CN104359557B - A kind of double; two spectrum imaging devices for deep space probing - Google Patents
A kind of double; two spectrum imaging devices for deep space probing Download PDFInfo
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- CN104359557B CN104359557B CN201410744658.3A CN201410744658A CN104359557B CN 104359557 B CN104359557 B CN 104359557B CN 201410744658 A CN201410744658 A CN 201410744658A CN 104359557 B CN104359557 B CN 104359557B
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Abstract
The present invention relates to a kind of double; two spectrum imaging devices for deep space probing, comprise: lower house, it has an accommodation chamber, and top arranges opening;Upper cover plate, its covering is arranged in the open top of described lower house, and fixing with described lower house is connected;Information board, it is fixedly installed on the accommodation intracavity of described lower house;Visual light imaging unit, it is arranged on described information board, and is connected with described upper cover plate;Infrared imaging unit, it is arranged on described information board, and is connected with described upper cover plate.The present invention has visible ray and infrared imaging ability simultaneously, therefore has the high advantage not limited by illumination condition with infrared imaging of visual light imaging resolution concurrently, and adapts to space mechanics and the radiation environment of harshness.
Description
Technical field
The present invention relates to a kind of imaging device for deep space probing, specifically refer to a kind of double; two spectrum imaging devices with visual light imaging and infrared imaging ability, can under harsh space environment, do not realized the round-the-clock to extraterrestrial target with being limited monitor and observation by illumination, belong to the technical field of spatial light Electrical imaging.
Background technology
Photoelectric imaging technology is to observe one of movable directly perceived, the most the most frequently used approach of space.Therefore, current various spacecrafts both domestic and external are generally provided with supervision camera, it is possible to the live space of observed object imaging even real time imaging is movable." curious number " Mars probes of the such as U.S., the Shenzhou airship of China and " goddess in the moon No. 3 " aircraft etc..
According to the difference of imaging spectral, photoelectric imaging technology generally can be divided into ultraviolet imagery, visual light imaging and infrared imaging etc..At present, it is seen that photoimaging technology is highly developed, it is common to be applied to the fields such as digital vedio recording, industrial detection and medical image.Domestic outer spacecraft almost all adopt Visible Light Camera as the equipment of supervision.Visual light imaging has the advantages such as resolution height, detection range be remote, but is limited by illumination condition, it is impossible in shadow region imaging.
Infrared imaging is " thermal imaging " that be commonly called as, by the temperature imaging of sensitive detection target, not by the restriction of illumination condition, compensate for the weak point of visual light imaging well.Under setting off close to the space background of absolute zero, infrared imaging can obtain bigger temperature contrast and good imaging effect.But comparing visual light imaging technology, there is the deficiencies such as resolution is not high, responsiveness is low in infrared imaging.
Additionally, civil camera common at present is difficult to bear the enormous impact produced when carrier rocket is launched and vibration in structural design, the cosmic radiation in space environment and single particle effect equally also cannot be adapted to.
Based on above-mentioned, need badly at present provide a kind of can the imaging device of integrated visual light imaging and infrared imaging, it is made to have the high advantage not limited by illumination with infrared imaging of visual light imaging resolution concurrently, when section in office can imaging and passive imaging, also there is the ability of anti-complicated mechanical environment and spatial environments simultaneously.
Summary of the invention
It is an object of the invention to provide a kind of double; two spectrum imaging devices for deep space probing, there is visible ray and infrared imaging ability simultaneously, therefore have the high advantage not limited by illumination condition with infrared imaging of visual light imaging resolution concurrently, and adapt to space mechanics and the radiation environment of harshness.
For achieving the above object, the present invention provides a kind of double; two spectrum imaging devices for deep space probing, comprises: lower house, and it has an accommodation chamber, and top arranges opening;Upper cover plate, its covering is arranged in the open top of described lower house, and fixing with described lower house is connected;Information board, it is fixedly installed on the accommodation intracavity of described lower house;Visual light imaging unit, it is arranged on described information board, and is connected with described upper cover plate;Infrared imaging unit, it is arranged on described information board, and is connected with described upper cover plate.
Described double; two spectrum imaging devices also comprise: power panel, and it is fixedly installed on the accommodation intracavity of described lower house by a beam structure, are positioned at the top of described information board, and with this information board by being electrically connected, it is provided that working power.
Described visual light imaging unit comprises: the visible light lens of transmission-type, and it is directly connected to be arranged on upper cover plate by flange-interface;Visible light sensor, it passes through welded and installed on information board, and is directed at described visible light lens;Target subject is focused on visible light sensor by certain amplification and carries out opto-electronic conversion by this visible light lens, converts optical signals to digital picture.
