CN104378955A - Heat insulation component and circuit board - Google Patents
Heat insulation component and circuit board Download PDFInfo
- Publication number
- CN104378955A CN104378955A CN201410614269.9A CN201410614269A CN104378955A CN 104378955 A CN104378955 A CN 104378955A CN 201410614269 A CN201410614269 A CN 201410614269A CN 104378955 A CN104378955 A CN 104378955A
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- functional module
- insulating assembly
- modules
- heat insulation
- base material
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- 238000009413 insulation Methods 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000004891 communication Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract 1
- 238000012546 transfer Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
The invention provides a heat insulation component and a circuit board. The heat insulation component comprises a heat insulation component base material and a functional module arranged on the heat insulation component base material, wherein at least one through hole is formed in the area, outside the functional module, of the heat insulation component base material, and the at least one through hole is used for heat insulation between the functional module and other modules on the heat insulation component base material. By the adoption of the technical scheme, heat insulation between the functional module and other modules on the same base material is achieved, and the problems such as the failure of the functional module caused by the working temperature of other modules and heat conduction of the base material are avoided. The heat insulation component achieving heat insulation is simple in structure and low in cost and is suitable for large-scale batch production.
Description
Technical field
The present invention relates to heat-insulating technique field, in particular to a kind of insulating assembly and a kind of circuit board.
Background technology
Along with IC (Integrated Circuit, integrated circuit) miniaturization of technology, develop compatiblely, structure between modular structure in IC module is more and more nearer, with IPM (Intelligent PowerModule, intelligent driver module) the IC module of type is example, IPM module achieves the integrated of device for power switching and high-voltage driving circuit, on the one hand, IPM module receives microprocessor-based control signal, on the other hand, detected state is sent to microprocessor by IPM module, therefore, IPM module is widely used in variable-frequency control technique, metallurgical machinery technology, electric traction technology, in the design of Servo Drive Technology's and frequency-conversion domestic electric appliances, but, spacing in IPM module between multiple functional module is less, and difference in functionality module causes heat radiation heat difference larger because of the difference of power consumption, therefore larger hot crosstalk can be produced between functional module, even cause some low power functional module impaired when being subject to larger hot crosstalk.
In the related, in order to reduce the hot crosstalk between multiple functional module, adopt the mode of Vacuum Package to weaken heat transfer effect, but the base material due to multiple functional module place is communicated with, and still can cause serious hot crosstalk phenomenon by base material.
Therefore, how to design insulating assembly to isolate with the heat between practical function module and other modules and become technical problem urgently to be resolved hurrily.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art or correlation technique.
For this reason, one object of the present invention is to propose the insulating assembly that the heat between a kind of new practical function module and other modules is isolated.
Another object of the present invention is to propose a kind of circuit board.
For achieving the above object, embodiment according to a first aspect of the invention, proposes a kind of insulating assembly, comprising: insulating assembly base material; Functional module, be arranged on described insulating assembly base material, described insulating assembly base material is provided with at least one through hole in the exterior lateral area of described functional module, and at least one through hole described is for carrying out heat insulation process to other modules in described functional module and described insulating assembly base material.
Insulating assembly according to an embodiment of the invention, exterior lateral area in functional module on insulating assembly base material is provided with at least one through hole, reduce the lateral conduction structure of insulating assembly base material, also namely between functional module and other modules, heat conduction structure defect is defined, therefore, effectively reduce the heat transfer between functional module and other modules, ensure that the proud normal work of functional module.
In addition, insulating assembly according to the above embodiment of the present invention, can also have following additional technical characteristic:
According to one embodiment of present invention, at least one through hole described is arranged at the region between described functional module and other modules described.
Insulating assembly according to an embodiment of the invention, by least one through hole being arranged at the region between functional module and other modules, decreasing the fault of construction of insulating assembly base material, therefore, ensure that the reliability of insulating assembly matrix structure.
According to one embodiment of present invention, at least one through hole described is arranged at the exterior lateral area of described functional module around ground.
Insulating assembly according to an embodiment of the invention, by at least one through hole to be arranged at the exterior lateral area of functional module around ground, further reduce the lateral conduction structure of insulating assembly base material, also namely between functional module and other modules, heat conduction structure defect is defined, therefore, further reduce the heat transfer between functional module and other modules, ensure that the proud normal work of functional module.
