CN102212330A - Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof - Google Patents
Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof Download PDFInfo
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- CN102212330A CN102212330A CN201010140939XA CN201010140939A CN102212330A CN 102212330 A CN102212330 A CN 102212330A CN 201010140939X A CN201010140939X A CN 201010140939XA CN 201010140939 A CN201010140939 A CN 201010140939A CN 102212330 A CN102212330 A CN 102212330A
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- epoxy resin
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Abstract
The invention relates to an epoxy resin adhesive for hollow fiber membrane end sealing. The epoxy resin adhesive is prepared from the following raw materials in parts by weight: 55-75 parts of epoxy, 17-22 parts of curing agent, 5-10 parts of flexibilizer and 10-20 parts of filling material. The invention also correspondingly provides preparation and application methods for the hollow fiber membrane end sealing. The epoxy resin adhesive has the advantages of good bonding property, high compressive strength and room temperature solidification when being used for end sealing of a hollow fiber membrane.
Description
Technical field
The present invention relates to the end encapsulation technique of hollow fiber ultrafiltration membrane or micro-filtration membrane module, more particularly, relate to a kind of hollow-fibre membrane end envelope epoxy resin glue and methods for making and using same thereof.
Background technology
Hollow-fibre membrane is a kind of porous filtering material, is applied to tap water and sewage treatment area mostly, and its principle is by mechanical grading, and with big particulate matter filtering, water molecules can see through.Because the filling area of its unit volume is big, to be convenient to along back flushing, characteristics such as good filtration effect have become the requisite material of water purification industry.Except film itself, the quality of end envelope will directly determine the performance and the life-span of membrane module.
Be used to hold the glue material of envelope to require to be initially liquid, be solidified into solid-stately gradually, and make the termination form integral body.The end closure material of hollow-fibre membrane generally has two kinds of polyurethane adhesive and epoxy resin glues.Wherein polyurethane adhesive is owing to shortcomings such as its strong hydrophobic nature and rapid reaction are used less.Most of usefulness be epoxy resin glue.The simplest end envelope is two components with epoxy resin glue, i.e. Resins, epoxy and solidifying agent.
There are many shortcomings in common epoxy resin glue, and for example: fragility is strong, easy to crack after the Resins, epoxy adhesive curing; Need heat during curing; Curing exotherm is violent, causes implode; Glue can climb higher along hollow-fibre membrane; It is insecure to solidify the back adhesive effect; Cured article is not withstand voltage.
Summary of the invention
The technical problem to be solved in the present invention is, at the above-mentioned end sealing property not good defective of existing hollow-fibre membrane end envelope, provide a kind of hollow-fibre membrane end the envelope epoxy resin glue and methods for making and using same thereof that can at room temperature be cured with epoxy resin glue.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of hollow-fibre membrane end envelope epoxy resin glue and methods for making and using same thereof, adopt Resins, epoxy, solidifying agent, toughner, filler to make, its parts by weight are respectively: Resins, epoxy, 55～75; Solidifying agent, 17～22; Toughner, 5～10; Filler, 10～20.
With in the epoxy resin glue, described Resins, epoxy is the dihydroxyphenyl propane based epoxy resin in hollow-fibre membrane end envelope of the present invention.
With in the epoxy resin glue, described solidifying agent is the amine curing agent that contracts in hollow-fibre membrane end envelope of the present invention.
With in the epoxy resin glue, described solidifying agent is the binary polycondensate of m-xylene diamine in hollow-fibre membrane end envelope of the present invention.
With in the epoxy resin glue, described toughner is active Racemic glycidol ethers toughner in hollow-fibre membrane end envelope of the present invention.
With in the epoxy resin glue, described filler is active inorganic powder in hollow-fibre membrane end envelope of the present invention, and described active inorganic powder is silicon powder, talcum powder, aluminum oxide or titanium dioxide.
With in the epoxy resin glue, the granularity of described active inorganic powder is 400 to 2000 orders in hollow-fibre membrane end envelope of the present invention.
The present invention also provides the preparation method of a kind of hollow-fibre membrane end envelope with epoxy resin glue, may further comprise the steps:
S1, Resins, epoxy and toughner are stirred to evenly;
S2, in step S1 mixed raw materials, add solidifying agent, stirred 2 to 4 minutes;
S3, in step S2 mixed raw materials, add filler, stirred 3 to 5 minutes, obtain glue;
S4, with described glue standing and defoaming 5 to 8 minutes, obtain hollow-fibre membrane end envelope epoxy resin glue.
