CN104395762A - Jig for fixing socket board for testing memory package - Google Patents
Jig for fixing socket board for testing memory package Download PDFInfo
- Publication number
- CN104395762A CN104395762A CN201380032777.XA CN201380032777A CN104395762A CN 104395762 A CN104395762 A CN 104395762A CN 201380032777 A CN201380032777 A CN 201380032777A CN 104395762 A CN104395762 A CN 104395762A
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- China
- Prior art keywords
- memory package
- stationary fixture
- fixture
- socket
- fixed
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56016—Apparatus features
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a jig for fixing a socket board for testing a memory package, and is to provide a handler pusher for selectively and simultaneously raising a plurality of pressure elements fixedly protruding from the lower surface of a raised/lowered panel by turning a raising/lowering lever, whereby a plurality of memory packages inserted in a plurality of package reception hollows arranged in the upper fixing jig may be simultaneously pressed so as to considerably increase the efficiency of testing the memory packages. To this end, a jig for fixing a socket board for testing memory packages according to the present invention comprises: an upper and a lower fixing jig; and a socket board having sockets and fixed between the upper and the lower fixing jig, wherein a plurality of package reception hollows are arranged in the upper fixing jig corresponding to a memory package test base plate with a lower surface contacting the upper surface of the sockets so as to receive the memory packages selectively pressed for testing by a pressure member fixedly arranged in the package reception hollows, and a handler pusher is arranged with one side hinged to the upper side of the upper fixing jig and the other side provided with a resilient means to enable the lower surface to resiliently contact the upper surface of the upper fixing jig, and a fixing hook is arranged in the other side of the pusher handler so as to be held by a hook fixing slot formed in one side of the upper fixing jig, so that the pressure elements protruding downwardly may be selectively lowered so as to press the memory packages inserted in the package reception hollows of the upper base plate pressure member.
Description
Technical field
The present invention relates to a kind of socket substrate stationary fixture for memory package test, in more detail, relate to a kind of socket substrate stationary fixture for memory package test with action advances device, multiple outstanding pressure sheet be fixed on the lower surface of lifter plate downwards is optionally elevated by the rotation of described elevating lever by described action advances device simultaneously, the encapsulation mounting groove of therefore multiple arrangement on fixed fixture is once laid to property and multiple memory package of pressurizeing, thus can lay and multiple memory package of pressurizeing simultaneously, the operating efficiency that the unfavorable condition of memory package is tested can be significantly improved thus.
Background technology
Usually, BGA is the abbreviation of Ball Grid Array, be the one of SMD (Surface MountDevices), substitute Pin (PGA) or Lead (DFP) face when being encapsulation (Packaging) and use the encapsulation technology of Ball.
Such BGA, is divided into Flexible BGA (Main PI material), C-BGA (Ceramic) and P-BGA (Plastic, BT) according to material sections.
Foregoing BGA package technology, can be reduced to about 50% of existing die size by the size of chip, therefore has the advantage that can reduce the package area of parts when the upper encapsulation of plate (mainboard or graphics card).Further, such BGA package technology, because terminal is not exposed at the outside of chip, therefore has jamproof advantage.
In addition, along with the development of central processing unit (CPU), the performance also raising by leaps and bounds of personal computer, the competition being intended to develop the computing machine of faster, more excellent performance constantly continues, and occurs that supercomputer, parallel processing computer, RISC (Reduced Instruction SetComputer) develop.And the effort improving computing power also will continue.
As previously mentioned, the core being intended to develop the competition of the computing machine of faster, more excellent performance be develop can high speed processing more data CPU and height is integrated, the memory chip of high power capacity, high speed, thus accelerate its exploitation competition.Especially, the memory chip etc. developed by such technological development, in order to reduce the package area of parts and guarantee reliability by reducing interference, needs the memory chip developing BGA package type.
In addition, as for testing, foregoing height is integrated, the memory chip of the BGA package type of high power capacity, high speed is (following, the all memory chips comprising BGA package type memory chip are referred to as " memory package ") the prior art of fraction defective, provide a kind of the socket substrate that is packaged with socket is fixing by socket substrate stationary fixture after, be confirmed whether to be electrically connected by the electrical contact of the socket with memory package that are packaged in socket substrate, test the method for the fraction defective of the memory package as tested object thing thus.
When testing the fraction defective of foregoing memory package, by to be inserted by encapsulation insertion groove with the state being fixed on socket substrate stationary fixture and the memory package being positioned at socket top carries out pressurization to be confirmed whether being electrically connected, in the process, mode to the upside pressurized storage device encapsulation of socket has, arrange manual operation thruster in the upside of the encapsulation insertion groove of the upper stationary fixture of formation socket substrate stationary fixture carry out the mode of pressurized storage device encapsulation and by the automatic operation thruster along left and right horizontal direction and upper and lower vertical direction movement, memory package be pressurized to the mode of socket.