According to one embodiment of present invention, heat insulation structural is provided with in described through hole.
Insulating assembly according to an embodiment of the invention, by arranging heat insulation structural in through-holes, further decreasing the heat transfer between functional module and other modules, ensure that the proud normal work of functional module, particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the surface of described functional module is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, further decreases the heat transfer between functional module and other modules, ensure that the proud normal work of functional module, and particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the surface of other modules described is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, further decreases the heat transfer between functional module and other modules, ensure that the normal work of functional module, and particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the working temperature of described functional module is less than or equal to the working temperature of other modules described.
Insulating assembly according to an embodiment of the invention, when working temperature less than or equal to other modules of the working temperature of functional module, by the through hole between functional module and other modules and the heat insulation structural in through hole, the heat avoiding other modules is passed to functional module by insulating assembly base material, wherein, the working temperature of functional module comprises functional module threshold temperature in normal operating conditions and temperature upper limit affected by environment, the working temperature of other modules comprises functional module threshold temperature in normal operating conditions and temperature upper limit affected by environment.
According to one embodiment of present invention, communication line is provided with between described functional module and other modules described.
Insulating assembly according to an embodiment of the invention, by being provided with communication line between functional module and other modules, achieve the signal transfer functions between functional module and other modules, and the structure of through hole and communication line is not overlapping, therefore, heat insulation between through hole practical function module and other modules.
According to one embodiment of present invention, the surface of described communication line is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, by the surface at communication line, thermal insulation layer is set, avoid between communication line and operational environment and heat trnasfer occurs, and then avoid, by communication line, amount of heat is passed to communication line, further enhancing the rising of functional module temperature, particularly, heat insulation structural can be resin bed structure.
Embodiment according to a second aspect of the present invention, also proposed a kind of circuit board, comprising: the insulating assembly as described in above-mentioned any one technical scheme.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 shows the schematic diagram of insulating assembly according to an embodiment of the invention;
Fig. 2 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 3 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 4 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 5 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 6 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 7 shows the schematic diagram of insulating assembly according to another embodiment of the invention;
Fig. 8 shows the schematic diagram of insulating assembly according to another embodiment of the invention.
Reference numeral in Fig. 1 to Fig. 8 and the structure name of correspondence thereof are called: 1 insulating assembly base material, 2 functional modules, 3 through holes, 4 communication lines, 5 other modules.
Embodiment
In order to more clearly understand above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail.It should be noted that, when not conflicting, the feature in the embodiment of the application and embodiment can combine mutually.
Set forth a lot of detail in the following description so that fully understand the present invention; but; the present invention can also adopt other to be different from other modes described here and implement, and therefore, protection scope of the present invention is not by the restriction of following public specific embodiment.
As shown in Figures 1 to 8, insulating assembly according to an embodiment of the invention, comprising: insulating assembly base material 1; Functional module 2, be arranged on described insulating assembly base material 1, described insulating assembly base material 1 is provided with at least one through hole 3 in the exterior lateral area of described functional module 2, and at least one through hole 3 described is for carrying out heat insulation process to other modules 5 in described functional module 2 and described insulating assembly base material 1.
Insulating assembly according to an embodiment of the invention, by insulating assembly base material 1 is provided with at least one through hole 3 in the exterior lateral area of functional module 2, reduce the lateral conduction structure of insulating assembly base material 1, also namely between functional module 2 and other modules 5, heat conduction structure defect is defined, therefore, effectively reduce the heat transfer between functional module 2 and other modules 5, ensure that the proud normal work of functional module 2.
Composition graphs 1 to Fig. 8, is described the embodiment of insulating assembly:
Embodiment one:
As shown in Figure 1 to Figure 3, when insulating assembly base material 1 only comprises functional module 2, through hole 3 is arranged at the exterior lateral area of functional module 2, and do not affect the conducting of communication line 4 and the reliability of structure of insulating assembly base material 1, through hole 3 can be annular through-hole 3 as shown in Figure 1 or 2, also can be multiple through holes 3 as shown in Figure 3.