Described infrared imaging unit comprises: the infrared lens of transmission-type, and it is directly connected to be arranged on upper cover plate by flange-interface, and with the described asymmetric setting of visible light lens;Infrared sensor, it passes through welded and installed on information board, and is directed at described infrared lens;Target subject is focused on infrared sensor by certain amplification and carries out opto-electronic conversion by this infrared lens, converts optical signals to digital picture.
Described information board is additionally provided with: information process unit, it passes through to be electrically connected with described visible light sensor and infrared sensor respectively, it is made up of FPGA and DSP, visible light sensor and infrared sensor the digital picture being converted to is carried out image procossing and compression;LVDS interface, itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.
The sidewall of described lower house is provided with some fixing ears, each fixing ear is provided with the first fixing hole, utilize some screws correspondence respectively through each first fixing hole, to be fixed on satellite body by lower house.
Four corners in the lower surface of described lower house are respectively arranged with projection, and described information board is fixedly installed on those projections so that leave gap between information board and the lower surface of lower house.
The lower surface of described lower house is provided with some reinforcements.
Be provided with DSP heat radiation boss in the lower surface of described lower house, FPGA dispels the heat boss and infrared sensor heat radiation boss, and it lays respectively at the vertical lower of DSP, FPGA and infrared sensor.
Described visible light lens is provided with visible ray focusing pad, described infrared lens is provided with infrared focusing pad.
In sum, double; two spectrum imaging devices for deep space probing provided by the present invention, there is visible ray and infrared imaging ability simultaneously, therefore the high advantage not limited by illumination condition with infrared imaging of visual light imaging resolution is had concurrently, reach the space operations such as deep space probing provide a kind of not by time and illumination limited monitor effect continuously, and adapt to space mechanics and the radiation environment of harshness.
Accompanying drawing explanation
Fig. 1 is the appearance schematic diagram of the double; two spectrum imaging devices for deep space probing in the present invention;
Fig. 2 is the sectional view of the double; two spectrum imaging devices for deep space probing in the present invention;
Fig. 3 is the decomposing schematic representation of the double; two spectrum imaging devices for deep space probing in the present invention;
Fig. 4 is the schematic diagram of the lower house in the present invention.
Detailed description of the invention
Below in conjunction with Fig. 1~Fig. 4, describe a preferred embodiment of the present invention in detail.
As shown in FIG. 1 to 3, the double; two spectrum imaging devices for deep space probing provided by the invention, comprise: lower house 4, it has an accommodation chamber, and top arranges opening;Upper cover plate 3, its covering is arranged in the open top of described lower house 4, and fixing with described lower house 4 is connected;Information board 6, it is fixedly installed on the accommodation intracavity of described lower house 4;Visual light imaging unit, it is arranged on described information board 6, and is connected with described upper cover plate 3;Infrared imaging unit, it is arranged on described information board 6, and is connected with described upper cover plate 3.
Described double; two spectrum imaging devices also comprise: power panel 5, and it is fixedly installed on the accommodation intracavity of described lower house 4 by a beam structure, are positioned at the top of described information board 6, and with this information board 6 by being electrically connected, it is provided that working power.
Described visual light imaging unit comprises: visible light lens 1, and it is directly connected to be arranged on upper cover plate 3 by flange-interface;Visible light sensor 7, it passes through welded and installed on information board 6, and is directed at described visible light lens 1;Target subject is focused on visible light sensor 7 by certain amplification and carries out opto-electronic conversion by this visible light lens 1, converts optical signals to digital picture.
Described infrared imaging unit comprises: infrared lens 2, and it is directly connected to be arranged on upper cover plate 3 by flange-interface, and with the described asymmetric setting of visible light lens 1;Infrared sensor 8, it passes through welded and installed on information board 6, and is directed at described infrared lens 2;Target subject is focused on infrared sensor 8 by certain amplification and carries out opto-electronic conversion by this infrared lens 2, converts optical signals to digital picture.
Described visible light lens 1 and infrared lens 2 all adopt transmissive design.
Described information board 6 is additionally provided with: information process unit, it passes through to be electrically connected with described visible light sensor 7 and infrared sensor 8 respectively, by FPGA(FieldProgrammableGateArray, field programmable gate array) and DSP(DigitalSignalProcess, digital signal processor) composition, the digital picture being converted to by visible light sensor 7 and infrared sensor 8 is carried out image procossing and compression, referred to herein as image procossing include strengthening picture quality, improving contrast etc.;LVDS(LowVoltageDifferentialSignaling, low-voltage differential signal) interface, itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.It is to say, visual light imaging spectral coverage and infrared imaging spectral coverage in the present invention share an information process unit and output interface.