In foregoing mode, especially the existing angle of rake socket substrate stationary fixture for memory package test of manual operation that utilizes comprises upper stationary fixture and lower stationary fixture, and laid by the encapsulation mounting groove that fixed fixture is formed and the encapsulation of pressurized storage device, test the fraction defective of described memory package thus.
Especially, the existing socket substrate stationary fixture for memory package test so also comprises action advances device, described action advances device can be rotatably set on fixed fixture, and be optionally inserted in described encapsulation mounting groove, optionally lay thus and described memory package of pressurizeing.
At this, the side of described action advances device has outstanding pressure sheet downwards, and described pressure sheet lays the described memory package being also inserted into described encapsulation mounting groove pressurized selective.
In other words, an end of described action advances device is rotatably connected on fixed fixture by hinge arrangement, projecting described pressure sheet on the bottom surface, side opposed with hinge.
Therefore, the existing socket substrate stationary fixture for memory package test is rotatably connected to the rotation of the described action advances device on fixed fixture by hinge arrangement by an end, described encapsulation mounting groove lays described memory package, and laid and described memory package of pressurizeing by the pressure sheet of described action advances device, thus the fraction defective of described memory package can be tested.
In the aforesaid existing socket substrate stationary fixture for memory package test, the side bottom surface opposed with described action advances device has single pressure sheet, especially, such action advances device is arranged on fixed fixture by hinge arrangement, to make described action advances device corresponding to the described internal memory mounting groove be formed on fixed fixture, and rotatable respectively.
That is, the existing socket substrate stationary fixture for memory package test corresponds to internal memory mounting groove, possesses the action advances device with single pressure sheet respectively, and in order to test multiple memory package, operator needs each action advances device of manual rotation and fixes.
Thus, exist whether bad multiple memory package as test object cannot be fixed on the problem of multiple encapsulation mounting groove carrying out test simultaneously.
Further, owing to multiple memory package cannot be fixed and test simultaneously, therefore the memory package of minority can only be tested repeatedly, the problem that the operating efficiency that there is the bad problem test of memory package thus declines.
Therefore, need research and development can improve the socket substrate stationary fixture for memory package test of the operating efficiency of the unfavorable condition test of memory package, the encapsulation mounting groove of described stationary fixture multiple arrangement on upper stationary fixture can be laid and multiple memory package of pressurizeing once, realize laying and multiple memory package of pressurizeing simultaneously, the operating efficiency of the bad problem test to memory package can be significantly improved thus.
Summary of the invention
(1) technical matters that will solve
In order to solve described problem, the object of the present invention is to provide a kind of socket substrate stationary fixture for memory package test, this stationary fixture has action advances device, described action advances device is outstandingly downwards fixed on the pressure sheet on the lower surface of lifter plate by multiple and is optionally elevated by the rotation of elevating lever simultaneously, the encapsulation mounting groove of therefore multiple arrangement on upper stationary fixture can be laid and multiple memory package of pressurizeing once, thus realize laying and multiple memory package of pressurizeing simultaneously.
And, socket substrate stationary fixture for memory package test according to the present invention has action advances device, described action advances device is outstandingly downwards fixed on the pressure sheet on the lower surface of lifter plate by multiple and is optionally elevated by the rotation of elevating lever simultaneously, the encapsulation mounting groove of therefore multiple arrangement on upper stationary fixture can be laid and multiple memory package of pressurizeing once, thus realize laying and multiple memory package of pressurizeing, the operating efficiency of the bad problem test to memory package can be significantly improved thus. simultaneously
(2) technical scheme
For the present invention realizing aforesaid object is as follows.Namely, socket substrate stationary fixture for memory package test of the present invention is made up of upper stationary fixture and lower stationary fixture, the socket substrate of socket is fixedly packaged with between fixed fixture and lower stationary fixture, the substrate for memory package test of described socket upper surface is contacted with corresponding to lower surface, on the encapsulation mounting groove of the substrate pressure-producing part that multiple encapsulation insertion grooves that fixed fixture is formed are fixedly installed, optionally lay also pressurized storage device encapsulation and test the fraction defective of described memory package, the described socket substrate stationary fixture for memory package test also comprises action advances device, the side of described action advances device is rotatably connected to the upside of fixed fixture by hinge arrangement, rotate to make the underrun of described action advances device and maintain with the upper surface of fixed fixture the state be adjacent to, rotated by the dependence elastic force of opposite side and restore and realize the fixing buckle of inlay card, make opposite side inlay card and be fixed on fixed fixture side formed buckle pickup groove after, multiple pressure sheets of outstanding configuration optionally decline downwards, thus optionally lay on the mounting groove of described substrate pressure-producing part and described memory package of pressurizeing.
