CN104359481A - Miniature inertia measurement unit based on FPGA (field programmable gate array) - Google Patents
Miniature inertia measurement unit based on FPGA (field programmable gate array) Download PDFInfo
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- CN104359481A CN104359481A CN201410635870.6A CN201410635870A CN104359481A CN 104359481 A CN104359481 A CN 104359481A CN 201410635870 A CN201410635870 A CN 201410635870A CN 104359481 A CN104359481 A CN 104359481A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/18—Stabilised platforms, e.g. by gyroscope
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- Radar, Positioning & Navigation (AREA)
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Abstract
The invention discloses a miniature inertia measurement unit based on FPGA (field programmable gate array). A triaxial MEMS (micro-electromechanical system) accelerometer module is used for sensing acceleration information of X, Y and Z axis directions of carriers in real time and transmitting the acceleration information to a signal processor; a triaxial MEMS gyroscope module is used for sensing angular speed information of the X, Y and Z axis directions of the carriers in real time and transmitting the angular speed information to the signal processor; a temperature sensor module is used for sensing environment temperature information around the carriers and transmitting the environment temperature information to the signal processor; the signal processor is used for marking and compensating received data; and an RS232 level conversion module is used for converting the acceleration and angular speed information of the carriers into a format according with an RS232 protocol and transmitting the information out. An FPGA chip is used as a system signal processor to reduce the operation cycle and hardware errors; a small amount of chips are arranged at the periphery to conveniently realize system miniaturization. A digital sensor is adopted to effectively improve anti-jamming capability and measurement accuracy. The sensors are operated in parallel to facilitate time calibration and consistent measurement, and the measurement errors can be reduced.
Description
Technical field
The present invention relates to a kind of micro inertial measurement unit based on FPGA, belong to circuit engineering field.
Background technology
Along with micro-fabrication technique and MEMS technology development, MEMS microminiature measuring unit based on miniature MEMS gyroscope of new generation and mems accelerometer develops rapidly, is widely used in the fields such as minute vehicle, micro-robot, personal navigation positioning equipment, assistant GPS navigation.
The design philosophy of legacy system utilizes DSP or chip microcontroller data acquisition and processing (DAP), but single-chip microcomputer speed on algorithm realization is slower, the requirement that system high-speed is real-time cannot be met, although DSP is very fast on algorithm realization, but peripheral circuit is more complicated, need to configure the devices such as more logical transition, the number of chips of increase not easily meets the requirement of system compact, simultaneously to there is the construction cycle long for these schemes, can not for limitations such as changes, flexibly amendment hardware design.
FPGA is the abbreviation of field programmable gate array (field programmable GateArray), and its adopts logical cell array as elementary cell, and inside comprises configurable logic blocks, input/output module and interconnector three part.Principal feature has: (1) FPGA utilizes internal logic unit array to form hardware circuit and realizes system, and system in parallel processing power is given prominence to; (2) FPGA has the abundant and I/O port that can conveniently configure, make circuit design and system layout's fabric swatch more succinctly convenient; (3) FPGA can carry out modular design, facilitates the utilization of the multiplexing of module, particularly IP kernel, makes system development more flexible.
Summary of the invention
object of the present invention:overcome the deficiencies in the prior art, designing a kind of take FPGA as the full digital Inertial Measurement Unit of core, can improve the antijamming capability of system, and is more conducive to the miniaturization of system and integrated.
the technical solution realizing the object of the invention is:
Based on a micro inertial measurement unit of FPGA, it is characterized in that, comprise 3 axis MEMS accelerometer module, three axis MEMS gyro module, temperature sensor module, signal processor, RS232 level switch module and power management module;
Power management module provides supply voltage for other all modules;
The acceleration information of 3 axis MEMS accelerometer module real-time perception carrier X, Y, Z tri-axis, and be sent to signal processor in real time;
The angular velocity information of three axis MEMS gyro module real-time perception carrier X, Y, Z tri-axis, and be sent to signal processor in real time;
Ambient temperature information around temperature sensor module perception carrier, and be sent to signal processor in real time;
Signal processor is demarcated the data received and is compensated, and converts the acceleration of carrier and angular velocity information to meet RS232 agreement form send by RS232 level switch module.