In hollow-fibre membrane end of the present invention envelope with among the preparation method of epoxy resin glue, described step S1 to the mixing speed among the step S3 be 200-300 rev/min.
The present invention also provides the application method of a kind of hollow-fibre membrane end envelope with epoxy resin glue, may further comprise the steps:
Cast step: use the above-mentioned epoxy resin glue cast end envelope hollow fiber film assembly that makes;
Curing schedule: the described hollow fiber film assembly that will pour into a mould the step acquisition was placed 36 to 96 hours in room temperature.
Implement hollow-fibre membrane end envelope epoxy resin glue and methods for making and using same thereof of the present invention, have following beneficial effect: the epoxy resin glue that the present invention makes can be realized self-vulcanizing, reacting balance when end envelope hollow-fibre membrane, simple to operate, the end sealing property is good.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, now describe the present invention in conjunction with specific embodiments:
In the matrix material raw material of the following example,
Resins, epoxy adopts bisphenol A-type, and viscosity is 5000～10000mPaS under its room temperature.
Solidifying agent is the core component of epoxy resin glue, and is more as the amine curing agent kind of epoxy curing agent, and fatty amine is arranged, and as quadrol, diethylenetriamine, triethylene tetramine, hexanediamine etc., types such as aliphatic cyclic amine, aromatic amine, polymeric amide arranged in addition.Usually, small molecules amine solidifying agent curing reaction is violent, when end envelope cast tubular fibre, cause implode easily, and macromolecular solidifying agent such as polyamide-based its viscosity are big, mobile poor, speed of response is too slow, is difficult to form between tubular fibre complete filling, and choosing of therefore suitable solidifying agent is most important.Amine curing agent of the present invention is the amine curing agent that contracts, the binary polycondensate of preferred m-xylene diamine, and its structural formula is:
Toughner can adopt commercially available active Racemic glycidol ethers toughner, and toughness and shock resistance by toughner raising cured article overcome fragility.
The effect of filler is a solidification value of stablizing glue, avoids implode, reduces climbing of glue, reduces the shrinking percentage of cured article, reduces the cost of glue simultaneously.Filler adopts active inorganic powder: silicon powder, talcum powder, aluminum oxide or titanium dioxide.Packing material size is 400 to 2000 orders.
In the preparation method of the following example, with Resins, epoxy, solidifying agent, toughner, 4 components of filler according to described preset proportion weighing, the weighing of each component and stirring are in proper order: the good Resins, epoxy of first weighing is poured stirred pot into, the good toughner of weighing is poured into again, turn on agitator stirs two components earlier; Pour load weighted solidifying agent then into, stirred 2 to 4 minutes; Pour powder filler at last into, stirred 3 to 5 minutes.Wherein, mixing the rotating speed that stirs is 200～300 rev/mins.After treating that each component stirs, glue standing and defoaming 5 to 8 minutes can begin cast end envelope.
In the application method of the following example, the epoxy resin glue that uses the present invention to make is held envelope to hollow fiber film assembly earlier, work in-process hollow fiber film assembly after subsequently cast being finished was at room temperature placed 36 to 96 hours, promptly solidified to finish, and the ambient temperature scope refers generally to 15 to 35 ℃.
Embodiment 1
The raw material that takes by weighing following mass fraction is according to above-mentioned preparation epoxy resin glue: dihydroxyphenyl propane based epoxy resin, 62.5; M-xylene diamine binary polycondensate solidifying agent, 18.75; Racemic glycidol ethers toughner, 6.25; Active micro silicon powder, 12.5.The epoxy resin glue that makes is held envelope to hollow fiber film assembly, and the work in-process hollow fiber film assembly after subsequently cast being finished was at room temperature placed 72 hours, promptly solidified to finish.
Embodiment 2
The raw material that takes by weighing following mass fraction is according to above-mentioned preparation epoxy resin glue: dihydroxyphenyl propane based epoxy resin, 55; Polyamide-based solidifying agent, 22; Polyethers toughner toughner, 5; Talcum powder, 18.The epoxy resin glue that makes is held envelope to hollow fiber film assembly, and the work in-process hollow fiber film assembly after subsequently cast being finished was at room temperature placed 36 hours, promptly solidified to finish.
