CN104359557A - Dual spectral imaging equipment for space exploration - Google Patents
Dual spectral imaging equipment for space exploration Download PDFInfo
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- CN104359557A CN104359557A CN201410744658.3A CN201410744658A CN104359557A CN 104359557 A CN104359557 A CN 104359557A CN 201410744658 A CN201410744658 A CN 201410744658A CN 104359557 A CN104359557 A CN 104359557A
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- lower house
- information board
- imaging devices
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- 238000000701 chemical imaging Methods 0.000 title abstract 4
- 230000009977 dual effect Effects 0.000 title abstract 4
- 238000003384 imaging method Methods 0.000 claims abstract description 62
- 238000003331 infrared imaging Methods 0.000 claims abstract description 24
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 238000001228 spectrum Methods 0.000 claims description 29
- 230000000007 visual effect Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 230000005693 optoelectronics Effects 0.000 claims description 7
- 230000002787 reinforcement Effects 0.000 claims description 5
- 210000005069 ears Anatomy 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 abstract 2
- 238000005286 illumination Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
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Abstract
The invention relates to dual spectral imaging equipment for space exploration. The dual spectral imaging equipment comprises a lower shell, an upper cover plate, an information plate, a visible light imaging unit and an infrared imaging unit, wherein an accommodation cavity is formed in the lower shell; an opening is formed in the top of the lower shell; the upper cover plate covers the top opening of the lower shell and is fixedly connected with the lower shell; the information plate is fixedly arranged inside the accommodation cavity of the lower shell; the visible light imaging unit is arranged on the information plate and is connected with the upper cover plate; the infrared imaging unit is arranged on the information plate and is connected with the upper cover plate. Due to visible light and infrared imaging capability, the dual spectral imaging equipment has the advantages that the visible light imaging resolution ratio is high and the infrared imaging is not limited by light conditions, and is applicable to rigorous space mechanics and radiation environments.
Description
Technical field
The present invention relates to a kind of imaging device for deep space probing, specifically refer to a kind of two spectrum imaging devices simultaneously with visual light imaging and infrared imaging ability, can under harsh space environment, do not realize monitoring and observation the round-the-clock of extraterrestrial target by illumination restriction ground, belong to the technical field of spatial light Electrical imaging.
Background technology
Photoelectric imaging technology observes one of movable directly perceived, the most the most frequently used approach of space.Therefore, current various spacecraft both domestic and external is generally provided with supervision camera, can to the observed object imaging even live space activity of realtime graphic." curious number " Mars probes of the such as U.S., the Shenzhou airship of China and " goddess in the moon No. 3 " aircraft etc.
According to the difference of imaging spectral, photoelectric imaging technology generally can be divided into ultraviolet imagery, visual light imaging and infrared imaging etc.At present, visual light imaging technology is very ripe, is widely used in the fields such as digital vedio recording, industrial detection and medical image.Domestic outer spacecraft almost all adopt Visible Light Camera as surveillance equipment.Visual light imaging has the advantages such as resolution is high, detection range is far away, but is limited by illumination condition, cannot in shadow region imaging.
Infrared imaging is " thermal imaging " that be commonly called as, by the temperature imaging of sensitive detection target, not by the restriction of illumination condition, compensate for the weak point of visual light imaging well.Under the space background close to absolute zero sets off, infrared imaging can obtain larger temperature contrast and good imaging effect.But comparing visual light imaging technology, there is the deficiencies such as resolution is not high, responsiveness is low in infrared imaging.
In addition, civil camera common is at present difficult to enormous impact and the vibration of bearing generation when carrier rocket is launched in structural design, equally also cannot adapt to the cosmic radiation in space environment and single particle effect.
Based on above-mentioned, need badly at present provide a kind of can the imaging device of integrated visual light imaging and infrared imaging, it is made to have the high and infrared imaging of visual light imaging resolution concurrently by the advantage that illumination limits, when section in office can imaging and passive imaging, also has the ability of anti-complicated mechanical environment and space environment simultaneously.