As shown in Figure 4, the sidewall of described lower house 4 is provided with some fixing ears 45, each fixing ear is provided with the first fixing hole 46, utilize some M4 screws correspondence respectively through each first fixing hole 46, to be fixed on satellite body by lower house 4.
In a preferred embodiment of the invention, arranging at the two ends, bottom of the both sides sidewall of lower house 4 and amount to 4 fixing ears 45, the diameter of the first fixing hole 46 on each fixing ear is 4.5mm, can pass through 4 M4 screws and is fixed on satellite body by lower house 4.
In a preferred embodiment of the invention, four corners of described upper cover plate 3 are respectively arranged with the second fixing hole, open-topped four corners of described lower house 4 are correspondingly arranged on the 3rd fixing hole respectively, 4 M4 screws are utilized to sequentially pass through the second fixing hole and the 3rd fixing hole of correspondence respectively, it is achieved the connection between upper cover plate 3 and lower house 4 is fixed.
In a preferred embodiment of the invention, four corners of described information board 6 are respectively arranged with the 4th fixing hole, four corners in the lower surface of described lower house 4 are correspondingly arranged on projection 47 respectively, each projection 47 offers the 5th fixing hole, 4 M2 screws are utilized to sequentially pass through the 4th fixing hole and the 5th fixing hole of correspondence respectively, the connection realized between information board 6 and lower house 4 is fixed, and make to leave between the lower surface of information board 6 and lower house 4 gap, and the height in described gap is the height of projection 47.
As shown in Figure 4, owing to being provided with gap between lower surface and the information board 6 of described lower house 4, therefore some reinforcements 42 are set in the lower surface of described lower house 4, to guarantee the mechanical performance of whole pair of spectrum imaging device.
As shown in Figure 4, can also arrange DSP heat radiation boss 41 in the lower surface of described lower house 4, FPGA dispels the heat boss 43 and infrared sensor heat radiation boss 44 simultaneously, it lays respectively at DSP, FPGA and the vertical lower of infrared sensor 8, while coordinating the heat radiation of high power consuming devices, Primary Component protective action be can also be played, its anti-space radiation and the performance of single-particle impact strengthened.
In a preferred embodiment of the invention, as it is shown on figure 3, described visible light lens 1 is provided with visible ray focusing pad 9, described infrared lens 2 is provided with infrared focusing pad 10, it is thus possible to visible light lens 1 and infrared lens 2 are carried out manual focusing, make target subject blur-free imaging.
Shown in Fig. 3, described lower house 4 is additionally provided with the sign board 12 that can dismantle flexibly.And on described sign board 12, it is additionally provided with the product socket 11 of right-angled bend form, to realize modularity.
Double; two spectrum imaging devices for deep space probing provided by the invention, it will be seen that spectrum segment and non-brake method LONG WAVE INFRARED spectral coverage are integrated in double; two spectrum imaging devices, equipped with visible light lens independent mutually and infrared lens in this pair of spectrum imaging device;And in order to realize the miniaturization of whole equipment, two described camera lenses all adopt transmissive design, and are directly installed on upper cover plate by flange-interface.
Double; two spectrum imaging devices for deep space probing provided by the invention, its power line portion comprises power panel and two pieces of circuit boards of information board, and imageable target focuses on the visible light sensor on information board respectively by visible light lens and infrared lens and carries out opto-electronic conversion acquisition digital picture on infrared sensor;And by the information processing system that double; two spectrum are shared, digital picture is carried out image procossing and compression, export eventually through LVDS interface.
Double; two spectrum imaging devices for deep space probing provided by the invention, are additionally provided with reinforcement on lower house so that it is can bear mechanics vibration, the impact etc. that produce when carrier rocket is launched with flight in-orbit;And core component (such as DSP, FPGA and infrared sensor) is equipped with heat radiation boss respectively, by the means such as reinforcement protection and Redundancy Design so that it is adapt to the radiation of spatial environments, single particle effect etc. simultaneously.
In sum, double; two spectrum imaging devices for deep space probing provided by the present invention, there is visible ray and infrared imaging ability simultaneously, therefore the high advantage not limited by illumination condition with infrared imaging of visual light imaging resolution is had concurrently, reach the space operations such as deep space probing provide a kind of not by time and illumination limited monitor effect continuously, and adapt to space mechanics and the radiation environment of harshness.
