mainboard material comprises the following steps: collecting image pixel information of a reference board and a to-be-detected mainboard to respectively obtain R/G/B chromatic values of the pixels and classifying the pixels, generating an electronic identification standard data file and an electronic identification to-be-compared data file, then comparing line by line, reflecting and marking difference points on imaging picture of the to-be-detected mainboard. By virtue of the consistency image detection method of the server mainboard material, the server mainboard material is intelligently detected in batches; errors caused by manual observation can be avoided; the labor is saved; the time is also reduced; the reliable and safe design of detection of the server mainboard material is implemented; the consistency image detection method of the server mainboard material is of a great significance to the quality reliability of the server mainboard.
Description
Technical field
The present invention relates to computer communication technology field, particularly a kind of server master board material consistance image detecting method.
Background technology
On current server master board, the use kind of material and quantity get more and more, and the material encapsulation of the mainboard of server is also tending towards diminishing, and the chip that mainboard is put in unit area and the quantity of resistor-capacitor unit also get more and more.On server master board material, part situation detects through strict, and on the material preventing the neglected loading of device or the abnormal operation of other staff from bringing, part is imperfect.The disappearance of the single material on mainboard may affect the stability of server system, and system even may be caused normally to work.In order to ensure current server master board material consistance, configure specification demands when the detection demand fulfillment of server system dispatches from the factory, especially enter factory when detecting, the consistency detection of material plays vital effect for the normal work of server system.
Current, to the material consistency detection of server master board, become the key factor affecting quality of server safety gradually.Current usual way is the visual inspection relying on testing staff, realizes the inspection to critical component deletion condition.Because which exists artificial active element, rely on the observation level of testing staff to a great extent, accuracy rate cannot be guaranteed, and cannot realize real quality control.This single dependence manual observation realizes the mode that mainboard material deletion condition detects, and cannot realize the quality safety demand of server system, and human cost expends higher simultaneously.Along with requiring server system quality safety constantly to increase, in order to the stable operation of Deterministic service device system, in the detection operating process of actual mainboard, how to realize the material consistency detection of server master board efficient, Reliable Design is particularly important, and become and determine one of stable key element of quality of server.
Conventional Chip-R package dimension and its power relation are: 0201,1/20W; 0402,1/16W; 0603,1/10W.Capacitance resistance package dimension and physical dimension corresponding relation are: 0201=0.6mm × 0.3mm; 0402=1.0mm × 0.5mm; 0603=1.6mm × 0.8mm.
For the problems referred to above run in current server mainboard material testing process, the critical electrical factors such as combining image identification, image procossing, by analysing in depth, we summarize a kind of server master board material consistance image detecting method.
Summary of the invention
The present invention, in order to make up the defect of prior art, provides a kind of agile and all-purpose server master board material consistance image detecting method.
The present invention is achieved through the following technical solutions:
A kind of server master board material consistance image detecting method, is characterized in that comprising the following steps:
(1) server master board that on each material, part is all correct is chosen as datum plate;
(2) determine the detection resolution scale for mainboard material, namely according to the components and parts distribution density of mainboard and the package size of material, determine the accuracy of detection needed;
(3) under datum plate being placed in the environment of certain intensity of illumination, video camera is adopted to obtain the high definition picture of datum plate, and detecting resolution scale according to determined mainboard material, bust shot is carried out in the region larger to device distribution density, ensures to obtain pictorial information quality accurately;
(4) determine each pixel R/G/B chromatic value according to the datum plate picture pixels information obtained, and with each pixel R/G/B chromatic value for sorting out according to by pixel, the occupied area forming each material identifies, generates the electronic recognition standard data file of part situation on material;
(5) mainboard to be detected is placed in step (3) under equal intensity of illumination environment, step (3) same method is adopted to obtain mainboard pictorial information to be detected, obtain each pixel R/G/B chromatic value, and according to the method for step (4), pixel is sorted out, the occupied area forming each material identifies, generates the electronic recognition data file to be compared of part situation on material;
(6) according to the coordinate of mainboard, data file to be compared for electronic recognition and electronic recognition standard data file are carried out scanning comparison line by line, discrepancy is fed back and is indicated on mainboard imaging picture to be detected, thus obtain upper situation of server master board material.
In described step (1), choosing of datum plate needs through strict visual inspection, global function test, the crucial power supply signal of mainboard and the measurement of clock signal, and guarantee the accuracy of the material of mainboard, all test is by rear, elects datum plate as.
In described step (2), mainboard determines grade respectively according to minimum package dimension, if the minimum package dimension of material is 0603, then the pixel image collection of employing 1024 × 768 is needed event data on mainboard; If minimum package dimension is 0402, then the pixel image collection of employing 1280 × 800 is needed event data on mainboard; If minimum package dimension is 0201, then the pixel image collection of employing 2560 × 1920 is needed event data on mainboard.
In described step (3), concrete intensity of illumination is 500LX; When device number is greater than 20 in per square centimeter, then need to confirm comparison separately to this region, ensure to obtain pictorial information quality and overall precision.
