CN103756615B - Polyolefin polymer modified binder material for organic electroluminescent device - Google Patents
Polyolefin polymer modified binder material for organic electroluminescent device Download PDFInfo
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- CN103756615B CN103756615B CN201410037094.XA CN201410037094A CN103756615B CN 103756615 B CN103756615 B CN 103756615B CN 201410037094 A CN201410037094 A CN 201410037094A CN 103756615 B CN103756615 B CN 103756615B
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- electroluminescent device
- organic electroluminescent
- binder material
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- epoxy resin
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Abstract
A composited binder material for packaging a electroluminescent device comprises 65.0-75.0% of organic silicon/epoxy resin matrix, 0.3-4.6% of ferroferric oxide fiber material, 2.0% of tetraethoxysilanecross-linking agent, 18.0-29.5% of the mixture of polyvinyl alcohol and polyethylene, and the balance of the assistant and a phthalic acid ester plasticizer, wherein the ratio of length to diameter of the fiber material is 4-6.
Description
Technical field
The invention relates to a kind of packaged material of electroluminescent cell, more specifically, method for packing of the present invention adopts a kind of adhesive property good, and the sealing-in binder material of the defect such as can improve that cause due to matrix material stress clear-cut is easily split.
Background technology
Organic electroluminescent device (OELD) is a kind of novel planar display device of current development newly developed, have unlatching and driving voltage low, and can direct voltage drive, can match with large-scale integrated circuit, easily realize full color, luminosity high (>105cd/m2), the advantages such as quantum luminous efficiency high (2.01m/w), but OELD device can't meet application requiring work-ing life, one of the technical difficulty solved wherein is needed to be exactly packaged material and the encapsulation technology of device.Organic membrane material in organic electroluminescent device for aqueous vapor and oxygen all very sensitive, be because aqueous vapor and oxygen can cause organic membrane material to worsen, and then affect the work-ing life of organic electroluminescent device.In order to effectively get rid of the impact of the factor such as aqueous vapor, oxygen on organic electroluminescent device, the work-ing life of extension element, therefore must encapsulate organic electroluminescent device.At present, abroad (Japan and the United States, Europe etc.) mainly adopts the packaged material such as epoxy resin, organosilicon and heat, light, radiation curing technology, but also there is many weak points, make epoxy resin embrittlement easy to crack as the crazing that produces due to internal stress effect, make degradation under sealing property.Also there is industrial waste resource simultaneously.The encapsulation binder material seeking to meet OELD device performance becomes focus and the key of current OELD device research and development.
Plate, in the use procedure of panel, when cover plate and/or substrate are subject to self gravitation or external force local compression and are bending time, can make glass cover-plate contact with the Organic Light Emitting Diode on substrate, thus Organic Light Emitting Diode is squeezed and damages.
Summary of the invention
Object of the present invention is just to provide a kind of electric device package binder material newly, the deformation that the packaging process of device is simple, set time is short, prevent stress from causing can be made, meanwhile, a kind of method for packing adopting above-mentioned binding agent to carry out electroluminescent device encapsulation is provided.
Polyolefin polymers, if polyethylene polypropylene etc. is owing to having good reproducibility and nontoxic property, is that the environmental protective polymer of generally acknowledging at present is more and more widely used.Meanwhile, its cohesiveness is strong, and expansion/contraction stable performance own, contributes to the cracking embrittlement phenomenon preventing stress from producing.Meanwhile, iron fiber doping is adopted.Further even adhesion agent distribution, prevents adhesive particle shape to be entangled with agglomerating.
1, a kind of encapsulation for electroluminescent device uses compoiste adhering agent material, and its weight consists of:
Organosilicon/the epoxy matrix material of 65.0-75.0%,
The Z 250 filamentary material of 0.3-4.6%,
The ratio of this filamentary material length and diameter is about 4-6,
2.0% positive silicic acid ester linking agent,
18.0-29.5% polyvinyl alcohol and poly mixture,
Auxiliary agent and phthalate plasticizers,
Its total amount meets 100%.
2, adhesive material as claimed in claim 1, wherein auxiliary agent also includes Ployethylene Wax,
3, binder material as claimed in claim 1, can also add the tinting material identical with the color such as device framework background.
This composition reduces the weight percent that common are machine silicon/epoxy resin, reduces its detrimentally affect in stress.And improve the consumption of ep-type material polyolefin polymers, meanwhile, do not reduce the viscosity of this binder material.