At this, preferably, described action advances device comprises: lifter plate, have around described lifter plate upper surface and multiplely project upwards fixing lifting guide, so that described multiple pressure sheet is outstanding fixing downwards and optionally decline, described lifting guide to be inclined upwardly from side the dip plane that formed and forming from the surface level of one end horizontal extension certain length of described dip plane by upper surface; Reciprocating plate, in described reciprocating plate, the roller being closely attached on the upper surface of the lifting guide of described lifter plate is given prominence to certain length downwards and rotatably arranges, connecting link is extruded with in the side of flat board, give prominence to downwards in bottom surface, described connecting link end and form connection bump, described reciprocating plate is moved back and forth in the horizontal direction by syndeton, described roller is guided to the upper surface of the lifting guide of described lifter plate, thus is optionally elevated described lifter plate; Elevating lever, the link slot of the connection bump inserting described reciprocating plate is formed in its side, the axis hole for rotating is formed in the side of described link slot, the opposite side of described elevating lever to rotate at a certain angle for benchmark with described axis hole and restores, described reciprocating plate is moved back and forth in the horizontal direction, and is optionally elevated described lifter plate; And thruster shell, its side is rotatably connected to the upside of fixed fixture with hinge arrangement, the liftably built-in described lifter plate from downside, built-in described reciprocating plate between described thruster shell and described lifter plate, is inserted into the turning axle of the axis hole of described elevating lever in opposite side outstanding formation downwards.
Now, preferably, the lifting guide of described lifter plate is recessed to form with round-shaped the mounting groove laying described roller downwards accordingly with described roller on described surface level, so that the roller of described reciprocating plate is under the state be adjacent to described lifting guide, by the rotation of described elevating lever, lay to the process of described surface level movement from the dip plane of described lifting guide and be fixed on described surface level.
And, preferably, fixed fixture opposite side also cooling fan is set, so that the superheating phenomenon of the components and parts preventing the thermal conductance produced when described socket that the described socket substrate because being fixed between fixed fixture and lower stationary fixture encapsulates and described substrate pressure-producing part and described memory package electrical contact from causing.
Especially, preferably, on the opposite side top of fixed fixture, also DVM is set, so as to measure be fixed between fixed fixture and lower stationary fixture described socket substrate on the socket that encapsulates and insertion be adjacent to the electric contact state of the described memory package of described substrate pressure-producing part.
And, preferably, on the opposite side bottom surface of described action advances device, also configuration is outstanding downwards has flexible buffer unit, so that when described action advances device is adjacent to by the upper surface rotating its bottom surface and upper stationary fixture, relies on the mutual snubber contact of elasticity and maintain by described fixing buckle the state be adjacent to.
And, preferably, also configure in the side of the described buckle pickup groove of fixed fixture project upwards certain altitude from upper surface there is flexible second buffer unit, so that described action advances device is by rotating, when the upper surface of its bottom surface and upper stationary fixture is adjacent to, relies on the mutual snubber contact of elasticity and maintain by described fixing buckle the state be adjacent to.
(3) beneficial effect
Illustrate that the effect of socket substrate stationary fixture for memory package test of the present invention is as follows.
First, socket substrate stationary fixture for memory package test of the present invention has action advances device, multiple outstanding pressure sheet being fixed on the lower surface of described lifter plate downwards is optionally elevated by the rotation of elevating lever by described action advances device simultaneously, therefore on upper stationary fixture the substrate pressure-producing part of multiple arrangement encapsulation mounting groove on can lay once and multiple memory package of pressurizeing, thus can to lay and multiple memory package of pressurizeing simultaneously.
Second, socket substrate stationary fixture for memory package test of the present invention has action advances device, multiple outstanding pressure sheet being fixed on the lower surface of described lifter plate downwards is optionally elevated by the rotation of elevating lever by described action advances device simultaneously, therefore on upper stationary fixture the substrate pressure-producing part of multiple arrangement encapsulation mounting groove on can lay once and multiple memory package of pressurizeing, thus can lay and multiple memory package of pressurizeing, the operating efficiency of the bad problem test to memory package can be significantly improved thus. simultaneously
Accompanying drawing explanation
Fig. 1 is the separation three-dimensional structure diagram representing the socket substrate stationary fixture for memory package test of the present invention.
Fig. 2 be represent of the present invention for memory package test socket substrate stationary fixture in conjunction with three-dimensional structure diagram.
Fig. 3 is the cut-open view of the A-A line along Fig. 2, be represent of the present invention for memory package test socket substrate stationary fixture in conjunction with sectional structure chart.
Fig. 4 is the separation three-dimensional structure diagram of the action advances device of the vitals represented as the socket substrate stationary fixture for memory package test of the present invention.
Fig. 5 represents that the bottom surface of the structure looked up from the bottom surface of Fig. 4 is separated three-dimensional structure diagram.
Fig. 6 represents the action advances device at the vitals as the socket substrate stationary fixture for memory package test of the present invention, and lifter plate is directed into guide plate and the vitals construction profile of the running status of lifting.
Fig. 7 represents the action advances device at the vitals as the socket substrate stationary fixture for memory package test of the present invention, and lifter plate is directed into guide plate and the vitals plane structure chart of the running status of lifting.