In described step (4), according to the corresponding numerical value of the R/G/B of each collection pixel, according to the mode of fuzzy diagnosis, the all pixels of corresponding numerical bias within 20 by R/G/B are categorized in a set, form the region that material takies, in this way by the generating virtual identified region in this way of all devices on mainboard.
The invention has the beneficial effects as follows: this server master board material consistance image detecting method, achieve intellectuality and the mass of server master board material detection, avoid the error relying on manual observation to cause, both saved manpower, and saved the time; Meanwhile, achieve reliability, safety Design that server master board material detects, the reliability for server master board is significant.
Embodiment
This server master board material consistance image detecting method, comprises the following steps:
(1) server master board that on each material, part is all correct is chosen as datum plate.Choosing of datum plate needs through strict visual inspection, global function test, the crucial power supply signal of mainboard and the measurement of clock signal, and guarantee the accuracy of the material of mainboard, all test is by rear, elects datum plate as.
(2) determine the detection resolution scale for mainboard material, namely according to the components and parts distribution density of mainboard and the package size of material, determine the accuracy of detection needed.
Concrete grammar is: mainboard determines grade respectively according to minimum package dimension, if the minimum package dimension of material is 0603, then the pixel image collection of employing 1024 × 768 is needed event data on mainboard; If minimum package dimension is 0402, then the pixel image collection of employing 1280 × 800 is needed event data on mainboard; If minimum package dimension is 0201, then the pixel image collection of employing 2560 × 1920 is needed event data on mainboard.
(3) datum plate being placed in intensity of illumination is under the environment of 500LX, video camera is adopted to obtain the high definition picture of datum plate, and detecting resolution scale according to determined mainboard material, bust shot is carried out in the region larger to device distribution density, ensures to obtain pictorial information quality accurately.When device number is greater than 20 in per square centimeter, then need to confirm comparison separately to this region, ensure to obtain pictorial information quality and overall precision.
(4) each pixel R/G/B chromatic value is determined according to the datum plate picture pixels information obtained, and with each pixel R/G/B chromatic value for pixel is sorted out by foundation.According to the corresponding numerical value of the R/G/B of each collection pixel, according to the mode of fuzzy diagnosis, all pixels of corresponding numerical bias within 20 by R/G/B are categorized in a set, and the occupied area forming each material identifies.In this way by the generating virtual identified region in this way of all devices on mainboard, generate the electronic recognition standard data file of part situation on material.
(5) mainboard to be detected is placed in step (3) under equal intensity of illumination environment, step (3) same method is adopted to obtain mainboard pictorial information to be detected, obtain each pixel R/G/B chromatic value, and according to the method for step (4), pixel is sorted out, the occupied area forming each material identifies, generates the electronic recognition data file to be compared of part situation on material.
(6) according to the coordinate of mainboard, data file to be compared for electronic recognition and electronic recognition standard data file are carried out scanning comparison line by line, discrepancy is fed back and is indicated on mainboard imaging picture to be detected, thus obtain upper situation of server master board material.
Claims (5)
1. a server master board material consistance image detecting method, is characterized in that comprising the following steps:
(1) server master board that on each material, part is all correct is chosen as datum plate;
(2) determine the detection resolution scale for mainboard material, namely according to the components and parts distribution density of mainboard and the package size of material, determine the accuracy of detection needed;
(3) under datum plate being placed in the environment of certain intensity of illumination, video camera is adopted to obtain the high definition picture of datum plate, and detecting resolution scale according to determined mainboard material, bust shot is carried out in the region larger to device distribution density, ensures to obtain pictorial information quality accurately;
(4) determine each pixel R/G/B chromatic value according to the datum plate picture pixels information obtained, and with each pixel R/G/B chromatic value for sorting out according to by pixel, the occupied area forming each material identifies, generates the electronic recognition standard data file of part situation on material;
(5) mainboard to be detected is placed in step (3) under equal intensity of illumination environment, step (3) same method is adopted to obtain mainboard pictorial information to be detected, obtain each pixel R/G/B chromatic value, and according to the method for step (4), pixel is sorted out, the occupied area forming each material identifies, generates the electronic recognition data file to be compared of part situation on material;
(6) according to the coordinate of mainboard, data file to be compared for electronic recognition and electronic recognition standard data file are carried out scanning comparison line by line, discrepancy is fed back and is indicated on mainboard imaging picture to be detected, thus obtain upper situation of server master board material.
2. server master board material consistance image detecting method according to claim 1, it is characterized in that: in described step (1), choosing of datum plate needs through strict visual inspection, global function test, the crucial power supply signal of mainboard and the measurement of clock signal, guarantee the accuracy of the material of mainboard, whole test, by rear, elects datum plate as.
3. server master board material consistance image detecting method according to claim 1, it is characterized in that: in described step (2), mainboard determines grade respectively according to minimum package dimension, if the minimum package dimension of material is 0603, then the pixel image collection of employing 1024 × 768 is needed event data on mainboard; If minimum package dimension is 0402, then the pixel image collection of employing 1280 × 800 is needed event data on mainboard; If minimum package dimension is 0201, then the pixel image collection of employing 2560 × 1920 is needed event data on mainboard.
