CN104371626A - Epoxy resin adhesive for potting PVDF hollow fiber membrane and preparation method of epoxy resin adhesive - Google Patents
Epoxy resin adhesive for potting PVDF hollow fiber membrane and preparation method of epoxy resin adhesive Download PDFInfo
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- CN104371626A CN104371626A CN201410606987.1A CN201410606987A CN104371626A CN 104371626 A CN104371626 A CN 104371626A CN 201410606987 A CN201410606987 A CN 201410606987A CN 104371626 A CN104371626 A CN 104371626A
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- epoxy resin
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 64
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 64
- 239000012528 membrane Substances 0.000 title claims abstract description 43
- 229920002981 polyvinylidene fluoride Polymers 0.000 title claims abstract description 40
- 239000002033 PVDF binder Substances 0.000 title claims abstract 6
- 238000002360 preparation method Methods 0.000 title claims description 18
- 239000000853 adhesive Substances 0.000 title abstract description 11
- 230000001070 adhesive effect Effects 0.000 title abstract description 11
- 239000012510 hollow fiber Substances 0.000 title abstract description 10
- 238000004382 potting Methods 0.000 title abstract description 7
- 239000000835 fiber Substances 0.000 claims abstract description 30
- -1 polysiloxane Polymers 0.000 claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 12
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 10
- 239000000194 fatty acid Substances 0.000 claims abstract description 10
- 229930195729 fatty acid Natural products 0.000 claims abstract description 10
- 150000002191 fatty alcohols Chemical class 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 7
- 229920005862 polyol Polymers 0.000 claims abstract description 6
- 150000003077 polyols Chemical class 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 36
- 239000013530 defoamer Substances 0.000 claims description 15
- XMVBHZBLHNOQON-UHFFFAOYSA-N 2-butyl-1-octanol Chemical compound CCCCCCC(CO)CCCC XMVBHZBLHNOQON-UHFFFAOYSA-N 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 8
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 5
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 claims description 5
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims description 5
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 abstract description 6
- 239000004814 polyurethane Substances 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 3
- 239000002518 antifoaming agent Substances 0.000 abstract 2
- 239000012745 toughening agent Substances 0.000 abstract 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000002209 hydrophobic effect Effects 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000002791 soaking Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- 239000000565 sealant Substances 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- 238000005266 casting Methods 0.000 description 7
- 230000009194 climbing Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000011343 solid material Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005796 dehydrofluorination reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010842 industrial wastewater Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920001596 poly (chlorostyrenes) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The invention provides an epoxy resin adhesive for potting a PVDF hollow fiber membrane. The epoxy resin adhesive comprises a component A and a component B at a mass ratio of 100 to (15-35), wherein the component A comprises 50-70 parts of epoxy resin, 5-15 parts of a toughening agent and 1-5 parts of a defoaming agent, the component B comprise an amine curing agent, the epoxy resin comprises bisphenol A diglycidyl ether; the toughening agent is a low-molecular polyurethane or polyol glycidyl ether; and the defoaming agent is one or more selected from organic phosphonic acid, polysiloxane, fatty alcohol, fatty acid ester and hydrophobic silicon oxide. The epoxy resin adhesive provided by the invention has the advantages of excellent mechanical property, aging resistance, heat resistance, corrosion resistance, good flexibility and the like, especially, the flexibility is enhanced and the problems of breakage and soaking of a membrane fiber during the potting of the epoxy resin adhesive are solved.
Description
Technical field
The present invention relates to a kind of polyvinylidene difluoride (PVDF) (PVDF) hollow-fibre membrane embedding epoxy resin glue and its preparation method and application method.
Background technology
Hollow-fibre membrane is the one of high molecule micropore filter membrane, and Application Areas is extensive.Compared with other forms of film, hollow-fibre membrane has following outstanding advantages: 1) film silk tamped density is high, and membrane module working area is large; 2) mould material is self-bearing type, and without the need to other supporter, preparation technology is simple; 3) mould material of specific yield is with low cost, and application and popularization value is large.Material for the preparation of hollow-fibre membrane can be organic polymer, as polyvinylidene difluoride (PVDF), polysulfones, polyethersulfone, polyacrylonitrile, polyethylene, polypropylene, polychlorostyrene and alkene etc.; Also can be inorganic materials, as metal, pottery etc.Wherein, PVDF is a kind of macromolecule resin material of excellent property, take PVDF as hollow-fibre membrane prepared by base material, not only has high separation accuracy and high workload efficiency, also there is excellent chemical stability, thermostability, ultraviolet light resistant and aging, and good physical strength.The topmost Application Areas of PVDF hollow-fibre membrane is the occasions that water quality is severe, applied environment is complicated such as sanitary sewage, Industrial Wastewater Treatment and Treated sewage reusing.
