CN104369087A - 一种研磨机气压伺服系统的压力控制方法 - Google Patents
一种研磨机气压伺服系统的压力控制方法 Download PDFInfo
- Publication number
- CN104369087A CN104369087A CN201410557075.XA CN201410557075A CN104369087A CN 104369087 A CN104369087 A CN 104369087A CN 201410557075 A CN201410557075 A CN 201410557075A CN 104369087 A CN104369087 A CN 104369087A
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- China
- Prior art keywords
- pressure
- workpiece
- top lap
- value
- grinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000006837 decompression Effects 0.000 claims description 17
- 230000000052 comparative effect Effects 0.000 claims description 12
- 238000012545 processing Methods 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410557075.XA CN104369087B (zh) | 2014-10-21 | 2014-10-21 | 一种研磨机气压伺服系统的压力控制方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410557075.XA CN104369087B (zh) | 2014-10-21 | 2014-10-21 | 一种研磨机气压伺服系统的压力控制方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104369087A true CN104369087A (zh) | 2015-02-25 |
CN104369087B CN104369087B (zh) | 2016-09-07 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201410557075.XA Active CN104369087B (zh) | 2014-10-21 | 2014-10-21 | 一种研磨机气压伺服系统的压力控制方法 |
Country Status (1)
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CN (1) | CN104369087B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105014521A (zh) * | 2015-05-27 | 2015-11-04 | 苏州德锐朗智能科技有限公司 | 一种平面研磨机三段式上盘升降速度控制方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3691697A (en) * | 1970-09-21 | 1972-09-19 | Hamco Mach & Elect Co | Pressure control for lapping device |
JP2000127024A (ja) * | 1998-10-27 | 2000-05-09 | Toshiba Corp | ポリッシング装置及び研磨加工方法 |
KR100670716B1 (ko) * | 2003-04-11 | 2007-01-18 | 맥 밸브즈, 인크. | 정압 및 부압 공급능이 있는 비례식 압력 조절기 |
CN101905444A (zh) * | 2009-06-04 | 2010-12-08 | 株式会社荏原制作所 | 修整装置、修整方法和抛光装置 |
CN102133730A (zh) * | 2011-01-06 | 2011-07-27 | 清华大学 | 一种用于cmp抛光头多区的气压控制系统 |
CN102133733A (zh) * | 2011-01-06 | 2011-07-27 | 清华大学 | 一种用于cmp多腔室的气压控制系统 |
CN102884612A (zh) * | 2011-01-03 | 2013-01-16 | 应用材料公司 | 压力控制的抛光压板 |
TW201404536A (zh) * | 2012-07-23 | 2014-02-01 | Ebara Corp | 壓力控制裝置、具備該壓力控制裝置之研磨裝置及研磨方法 |
CN203738563U (zh) * | 2014-02-28 | 2014-07-30 | 江苏海事职业技术学院 | 一种基于plc的平面高速研磨机 |
-
2014
- 2014-10-21 CN CN201410557075.XA patent/CN104369087B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3691697A (en) * | 1970-09-21 | 1972-09-19 | Hamco Mach & Elect Co | Pressure control for lapping device |
JP2000127024A (ja) * | 1998-10-27 | 2000-05-09 | Toshiba Corp | ポリッシング装置及び研磨加工方法 |
KR100670716B1 (ko) * | 2003-04-11 | 2007-01-18 | 맥 밸브즈, 인크. | 정압 및 부압 공급능이 있는 비례식 압력 조절기 |
CN101905444A (zh) * | 2009-06-04 | 2010-12-08 | 株式会社荏原制作所 | 修整装置、修整方法和抛光装置 |
CN102884612A (zh) * | 2011-01-03 | 2013-01-16 | 应用材料公司 | 压力控制的抛光压板 |
CN102133730A (zh) * | 2011-01-06 | 2011-07-27 | 清华大学 | 一种用于cmp抛光头多区的气压控制系统 |
CN102133733A (zh) * | 2011-01-06 | 2011-07-27 | 清华大学 | 一种用于cmp多腔室的气压控制系统 |
TW201404536A (zh) * | 2012-07-23 | 2014-02-01 | Ebara Corp | 壓力控制裝置、具備該壓力控制裝置之研磨裝置及研磨方法 |
CN203738563U (zh) * | 2014-02-28 | 2014-07-30 | 江苏海事职业技术学院 | 一种基于plc的平面高速研磨机 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105014521A (zh) * | 2015-05-27 | 2015-11-04 | 苏州德锐朗智能科技有限公司 | 一种平面研磨机三段式上盘升降速度控制方法 |
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Publication number | Publication date |
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CN104369087B (zh) | 2016-09-07 |
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Effective date of registration: 20160810 Address after: 266045 Shandong province Qingdao City, Zhengzhou Road No. 43 building 130 room A Applicant after: Qingdao Rubber Valley Intellectual Property Co.,Ltd. Address before: Taishan road Suzhou City, Jiangsu province 215299 Suzhou high tech Industrial Development Zone No. 2 Canton Technology Park 10 building 324 Applicant before: Suzhou Hexinmei Electronic Technology Co., Ltd. |
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Effective date of registration: 20170626 Address after: 519060 Guangdong city of Zhuhai province Nan Ping Ping North Road No. 22 building first floor workshop 03 Patentee after: Zhuhai Binhe mechanical equipment Co. Ltd. Address before: 266045 Shandong province Qingdao City, Zhengzhou Road No. 43 building 130 room A Patentee before: Qingdao Rubber Valley Intellectual Property Co.,Ltd. |
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