Summary of the invention
The object of this invention is to provide a kind of two spectrum imaging devices for deep space probing, there is visible ray and infrared imaging ability simultaneously, therefore have the high and infrared imaging of visual light imaging resolution concurrently by the advantage of illumination condition restriction, and space mechanics and the radiation environment of harshness can be adapted to.
For achieving the above object, the invention provides a kind of two spectrum imaging devices for deep space probing, comprise: lower house, it has a container cavity, and top arranges opening; Upper cover plate, its covering is arranged in the open top of described lower house, and is fixedly connected with described lower house; Information board, it is fixedly installed in the container cavity of described lower house; Visual light imaging unit, it is arranged on described information board, and is connected with described upper cover plate; Infrared imaging unit, it is arranged on described information board, and is connected with described upper cover plate.
Described two spectrum imaging devices also comprise: power panel, and it is fixedly installed in the container cavity of described lower house by a beam structure, are positioned at the top of described information board, and with this information board by being electrically connected, provide working power.
Described visual light imaging unit comprises: the visible light lens of transmission-type, and it is directly mounted on upper cover plate by flange-interface; Visible light sensor, its by welded and installed on information board, and aim at described in visible light lens; Target subject is focused on visible light sensor by certain magnification and carries out opto-electronic conversion by this visible light lens, and light signal is converted to digital picture.
Described infrared imaging unit comprises: the infrared lens of transmission-type, and it is directly mounted on upper cover plate by flange-interface, and setting asymmetric with described visible light lens; Infrared sensor, its by welded and installed on information board, and aim at described in infrared lens; Target subject is focused on infrared sensor by certain magnification and carries out opto-electronic conversion by this infrared lens, and light signal is converted to digital picture.
Described information board is also provided with: information process unit, it passes through to be electrically connected with described visible light sensor and infrared sensor respectively, be made up of FPGA and DSP, image procossing and compression are carried out to the digital picture be converted to by visible light sensor and infrared sensor; LVDS interface, itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.
The sidewall of described lower house is provided with some fixing ears, each fixing ear is provided with the first fixed orifice, utilize some screws corresponding to each first fixed orifice respectively, lower house is fixed on satellite body.
Four corners in the lower surface of described lower house are respectively arranged with projection, and described information board is fixedly installed on those projections, makes to leave gap between information board and the lower surface of lower house.
The lower surface of described lower house is provided with some reinforcements.
The lower surface of described lower house is provided with DSP heat radiation boss, FPGA dispels the heat boss and infrared sensor heat radiation boss, it lays respectively at the vertical lower of DSP, FPGA and infrared sensor.
Described visible light lens is provided with visible ray focusing pad, described infrared lens is provided with infrared focusing pad.
In sum, two spectrum imaging devices for deep space probing provided by the present invention, there is visible ray and infrared imaging ability simultaneously, therefore the high and infrared imaging of visual light imaging resolution is had concurrently by the advantage that illumination condition limits, reaching the space operations such as deep space probing provides a kind of not by the watch-keeping effect that time and illumination limit, and can adapt to harsh space mechanics and radiation environment.
Accompanying drawing explanation
Fig. 1 is the appearance schematic diagram of the two spectrum imaging devices for deep space probing in the present invention;
Fig. 2 is the cut-open view of the two spectrum imaging devices for deep space probing in the present invention;
Fig. 3 is the decomposing schematic representation of the two spectrum imaging devices for deep space probing in the present invention;
Fig. 4 is the schematic diagram of the lower house in the present invention.
Embodiment
Below in conjunction with Fig. 1 ~ Fig. 4, describe a preferred embodiment of the present invention in detail.
As shown in FIG. 1 to 3, the two spectrum imaging devices for deep space probing provided by the invention, comprise: lower house 4, it has a container cavity, and top arranges opening; Upper cover plate 3, its covering is arranged in the open top of described lower house 4, and is fixedly connected with described lower house 4; Information board 6, it is fixedly installed in the container cavity of described lower house 4; Visual light imaging unit, it is arranged on described information board 6, and is connected with described upper cover plate 3; Infrared imaging unit, it is arranged on described information board 6, and is connected with described upper cover plate 3.
