CN104360289A - Modular power fault recording circuit and device - Google Patents

Modular power fault recording circuit and device Download PDF

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Publication number
CN104360289A
CN104360289A CN201410617508.6A CN201410617508A CN104360289A CN 104360289 A CN104360289 A CN 104360289A CN 201410617508 A CN201410617508 A CN 201410617508A CN 104360289 A CN104360289 A CN 104360289A
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CN
China
Prior art keywords
circuit
control chip
master control
power failure
voltage
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CN201410617508.6A
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Chinese (zh)
Inventor
杜垚
王军
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709th Research Institute of CSIC
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709th Research Institute of CSIC
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Priority to CN201410617508.6A priority Critical patent/CN104360289A/en
Publication of CN104360289A publication Critical patent/CN104360289A/en
Pending legal-status Critical Current

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Abstract

The invention provides a modular power fault recording circuit. A main control chip is connected to a power state information acquiring module, a calendar chip, a storage module, an auxiliary power supply and an interface circuit electrically; the power state information acquiring module acquires the real-time state information of the power supply within a preset frequency and transmits the real-time state information to the main control chip; the calendar chip transmits the time information of the real-time state information to the main control chip; the main control chip stores the real-time state information and the time information into the storage module; the interface circuit is used for providing a connecting interface for an external upper computer and main control chip, and the external upper computer reads the real-time state information and the time information acquired by the main control chip from the storage module through the interface circuit; the auxiliary power supply is used for supplying power for a circuit body.