Embodiment 3
The raw material that takes by weighing following mass fraction is according to above-mentioned preparation epoxy resin glue: dihydroxyphenyl propane based epoxy resin, 63; The fat amine curing agent, 17; Polyester toughner toughner, 10; Aluminum oxide, 10.The epoxy resin glue that makes is held envelope to hollow fiber film assembly, and the work in-process hollow fiber film assembly after subsequently cast being finished was at room temperature placed 96 hours, promptly solidified to finish.
Embodiment 4
The raw material that takes by weighing following mass fraction is according to above-mentioned preparation epoxy resin glue: dihydroxyphenyl propane based epoxy resin, 70; M-xylene diamine binary polycondensate solidifying agent, 17; Polyester toughner toughner, 5; Titanium dioxide, 20.The epoxy resin glue that makes is held envelope to hollow fiber film assembly, and the work in-process hollow fiber film assembly after subsequently cast being finished was at room temperature placed 60 hours, promptly solidified to finish.
Experimental result
The hollow fiber film assembly that embodiment 1 to embodiment 4 middle-end is sealed is hunted leak: adopt the external pressure of 0.4MPa air pressure inspection hollow-fibre membrane, end face does not have leak source, and epoxy resin glue is bonding firmly; Adopt the hydraulic pressure of 1.0MPa to suppress the end face 10,000 times of membrane module, end face does not have and subsides and be out of shape, and the distance of subsiding is less than 0.2mm, is significantly less than the membrane module (membrane module of common end envelope subside under same experimental conditions apart from generally greater than 2mm) of common end envelope.This shows that the epoxy resin glue that the present invention makes can be realized self-vulcanizing when end envelope hollow-fibre membrane, and simple to operate, the end sealing property is good.
Claims (10)
1. a hollow-fibre membrane end envelope is used epoxy resin glue, it is characterized in that, is made by the raw material of following parts by weight:
Resins, epoxy 55～75;
Solidifying agent 17～22;
Toughner 5～10;
Filler 10～20.
2. hollow-fibre membrane end envelope according to claim 1 is used epoxy resin glue, it is characterized in that described Resins, epoxy is the dihydroxyphenyl propane based epoxy resin.
3. hollow-fibre membrane end envelope according to claim 1 is used epoxy resin glue, it is characterized in that described solidifying agent is the amine curing agent that contracts.
4. hollow-fibre membrane end envelope according to claim 3 is used epoxy resin glue, it is characterized in that the described amine curing agent that contracts is the binary polycondensate of m-xylene diamine.
5. hollow-fibre membrane end envelope according to claim 1 is used epoxy resin glue, it is characterized in that described toughner is active Racemic glycidol ethers toughner.
6. hollow-fibre membrane end envelope according to claim 1 is used epoxy resin glue, it is characterized in that described filler is active inorganic powder, and described active inorganic powder is silicon powder, talcum powder, aluminum oxide or titanium dioxide.
7. hollow-fibre membrane end envelope according to claim 6 is used epoxy resin glue, it is characterized in that the granularity of described active inorganic powder is 400 to 2000 orders.
8. a hollow-fibre membrane end seals the preparation method who uses epoxy resin glue, it is characterized in that, may further comprise the steps:
S1, Resins, epoxy and toughner are stirred to evenly;
S2, in step S1 mixed raw materials, add solidifying agent, stirred 2 to 4 minutes;
S3, in step S2 mixed raw materials, add filler, stirred 3 to 5 minutes, obtain glue;
S4, with described glue standing and defoaming 5 to 8 minutes, obtain hollow-fibre membrane end envelope epoxy resin glue.
9. hollow-fibre membrane end according to claim 8 envelope is characterized in that with the preparation method of epoxy resin glue, described step S1 to the mixing speed among the step S3 be 200-300 rev/min.