Described signal processor and fpga chip, utilize VerilogHDL language on fpga chip, realize information collecting interface, Data Format Transform, storage, and demarcate gyroscope and accelerometer data and compensate.
Signal processing module comprises data conversion and processing module, demarcate and temperature compensation module, with sending FIFO and receiving the UART module of FIFO, and multiple SPI interface.
Signal processing module adopts SPI communications protocol to communicate with between 3 axis MEMS accelerometer module, three axis MEMS gyro, temperature sensor module, SPI interface comprises chip selection signal, serial clock input, primary input is from output, main output from input four ports, the main frame that signal processing module communicates as SPI, provides chip selection signal, clock signal and control word.
The temporary of inertial data and RS232 formatted output is realized with the UART module sending FIFO and reception FIFO.
Data conversion is resolved with the data of processing module to 3 axis MEMS accelerometer module and three axis MEMS gyro perception;
Demarcate with temperature compensation module to zero partially, non-linear, the alignment error of calibration factor and temperature compensation process.The static state of Inertial Measurement Unit three axis that module records according to rating test, dynamic error coefficient compensate.
The beneficial effect that the present invention reaches:
(1) using fpga chip as system signal processor, with the advantage of its concurrent operation, reduce the system cloud gray model cycle, decrease the hardware error of system.System peripherals chip is few, is beneficial to the miniaturization realizing whole system.
(2) system all adopts digital transducer, and on plate, signal is digital signal, effectively can improve the antijamming capability of system, improves the measuring accuracy of system.
(3) system utilizes the abundant I/O port resource of FPGA, and designing multiple SPI interface, is all equal parallel runnings of sensor, starts simultaneously and gathers external information, can improve the time consistency of measurement, reduce error in measurement.
The equal parallel running of all sensors, is beneficial to the time alignment of system and measures consistance, can reduce the measuring error of system.
Accompanying drawing explanation
Fig. 1 Inertial Measurement Unit theory diagram;
Fig. 2 signal processing module theory diagram;
Fig. 3 accelerometer module circuit diagram;
Fig. 4 gyro module circuit diagram;
Fig. 5 temperature sensor module circuit diagram;
Fig. 6 RS232 level switch module circuit diagram;
Fig. 7 signal processor module circuit diagram;
Fig. 8 power management module circuit diagram;
The process flow diagram of Fig. 9 calibration compensation.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
As shown in Figure 1, system is made up of mems accelerometer module, MEMS gyro instrument module, temperature sensor module, signal processor (FPGA), RS232 level switch module and power management module Inertial Measurement Unit theory diagram in the present invention.
Power management module provides the burning voltage needed for whole system, ensures that the power supply of each module is normal; The acceleration information of mems accelerometer module real-time perception carrier X, Y, Z tri-axis; The angular velocity information of MEMS gyro instrument module real-time perception carrier X, Y, Z tri-axis; Ambient temperature information around temperature sensor module perception carrier; What information all was above all real-time is sent to signal processor.First signal processor collects each sensor information, then according to the accelerometer, the gyrostatic characteristic parameter that measure in advance, accelerometer and gyrostatic output are demarcated and compensated, these are demarcated and compensation comprises zero partially, calibration factor is non-linear, alignment error, temperature compensation etc., last signal processor converts the acceleration of carrier and angular velocity information to meet RS232 agreement form and sends.Due to signal processor output is Transistor-Transistor Logic level, so need RS232 level switch module to complete level conversion.
Signal processor is realized by FPGA entirely, utilizes VerilogHDL language to realize information collecting interface on FPGA, Data Format Transform, storage, gyroscope and accelerometer calibration compensation and relevant sequential logic function etc.Fig. 2 is the theory diagram of signal processor.
Accelerometer, gyroscope and between temperature sensor with FPGA, adopt SPI communications protocol to communicate, SPI interface comprises sheet choosing (CS) signal, clock input (SCK), primary input is from output (MISO), main output is from four ports such as inputs (MOSI), the main frame that FPGA communicates as SPI, provides chip selection signal, clock signal and control word, and the form that read-write operation is specified according to accelerometer, gyroscope and temperature sensor carries out.Be integrated with the UART interface sending FIFO and receive FIFO and realize the temporary of inertial data and RS232 formatted output.Data conversion is resolved three axis accelerometer and gyro data with processing module, is beneficial to demarcate them and compensate.Demarcating with temperature compensation module is the core of signal processor, completes zero partially, the process such as calibration factor is non-linear, alignment error, temperature compensation at this, the measuring accuracy of effective raising system.