Hollow-fibre membranes material needs to use joint sealant to be fixed, and is encapsulated in the putamina according to application-specific Scenario Design, and becoming can for the minimum independent film assembly of application.PVDF hollow-fibre membrane, except having very high requirement to film silk, also requires that potting compound has excellent cohesive strength, mechanical property, anti-aging property, wet-heat resisting characteristic, strong alkali-acid resistance characteristic.In numerous joint sealant systems, epoxy resin joint sealant, because preparation technology is simple, bonding strength is high, the advantage such as weathering resistance and chemical resistance is good, relative low price, is be most widely used the hollow-fibre membrane joint sealant system maximum with consumption at present.But because epoxy resin embedding adhesive adopts amine curing agent mostly, and during cast, heat release is comparatively violent, causes curing exothermic peak relatively high; When casting PVDF hollow-fibre membrane, the amine curing agent of joint sealant neutral and alkali, under higher heat release, can cause PVDF dehydrofluorination and variable color and become fragile, so-called " burning silk ".In addition, due to capillary effect, in membrane module casting cycle, glue can infiltrate along film silk, so-called " climbing silk ", and after epoxy sealing adhesive curing, hardness is large, and cause joint sealant and film silk junction to become fragile, film silk in use easily ruptures.
In order to solve the problem that epoxy resin embedding adhesive burns silk and climbs silk ribbon, current common way is, with polyurethane pouring sealant, second casting is carried out to the membrane module of having cast with epoxy resin glue, after utilizing polyurethane adhesive to solidify, hardness is lower, glue and film silk junction can not be caused after climbing silk to become fragile, in addition, polyurethane pouring sealant can not occur to burn silk phenomenon when casting PVDF.Hollow fiber film assembly after second casting, both the advantage that epoxy resin embedding adhesive cohesive strength is large had been combined, turn avoid the disadvantageous effect that epoxy resin glue causes membrane module with burning silk because climbing silk, is the main encapsulating method of current industrial hollow fiber film assembly.But the cost of polyurethane pouring sealant is higher than epoxy resin glue, cannot be used alone because cohesive strength is less.Introduce the material cost that second casting not only increases joint sealant, also add operation sequence, reduce production efficiency.If it is high to develop a kind of cohesive strength, hardness is moderate, and burning silk when can effectively avoid pvdf membrane silk to cast and the joint sealant of climbing the problems such as silk, have obvious advantage by the batch production of hollow-fibre membrane.
Summary of the invention
The invention provides a kind of exothermic peak is low, ambient temperature curable, hardness are moderate, cohesive strength is high epoxy resin embedding adhesive and methods for making and using same thereof, when this joint sealant is used for the casting of pvdf membrane silk, efficiently avoid the generation of burning silk and climbing the phenomenons such as silk.
Therefore, the invention provides a kind of PVDF hollow-fibre membrane embedding epoxy resin glue, described epoxy resin glue is made up of component A and B component, component A comprises 50-70 part epoxy resin, 5-15 part toughner, 1-5 part defoamer, B component comprises amine curing agent, and the mass ratio of component A and B is 100: 15 ~ 35; Bisphenol A diglycidyl ether is comprised in described epoxy resin, described toughner is low molecule urethane or polyol shrinkaging glycerin ether, described defoamer be selected from organic phospho acid, polysiloxane, fatty alcohol, fatty acid ester, water drain silica one or more.
It is good etc. that epoxy resin glue provided by the invention possesses excellent mechanical property, anti-aging property, heat-resistant quality, erosion resistance, snappiness, especially enhances snappiness and the burning silk that solves in epoxy resin glue potting process and climb a problem.
In a kind of concrete embodiment, described amine curing agent be selected from mphenylenediamine, m-xylene diamine, tetraethylene pentamine, quadrol one or more.
Preferably, described defoamer be organic phospho acid, fatty alcohol or fatty acid ester, with the mixture of water drain silica three, or described defoamer be polysiloxane, fatty alcohol or fatty acid ester, with the mixture of water drain silica three, when above-mentioned preferred version selected by defoamer, more completely can solve sooner and climb a problem in potting process.