Description

Modular power failure logging circuit and device
Technical field
The present invention relates to electronic equipment power source detection field, particularly a kind of modular power failure logging circuit and device.
Background technology
Along with more and more higher to the requirement of reliability of electronic equipment, the application of installation of various fault diagnosis is also more and more extensive, but the location of the fault of power supply also rests on the stage analyzed again after fault occurs.
Analysis after power failure, usually due to condition when fault occurs cannot be described, and cannot accurate localizing faults reason, need repetition test just can find out cause and effect, waste time and energy.Sometimes localization of fault is to certain device, but can not determine the problem that outside or inside causes.
Summary of the invention
For solving the problem that electronic equipment power source fault cannot accurately be located and failure cause cannot accurately ascertain, be necessary to provide a kind of can accurately the modular power failure logging circuit of Positioning Power fault and device.
A kind of modular power failure logging circuit, described modular power failure logging circuit comprises Master control chip, power state information acquisition module, calendar chip, memory module, accessory power supply, interface circuit;
Master control chip is electrically connected with power state information acquisition module, calendar chip, memory module, accessory power supply, interface circuit respectively;
Power state information acquisition module is used for the real time status information of the frequency collection power supply preset, and real time status information is transmitted to Master control chip;
The temporal information that calendar chip is used for when power state information acquisition module being gathered the real time status information of power supply sends to Master control chip;
Master control chip sends real time status information and calendar chip transmission time information for receiving power state information acquisition module, and real time status information and temporal information are dumped to memory module;
Interface circuit is for providing the connecting interface of outside host computer and Master control chip, and outside host computer reads the real time status information that obtains from memory module of Master control chip and temporal information by interface circuit;
Accessory power supply is used for powering for modular power failure logging circuit.
The present invention also provides a kind of modular power failure recording device, and it comprises above-mentioned modular power failure logging circuit and a metal sealing housing;
Described metal sealing housing is used for accommodating modular power failure logging circuit, metal sealing housing is offered the through hole for providing the pin of modular power failure logging circuit to connect external circuit.
Modular power failure logging circuit provided by the invention, by power state information acquisition module with the real time status information of the frequency collection power supply preset; And the temporal information that calendar chip is used for when power state information acquisition module being gathered the real time status information of power supply sends to Master control chip, real time status information and temporal information are dumped to memory module by Master control chip, so outside host computer just can read by interface circuit the real time status information and temporal information that Master control chip obtains from memory module, host computer can the mode of waveform be shown, for the analysis of power fail provides details.
Modular power failure recording device provided by the invention, by being placed in metal sealing housing by modular power failure logging circuit, when can prevent power failure, on fire, blast damages this modular power failure recording device.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of the modular power failure logging circuit that embodiment of the present invention provides;
Fig. 2 is the annexation schematic diagram of power state information acquisition module and Master control chip in Fig. 1;
Fig. 3 is the annexation schematic diagram of multiple-channel output voltage in Fig. 2, current acquisition unit and Master control chip;
Fig. 4 is the structural representation of calendar chip in Fig. 1;
Fig. 5 is the annexation schematic diagram of multiplex temperature collection unit and Master control chip in Fig. 2.
Embodiment
As shown in Figure 1, the embodiment of the present invention provides a kind of modular power failure logging circuit, and described modular power failure logging circuit comprises Master control chip 1, power state information acquisition module 2, calendar chip 3, memory module 4, accessory power supply 5, interface circuit 6.
Master control chip 1 is electrically connected with power state information acquisition module 2, calendar chip 3, memory module 4, accessory power supply 5, interface circuit 6 respectively.
Real time status information for the real time status information of frequency collection power supply preset, and is transmitted to Master control chip 1 by power state information acquisition module 2.
Alternatively, as shown in Figure 2, power state information acquisition module 2 comprises input voltage collecting unit 21, input current collecting unit 22, multiple-channel output voltage, current acquisition unit 23, multiplex temperature collection unit 24.
Input voltage collecting unit 21, input current collecting unit 22, multiple-channel output voltage, current acquisition unit 23, multiplex temperature collection unit 24 is electrically connected with Master control chip 1 respectively.
Alternatively, as shown in Figure 5, multiplex temperature collection unit 24 comprise at least two temperature sensor IC1, IC2 to ICn, IC1, IC2 to ICn place in circuit voltage pin Vcc be parallel-connected to the Vcc pin of Master control chip 1 (FPGA); The digital signal input and output pin DQ of IC1, IC2 to ICn is parallel-connected to the pin DQ of Master control chip 1 (FPGA); The grounding pin GND of IC1, IC2 to ICn is parallel-connected to the grounding pin GND of Master control chip 1.Resistance R3 is connected between Vcc and the DQ pin of IC1, IC2 to ICn.
Input voltage collecting unit 21 is for gathering the input voltage value of power supply.
Input current collecting unit 22 is for gathering the input current value of power supply.