Accompanying drawing explanation
Embodiment
Its technological line is as follows:
The preparation of modifying epoxy resin by organosilicon substrate material:
To be organosilicon and each 7 grams of the epoxy resin of 1: 1 by weight ratio, be dissolved in 10 milliliters of isopyknic dimethylbenzene and cyclohexanone solvent respectively, electromagnetic force stirs, temperature is 50 DEG C, churning time is 4 hours, then above-mentioned solution is mixed to join in the three neck round-bottomed flasks of 100 milliliters, electromagnetic force stirs, vary with temperature with separating funnel again and drip dibutyltin dilaurate catalyst 0.01 mole gradually, final temp controls at 136 DEG C, react 10 hours, shallow yellow transparent solution is obtained after back flow reaction completes, solvent is removed again through underpressure distillation, namely modifying epoxy resin by organosilicon matrigel material is obtained, its form is the light yellow clear colloidal materials of thickness.
There is the preparation of the Z 250 filamentary material of uneven surface:
Adopt hydrothermal method.By Iron nitrate, Trisodium Citrate and distilled water according to after the ratio mixing of 1.5: 3: 50, add gelatin to mixture, obtain the water-sol.Utilize strong base-weak acid salt by the ph value to 8.5 of the water-sol, react under 240-300 degree Celsius and obtain for 3 hours.
Wherein, Z 250 filamentary material has uneven surface, is the Z 250 fiber of porous surface.This fibrous texture significantly increases its specific surface area, and be conducive to absorption or be dispersed among binding agent, the ratio of its length and diameter is 4-6.The diameter in the hole on its surface is 20-30nm.
Diameter is 100-150nm.To obtain the ratio of aperture and the diameter be applicable to, thus effectively improve the dispersiveness of fiber and there is appropriate adsorptivity.Z 250 filamentary material accounts for binder material gross weight than being 0.3-4.6%.
In the present invention, can also add tinting material, its consumption is less than 0.5% of cohesive material gross weight, and the color of tinting material selects the color identical with background or seal frame as far as possible.
Adopt the method for packing of the present invention's binder material used:
Method 1, first provide glass substrate containing organic electroluminescent LED, then with point gum machine, composite adhered agent material is coated the surface of each organic electroluminescent LED on glass substrate.Re-use glass cover-plate and cover organic electroluminescent LED, and by binding agent and glass substrate pressing, then make binding agent air-set, complete the encapsulation of organic electroluminescent LED 302.
Method 2, there is stamping forming crown cap, with point gum machine by the edge of adhesive coated in crown cap, and moisture absorption layer is configured in crown cap.Crown cap is positioned, makes it correspond to the position of element for package on glass substrate.The glass substrate with electroluminescent diode is covered above crown cap, and by the edge pressing of tackiness agent by itself and crown cap, another tackiness agent air-set.
According to binding agent of the present invention, its adhesive property is stablized, and ensures overheated or under various ambient moisture validity, adopts this binding agent to encapsulate organic electroluminescence device, improve life-span and the performance of electroluminescent device.
Claims (3)
1., for an electroluminescent device encapsulation compoiste adhering agent material, its weight consists of:
The modifying epoxy resin by organosilicon matrix of 65.0-75.0%,
The Z 250 filamentary material of 0.3-4.6%,
The ratio of this filamentary material length and diameter is 4-6,
The own ester linking agent of 2.0% positive silicic acid,
18.0-29.5% polyvinyl alcohol and poly mixture,
Auxiliary agent and phthalate plasticizers,
Its total amount meets 100%.
2. compoiste adhering agent material as claimed in claim 1, wherein auxiliary agent also includes polyethylene wax.
3. compoiste adhering agent material as claimed in claim 1, also adds the tinting material identical with device framework background color.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410037094.XA CN103756615B (en) | 2014-01-26 | 2014-01-26 | Polyolefin polymer modified binder material for organic electroluminescent device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410037094.XA CN103756615B (en) | 2014-01-26 | 2014-01-26 | Polyolefin polymer modified binder material for organic electroluminescent device |
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| CN103756615A CN103756615A (en) | 2014-04-30 |
| CN103756615B true CN103756615B (en) | 2015-02-04 |
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| CN201410037094.XA Active CN103756615B (en) | 2014-01-26 | 2014-01-26 | Polyolefin polymer modified binder material for organic electroluminescent device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11320570B2 (en) | 2020-04-08 | 2022-05-03 | Delta Electronics, Inc. | Wavelength converting device |
| EP4298176A1 (en) * | 2021-02-24 | 2024-01-03 | Henkel AG & Co. KGaA | Photocurable adhesive composition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1270979A (en) * | 2000-05-10 | 2000-10-25 | 吉林大学 | Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide |
| CN103173175A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Organic silicone modified epoxy resin sealant and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5545246B2 (en) * | 2010-03-30 | 2014-07-09 | 信越化学工業株式会社 | Resin composition, reflector for light emitting semiconductor element, and light emitting semiconductor device |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1270979A (en) * | 2000-05-10 | 2000-10-25 | 吉林大学 | Organic silicon/epoxy resin packing material modified with nanometer-level silicon-base oxide |
| CN103173175A (en) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | Organic silicone modified epoxy resin sealant and preparation method thereof |
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| CN103756615A (en) | 2014-04-30 |
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