CN104377250A - 光子检测装置和堆叠硅光电倍增器 - Google Patents
光子检测装置和堆叠硅光电倍增器 Download PDFInfo
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- CN104377250A CN104377250A CN201410005758.4A CN201410005758A CN104377250A CN 104377250 A CN104377250 A CN 104377250A CN 201410005758 A CN201410005758 A CN 201410005758A CN 104377250 A CN104377250 A CN 104377250A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 22
- 229910052710 silicon Inorganic materials 0.000 title claims description 22
- 239000010703 silicon Substances 0.000 title claims description 22
- 238000001514 detection method Methods 0.000 claims abstract description 140
- 239000004020 conductor Substances 0.000 claims abstract description 16
- 230000001934 delay Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 17
- 238000010791 quenching Methods 0.000 claims description 14
- 230000000171 quenching effect Effects 0.000 claims description 14
- 238000005286 illumination Methods 0.000 claims description 6
- 238000004088 simulation Methods 0.000 claims description 4
- 238000013341 scale-up Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 48
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/964,987 US9082675B2 (en) | 2013-08-12 | 2013-08-12 | Partitioned silicon photomultiplier with delay equalization |
US13/964,987 | 2013-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104377250A true CN104377250A (zh) | 2015-02-25 |
CN104377250B CN104377250B (zh) | 2017-01-04 |
Family
ID=52447794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410005758.4A Active CN104377250B (zh) | 2013-08-12 | 2014-01-07 | 光子检测装置和堆叠硅光电倍增器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9082675B2 (zh) |
CN (1) | CN104377250B (zh) |
HK (1) | HK1207209A1 (zh) |
TW (1) | TWI533013B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106129072A (zh) * | 2015-05-08 | 2016-11-16 | 全视科技有限公司 | 堆叠芯片共享像素架构 |
CN106454141A (zh) * | 2015-08-07 | 2017-02-22 | 豪威科技股份有限公司 | 实施堆叠芯片高动态范围图像传感器的方法及系统 |
CN111480096A (zh) * | 2017-12-14 | 2020-07-31 | 森斯尔科技有限公司 | 静电放电保护的半导体光电倍增器 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015081134A2 (en) * | 2013-11-26 | 2015-06-04 | Flir Detection, Inc. | SiPM-BASED RADIATION DETECTION SYSTEMS AND METHODS |
US9466631B2 (en) * | 2014-05-13 | 2016-10-11 | Stmicroelectronics S.R.L. | Solid state photomultipliers array of enhanced fill factor and simplified packaging |
US9659980B2 (en) | 2014-12-19 | 2017-05-23 | Sensl Technologies Ltd | Semiconductor photomultiplier |
US20160181302A1 (en) | 2014-12-19 | 2016-06-23 | Sensl Technologies Ltd | Semiconductor photomultiplier |
US9767246B2 (en) * | 2015-06-17 | 2017-09-19 | General Electric Company | Adjustment and compensation of delays in photo sensor microcells |
US9443899B1 (en) | 2015-11-04 | 2016-09-13 | Omnivision Technologies, Inc. | BSI CMOS image sensor with improved phase detecting pixel |
US10585174B2 (en) * | 2017-03-10 | 2020-03-10 | Sensl Technologies Ltd. | LiDAR readout circuit |
US10515993B2 (en) * | 2018-05-17 | 2019-12-24 | Hi Llc | Stacked photodetector assemblies |
US10340408B1 (en) | 2018-05-17 | 2019-07-02 | Hi Llc | Non-invasive wearable brain interface systems including a headgear and a plurality of self-contained photodetector units configured to removably attach to the headgear |
US10158038B1 (en) | 2018-05-17 | 2018-12-18 | Hi Llc | Fast-gated photodetector architectures comprising dual voltage sources with a switch configuration |
US10420498B1 (en) | 2018-06-20 | 2019-09-24 | Hi Llc | Spatial and temporal-based diffusive correlation spectroscopy systems and methods |
US11213206B2 (en) | 2018-07-17 | 2022-01-04 | Hi Llc | Non-invasive measurement systems with single-photon counting camera |
WO2020131148A1 (en) | 2018-12-21 | 2020-06-25 | Hi Llc | Biofeedback for awareness and modulation of mental state using a non-invasive brain interface system and method |
EP3980849A1 (en) | 2019-06-06 | 2022-04-13 | Hi LLC | Photodetector systems with low-power time-to-digital converter architectures |
WO2021167892A1 (en) | 2020-02-21 | 2021-08-26 | Hi Llc | Wearable devices and wearable assemblies with adjustable positioning for use in an optical measurement system |
US11096620B1 (en) | 2020-02-21 | 2021-08-24 | Hi Llc | Wearable module assemblies for an optical measurement system |
US11883181B2 (en) | 2020-02-21 | 2024-01-30 | Hi Llc | Multimodal wearable measurement systems and methods |
US11771362B2 (en) | 2020-02-21 | 2023-10-03 | Hi Llc | Integrated detector assemblies for a wearable module of an optical measurement system |
US11969259B2 (en) | 2020-02-21 | 2024-04-30 | Hi Llc | Detector assemblies for a wearable module of an optical measurement system and including spring-loaded light-receiving members |
US11950879B2 (en) | 2020-02-21 | 2024-04-09 | Hi Llc | Estimation of source-detector separation in an optical measurement system |