Embodiment two:
As shown in Figures 4 to 6, when insulating assembly base material 1 comprises functional module 2 and other modules 5, through hole 3 is arranged at the exterior lateral area of functional module 2, and do not affect the conducting of communication line 4 and the reliability of structure of insulating assembly base material 1, through hole 3 can be the annular through-hole 3 as shown in Fig. 4 or Fig. 5, also can be multiple through holes 3 as shown in Figure 6.
Embodiment three:
As shown in Fig. 7 to Fig. 8, when insulating assembly base material 1 comprises functional module 2 and other modules 5, through hole 3 is arranged between functional module 2 and other modules 5, and do not affect the conducting of communication line 4 and the reliability of structure of insulating assembly base material 1, through hole 3 can be an exhausting hole 3 as shown in Figure 7, also can be many exhausting holes 3 as shown in Figure 8.
In addition, insulating assembly according to the above embodiment of the present invention, can also have following additional technical characteristic:
According to one embodiment of present invention, at least one through hole 3 described is arranged at the region between described functional module 2 and other modules 5 described.
Insulating assembly according to an embodiment of the invention, by least one through hole 3 being arranged at the region between functional module 2 and other modules 5, decreasing the fault of construction of insulating assembly base material 1, therefore, ensure that insulating assembly base material 1 reliability of structure.
According to one embodiment of present invention, at least one through hole 3 described is arranged at the exterior lateral area of described functional module 2 around ground.
Insulating assembly according to an embodiment of the invention, by at least one through hole 3 to be arranged at the exterior lateral area of functional module 2 around ground, further reduce the lateral conduction structure of insulating assembly base material 1, also namely between functional module 2 and other modules 5, heat conduction structure defect is defined, therefore, further reduce the heat transfer between functional module 2 and other modules 5, ensure that the normal work of functional module 2.
According to one embodiment of present invention, heat insulation structural is provided with in described through hole 3.
Insulating assembly according to an embodiment of the invention, by arranging heat insulation structural in through hole 3, further decreasing the heat transfer between functional module 2 and other modules 5, ensure that the proud normal work of functional module 2, particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the surface of described functional module 2 is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, further decreases the heat transfer between functional module 2 and other modules 5, ensure that the proud normal work of functional module 2, and particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the surface of other modules 5 described is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, further decreases the heat transfer between functional module 2 and other modules 5, ensure that the proud normal work of functional module 2, and particularly, heat insulation structural can be resin bed structure.
According to one embodiment of present invention, the working temperature of described functional module 2 is less than or equal to the working temperature of other modules 5 described.
Insulating assembly according to an embodiment of the invention, when working temperature less than or equal to other modules 5 of the working temperature of functional module 2, by the through hole 3 between functional module 2 and other modules 5 and the heat insulation structural in through hole 3, the heat avoiding other modules 5 is passed to functional module 2 by insulating assembly base material 1, wherein, the working temperature of functional module 2 comprises functional module 2 threshold temperature in normal operating conditions and temperature upper limit affected by environment, the working temperature of other modules 5 comprises functional module 2 threshold temperature in normal operating conditions and temperature upper limit affected by environment.
According to one embodiment of present invention, communication line 4 is provided with between described functional module 2 and other modules 5 described.
Insulating assembly according to an embodiment of the invention, by being provided with communication line 4 between functional module 2 and other modules 5, achieve the signal transfer functions between functional module 2 and other modules 5, and the structure of through hole 3 and communication line 4 is not overlapping, therefore, heat insulation between through hole 3 practical function module 2 and other modules 5.
According to one embodiment of present invention, the surface of described communication line 4 is provided with thermal insulation layer.
Insulating assembly according to an embodiment of the invention, by arranging thermal insulation layer on the surface of communication line 4, avoid between communication line 4 and operational environment and heat trnasfer occurs, and then avoid, by communication line 4, amount of heat is passed to communication line 4, further enhancing the rising of functional module 2 temperature, particularly, heat insulation structural can be resin bed structure.
More than be described with reference to the accompanying drawings technical scheme of the present invention, consider in correlation technique the technical problem how designing insulating assembly and isolate with the heat between practical function module and other modules.The present invention proposes a kind of insulating assembly and a kind of circuit board.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. an insulating assembly, is characterized in that, comprising:
Insulating assembly base material;
Functional module, be arranged on described insulating assembly base material, described insulating assembly base material is provided with at least one through hole in the exterior lateral area of described functional module, and at least one through hole described is for carrying out heat insulation process to other modules in described functional module and described insulating assembly base material.