Multiple-channel output voltage, current acquisition unit 23 are for gathering voltage, the current value of the multiple-channel output of power supply.
Alternatively, multiple-channel output voltage, current acquisition unit 23 comprise at least two output voltages, current acquisition subelement, output voltage, current acquisition subelement are for gathering road voltage or a current analog signal, voltage or current analog signal are carried out nursing one's health and isolation amplifier, and the voltage after conditioning and isolation amplifier or current analog signal are converted to digital signal, digital signal is sent to Master control chip 1.
Alternatively, as shown in Figure 3, multiple-channel output voltage, current acquisition unit 23 comprise at least two output voltages, current acquisition subelement.As first via voltage, current acquisition subelement 23a, the second road voltage, current acquisition subelement 23b to the n-th road voltage, current acquisition subelement 23n.
First via output voltage, current acquisition subelement 23a comprise first via signal conditioning circuit 231a (signal conditioning circuit), first via linear optical coupling circuit 232a (linear optical coupling circuit), first via DC-DC feed circuit 234a (DC-DC feed circuit 234a), first via ADC change-over circuit 233a (ADC change-over circuit).
First via linear optical coupling circuit 232a is electrically connected with first via signal conditioning circuit 231a, first via ADC change-over circuit 233a respectively; First via DC-DC feed circuit 234a is electrically connected with first via signal conditioning circuit 231a, first via linear optical coupling circuit 232a respectively; First via ADC change-over circuit 233a is electrically connected with Master control chip 1.
First via signal conditioning circuit 231a is used for nursing one's health the voltage received or current analog signal, and the voltage after conditioning or current analog signal are sent to first via linear optical coupling circuit 232a.
First via linear optical coupling circuit 232a is used for carrying out isolation amplifier to the voltage after conditioning received or current analog signal, and sends to first via ADC change-over circuit 233a by through the voltage of isolation amplifier or current analog signal.
Alternatively, linear optical coupling circuit comprises linear optical coupling and operational amplifier;
Linear optical coupling for reducing outside environmental elements to the voltage after conditioning or the interference of current analog signal;
Operational amplifier is used for carrying out operation amplifier to the voltage after conditioning or current analog signal.
First via ADC change-over circuit 233a is used for the voltage through isolation amplifier received or current analog signal to be converted to digital signal, and digital signal is sent to Master control chip 1.
First via DC-DC feed circuit 234a is used for powering for first via signal conditioning circuit 231a and first via linear optical coupling circuit 232a.
Second road voltage, current acquisition subelement 23b to the n-th road voltage, current acquisition subelement 23n are roughly the same with the structure of first via voltage, current acquisition subelement 23a.
In like manner, input voltage collecting unit 21 is also roughly the same with the structure of first via voltage, current acquisition subelement 23a with input current collecting unit 22.
Certainly, the embodiment of the present invention does not limit the structure of input voltage collecting unit 21 and input current collecting unit 22, multiple-channel output voltage, current acquisition unit 23, as long as can realize and input voltage collecting unit 21 and input current collecting unit 22, multiple-channel output voltage, function that current acquisition unit 23 is identical.
May not altogether between tested power supply Zhong Ge road power supply, so quarantine measures must be adopted to gather the state of each road power supply.Phototube Coupling is the electrical isolation method generally adopted at present, and linear optical coupling has the features such as good temperature characterisitic, the linearity and low-power consumption because of it, and is widely used in the isolation design between simulating signal.The conditioning part of each road input end of analog signal and the input end of linear optical coupling adopt independently DC-DC feed circuit to power, simulating signal Jin Yugai road, every road signal conditioning circuit altogether, make between the simulating signal to be measured of each road, simulating signal to be measured and each road output voltage, to isolate mutually between current acquisition subelement, ensure that the electric independence of simulating signal to be measured.
Calendar chip 3 sends to Master control chip 1 for temporal information when power state information acquisition module 2 being gathered the real time status information of power supply.
Alternatively, calendar chip 3 is electrically connected with Master control chip 1 by iic bus.
Alternatively, as shown in Figure 4, the structural representation of a kind of embodiment of calendar chip 3 is as follows, and the oscillator output pin OSCO of clock chip CLOCK is connected with one end of crystal oscillator Crystal, and the other end of crystal oscillator Crystal is by tunable capacitor C1 ground connection; The oscillator input pin OSCI of clock chip CLOCK is connected between tunable capacitor C1 and crystal oscillator Crystal.The positive supply pin Vdd of the Vdd pin of clock chip CLOCK is connected to the negative pole of diode D2, and the positive pole of diode D2 is connected to positive supply Vdd; The negative pole of diode D1 is connected between the negative pole of diode D2 and the Vdd pin of clock chip CLOCK, and the positive pole of diode D1 is connected to the positive pole of battery BAT, the minus earth of battery BAT.The positive pole of polar capacitor C2 is connected between the negative pole of diode D2 and the Vdd pin of clock chip CLOCK, the minus earth of polar capacitor C2.The serial clock access pin SCL of clock chip CLOCK by the SCL line being linked into IIC-Bus be connected to main transceiver MASTER TRANSMITTER/RECEIVER serial clock access pin SCL; The serial data I/O pin SDA of clock chip CLOCK by the SDA line being linked into IIC-Bus be connected to main transceiver MASTER TRANSMITTER/RECEIVER serial data I/O pin SDA.The positive supply pin Vdd of main transceiver MASTER TRANSMITTER/RECEIVER is connected to positive supply Vdd, the circuit common ground terminal voltage pin Vss ground connection of main transceiver MASTER TRANSMITTER/RECEIVER.Pull-up resistor R1 and R2 is connected between the SDA line of IIC-Bus and SCL line after connecting, and is connected to positive supply Vdd between pull-up resistor R1 and R2.