Accompanying drawing illustrates mark
1: for the socket substrate stationary fixture of memory package test
100: upper stationary fixture 110: encapsulation insertion groove
120: substrate pressure-producing part 121: encapsulation mounting groove
130: buckle pickup groove 140: the second buffer unit
150: cooling fan 160: DVM
200: lower stationary fixture 300: action advances device
310: fixing buckle 311: elastomeric element
320: lifter plate 321: lifting guide
322: dip plane 323: surface level
324: mounting groove 325: leading axle
326: elastomeric element 329: guide portion
330: pressure sheet 340: reciprocating plate
341: connecting link 342: connection bump
345: roller 346: roller shaft
347: set bolt 360: elevating lever
362: link slot 363: axis hole
368: the first locking surface 369: the second locking surfaces
380: thruster shell 381: stator
382: bonding pad 383: turning axle
385: buffer unit 387: restraint slot
388: the first containment surfaces 389: the second containment surfaces
400: socket substrate 410: socket
500: memory package 600: for the substrate of memory package test
Embodiment
Below, the preferred embodiment of the socket substrate stationary fixture for memory package test of the present invention is explained with reference to accompanying drawing.
Fig. 1 is the separation three-dimensional structure diagram representing the socket substrate stationary fixture for memory package test of the present invention, Fig. 2 be represent of the present invention for memory package test socket substrate stationary fixture in conjunction with three-dimensional structure diagram, Fig. 3 is the cut-open view of the A-A line along Fig. 2, be represent of the present invention for memory package test socket substrate stationary fixture in conjunction with sectional structure chart.
Fig. 4 is the separation three-dimensional structure diagram of the action advances device of the vitals represented as the socket substrate stationary fixture for memory package test of the present invention, and Fig. 5 represents that the bottom surface of the structure looked up from the bottom surface of Fig. 4 is separated three-dimensional structure diagram.
Fig. 6 represents the action advances device at the vitals as the socket substrate stationary fixture for memory package test of the present invention, lifter plate is directed into guide plate and the vitals construction profile of the running status of lifting, Fig. 7 represents the action advances device at the vitals as the socket substrate stationary fixture for memory package test of the present invention, and lifter plate is directed into guide plate and the vitals plane structure chart of the running status of lifting.
As shown in Figures 1 to 7, the socket substrate stationary fixture 1 for memory package test of the preferred embodiments of the present invention is made up of upper stationary fixture 100 and lower stationary fixture 200, the socket substrate 400 of socket 410 is fixedly packaged with between fixed fixture 100 and lower stationary fixture 200, the substrate 600 for memory package test of described socket 410 upper surface is contacted with corresponding to lower surface, on the encapsulation mounting groove 121 of the substrate pressure-producing part 120 that the encapsulation insertion groove 110 of multiple formation on fixed fixture 100 is fixedly installed, optionally lay and pressurized storage device encapsulation 500, test the fraction defective of described memory package 500 thus.
Especially, the socket substrate stationary fixture 1 for memory package test so also comprises action advances device 300, the side of described action advances device is rotatably connected to the upside of fixed fixture 100 by hinge arrangement, rotate to make the underrun of described action advances device and maintain with the upper surface of fixed fixture 100 state be adjacent to, undertaken rotating by the dependence elastic force of opposite side and restore and realize the fixing buckle 310 of inlay card, opposite side inlay card and be fixed on fixed fixture 100 side formed buckle pickup groove 130, then multiple pressure sheets 330 of outstanding configuration downwards optionally decline and optionally lay on the mounting groove of described substrate pressure-producing part 120 and described memory package 500 of pressurizeing.
At this, described action advances device 300 is formed primarily of lifter plate 320, reciprocating plate 340, elevating lever 360 and thruster shell 380.
Now, preferably, described lifter plate 320 thereon surface has along surrounding and multiplely projects upwards fixing lifting guide 321, fix so that described multiple pressure sheet 330 is outstanding downwards and optionally declines, the surface level 323 that the dip plane 322 that described lifting guide is formed from side by upper surface with being inclined upwardly and the one end from described dip plane 322 flatly extend certain length forms.
Especially, on lifter plate 320, give prominence to fixing described pressure sheet 330 downwards as above, outstanding fixing downwards in the bottom surface of described lifter plate 320, and there is elasticity, therefore, it is possible to realize cushioning.
That is, when described pressure sheet 330 is close to bottom surface and pressurize to described memory package 500, in order to prevent causing damage to described memory package 500, stably to pressurize described memory package 500 with cushion effect when being adjacent to pressurization.
Such described pressure sheet 300 by the leading axle 325 given prominence to downwards in the bottom surface of described lifter plate 320 in vertical direction and have elasticity, establish elastomeric element 326 the arranging in groove (unmarked) from upper surface to lower recess in its bight, and combine the bottom surface being fixed on described lifter plate 320.