Preferably, also comprise lauryl alcohol glycidyl ether and 2-butyl octanol in described epoxy resin, and the epoxy equivalent (weight) of described epoxy resin is less than 200.Be more preferably, in described epoxy resin, the mass ratio of bisphenol A diglycidyl ether, lauryl alcohol glycidyl ether and 2-butyl octanol is 2 ~ 3: 1.2 ~ 2.5: 1.The present inventor found through experiments, although it is also feasible that alone bisphenol A diglycidyl ether forms epoxy resin, but most preferably above-mentioned three kinds of materials are be mixed with obtain epoxy resin at 2 ~ 3: 1.2 ~ 2.5: 1 with mass ratio, it effectively can reduce the severe degree of A in potting process, B component reaction, make exothermic heat of reaction peak and exothermic process controlled, the performance of the PVDF hollow-fibre membrane embedding epoxy resin glue prepared by it is best, in the process of encapsulated epoxy resin glue, can stop completely burn silk and climb the phenomenons such as silk.
In a kind of concrete embodiment, also comprise exothermic heat of reaction when solidifying for reducing embedding in described B component, accelerate the curing catalyst of solidification simultaneously, described curing catalyst is for being selected from phenol, Resorcinol, Whitfield's ointment, 2, one or more in 4,6-tri-(dimethylamino methyl) phenol.
The present invention also provides a kind of preparation method of PVDF hollow-fibre membrane embedding epoxy resin glue described above, comprise the steps: steps A, prepare epoxy resin with the mixture of bisphenol A diglycidyl ether or bisphenol A diglycidyl ether and lauryl alcohol glycidyl ether and 2-butyl octanol; Step B, adds described defoamer and toughner in epoxy resin; Step C, adds B component wherein and forms described PVDF hollow-fibre membrane embedding epoxy resin glue.
When applying epoxy resin glue of the present invention, comprising and first described epoxy resin glue being poured in PVDF hollow fiber film assembly, more at room temperature solidify 24 hours.Those skilled in the art's easy understand, the epoxy resin glue in the present invention is generally now with the current, if need long-term preservation, is then generally that component A and B component are separately deposited.
The present invention also provides a kind of application of PVDF hollow-fibre membrane in water treatment field field of epoxy resin glue embedding as above.
Selected the epoxy resin that a kind of macromolecular material price is cheaper in the present invention, its preparation method is simple, and material mechanical performance is more excellent, is particularly useful for the embedding of PVDF hollow-fibre membrane and uses.With use urethane as compared with PVDF hollow-fibre membrane Embedding Material, packaged material of the present invention is without the need to considering that film silk dries degree and outdoor environment humidity and can realize encapsulation, reduce technology controlling and process cost, improve the machine-shaping characteristic of material, cementability and ageing resistance.Present invention process is simple, easy handling, and continuous seepage efficiency is high, constant product quality.This technology has good industrialization advantage.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail.In the examples below for the preparation of each raw material (such as bisphenol A diglycidyl ether, lauryl alcohol glycidyl ether, 2-butyl octanol, low molecule urethane, polyol shrinkaging glycerin ether, organic phospho acid, polysiloxane, fatty alcohol, fatty acid ester, water drain silica, mphenylenediamine, m-xylene diamine, tetraethylene pentamine, quadrol, phenol, Resorcinol, the Whitfield's ointment, 2 in the component A of the PVDF hollow-fibre membrane embedding epoxy resin glue in the present invention and B component, 4,6-tri-(dimethylamino methyl) phenol) all can be purchased acquisition.
Embodiment 1
Preparation component A: 45g bisphenol A diglycidyl ether, 30g lauryl alcohol glycidyl ether, 15g2-butyl octanol are put in reactor, be heated to 85 DEG C, stir under mixing speed 80rpm, solid material is dissolved completely, add defoamer and 10g low molecular weight polycaprolactone urethane polymers that 5g prepares by the mass ratio such as organic phospho acid, fatty alcohol and water drain silica, abundant stirring makes it to become transparent clarified liq, is cooled to room temperature, obtains component A after vacuum defoamation.Preparation B component: add phenol in phenylenediamine, stir at 25 DEG C, mixing speed is 100rpm, then vacuum defoamation, finally obtains B component.
A, B component are stored in respectively in drying, airtight plastic containers, during use behind 100: 25 fully mixing, obtain PVDF hollow-fibre membrane embedding epoxy resin glue, apply to membrane module cast, cured at room temperature 24 hours, obtains PVDF hollow fiber film assembly.