Demarcate with temperature compensation module to zero partially, non-linear, the alignment error of calibration factor and temperature compensation process.The static state of Inertial Measurement Unit three axis that module records according to rating test, dynamic error coefficient compensate, and the process flow diagram of calibration compensation as shown in Figure 9.
Gyroscope is the three axis MEMS gyro of digital output, and accelerometer is the 3 axis MEMS accelerometer of digital output, and temperature sensor is the temperature sensor of digital output.
each several part hardware circuit realizes as follows:
Mems accelerometer circuit and with the interconnection of FPGA module as shown in Figure 3.Be made up of six I/O mouths of ADXL346 three axis accelerometer N2, electric capacity C1, C2 and FPGA module N1A.The acceleration information of three axis accelerometer N2 Real-time Collection three axis is also exported by SPI interface, four I/O mouths (pin 7,8,9,24) of FPGA module N1A by VerilogHDL programming realization SPI interface protocol, and according to three axis accelerometer N2 export look-at-me (INT1, INT2) timing acquisition three-axis gyroscope N3 export acceleration information.
MEMS gyro instrument circuit and with the interconnection of FPGA module as shown in Figure 4.Be made up of five I/O mouths of L3G4200D three-axis gyroscope N3, electric capacity C41, C42, C43, C44 and FPGA N1B.The angular velocity information of three-axis gyroscope N3 Real-time Collection three axis is also exported by SPI interface, four I/O mouths (pin 30,41,42,43) of FPGA module N1B by VerilogHDL programming realization SPI interface protocol, and according to three-axis gyroscope N3 export look-at-me (DRDY/INT2) timing acquisition three-axis gyroscope N3 export angular velocity information.
MEMS temperature sensor modular circuit and with the interconnection of FPGA module as shown in Figure 5.Be made up of four I/O mouths of AD7814ART temperature sensor N4, electric capacity C30 and FPGA module N1E.Temperature sensor N4 Real-time Collection ambient temperature information is also exported by SPI interface, and four I/O mouths (pin 45,47,48,50) of FPGA module N1E, by VerilogHDL programming realization SPI interface protocol, read temperature information in real time.
RS232 level switch module circuit and with the interconnection of FPGA module as shown in Figure 6.Be made up of four I/O mouths of MAX3232E level transferring chip N5, electric capacity C11, C12, C13, C14, C15 and FPGA module N1D.Four I/O mouths (pin 52,53,55,57) of FPGA module N1D by VerilogHDL programming realization RS232 interface reception and send agreement, the Inertia information of three axles and temperature information are sent to MAX3232E level transferring chip N5, send to navigational computer to use information by level conversion.
Signal processing module is responsible for the data gathering all the sensors, and according to the result of accelerometer and gyroscope test, they are demarcated, carry out full temperature compensation according to temperature information to 3-axis acceleration and angular velocity information to repay simultaneously, then export navigational computer to according to RS232 agreement 3-axis acceleration and angular velocity information.This module is primarily of fpga chip and peripheral circuit composition thereof, and circuit diagram as shown in Figure 7.The configuring chip that in figure, N6 (EPCS4SI8) is FPGA; N7(LTC1799HS5) and resistance R9, R10, electric capacity C20, C21 form the external crystal oscillating circuit of FPGA, for FPGA provides the clock signal of 20MHz; J1 is the JTAG end of FPGA, is the interface of download and configurator.
The function of power management module is for whole system provides reliable and stable power supply, because fpga chip needs+3.3V and+1.2V two kinds of power supplys, so system adopts the TPS70345 Voltage Cortrol chip N8 of TI company, the circuit diagram of whole module as shown in Figure 8, by TPS70345 Voltage Cortrol chip, resistance R1, R2, R3, R4 and electric capacity C4, C5, C6, C7, C8, C9, C10 composition.
The annexation that what the FPGA module N1A above in each figure, N1B, N1E, N1D all showed is between the part pin of same FPGA module and other each modules.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and distortion, these improve and distortion also should be considered as protection scope of the present invention.