Described two spectrum imaging devices also comprise: power panel 5, and it is fixedly installed in the container cavity of described lower house 4 by a beam structure, are positioned at the top of described information board 6, and with this information board 6 by being electrically connected, provide working power.
Described visual light imaging unit comprises: visible light lens 1, and it is directly mounted on upper cover plate 3 by flange-interface; Visible light sensor 7, its by welded and installed on information board 6, and aim at described in visible light lens 1; Target subject is focused on visible light sensor 7 by certain magnification and carries out opto-electronic conversion by this visible light lens 1, and light signal is converted to digital picture.
Described infrared imaging unit comprises: infrared lens 2, and it is directly mounted on upper cover plate 3 by flange-interface, and with the described asymmetric setting of visible light lens 1; Infrared sensor 8, its by welded and installed on information board 6, and aim at described in infrared lens 2; Target subject is focused on infrared sensor 8 by certain magnification and carries out opto-electronic conversion by this infrared lens 2, and light signal is converted to digital picture.
Described visible light lens 1 and infrared lens 2 all adopt transmissive design.
Described information board 6 is also provided with: information process unit, it passes through to be electrically connected with described visible light sensor 7 and infrared sensor 8 respectively, by FPGA(Field Programmable Gate Array, field programmable gate array) and DSP(Digital Signal Process, digital signal processor) composition, carry out image procossing and compression to the digital picture be converted to by visible light sensor 7 and infrared sensor 8, the image procossing mentioned here comprises enhancing picture quality, improves contrast etc.; LVDS(Low Voltage Differential Signaling, low-voltage differential signal) interface, itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.That is, the visual light imaging spectral coverage in the present invention and infrared imaging spectral coverage share an information process unit and output interface.
As shown in Figure 4, the sidewall of described lower house 4 is provided with some fixing ears 45, each fixing ear is provided with the first fixed orifice 46, utilize some M4 screws corresponding to each first fixed orifice 46 respectively, lower house 4 is fixed on satellite body.
In a preferred embodiment of the invention, arrange at the two ends, bottom of the both sides sidewall of lower house 4 and amount to 4 fixing ears 45, the diameter of the first fixed orifice 46 on each fixing ear is 4.5mm, is fixed on satellite body by lower house 4 by 4 M4 screws.
In a preferred embodiment of the invention, four corners of described upper cover plate 3 are respectively arranged with the second fixed orifice, open-topped four corners of described lower house 4 respectively correspondence are provided with the 3rd fixed orifice, utilize 4 M4 screws respectively successively through the second corresponding fixed orifice and the 3rd fixed orifice, realize being connected and fixed between upper cover plate 3 and lower house 4.
In a preferred embodiment of the invention, four corners of described information board 6 are respectively arranged with the 4th fixed orifice, four corners in the lower surface of described lower house 4 respectively correspondence are provided with projection 47, each projection 47 is offered the 5th fixed orifice, utilize 4 M2 screws respectively successively through the 4th corresponding fixed orifice and the 5th fixed orifice, realize being connected and fixed between information board 6 and lower house 4, and make to leave gap between the lower surface of information board 6 and lower house 4, and the height in described gap is the height of projection 47.
As shown in Figure 4, owing to being provided with gap between the lower surface of described lower house 4 and information board 6, therefore some reinforcements 42 are set in the lower surface of described lower house 4, to guarantee the mechanical performance of whole pair of spectrum imaging device.
As shown in Figure 4, DSP heat radiation boss 41 can also be set simultaneously in the lower surface of described lower house 4, FPGA dispels the heat boss 43 and infrared sensor heat radiation boss 44, it lays respectively at the vertical lower of DSP, FPGA and infrared sensor 8, while the high power consuming devices heat radiation of cooperation, protective action can also be played to Primary Component, strengthen the performance of its anti-space radiation and single-particle impact.