US11515014B2 (en) | 2020-02-21 | 2022-11-29 | Hi Llc | Methods and systems for initiating and conducting a customized computer-enabled brain research study |
US11877825B2 (en) | 2020-03-20 | 2024-01-23 | Hi Llc | Device enumeration in an optical measurement system |
US11864867B2 (en) | 2020-03-20 | 2024-01-09 | Hi Llc | Control circuit for a light source in an optical measurement system by applying voltage with a first polarity to start an emission of a light pulse and applying voltage with a second polarity to stop the emission of the light pulse |
WO2021188486A1 (en) | 2020-03-20 | 2021-09-23 | Hi Llc | Phase lock loop circuit based adjustment of a measurement time window in an optical measurement system |
WO2021188487A1 (en) | 2020-03-20 | 2021-09-23 | Hi Llc | Temporal resolution control for temporal point spread function generation in an optical measurement system |
US11187575B2 (en) | 2020-03-20 | 2021-11-30 | Hi Llc | High density optical measurement systems with minimal number of light sources |
US11903676B2 (en) | 2020-03-20 | 2024-02-20 | Hi Llc | Photodetector calibration of an optical measurement system |
US11857348B2 (en) | 2020-03-20 | 2024-01-02 | Hi Llc | Techniques for determining a timing uncertainty of a component of an optical measurement system |
US11819311B2 (en) | 2020-03-20 | 2023-11-21 | Hi Llc | Maintaining consistent photodetector sensitivity in an optical measurement system |
US11245404B2 (en) | 2020-03-20 | 2022-02-08 | Hi Llc | Phase lock loop circuit based signal generation in an optical measurement system |
Citations (8)
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CN101861527A (zh) * | 2007-08-08 | 2010-10-13 | 皇家飞利浦电子股份有限公司 | 硅光电倍增器触发网络 |
US20100316184A1 (en) * | 2008-10-17 | 2010-12-16 | Jan Iwanczyk | Silicon photomultiplier detector for computed tomography |
US20110084212A1 (en) * | 2009-09-22 | 2011-04-14 | Irvine Sensors Corporation | Multi-layer photon counting electronic module |
US20110147567A1 (en) * | 2009-12-22 | 2011-06-23 | Slemens Medical Solutions USA, Inc. | SiPM Photosensor With Early Signal Digitization |
WO2012019640A1 (en) * | 2010-08-10 | 2012-02-16 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Silicon photoelectric multiplier with multiple "isochronic" read-out |
WO2013021075A1 (es) * | 2011-08-10 | 2013-02-14 | Tgb Rodamientos, S. L. | Módulo de giro cenital para la orientación de paneles solares |
WO2013021175A2 (en) * | 2011-08-05 | 2013-02-14 | Base4 Innovation Ltd | Device, apparatus and method |
US20130099100A1 (en) * | 2010-03-24 | 2013-04-25 | Sensl Technologies Ltd. | Silicon photomultiplier and readout method |
-
2013
- 2013-08-12 US US13/964,987 patent/US9082675B2/en active Active
- 2013-12-11 TW TW102145668A patent/TWI533013B/zh active
-
2014
- 2014-01-07 CN CN201410005758.4A patent/CN104377250B/zh active Active
-
2015
- 2015-08-13 HK HK15107824.0A patent/HK1207209A1/zh unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101861527A (zh) * | 2007-08-08 | 2010-10-13 | 皇家飞利浦电子股份有限公司 | 硅光电倍增器触发网络 |
US20100316184A1 (en) * | 2008-10-17 | 2010-12-16 | Jan Iwanczyk | Silicon photomultiplier detector for computed tomography |
US20110084212A1 (en) * | 2009-09-22 | 2011-04-14 | Irvine Sensors Corporation | Multi-layer photon counting electronic module |
US20110147567A1 (en) * | 2009-12-22 | 2011-06-23 | Slemens Medical Solutions USA, Inc. | SiPM Photosensor With Early Signal Digitization |
US8476571B2 (en) * | 2009-12-22 | 2013-07-02 | Siemens Aktiengesellschaft | SiPM photosensor with early signal digitization |
US20130099100A1 (en) * | 2010-03-24 | 2013-04-25 | Sensl Technologies Ltd. | Silicon photomultiplier and readout method |
WO2012019640A1 (en) * | 2010-08-10 | 2012-02-16 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Silicon photoelectric multiplier with multiple "isochronic" read-out |
WO2013021175A2 (en) * | 2011-08-05 | 2013-02-14 | Base4 Innovation Ltd | Device, apparatus and method |
WO2013021075A1 (es) * | 2011-08-10 | 2013-02-14 | Tgb Rodamientos, S. L. | Módulo de giro cenital para la orientación de paneles solares |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106129072A (zh) * | 2015-05-08 | 2016-11-16 | 全视科技有限公司 | 堆叠芯片共享像素架构 |
CN106129072B (zh) * | 2015-05-08 | 2019-07-26 | 豪威科技股份有限公司 | 堆叠芯片共享像素架构 |
CN106454141A (zh) * | 2015-08-07 | 2017-02-22 | 豪威科技股份有限公司 | 实施堆叠芯片高动态范围图像传感器的方法及系统 |
CN111480096A (zh) * | 2017-12-14 | 2020-07-31 | 森斯尔科技有限公司 | 静电放电保护的半导体光电倍增器 |
CN111480096B (zh) * | 2017-12-14 | 2023-09-29 | 森斯尔科技有限公司 | 静电放电保护的半导体光电倍增器 |
Also Published As
Publication number | Publication date |
---|---|
CN104377250B (zh) | 2017-01-04 |
US9082675B2 (en) | 2015-07-14 |
US20150041627A1 (en) | 2015-02-12 |
HK1207209A1 (zh) | 2016-01-22 |
TW201506435A (zh) | 2015-02-16 |
TWI533013B (zh) | 2016-05-11 |
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