Now, preferably, described pressure sheet 300 forms hanging groove portion (unmarked) around upper end, makes described hanging groove portion (unmarked) fixing by the head locking of joint bolt (unmarked), is incorporated into the bottom surface of described lifter plate 320 thus.
In other words, described pressure sheet 300 combines fixing by described elastomeric element 326, so that the leading axle 325 given prominence to downwards by the bottom surface of described lifter plate 320 in vertical direction and have elasticity.
And, preferably, in described reciprocating plate 340, the roller 345 being closely attached on the upper surface of the lifting guide 321 of described lifter plate 320 is given prominence to certain length downwards and rotatably arranges, connecting link 341 is extruded with, in the bottom surface outstanding formation connection bump 342 downwards of the end of described connecting link 341 in the side of flat board.
Thus, described reciprocating plate 340 is moved back and forth in the horizontal direction by syndeton, and described roller 345 is directed into the upper surface of the lifting guide 321 of described lifter plate 320 thus, thus optionally can be elevated described lifter plate 320.
Preferably, there is in reciprocating plate 340 as above described roller 345 corresponding to multiple and described lifting guide 321, such roller 345 is arranged in described reciprocating plate 340 by roller shaft 346 and set bolt 347, further, give prominence to certain length downwards from the bottom surface of described reciprocating plate 340 and rotatably arrange.
In addition, the link slot 362 of the connection bump 342 inserting described reciprocating plate 340 is formed in the side of described elevating lever 360, the axis hole 363 for rotating is formed in the side of described link slot 362, the opposite side of described elevating lever is that benchmark rotates and recovery with certain angle with described axis hole 363, described reciprocating plate 340 is moved back and forth in the horizontal direction, and is optionally elevated described lifter plate 320.
In addition, preferably, the side of described thruster shell 380 is rotatably connected to the upside of fixed fixture 100 by hinge arrangement, be liftably built-in with described lifter plate 320 from downside, built-in described reciprocating plate 340 between described thruster shell and described lifter plate 320.
At this, have described fixing buckle 310 at the opposite side of the thruster shell 380 of described action advances device 300, described fixing buckle relies on elastic force rotate and restore, thus optionally inlay card on the buckle pickup groove 130 of fixed fixture 100.
Now, described fixing buckle 310 is fixedly installed on the opposite side of described thruster shell 380 by hinge arrangement, to rely on elastic force to carry out rotating and restoring, and the flanking central portion that described fixing buckle 310 is fixedly installed into its side, top one opposite side of shell 380 outside described thruster keeps vertical state by elastomeric element 311.
Thus, if pressurizeed, the another side on the top of described fixing buckle 310 discharges later again, then described fixing buckle 310 relies on elastic force can restore to previous status and vertical state, and described fixing buckle 310 can be made thus to realize optionally hooking at the buckle pickup groove 130 of fixed fixture 100.
In addition, preferably, on the opposite side bottom surface of described thruster shell 380, outstanding formation is inserted into the turning axle 383 of the axis hole 363 of described lifter plate 360 downwards, the described axis hole 363 of fixing described elevating lever 360 is inserted thus on described turning axle 383, one end of described elevating lever 360 is rotatably connected, the other end realizing 360 of described elevating lever thus with an end of described elevating lever 360 for benchmark rotates.
Now, after the described axis hole 363 of described elevating lever 360 is inserted into described turning axle 383, bonding pad 382 is adjacent to combination in the lower end of described turning axle 383, and rotatably arranges at the opposite side of described thruster shell 380.
And, preferably, after described thruster shell 380 is adjacent to the described reciprocating plate 340 of insertion and lifter plate 320 successively from downside, the guide portion 329 that the corner parts of described lifter plate 320 is upwards recessed to form with chamfering is adjacent to stator 381 respectively, described reciprocating plate 340 and described lifter plate 320 are set by described stator 381.
And, at the described elevating lever 360 that the opposite side of described thruster shell 380 is rotatably arranged, with described turning axle 383 for axle, carry out rotating and restoring within the scope of certain angle.
Particularly, some corner parts in the opposite side corner of described thruster shell 380 form the restraint slot 387 be upwards recessed to form from bottom surface, in the first containment surfaces 388 of a sidewall of described restraint slot 387, first locking surface 368 outstanding in a side of described elevating lever 360 is optionally adjacent to prevention by rotating, in the second containment surfaces 389 of another sidewall of described restraint slot 387, the second locking surface 369 with " V " word shape concave configuration on the another side of described elevating lever 360 is optionally adjacent to prevention by rotating.
Thus, elevating lever 360 for axle with described turning axle 383, respectively to side or opposite side can only rotate at a certain angle and restore, and it can be stoped to rotate larger angle.
Especially, the lifting guide 321 of described lifter plate 320 is recessed to form with round-shaped the mounting groove 324 laying described roller 345 downwards accordingly with described roller 345 on described surface level 323, so that the roller 345 of described reciprocating plate 340 is under the state be adjacent to described lifting guide plate 321, is laid to the process of described surface level 323 movement from the dip plane 322 of described lifting guide 321 by the rotation of described elevating lever 360 and be fixed on described surface level 323.