Although present disclosure has been made to be discussed in detail already by above preferred embodiment, but it should be appreciated that the description above is not considered as limitation of the present invention.After those skilled in the art have read foregoing, multiple amendment and replacement for the present invention all will be apparent from.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (8)
1. the double; two spectrum imaging devices for deep space probing, it is characterised in that comprise:
Lower house (4), it has an accommodation chamber, and top arranges opening;
Upper cover plate (3), its covering is arranged in the open top of described lower house (4), and fixing with described lower house (4) is connected;
Information board (6), it is fixedly installed on the accommodation intracavity of described lower house (4);This information board is provided with, on (6), the information process unit being made up of FPGA and DSP;
Visual light imaging unit, it is arranged on described information board (6), and is connected with described upper cover plate (3);
Infrared imaging unit, it is arranged on described information board (6), and is connected with described upper cover plate (3);This infrared imaging unit comprises welded and installed infrared sensor (8) on information board (6);
Wherein, four corners in the lower surface of described lower house (4) are respectively arranged with projection (47), and described information board (6) is fixedly installed on those projections (47), make to leave gap between the lower surface of information board (6) and lower house (4);
Being provided with DSP heat radiation boss (41), FPGA heat radiation boss (43) and infrared sensor heat radiation boss (44) in the lower surface of described lower house (4), it lays respectively at DSP, FPGA and the vertical lower of infrared sensor (8).
2. the double; two spectrum imaging devices for deep space probing as claimed in claim 1, it is characterized in that, also comprise power panel (5), it is fixedly installed on the accommodation intracavity of described lower house (4) by a beam structure, it is positioned at the top of described information board (6), and with this information board (6) by being electrically connected, it is provided that working power.
3. the double; two spectrum imaging devices for deep space probing as claimed in claim 2, it is characterised in that described visual light imaging unit comprises:
The visible light lens (1) of transmission-type, it is directly connected to be arranged on upper cover plate (3) by flange-interface;
Visible light sensor (7), it passes through welded and installed on information board (6), and is directed at described visible light lens (1);
Wherein, target subject is focused on visible light sensor (7) by certain amplification and carries out opto-electronic conversion by described visible light lens (1), converts optical signals to digital picture.
4. the double; two spectrum imaging devices for deep space probing as claimed in claim 3, it is characterised in that described infrared imaging unit also comprises:
The infrared lens (2) of transmission-type, it is directly connected to be arranged on upper cover plate (3) by flange-interface, and with described visible light lens (1) asymmetric setting;
Wherein, described infrared sensor (8) is directed at this infrared lens (2);Target subject is focused on infrared sensor (8) by certain amplification and carries out opto-electronic conversion by described infrared lens (2), converts optical signals to digital picture.
5. the double; two spectrum imaging devices for deep space probing as claimed in claim 4, it is characterized in that, described information process unit passes through to be electrically connected with described visible light sensor (7) and infrared sensor (8) respectively, visible light sensor (7) and infrared sensor (8) digital picture being converted to is carried out image procossing and compression;
Being additionally provided with LVDS interface on described information board (6), itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.
6. the double; two spectrum imaging devices for deep space probing as claimed in claim 1, it is characterized in that, the sidewall of described lower house (4) is provided with some fixing ears (45), each fixing ear is provided with the first fixing hole (46), some screws correspondence respectively is utilized through each first fixing hole (46), to be fixed on satellite body by lower house (4).
7. the double; two spectrum imaging devices for deep space probing as claimed in claim 1, it is characterised in that be provided with some reinforcements (42) in the lower surface of described lower house (4).
8. the double; two spectrum imaging devices for deep space probing as claimed in claim 4, it is characterised in that be provided with visible ray focusing pad (9) on described visible light lens (1);Described infrared lens (2) is provided with infrared focusing pad (10).
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CN106706129A (en) * | 2016-12-30 | 2017-05-24 | 中国科学院西安光学精密机械研究所 | Standard modularization spaceborne spectrometer |
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CN202488561U (en) * | 2012-03-23 | 2012-10-10 | 田锦林 | Wireless infrared video camera |
CN103323113A (en) * | 2013-05-30 | 2013-09-25 | 中国科学院长春光学精密机械与物理研究所 | Multispectral imager based on light fieldd imaging technique |
CN103743485A (en) * | 2014-01-17 | 2014-04-23 | 北京航空航天大学 | Full polarization spectrum imaging system for synchronously detecting ground feature light and skylight |
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CN202488561U (en) * | 2012-03-23 | 2012-10-10 | 田锦林 | Wireless infrared video camera |
CN103323113A (en) * | 2013-05-30 | 2013-09-25 | 中国科学院长春光学精密机械与物理研究所 | Multispectral imager based on light fieldd imaging technique |
CN103743485A (en) * | 2014-01-17 | 2014-04-23 | 北京航空航天大学 | Full polarization spectrum imaging system for synchronously detecting ground feature light and skylight |
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