2. insulating assembly according to claim 1, is characterized in that, at least one through hole described is arranged at the region between described functional module and other modules described.
3. insulating assembly according to claim 2, is characterized in that, at least one through hole described is arranged at the exterior lateral area of described functional module around ground.
4. insulating assembly according to any one of claim 1 to 3, is characterized in that, is provided with heat insulation structural in described through hole.
5. insulating assembly according to any one of claim 1 to 3, is characterized in that, the surface of described functional module is provided with thermal insulation layer.
6. insulating assembly according to any one of claim 1 to 3, is characterized in that, the surface of other modules described is provided with thermal insulation layer.
7. insulating assembly according to any one of claim 1 to 3, is characterized in that, the working temperature of described functional module is less than or equal to the working temperature of other modules described.
8. insulating assembly according to any one of claim 1 to 3, is characterized in that, is provided with communication line between described functional module and other modules described.
9. insulating assembly according to claim 8, is characterized in that, the surface of described communication line is provided with thermal insulation layer.
10. a circuit board, is characterized in that, comprising: insulating assembly as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410614269.9A CN104378955B (en) | 2014-11-03 | 2014-11-03 | Insulating assembly and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410614269.9A CN104378955B (en) | 2014-11-03 | 2014-11-03 | Insulating assembly and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104378955A true CN104378955A (en) | 2015-02-25 |
| CN104378955B CN104378955B (en) | 2018-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410614269.9A Expired - Fee Related CN104378955B (en) | 2014-11-03 | 2014-11-03 | Insulating assembly and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104378955B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019192147A1 (en) * | 2018-04-02 | 2019-10-10 | 青岛海信移动通信技术股份有限公司 | Printed circuit board and movable device |
| CN112219311A (en) * | 2018-07-09 | 2021-01-12 | 喜利得股份公司 | Rechargeable battery protection device |
| CN113097156A (en) * | 2021-04-23 | 2021-07-09 | 郑州大学 | Oriented and localized heat-conducting composite material and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1918758A (en) * | 2004-02-10 | 2007-02-21 | 波科海姆技术公共有限公司 | Optical amplifiers |
| CN103002722A (en) * | 2012-12-18 | 2013-03-27 | 武汉光迅科技股份有限公司 | Heat control device for power equipment |
| CN103151318A (en) * | 2013-03-07 | 2013-06-12 | 北京中石伟业科技股份有限公司 | Heat dissipation managing system and method between heating chip and shell in electronic equipment |
| CN203720769U (en) * | 2014-02-19 | 2014-07-16 | 山东超越数控电子有限公司 | Heat source separated cooling fin for computer |
| CN204231841U (en) * | 2014-11-03 | 2015-03-25 | 广东美的制冷设备有限公司 | Insulating assembly and circuit board |
-
2014
- 2014-11-03 CN CN201410614269.9A patent/CN104378955B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1918758A (en) * | 2004-02-10 | 2007-02-21 | 波科海姆技术公共有限公司 | Optical amplifiers |
| CN103002722A (en) * | 2012-12-18 | 2013-03-27 | 武汉光迅科技股份有限公司 | Heat control device for power equipment |
| CN103151318A (en) * | 2013-03-07 | 2013-06-12 | 北京中石伟业科技股份有限公司 | Heat dissipation managing system and method between heating chip and shell in electronic equipment |
| CN203720769U (en) * | 2014-02-19 | 2014-07-16 | 山东超越数控电子有限公司 | Heat source separated cooling fin for computer |
| CN204231841U (en) * | 2014-11-03 | 2015-03-25 | 广东美的制冷设备有限公司 | Insulating assembly and circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019192147A1 (en) * | 2018-04-02 | 2019-10-10 | 青岛海信移动通信技术股份有限公司 | Printed circuit board and movable device |
| CN112219311A (en) * | 2018-07-09 | 2021-01-12 | 喜利得股份公司 | Rechargeable battery protection device |
| CN113097156A (en) * | 2021-04-23 | 2021-07-09 | 郑州大学 | Oriented and localized heat-conducting composite material and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104378955B (en) | 2018-02-06 |
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Granted publication date: 20180206 |