In a preferred embodiment of the invention, as shown in Figure 3, described visible light lens 1 is provided with visible ray focusing pad 9, described infrared lens 2 is provided with infrared focusing pad 10, thus manual focusing can be carried out to visible light lens 1 and infrared lens 2, make target subject blur-free imaging.
Shown in Fig. 3, described lower house 4 is also provided with the sign board 12 that can dismantle flexibly.And on described sign board 12, be also provided with the product socket 11 of right-angled bend form, to realize modularization.
Two spectrum imaging devices for deep space probing provided by the invention, are integrated in visible spectrum and non-brake method LONG WAVE INFRARED spectral coverage in a two spectrum imaging device, independently visible light lens and infrared lens are housed in this pair of spectrum imaging device mutually; And in order to realize the miniaturization of whole equipment, two described camera lenses all adopt transmissive design, and are directly installed on upper cover plate by flange-interface.
Two spectrum imaging devices for deep space probing provided by the invention, its power line portion comprises power panel and information board two pieces of circuit boards, and imageable target is focused on respectively by visible light lens and infrared lens visible light sensor on information board and infrared sensor carry out opto-electronic conversion obtains digital picture; And by the information handling system that two spectrum shares, image procossing and compression are carried out to digital picture, export eventually through LVDS interface.
Two spectrum imaging devices for deep space probing provided by the invention, lower house is also provided with reinforcement, can bear the mechanics vibration, impact etc. that produce when carrier rocket is launched and flies in-orbit; And heat radiation boss is equipped with respectively to core component (as DSP, FPGA and infrared sensor) simultaneously, by the means such as reinforcement protection and Redundancy Design, the radiation of space environment, single particle effect etc. can be adapted to.
In sum, two spectrum imaging devices for deep space probing provided by the present invention, there is visible ray and infrared imaging ability simultaneously, therefore the high and infrared imaging of visual light imaging resolution is had concurrently by the advantage that illumination condition limits, reaching the space operations such as deep space probing provides a kind of not by the watch-keeping effect that time and illumination limit, and can adapt to harsh space mechanics and radiation environment.
Although content of the present invention has done detailed introduction by above preferred embodiment, will be appreciated that above-mentioned description should not be considered to limitation of the present invention.After those skilled in the art have read foregoing, for multiple amendment of the present invention and substitute will be all apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (10)
1., for two spectrum imaging devices for deep space probing, it is characterized in that, comprise:
Lower house (4), it has a container cavity, and top arranges opening;
Upper cover plate (3), its covering is arranged in the open top of described lower house (4), and is fixedly connected with described lower house (4);
Information board (6), it is fixedly installed in the container cavity of described lower house (4);
Visual light imaging unit, it is arranged on described information board (6), and is connected with described upper cover plate (3);
Infrared imaging unit, it is arranged on described information board (6), and is connected with described upper cover plate (3).
2. as claimed in claim 1 for two spectrum imaging devices of deep space probing, it is characterized in that, also comprise power panel (5), it is fixedly installed in the container cavity of described lower house (4) by a beam structure, be positioned at the top of described information board (6), and with this information board (6) by being electrically connected, provide working power.
3., as claimed in claim 2 for two spectrum imaging devices of deep space probing, it is characterized in that, described visual light imaging unit comprises:
The visible light lens (1) of transmission-type, it is directly mounted on upper cover plate (3) by flange-interface;
Visible light sensor (7), its by welded and installed on information board (6), and aim at described in visible light lens (1);
Wherein, target subject is focused on visible light sensor (7) by certain magnification and carries out opto-electronic conversion by described visible light lens (1), and light signal is converted to digital picture.