10. a hollow-fibre membrane end seals the application method of using epoxy resin glue, it is characterized in that, may further comprise the steps:
Cast step: the epoxy resin glue cast end envelope hollow fiber film assembly that uses claim 8 to make;
Curing schedule: the described hollow fiber film assembly that will pour into a mould the step acquisition was placed 36 to 96 hours in room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010140939XA CN102212330A (en) | 2010-04-07 | 2010-04-07 | Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof |
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| CN201010140939XA CN102212330A (en) | 2010-04-07 | 2010-04-07 | Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof |
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| CN102212330A true CN102212330A (en) | 2011-10-12 |
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| CN201010140939XA Pending CN102212330A (en) | 2010-04-07 | 2010-04-07 | Epoxy resin adhesive for hollow fiber membrane end sealing as well as preparation and application methods thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102600727A (en) * | 2012-04-09 | 2012-07-25 | 天津华泉环保设备有限公司 | Method for pouring hollow fibrous membrane assembly |
| CN102641664A (en) * | 2012-04-17 | 2012-08-22 | 浙江理工大学 | Pouring method for polytetrafluoroethylene hollow fiber membrane assembly |
| CN104059590A (en) * | 2014-06-09 | 2014-09-24 | 蓝星（成都）新材料有限公司 | Room-temperature-curing toughened epoxy resin adhesive and preparation method thereof |
| CN106867202A (en) * | 2017-03-29 | 2017-06-20 | 哈尔滨工业大学 | A kind of composition epoxy resin |
| JP2017136548A (en) * | 2016-02-03 | 2017-08-10 | 積水フーラー株式会社 | Potting agent for hollow fiber membrane module |
| CN108913078A (en) * | 2018-07-12 | 2018-11-30 | 江苏润达滤材有限公司 | A kind of special glue of end cap for foldable filter element and filter cloth bonding |
| CN109351197A (en) * | 2018-10-31 | 2019-02-19 | 国家海洋局天津海水淡化与综合利用研究所 | A kind of preparation method of single internal pressure hollow-fibre membrane cross-current type component |
| CN109475810A (en) * | 2016-08-08 | 2019-03-15 | 旭化成株式会社 | Gas separation membrane component |
| CN110947305A (en) * | 2018-09-27 | 2020-04-03 | 北京铂阳顶荣光伏科技有限公司 | Hollow fiber membrane packaging method and hollow fiber membrane module |
| CN111331762A (en) * | 2020-02-24 | 2020-06-26 | 沈阳中航迈瑞特工业有限公司 | Preparation process of epoxy resin daub mould |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102600727A (en) * | 2012-04-09 | 2012-07-25 | 天津华泉环保设备有限公司 | Method for pouring hollow fibrous membrane assembly |
| CN102641664A (en) * | 2012-04-17 | 2012-08-22 | 浙江理工大学 | Pouring method for polytetrafluoroethylene hollow fiber membrane assembly |
| CN104059590A (en) * | 2014-06-09 | 2014-09-24 | 蓝星（成都）新材料有限公司 | Room-temperature-curing toughened epoxy resin adhesive and preparation method thereof |
| JP2017136548A (en) * | 2016-02-03 | 2017-08-10 | 積水フーラー株式会社 | Potting agent for hollow fiber membrane module |
| CN109475810A (en) * | 2016-08-08 | 2019-03-15 | 旭化成株式会社 | Gas separation membrane component |
| CN106867202A (en) * | 2017-03-29 | 2017-06-20 | 哈尔滨工业大学 | A kind of composition epoxy resin |
| CN108913078A (en) * | 2018-07-12 | 2018-11-30 | 江苏润达滤材有限公司 | A kind of special glue of end cap for foldable filter element and filter cloth bonding |
| CN110947305A (en) * | 2018-09-27 | 2020-04-03 | 北京铂阳顶荣光伏科技有限公司 | Hollow fiber membrane packaging method and hollow fiber membrane module |
| CN109351197A (en) * | 2018-10-31 | 2019-02-19 | 国家海洋局天津海水淡化与综合利用研究所 | A kind of preparation method of single internal pressure hollow-fibre membrane cross-current type component |
| CN111331762A (en) * | 2020-02-24 | 2020-06-26 | 沈阳中航迈瑞特工业有限公司 | Preparation process of epoxy resin daub mould |
| CN111331762B (en) * | 2020-02-24 | 2021-12-28 | 沈阳中航迈瑞特工业有限公司 | Preparation process of epoxy resin daub mould |
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Application publication date: 20111012 |