Embodiment 2
Preparation component A: 50g bisphenol A diglycidyl ether, 45g lauryl alcohol glycidyl ether, 20g2-butyl octanol are put in reactor, be heated to 85 DEG C, stir under mixing speed 80rpm, dissolve completely to solid material, add defoamer and 12g low molecule polyurethane mixture that 7g prepares by the mass ratio such as organic phospho acid, fatty acid ester and water drain silica, fully stir, make it to become transparent clarified liq, vacuum defoamation was cooled to room temperature after 15 minutes, obtained component A.
Preparation B component: add Resorcinol to waiting in the mixture of mass ratio of m-xylene diamine and tetraethylene pentamine, stirring at 25 DEG C, mixing speed is 100rpm, then vacuum defoamation, finally obtains B component.
A, B component are stored in respectively in drying, airtight plastic containers, during use behind 100: 15 fully mixing, obtain PVDF hollow-fibre membrane embedding epoxy resin glue, apply to membrane module cast, cured at room temperature 24 hours, obtains PVDF hollow fiber film assembly.
Embodiment 3
Preparation component A: 40g bisphenol A diglycidyl ether, 25g lauryl alcohol glycidyl ether, 15g2-butyl octanol are put in reactor, be heated to 85 DEG C, stir under mixing speed 80rpm, dissolve completely to solid material, add defoamer and 7g polyol shrinkaging glycerin ether that 3g prepares by the mass ratio such as polysiloxane, fatty alcohol and water drain silica, fully stir, make it to become transparent clarified liq, vacuum defoamation was cooled to room temperature after 15 minutes, obtained component A.
Preparation B component: add Whitfield's ointment to waiting in the mixture of mass ratio of phenylenediamine and quadrol, stirring at 25 DEG C, mixing speed is 100rpm, then vacuum defoamation, finally obtains B component.
A, B component are stored in respectively in drying, airtight plastic containers, during use behind 100: 35 fully mixing, obtain PVDF hollow-fibre membrane embedding epoxy resin glue, apply to membrane module cast, cured at room temperature 24 hours, obtains PVDF hollow fiber film assembly.
Embodiment 4
Preparation component A: 55g bisphenol A diglycidyl ether, 35g lauryl alcohol glycidyl ether, 25g2-butyl octanol are put in reactor, be heated to 85 DEG C, stir under mixing speed 80rpm, dissolve completely to solid material, add defoamer and 9g polyol shrinkaging glycerin ether that 3g prepares by the mass ratio such as polysiloxane, fatty acid ester and water drain silica, fully stir, make it to become transparent clarified liq, vacuum defoamation was cooled to room temperature after 15 minutes, obtained component A.
Preparation B component: to m-xylene diamine and quadrol etc. mass ratio mixture in add 2,4,6-tri-(dimethylamino methyl) phenol and stir at 25 DEG C, mixing speed is 100rpm, then vacuum defoamation, finally obtains B component.
A, B component are stored in respectively in drying, airtight plastic containers, during use behind 100: 25 fully mixing, obtain PVDF hollow-fibre membrane embedding epoxy resin glue, apply to membrane module cast, cured at room temperature 24 hours, obtains PVDF hollow fiber film assembly.
Hardness test is carried out to the PVDF hollow-fibre membrane embedding epoxy resin glue in embodiment 1-4, and leak detection test is carried out to the PVDF hollow fiber film assembly poured into a mould, under the working pressure of 0.1MPa, section, without leak source, runs 30 days caudacoria stack face without subsiding, being out of shape and obscission.
Claims (8)
1. a PVDF hollow-fibre membrane embedding epoxy resin glue, it is characterized in that, described epoxy resin glue is made up of component A and B component, component A comprises 50-70 part epoxy resin, 5-15 part toughner, 1-5 part defoamer, B component comprises amine curing agent, and the mass ratio of component A and B is 100: 15 ~ 35; Bisphenol A diglycidyl ether is comprised in described epoxy resin, described toughner is low molecule urethane or polyol shrinkaging glycerin ether, described defoamer be selected from organic phospho acid, polysiloxane, fatty alcohol, fatty acid ester, water drain silica one or more.
2. embedding epoxy resin glue according to claim 1, is characterized in that, described amine curing agent be selected from mphenylenediamine, m-xylene diamine, tetraethylene pentamine, quadrol one or more.