In addition, socket substrate stationary fixture 1 for memory package test of the present invention foregoing, cooling fan 150 can also be set on the opposite side top of fixed fixture 100, so that the superheating phenomenon of the components and parts preventing the thermal conductance produced when described socket 410 that the described socket substrate 400 because being fixed between fixed fixture 100 and lower stationary fixture 200 encapsulates and described substrate pressure-producing part 120 and described memory package 500 electrical contact from causing.
And, preferably, DVM 160 (Digital voltage meter) is also set on fixed fixture 100 opposite side top, so as to measure be fixed between fixed fixture 100 and lower stationary fixture 200 described socket substrate 400 on the socket 410 that encapsulate and insert and be adjacent to the electric contact state of the described memory package 500 of described substrate pressure-producing part 120.
As above, by arranging described cooling fan 150 and DVM 160, promptly can confirm described memory package 500 whether bad as tested object, can reliably prevent components and parts overheated by described cooling fan 150 simultaneously, thus can continuous print be tested by described memory package 500.
Especially, preferably, foregoing in the socket substrate stationary fixture 1 for memory package test of the present invention, on the opposite side bottom surface of described action advances device 300, also configuration is outstanding downwards has flexible buffer unit 385, to be rotated by described action advances device 300, when the upper surface of its bottom surface and upper stationary fixture 100 is adjacent to, relies on the mutual snubber contact of elasticity and maintain by described fixing buckle 310 state be adjacent to.
And, can also configure in the side of the described buckle pickup groove 130 of fixed fixture 100 project upwards certain altitude from upper surface there is flexible second buffer unit 140, by configuring described buffer unit 385 and described second buffer unit 140 simultaneously, more stable buffer action can be realized.
Below, the using state of the test for memory package 500 utilizing the socket substrate stationary fixture 1 for memory package test of the present invention is foregoing described.
First, the socket substrate 400 upper surface being packaged with socket 410 is fixed between upper stationary fixture 100 and lower stationary fixture 200, now at the described substrate 600 for memory package test of upper surface configuration of described socket 410, the lower surface of the substrate 600 of described memory package test contacts with the upper surface of described socket 410.
Subsequently, side is connected to the action advances device 300 of the upside of fixed fixture 100 with hinge arrangement, not cover the state on the top of fixed fixture 100, namely under vertical state, in the encapsulation insertion groove 110 of fixed fixture 100 the described substrate pressure-producing part 120 of multiple arrangement encapsulation mounting groove 121 on lay multiple memory package 500.
Afterwards, with the side connected by hinge arrangement of described action advances device 300 for benchmark rotates opposite side, to make the bottom surface of described action advances device 300 be closely attached on the upper surface of fixed fixture 100.
Subsequently, the fixing buckle 310 being configured in the opposite side of described action advances device 300 is stuck in the buckle pickup groove 130 of fixed fixture 100, makes the bottom surface of described action advances device 300 and the upper surface of fixed fixture 100 maintain the state be adjacent to thus.
Afterwards, the elevating lever 360 that can be rotatably set in the opposite side of described action advances device 300 is rotated along a direction, in detail, described elevating lever 360 is rotated along a direction, until the first locking surface 368 of described elevating lever 360 is stoped by the first containment surfaces 388 of the restraint slot 387 be upwards recessed to form at the opposite side corner parts of described action advances device 300 and stops.
As above, when described elevating lever 360 to rotate along a direction stop to the first containment surfaces 388 by described restraint slot 387 and stop time, reciprocating plate 340 is moved along a direction by described elevating lever 360, and lifter plate 320 is declined by roller 345 and lifting guide 321.
Namely, when described lifter plate 320 declines, pressure sheet 330 projecting downwards on described lifter plate 320 will decline certain altitude, by the decline of such pressure sheet 330, and the multiple described memory package 500 be placed on described encapsulation mounting groove 121 of can pressurizeing downwards.
In other words, can to pressurize downwards the multiple described memory package 500 be placed in as above on described encapsulation mounting groove 121 simultaneously, when terminating such pressure process, by being arranged on the DVM 160 on fixed fixture 100, realize testing the fraction defective of described multiple memory package 500.
By foregoing process, the socket substrate stationary fixture 1 for memory package test of the present invention can be utilized, complete simultaneously and fraction defective test is carried out to multiple memory package 500.
Further, also known, operate by the reverse order by aforementioned process, after the described memory package 500 of test processes is separated, repeatedly performs aforesaid process and fraction defective test is carried out to multiple memory package simultaneously.
Socket substrate stationary fixture 1 for memory package test of the present invention has action advances device 300 as above, described action advances device 300 is optionally elevated at the multiple outstanding fixing described pressure sheet 330 downwards of the lower surface of described lifter plate 320 by the rotation of described elevating lever 360 simultaneously, therefore on fixed fixture 100 the substrate pressure-producing part 120 of multiple arrangement encapsulation mounting groove 121 on can lay once and multiple memory package 500 of pressurizeing, thus can to lay and multiple memory package 500 of pressurizeing simultaneously.