Master control chip 1 sends real time status information and calendar chip 3 transmission time information for receiving power state information acquisition module 2, and real time status information and temporal information are dumped to memory module 4.
Master control chip 1 can be FPGA.
The peripheral components of the embodiment of the present invention is not more, and steering logic is complicated, and the logical sequence that therefore FPGA produces various complexity just can control the work of peripheral chip harmonious orderly, meets the requirement of power fail record.
Memory module 4 is for storing real time status information and temporal information.
Alternatively, memory module 4 is the NAND FLASH storage chip of multi-disc parallel connection.
When the information data of recording power, each sample record amount, probably at 512byte, is such as calculated with the sampling rate of 100K, and data volume is 51.2M/s, and the data volume of 10 seconds is 512M.Therefore inventive embodiments preferably adopts high-speed high capacity to store, store data after a power failure simultaneously, the traditional memory technology such as EEPROM due to capacity little, speed is low, be not suitable for the storage of high-speed high capacity, therefore choose NANDFLASH as storage chip, the requirement of high-speed high capacity can be realized by multi-disc parallel connection.
Interface circuit 6 is for providing the connecting interface of outside host computer and Master control chip 1, and outside host computer reads by interface circuit 6 real time status information and temporal information that Master control chip 1 obtains from memory module 4.
Alternatively, interface circuit 6 is electrically connected with Master control chip 1 by subordinate fifo interface.
Accessory power supply 5 is for powering for modular power failure logging circuit.
Accessory power supply 5 can ensure when outside abnormal electrical power supply, and modular power failure logging circuit still can run a period of time by accessory power supply 5, ensures that whole Master control chip 1 normally runs.Battery powers to calendar chip 3 simultaneously, and ensure the correct of system time, accessory power supply 5 can maintain calendar chip 3 standby more than 5 years.
The principle of work of the embodiment of the present invention is as follows: the modular power failure logging circuit of the embodiment of the present invention just can be installed in power supply after the initialization time of initialization calendar chip 3, when having detected that power supply inputs, modular power failure logging circuit is started working, with the various information of the sample rate of predeterminated frequency (such as 100K) ceaselessly recording power, (the temperature of power supply when the power fails, power supply input and output voltage exceeds normal range, overcurrent), record trouble time point, and record predetermined time period (before and after such as fault 5 seconds, amount to 10 seconds) waveform of the various parameters of duration, reproduction power fail.Later stage can read these parameters by upper computer software, is shown in the mode of waveform, for the analysis of fault provides information.These information can take time shaft as horizontal ordinate, parameters is ordinate, show, be convenient to analyzing failure cause by the form of waveform.
The modular power failure logging circuit that the embodiment of the present invention provides, by power state information acquisition module 2 with the real time status information of the frequency collection power supply preset; And calendar chip 3 sends to Master control chip 1 for temporal information when power state information acquisition module 2 being gathered the real time status information of power supply, real time status information and temporal information are dumped to memory module 4 by Master control chip 1, so outside host computer just can read by interface circuit 6 real time status information and temporal information that Master control chip 1 obtains from memory module 4, host computer can the mode of waveform be shown, for the analysis of power fail provides information.
The present invention also provides a kind of modular power failure recording device, and it comprises the modular power failure logging circuit as described in any one and a metal sealing housing that provide as above-described embodiment;
Described metal sealing housing is used for accommodating modular power failure logging circuit, metal sealing housing is offered the through hole for providing the pin of modular power failure logging circuit to connect external circuit.
The modular power failure recording device that the embodiment of the present invention provides, by being placed in metal sealing housing by modular power failure logging circuit, when can prevent power failure, on fire, blast damages this modular power failure recording device.This modular power failure recording device adopts metal all-sealed structure in structure structure; the various situations such as chip blast, the quick-fried slurry of electric capacity, printed board be on fire may be there is in power supply when breaking down; the hermetic structural design of employing metal can well protect the integrated circuit in this device, ensures that pen recorder can not damage when there is above-mentioned situation.Metal sealing body height is preferably no more than 12.7mm (power module calibrated altitude).To sum up, modular power failure recording device can record relevant voltage, electric current and temperature information when power fail, reliable information is provided for analyzing power fail, and isolation design is carried out in isolation on whole device sample circuit, and adopt packed by metal casing, ensure the characteristic that it possesses " black box ".
The software module that the method described in conjunction with embodiment disclosed herein or the step of algorithm can directly use hardware, processor to perform, or the combination of the two is implemented.Software module can be placed in random access memory, internal memory, ROM (read-only memory), electrically programmable ROM, electricity can sassafras except any other forms of storage medium known in programming ROM, register, hard disk, moveable magnetic disc, CD-ROM or technical field.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.