3. embedding epoxy resin glue according to claim 1 and 2, it is characterized in that, described defoamer be organic phospho acid, fatty alcohol or fatty acid ester, with the mixture of water drain silica three, or described defoamer be polysiloxane, fatty alcohol or fatty acid ester, mixture with water drain silica three.
4. embedding epoxy resin glue according to claim 1 and 2, is characterized in that, also comprise lauryl alcohol glycidyl ether and 2-butyl octanol, and the epoxy equivalent (weight) of described epoxy resin is less than 200 in described epoxy resin.
5. embedding epoxy resin glue according to claim 4, is characterized in that, in described epoxy resin, the mass ratio of bisphenol A diglycidyl ether, lauryl alcohol glycidyl ether and 2-butyl octanol is 2 ~ 3: 1.2 ~ 2.5: 1.
6. embedding epoxy resin glue according to claim 1 and 2, it is characterized in that, in described B component, also comprise curing catalyst, and described curing catalyst is for being selected from phenol, Resorcinol, Whitfield's ointment, 2, one or more in 4,6-tri-(dimethylamino methyl) phenol.
7., as a preparation method for PVDF hollow-fibre membrane embedding epoxy resin glue as described in any one in claim 1 ~ 6, comprise the steps:
Steps A, prepares epoxy resin with the mixture of bisphenol A diglycidyl ether or bisphenol A diglycidyl ether and lauryl alcohol glycidyl ether and 2-butyl octanol;
Step B, adds described defoamer and toughner in epoxy resin;
Step C, adds B component wherein and forms described PVDF hollow-fibre membrane embedding epoxy resin glue.
8. one kind as the epoxy resin glue in claim 1 ~ 6 as described in any one or the application of PVDF hollow-fibre membrane in water treatment field field of epoxy resin glue embedding that prepare of method as claimed in claim 7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410606987.1A CN104371626B (en) | 2014-11-03 | 2014-11-03 | A kind of PVDF hollow-fibre membrane embedding epoxide-resin glue and preparation method thereof |
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| CN201410606987.1A CN104371626B (en) | 2014-11-03 | 2014-11-03 | A kind of PVDF hollow-fibre membrane embedding epoxide-resin glue and preparation method thereof |
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| CN104371626A true CN104371626A (en) | 2015-02-25 |
| CN104371626B CN104371626B (en) | 2016-09-14 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105038674A (en) * | 2015-07-07 | 2015-11-11 | 苏州扬子江新型材料股份有限公司 | Long-life and high-corrosion resistance PVDF film laminated board |
| CN105754531A (en) * | 2016-03-07 | 2016-07-13 | 慧融高科新型材料科技有限公司 | Adhesive for permeable pavement surface and preparation method thereof |
| CN106753131A (en) * | 2016-12-27 | 2017-05-31 | 上海康达化工新材料股份有限公司 | A kind of PVDF hyperfiltration membrane assemblies end-blocking epoxy radicals casting glue and preparation method thereof |
| CN108554188A (en) * | 2017-12-30 | 2018-09-21 | 武汉艾科滤膜技术有限公司 | High humility hollow fiber film yarn casting glue and casting method |
| CN111440578A (en) * | 2020-04-01 | 2020-07-24 | 上海康达化工新材料集团股份有限公司 | Water-treatment epoxy pouring sealant for preventing hollow fiber membrane from discoloring and preparation method thereof |
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| WO2012110230A1 (en) * | 2011-02-15 | 2012-08-23 | Zephyros Inc | Improved structural adhesives |
| CN103642175A (en) * | 2013-11-19 | 2014-03-19 | 南京淳净新材料有限公司 | Normal-temperature fast curing epoxy resin crack pouring agent for roads and bridges |
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- 2014-11-03 CN CN201410606987.1A patent/CN104371626B/en not_active Withdrawn - After Issue
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|---|---|---|---|---|
| WO2012110230A1 (en) * | 2011-02-15 | 2012-08-23 | Zephyros Inc | Improved structural adhesives |
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| CN111440578A (en) * | 2020-04-01 | 2020-07-24 | 上海康达化工新材料集团股份有限公司 | Water-treatment epoxy pouring sealant for preventing hollow fiber membrane from discoloring and preparation method thereof |
| CN111440578B (en) * | 2020-04-01 | 2022-08-12 | 康达新材料(集团)股份有限公司 | Water-treatment epoxy pouring sealant for preventing hollow fiber membrane from discoloring and preparation method thereof |
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