4., as claimed in claim 3 for two spectrum imaging devices of deep space probing, it is characterized in that, described infrared imaging unit comprises:
The infrared lens (2) of transmission-type, it is directly mounted on upper cover plate (3) by flange-interface, and with described visible light lens (1) asymmetric setting;
Infrared sensor (8), its by welded and installed on information board (6), and aim at described in infrared lens (2);
Wherein, target subject is focused on infrared sensor (8) by certain magnification and carries out opto-electronic conversion by described infrared lens (2), and light signal is converted to digital picture.
5., as claimed in claim 4 for two spectrum imaging devices of deep space probing, it is characterized in that, described information board (6) is also provided with:
Information process unit, it passes through to be electrically connected with described visible light sensor (7) and infrared sensor (8) respectively, be made up of FPGA and DSP, image procossing and compression are carried out to the digital picture be converted to by visible light sensor (7) and infrared sensor (8);
LVDS interface, itself and described information process unit, by being electrically connected, export the digital picture through image procossing and compression.
6. as claimed in claim 1 for two spectrum imaging devices of deep space probing, it is characterized in that, the sidewall of described lower house (4) is provided with some fixing ears (45), each fixing ear is provided with the first fixed orifice (46), utilize some screws corresponding to each first fixed orifice (46) respectively, lower house (4) is fixed on satellite body.
7. as claimed in claim 1 for two spectrum imaging devices of deep space probing, it is characterized in that, four corners in the lower surface of described lower house (4) are respectively arranged with projection (47), described information board (6) is fixedly installed on those projections (47), makes to leave gap between the lower surface of information board (6) and lower house (4).
8., as claimed in claim 7 for two spectrum imaging devices of deep space probing, it is characterized in that, the lower surface of described lower house (4) is provided with some reinforcements (42).
9. as claimed in claim 7 for two spectrum imaging devices of deep space probing, it is characterized in that, the lower surface of described lower house (4) is provided with DSP heat radiation boss (41), FPGA heat radiation boss (43) and infrared sensor heat radiation boss (44), it lays respectively at the vertical lower of DSP, FPGA and infrared sensor (8).
10. as claimed in claim 1 for two spectrum imaging devices of deep space probing, it is characterized in that, described visible light lens (1) is provided with visible ray focusing pad (9); Described infrared lens (2) is provided with infrared focusing pad (10).
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CN201410744658.3A CN104359557B (en) | 2014-12-09 | 2014-12-09 | A kind of double; two spectrum imaging devices for deep space probing |
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CN201410744658.3A CN104359557B (en) | 2014-12-09 | 2014-12-09 | A kind of double; two spectrum imaging devices for deep space probing |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106500842A (en) * | 2016-11-08 | 2017-03-15 | 北京华夏视科图像技术有限公司 | Multispectral camera and multispectral acquisition system |
CN106706129A (en) * | 2016-12-30 | 2017-05-24 | 中国科学院西安光学精密机械研究所 | Standard modular satellite-borne spectrometer |
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CN103323113A (en) * | 2013-05-30 | 2013-09-25 | 中国科学院长春光学精密机械与物理研究所 | Multispectral imager based on light fieldd imaging technique |
CN103743485A (en) * | 2014-01-17 | 2014-04-23 | 北京航空航天大学 | Full polarization spectrum imaging system for synchronously detecting ground feature light and skylight |
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2014
- 2014-12-09 CN CN201410744658.3A patent/CN104359557B/en not_active Expired - Fee Related
Patent Citations (5)
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US20040232339A1 (en) * | 2003-05-23 | 2004-11-25 | Institute For Technology Development | Hyperspectral imaging workstation having visible/near-infrared and ultraviolet image sensors |
US20060187451A1 (en) * | 2005-02-18 | 2006-08-24 | The Regents Of The University Of California | Phase-shifting test mask patterns for characterizing illumination polarization balance in image forming optical systems |
CN202488561U (en) * | 2012-03-23 | 2012-10-10 | 田锦林 | Wireless infrared video camera |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106706129A (en) * | 2016-12-30 | 2017-05-24 | 中国科学院西安光学精密机械研究所 | Standard modular satellite-borne spectrometer |
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