Especially, there is described action advances device 300, described action advances device 300 is optionally elevated at the multiple outstanding fixing described pressure sheet 330 downwards of the lower surface of described lifter plate 320 by the rotation of described elevating lever 360 simultaneously, therefore on fixed fixture 100 the substrate pressure-producing part 120 of multiple arrangement encapsulation mounting groove 121 on, can lay once and multiple memory package 500 of pressurizeing, thus can lay and multiple memory package 500 of pressurizeing simultaneously, the operating efficiency of the bad problem test to memory package 500 can be significantly improved thus.
In other words, described encapsulation mounting groove 121 can be laid once and multiple memory package 500 of pressurizeing, laying and pressurizeing of multiple memory package 500 can be realized simultaneously, thus the time needed for multiple memory package 500 tested can be shortened, and improve the reliability of the performance of memory package 500.
Below understand specific embodiment of the present invention in detail, but the present invention is not limited thereto, those skilled in the art can carry out various deformation, and such distortion is included in protection scope of the present invention.
Claims (7)
1. the socket substrate stationary fixture for memory package test, it is characterized in that, the described socket substrate stationary fixture (1) for memory package test is made up of upper stationary fixture (100) and lower stationary fixture (200), the socket substrate (400) of socket (410) is fixedly packaged with between fixed fixture (100) and lower stationary fixture (200), the substrate (600) for memory package test of described socket (410) upper surface is contacted with corresponding to lower surface, on the encapsulation mounting groove (121) of the substrate pressure-producing part (120) that the upper multiple encapsulation insertion grooves (110) formed of fixed fixture (100) are fixedly installed, optionally lay the fraction defective that described memory package 500 tested by pressurized storage device encapsulation (500),
The described socket substrate stationary fixture (1) for memory package test also comprises action advances device (300), the side of described action advances device (300) is rotatably connected to the upside of fixed fixture (100) by hinge arrangement, rotate to make the underrun of described action advances device (300) and maintain with the upper surface of fixed fixture (100) state be adjacent to, undertaken by the dependence elastic force of opposite side rotating and restore the fixing buckle (310) realizing inlay card, make opposite side inlay card and be fixed on fixed fixture (100) side formed buckle pickup groove (130) after, multiple pressure sheets (330) of outstanding configuration optionally decline downwards, thus optionally lay on the mounting groove (121) of described substrate pressure-producing part (120) and described memory package (500) of pressurizeing.
2. the socket substrate stationary fixture for memory package test according to claim 1, it is characterized in that, described action advances device (300) comprising:
Lifter plate (320), have around its upper surface and multiplely project upwards fixing lifting guide (321), so that described multiple pressure sheet (330) is outstanding fixing and optionally decline downwards, described lifting guide (321) to be inclined upwardly from side the dip plane (322) that formed and forming from the surface level (323) of one end horizontal-extending certain length of described dip plane (322) by upper surface;
Reciprocating plate (340), in described reciprocating plate (340), the roller (345) being closely attached on the upper surface of the lifting guide (321) of described lifter plate (320) is given prominence to certain length downwards and rotatably arranges, connecting link (341) is extruded with in the side of flat board, bottom surface outstanding formation connection bump (342) downwards of described connecting link (341) end, described reciprocating plate (340) is moved back and forth in the horizontal direction by syndeton, described roller (345) is guided to the upper surface of the lifting guide (321) of described lifter plate (320), thus be optionally elevated described lifter plate (320),
Elevating lever (360), its side forms the link slot (362) of the connection bump (342) inserting described reciprocating plate (340), the axis hole (363) for rotating is formed in the side of described link slot (362), the opposite side of described elevating lever (360) to rotate with certain angle for benchmark with described axis hole (363) and restores, described reciprocating plate (340) is moved back and forth in the horizontal direction, and is optionally elevated described lifter plate (320); And
Thruster shell (380), its side is rotatably connected to the upside of fixed fixture (100) by hinge arrangement, the liftably built-in described lifter plate (320) from downside, built-in described reciprocating plate (340) between described thruster shell (380) and described lifter plate (320), is inserted into the turning axle (383) of the axis hole (363) of described elevating lever (360) in opposite side outstanding formation downwards.
3. the socket substrate stationary fixture for memory package test according to claim 2, it is characterized in that, the lifting guide (321) of described lifter plate (320) is above recessed to form with round-shaped the mounting groove (324) laying described roller (345) downwards with described roller (345) accordingly at described surface level (323), so that the roller (345) of described reciprocating plate (340) is under the state be adjacent to described lifting guide (321), by the rotation of described elevating lever (360), lay to the process of described surface level (323) movement from the dip plane (322) of described lifting guide (321) and be fixed on described surface level (323).