Claims (6)
1. based on a micro inertial measurement unit of FPGA, it is characterized in that, comprise 3 axis MEMS accelerometer module, three axis MEMS gyro module, temperature sensor module, signal processor, RS232 level switch module and power management module;
Power management module provides supply voltage for other all modules;
The acceleration information of 3 axis MEMS accelerometer module real-time perception carrier X, Y, Z tri-axis, and be sent to signal processor in real time;
The angular velocity information of three axis MEMS gyro module real-time perception carrier X, Y, Z tri-axis, and be sent to signal processor in real time;
Ambient temperature information around temperature sensor module perception carrier, and be sent to signal processor in real time;
Signal processor is demarcated the data received and is compensated, and converts the acceleration of carrier and angular velocity information to meet RS232 agreement form send by RS232 level switch module.
2. the micro inertial measurement unit based on FPGA according to claim 1, it is characterized in that, described signal processor and fpga chip, utilize VerilogHDL language on fpga chip, realize information collecting interface, Data Format Transform, storage, and calibration compensation is carried out to gyroscope and accelerometer data.
3. the micro inertial measurement unit based on FPGA according to claim 1, is characterized in that,
Signal processing module comprises data conversion and processing module, demarcate and temperature compensation module, with sending FIFO and receiving the UART module of FIFO, multiple SPI interface module.
4. the micro inertial measurement unit based on FPGA according to claim 3, is characterized in that,
Signal processing module adopts SPI communications protocol to communicate with between 3 axis MEMS accelerometer module, three axis MEMS gyro, temperature sensor module, SPI interface comprises chip selection signal, serial clock input, primary input is from output, main output from input four ports, the main frame that signal processing module communicates as SPI, provides chip selection signal, clock signal and control word.
5. the micro inertial measurement unit based on FPGA according to claim 3, is characterized in that,
The temporary of inertial data and RS232 formatted output is realized with the UART interface module sending FIFO and reception FIFO.
6. the micro inertial measurement unit based on FPGA according to claim 3, is characterized in that,
Data conversion is resolved with the data of processing module to 3 axis MEMS accelerometer module and three axis MEMS gyro perception;
Demarcate with temperature compensation module to zero partially, non-linear, the alignment error of calibration factor and temperature error compensate process.
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CN105091883A (en) * | 2015-08-14 | 2015-11-25 | 宋长峰 | MEMS-integrated IMU temperature compensation improving method |
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CN114018233A (en) * | 2021-04-01 | 2022-02-08 | 东方空间技术(山东)有限公司 | Temperature compensation method and device of micromechanical gyroscope |
CN114199280A (en) * | 2021-12-10 | 2022-03-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Batch calibration and error compensation system and method for micro-inertia measurement assembly |
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CN106813659A (en) * | 2015-11-27 | 2017-06-09 | 上海乐相科技有限公司 | A kind of sensor device |
CN105783941A (en) * | 2016-02-24 | 2016-07-20 | 北京航天控制仪器研究所 | Testing method for inertial measurement unit based on SPI bus communication protocol output |
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CN111366188A (en) * | 2018-12-26 | 2020-07-03 | 北京信息科技大学 | Data acquisition and storage device for dynamic environment force measurement field |
CN109916537A (en) * | 2019-04-01 | 2019-06-21 | 中北大学 | A kind of pressure data acquisition system based on picogram bus transfer agreement |
CN110793520A (en) * | 2019-11-04 | 2020-02-14 | 中国兵器工业集团第二一四研究所苏州研发中心 | Micro-inertia assembly suitable for high-dynamic severe environment |
CN114018233A (en) * | 2021-04-01 | 2022-02-08 | 东方空间技术(山东)有限公司 | Temperature compensation method and device of micromechanical gyroscope |
CN113639705A (en) * | 2021-08-03 | 2021-11-12 | 北京航宇测通电子科技有限公司 | Method, system and device for measuring angular displacement |
CN114199280A (en) * | 2021-12-10 | 2022-03-18 | 中国兵器工业集团第二一四研究所苏州研发中心 | Batch calibration and error compensation system and method for micro-inertia measurement assembly |
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Application publication date: 20150218 |