4. server master board material consistance image detecting method according to claim 1, it is characterized in that: in described step (3), concrete intensity of illumination is 500LX; When device number is greater than 20 in per square centimeter, then need to confirm comparison separately to this region, ensure to obtain pictorial information quality and overall precision.
5. server master board material consistance image detecting method according to claim 1, it is characterized in that: in described step (4), according to the corresponding numerical value of the R/G/B of each collection pixel, according to the mode of fuzzy diagnosis, the all pixels of corresponding numerical bias within 20 by R/G/B are categorized in a set, form the region that material takies, in this way by the generating virtual identified region in this way of all devices on mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775339.9A CN104406984A (en) | 2014-12-16 | 2014-12-16 | Consistency image detection method of server mainboard material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410775339.9A CN104406984A (en) | 2014-12-16 | 2014-12-16 | Consistency image detection method of server mainboard material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104406984A true CN104406984A (en) | 2015-03-11 |
Family
ID=52644631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410775339.9A Pending CN104406984A (en) | 2014-12-16 | 2014-12-16 | Consistency image detection method of server mainboard material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104406984A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114782437A (en) * | 2022-06-20 | 2022-07-22 | 西南石油大学 | Computer mainboard quality detection method and system based on artificial intelligence |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175774A (en) * | 1987-01-16 | 1988-07-20 | Mitsubishi Electric Corp | Mother board testing device |
| GB2426599A (en) * | 2005-05-27 | 2006-11-29 | Mv Res Ltd | Lens array with tube like baffles and header assembly |
| CN102519985A (en) * | 2011-11-15 | 2012-06-27 | 浪潮电子信息产业股份有限公司 | Quick detection method for server motherboard material assembly based on structured light |
| CN102519967A (en) * | 2011-11-15 | 2012-06-27 | 浪潮电子信息产业股份有限公司 | Board card material inspection method based on image identification detection |
-
2014
- 2014-12-16 CN CN201410775339.9A patent/CN104406984A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63175774A (en) * | 1987-01-16 | 1988-07-20 | Mitsubishi Electric Corp | Mother board testing device |
| GB2426599A (en) * | 2005-05-27 | 2006-11-29 | Mv Res Ltd | Lens array with tube like baffles and header assembly |
| CN102519985A (en) * | 2011-11-15 | 2012-06-27 | 浪潮电子信息产业股份有限公司 | Quick detection method for server motherboard material assembly based on structured light |
| CN102519967A (en) * | 2011-11-15 | 2012-06-27 | 浪潮电子信息产业股份有限公司 | Board card material inspection method based on image identification detection |
Non-Patent Citations (1)
| Title |
|---|
| 钟伟全 等: "一种 PCB板元器件图像的分割方法", 《电子科技》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114782437A (en) * | 2022-06-20 | 2022-07-22 | 西南石油大学 | Computer mainboard quality detection method and system based on artificial intelligence |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105940354B (en) | Qualitative control device and its control method, storage device | |
| JP5517638B2 (en) | Mounting component inspection method, mounting component inspection apparatus for implementing the method, and component mounter equipped with the mounting component inspection device | |
| US9760427B2 (en) | Method and apparatus for identifying location related hardware failures | |
| CN113030123B (en) | AOI detection feedback system based on Internet of things | |
| KR20180039662A (en) | IN-POCKET integrated circuit (IC) device detection with each mounted laser and camera | |
| CN108508477B (en) | Seismic data acquisition system and method | |
| CN110389846A (en) | The electronic device and its method of record event | |
| US20130124135A1 (en) | Computing device and method for automatically replacing probes for coordinate measuring machines | |
| CN107748011B (en) | The test macro and test method of medium-wave infrared detector image-forming delay time | |
| KR102174424B1 (en) | Method for Inspecting Component basesd Server and system and apparatus therefor | |
| CN106531657A (en) | Appearance inspection method and inspection system of inkless wafer | |
| CN103913150B (en) | Intelligent electric energy meter electronic devices and components consistency detecting method | |
| US10755385B2 (en) | Image processing apparatus and recording medium | |
| CN108521296B (en) | Goods information identification system and method | |
| US11067598B2 (en) | Inspection data output device, display system, and inspection data output method | |
| US20160147590A1 (en) | Determine malfunction state of power supply module | |
| CN104406984A (en) | Consistency image detection method of server mainboard material | |
| US10657626B2 (en) | Image processing apparatus, image processing system, and recording medium | |
| US5825191A (en) | IC fault location tracing apparatus and method | |
| CN111815552A (en) | Workpiece detection method and device, readable storage medium and terminal equipment | |
| CN115035481A (en) | Image object distance fusion method, device, equipment and storage medium | |
| CN115980541A (en) | Data processing method, data processing device, data testing device, data processing equipment and data testing equipment, and storage medium | |
| JP2022112342A (en) | Equipment construction confirmation system, and equipment construction confirmation method | |
| CN112304214A (en) | Tool detection method and tool detection system based on photogrammetry | |
| CN104851817A (en) | Electronic beam inspection optimization method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150311 |