4. the socket substrate stationary fixture for memory package test according to claim 1 and 2, it is characterized in that, cooling fan (150) is also set on the top of the opposite side of fixed fixture (100), so that the superheating phenomenon of the components and parts preventing the thermal conductance because producing when the described socket substrate (400) be fixed between fixed fixture (100) and lower stationary fixture (200) goes up the described socket (410) and described substrate pressure-producing part (120) and described memory package (500) electrical contact that encapsulate from causing.
5. the socket substrate stationary fixture for memory package test according to claim 1 and 2, it is characterized in that, DVM (160) is also set on fixed fixture (100) opposite side top, is fixed on the upper socket (410) that encapsulates of described socket substrate (400) between fixed fixture (100) and lower stationary fixture (200) to measure and inserts and be adjacent to the electric contact state of the described memory package (500) of described substrate pressure-producing part (120).
6. the socket substrate stationary fixture for memory package test according to claim 1, it is characterized in that, on the opposite side bottom surface of described action advances device (300), also configuration is outstanding downwards has flexible buffer unit (385), so that when described action advances device (300) is adjacent to by the upper surface rotating its bottom surface and upper stationary fixture (100), rely on the mutual snubber contact of elasticity and the state be adjacent to by described fixing buckle (310) maintenance.
7. the socket substrate stationary fixture for memory package test according to claim 1 or 6, it is characterized in that, also configure in the side of the described buckle pickup groove (130) of fixed fixture (100) project upwards certain altitude from upper surface there is flexible second buffer unit (140), so that when described action advances device (300) is adjacent to by the upper surface rotating its bottom surface and upper stationary fixture (100), rely on the mutual snubber contact of elasticity and the state be adjacent to by described fixing buckle (310) maintenance.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0002582 | 2013-01-09 | ||
| KR1020130002582A KR101373744B1 (en) | 2013-01-09 | 2013-01-09 | Socket-board fixing jig for memory package |
| PCT/KR2013/011991 WO2014109493A1 (en) | 2013-01-09 | 2013-12-23 | Jig for fixing socket board for testing memory package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104395762A true CN104395762A (en) | 2015-03-04 |
Family
ID=50648544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380032777.XA Pending CN104395762A (en) | 2013-01-09 | 2013-12-23 | Jig for fixing socket board for testing memory package |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101373744B1 (en) |
| CN (1) | CN104395762A (en) |
| WO (1) | WO2014109493A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101991451B1 (en) * | 2018-07-06 | 2019-06-20 | 주식회사 네오셈 | Tray for testing dual in-line memory module |
| KR102184138B1 (en) * | 2019-10-04 | 2020-11-27 | (주)마이크로컨텍솔루션 | Socket apparatus |
| KR102407812B1 (en) * | 2021-10-15 | 2022-06-13 | (주)티에스에이 | Socket removing device of bun-ln board |
| CN115792309B (en) * | 2023-01-10 | 2023-04-11 | 法特迪精密科技（苏州）有限公司 | High-temperature aging test socket upper cover structure convenient for switching test of two kinds of packaged chips |
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| CN101093244A (en) * | 2006-06-22 | 2007-12-26 | 夏普株式会社 | Semiconductor device, semiconductor device testing method, and probe card |
| CN101344537A (en) * | 2007-07-09 | 2009-01-14 | 力成科技股份有限公司 | General scarf joint tool for positioning ball lattice array packaging member to be measured |
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| KR101042407B1 (en) * | 2009-07-06 | 2011-06-17 | (주)솔리드메카 | Socket-board fixing jig for memory package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101117789B1 (en) * | 2005-03-11 | 2012-03-13 | 가부시끼가이샤 니혼 마이크로닉스 | Ic carrier, ic socket and method for testing ic device |
| KR20100133067A (en) * | 2009-06-11 | 2010-12-21 | (주) 컴파스 시스템 | Gripper of socket adaptor for programer |
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2013
- 2013-01-09 KR KR1020130002582A patent/KR101373744B1/en active IP Right Grant
- 2013-12-23 CN CN201380032777.XA patent/CN104395762A/en active Pending
- 2013-12-23 WO PCT/KR2013/011991 patent/WO2014109493A1/en active Application Filing
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| CN101093244A (en) * | 2006-06-22 | 2007-12-26 | 夏普株式会社 | Semiconductor device, semiconductor device testing method, and probe card |
| US20070296395A1 (en) * | 2006-06-22 | 2007-12-27 | Sharp Kabushiki Kaisha | Semiconductor device, semiconductor device testing method, and probe card |
| CN101344537A (en) * | 2007-07-09 | 2009-01-14 | 力成科技股份有限公司 | General scarf joint tool for positioning ball lattice array packaging member to be measured |
| KR101042407B1 (en) * | 2009-07-06 | 2011-06-17 | (주)솔리드메카 | Socket-board fixing jig for memory package |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2014109493A1 (en) | 2014-07-17 |
| KR101373744B1 (en) | 2014-03-26 |
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