Claims (9)

1. a modular power failure logging circuit, is characterized in that, described modular power failure logging circuit comprises Master control chip, power state information acquisition module, calendar chip, memory module, accessory power supply, interface circuit;
Master control chip is electrically connected with power state information acquisition module, calendar chip, memory module, accessory power supply, interface circuit respectively;
Power state information acquisition module is used for the real time status information of the frequency collection power supply preset, and real time status information is transmitted to Master control chip;
The temporal information that calendar chip is used for when power state information acquisition module being gathered the real time status information of power supply sends to Master control chip;
Master control chip sends real time status information and calendar chip transmission time information for receiving power state information acquisition module, and real time status information and temporal information are dumped to memory module;
Memory module is for storing real time status information and temporal information;
Interface circuit is for providing the connecting interface of outside host computer and Master control chip, and outside host computer reads the real time status information that obtains from memory module of Master control chip and temporal information by interface circuit;
Accessory power supply is used for powering for modular power failure logging circuit.
2. modular power failure logging circuit as claimed in claim 1, it is characterized in that, power state information acquisition module comprises input voltage collecting unit, input current collecting unit, multiple-channel output voltage, current acquisition unit, multiplex temperature collection unit;
Input voltage collecting unit, input current collecting unit, multiple-channel output voltage, current acquisition unit, multiplex temperature collection unit are electrically connected with Master control chip respectively.
3. modular power failure logging circuit as claimed in claim 2, it is characterized in that, multiple-channel output voltage, current acquisition unit comprise at least two output voltages, current acquisition subelement, output voltage, current acquisition subelement are for gathering road voltage or a current analog signal, voltage or current analog signal are carried out nursing one's health and isolation amplifier, and the voltage after conditioning and isolation amplifier or current analog signal are converted to digital signal, digital signal is sent to Master control chip.
4. modular power failure logging circuit as claimed in claim 3, it is characterized in that, output voltage, current acquisition subelement comprise signal conditioning circuit, linear optical coupling circuit, DC-DC feed circuit, ADC change-over circuit;
Linear optical coupling circuit is electrically connected with signal conditioning circuit, ADC change-over circuit respectively; DC-DC feed circuit are electrically connected with signal conditioning circuit, linear optical coupling circuit respectively; ADC change-over circuit is electrically connected with Master control chip;
Signal conditioning circuit is used for nursing one's health the voltage received or current analog signal, and the voltage after conditioning or current analog signal are sent to linear optical coupling circuit;
Linear optical coupling circuit is used for carrying out isolation amplifier to the voltage after conditioning received or current analog signal, and sends to ADC change-over circuit by through the voltage of isolation amplifier or current analog signal;
ADC change-over circuit is used for the voltage through isolation amplifier received or current analog signal to be converted to digital signal, and digital signal is sent to Master control chip;
DC-DC feed circuit are used for powering for signal conditioning circuit and linear optical coupling circuit.
5. modular power failure logging circuit as claimed in claim 4, it is characterized in that, linear optical coupling circuit comprises linear optical coupling and operational amplifier;
Linear optical coupling for reducing outside environmental elements to the voltage after conditioning or the interference of current analog signal;
Operational amplifier is used for carrying out operation amplifier to the voltage after conditioning or current analog signal.
6. modular power failure logging circuit as claimed in claim 1, it is characterized in that, calendar chip is electrically connected with Master control chip by iic bus.
7. modular power failure logging circuit as claimed in claim 1, it is characterized in that, memory module is the NAND FLASH storage chip of multi-disc parallel connection.
8. modular power failure logging circuit as claimed in claim 1, is characterized in that, interface circuit is electrically connected with Master control chip by subordinate fifo interface.
9. a modular power failure recording device, is characterized in that, it comprises modular power failure logging circuit as described in any one of claim 1 to 8 and a metal sealing housing;
Described metal sealing housing is used for accommodating modular power failure logging circuit, metal sealing housing is offered the through hole for providing the pin of modular power failure logging circuit to connect external circuit.
CN201410617508.6A 2014-11-03 2014-11-03 Modular power fault recording circuit and device Pending CN104360289A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201410617508.6A CN104360289A (en) 2014-11-03 2014-11-03 Modular power fault recording circuit and device

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CN106708234A (en) * 2016-12-28 2017-05-24 郑州云海信息技术有限公司 Method and device for monitoring states of power supplies of system on basis of CPLD
CN106850237A (en) * 2015-12-03 2017-06-13 中兴通讯股份有限公司 The management method and device of terminal supplying power in a kind of active Ethernet
CN110729704A (en) * 2018-07-17 2020-01-24 东芝存储器株式会社 Power supply device, control method of power supply circuit, and storage device

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CN106850237A (en) * 2015-12-03 2017-06-13 中兴通讯股份有限公司 The management method and device of terminal supplying power in a kind of active Ethernet
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CN110729704A (en) * 2018-07-17 2020-01-24 东芝存储器株式会社 Power supply device, control method of power supply circuit, and storage device

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