CN104350423A - 衬底保持装置、光刻设备以及器件制造方法 - Google Patents

衬底保持装置、光刻设备以及器件制造方法 Download PDF

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Publication number
CN104350423A
CN104350423A CN201380020325.XA CN201380020325A CN104350423A CN 104350423 A CN104350423 A CN 104350423A CN 201380020325 A CN201380020325 A CN 201380020325A CN 104350423 A CN104350423 A CN 104350423A
Authority
CN
China
Prior art keywords
substrate
layer
holding device
conductive layer
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201380020325.XA
Other languages
English (en)
Chinese (zh)
Inventor
R·拉斐尔
N·德兹欧姆奇娜
Y·卡拉第
E·罗登勃格
H·西恩格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Publication of CN104350423A publication Critical patent/CN104350423A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201380020325.XA 2012-04-19 2013-03-19 衬底保持装置、光刻设备以及器件制造方法 Pending CN104350423A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261635754P 2012-04-19 2012-04-19
US61/635,754 2012-04-19
PCT/EP2013/055597 WO2013156236A1 (en) 2012-04-19 2013-03-19 Substrate holder, lithographic apparatus, and device manufacturing method

Publications (1)

Publication Number Publication Date
CN104350423A true CN104350423A (zh) 2015-02-11

Family

ID=47988926

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380020325.XA Pending CN104350423A (zh) 2012-04-19 2013-03-19 衬底保持装置、光刻设备以及器件制造方法

Country Status (8)

Country Link
US (1) US20150124234A1 (https=)
EP (1) EP2839342A1 (https=)
JP (1) JP2015518659A (https=)
KR (1) KR20150016508A (https=)
CN (1) CN104350423A (https=)
NL (1) NL2010472A (https=)
TW (1) TWI507828B (https=)
WO (1) WO2013156236A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108292109A (zh) * 2015-12-15 2018-07-17 Asml荷兰有限公司 衬底保持器、光刻设备及制造器件的方法
CN113571585A (zh) * 2021-07-07 2021-10-29 沈阳工业大学 低功耗双层阻挡接触式双向异或非门集成电路及制造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2009487A (en) 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
EP3683627A1 (en) 2012-02-03 2020-07-22 ASML Netherlands B.V. Substrate holder and lithographic apparatus
DE102015007216B4 (de) * 2015-06-03 2023-07-20 Asml Netherlands B.V. Verfahren zur Herstellung einer Halteplatte, insbesondere für einen Clamp zur Waferhalterung, Verfahren zur Herstellung einer Haltevorrichtung zur Halterung eines Bauteils, Halteplatte und Haltevorrichtung
US20180374736A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. Electrostatic carrier for die bonding applications
US11086238B2 (en) 2017-06-29 2021-08-10 Asml Netherlands B.V. System, a lithographic apparatus, and a method for reducing oxidation or removing oxide on a substrate support
WO2019096554A1 (en) * 2017-11-20 2019-05-23 Asml Netherlands B.V. Substrate holder, substrate support and method of clamping a substrate to a clamping system
US10722925B2 (en) * 2017-12-04 2020-07-28 Suss Micro Tec Photomask Equipment Gmbh & Co Kg Treatment head, treatment system and method for treating a local surface area of a substrate
US11650361B2 (en) * 2018-12-27 2023-05-16 Viavi Solutions Inc. Optical filter
KR102859857B1 (ko) * 2019-05-24 2025-09-12 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치, 기판 테이블 및 방법
US20210035767A1 (en) * 2019-07-29 2021-02-04 Applied Materials, Inc. Methods for repairing a recess of a chamber component
WO2021170320A1 (en) 2020-02-24 2021-09-02 Asml Netherlands B.V. Substrate support and substrate table
EP3882700A1 (en) 2020-03-16 2021-09-22 ASML Netherlands B.V. Object holder, tool and method of manufacturing an object holder
EP3923077A1 (en) * 2020-06-11 2021-12-15 ASML Netherlands B.V. Object holder, electrostatic sheet and method for making an electrostatic sheet
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
EP4481491A1 (en) * 2023-06-20 2024-12-25 ASML Netherlands B.V. Method of manufacturing an electrode for an object holder
WO2025201980A1 (en) * 2024-03-29 2025-10-02 Asml Netherlands B.V. Electrostatic clamp

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998011611A1 (en) * 1996-09-12 1998-03-19 Institut National D'optique Microbridge structure, and method for forming a microbridge suspended by a micro support
CN1577100A (zh) * 2003-07-24 2005-02-09 Asml荷兰有限公司 光刻装置和器件制造方法
CN1667515A (zh) * 2004-03-10 2005-09-14 Asml荷兰有限公司 光刻装置、洛伦兹致动器、及器件制作方法
CN1904737A (zh) * 2005-02-03 2007-01-31 Asml荷兰有限公司 图案形成装置和方法,判断位置的方法、测量设备和光刻装置
JP2007242644A (ja) * 2006-03-02 2007-09-20 Fujitsu Ltd 半導体装置及びその製造方法
US20080265442A1 (en) * 2007-04-26 2008-10-30 Sony Corporation Semiconductor device, electronic device, and method of producing semiconductor device
CN101918898A (zh) * 2007-12-21 2010-12-15 Asml荷兰有限公司 光刻设备、用于调平物体的方法以及光刻投影方法
WO2012005294A1 (ja) * 2010-07-09 2012-01-12 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD292119A5 (de) * 1990-02-21 1991-07-18 Carl Zeiss Jena,De Vorrichtung zum ebnen und elektrostatischen halten von wafern
WO1999049504A1 (fr) 1998-03-26 1999-09-30 Nikon Corporation Procede et systeme d'exposition par projection
SG135052A1 (en) 2002-11-12 2007-09-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7524735B1 (en) 2004-03-25 2009-04-28 Novellus Systems, Inc Flowable film dielectric gap fill process
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL1036715A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
US8421993B2 (en) 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
EP2131241B1 (en) 2008-05-08 2019-07-31 ASML Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
TWI475594B (zh) * 2008-05-19 2015-03-01 恩特格林斯公司 靜電夾頭
US8861170B2 (en) * 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
NL2006913A (en) 2010-07-16 2012-01-17 Asml Netherlands Bv Lithographic apparatus and method.
EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998011611A1 (en) * 1996-09-12 1998-03-19 Institut National D'optique Microbridge structure, and method for forming a microbridge suspended by a micro support
CN1577100A (zh) * 2003-07-24 2005-02-09 Asml荷兰有限公司 光刻装置和器件制造方法
CN1667515A (zh) * 2004-03-10 2005-09-14 Asml荷兰有限公司 光刻装置、洛伦兹致动器、及器件制作方法
CN1904737A (zh) * 2005-02-03 2007-01-31 Asml荷兰有限公司 图案形成装置和方法,判断位置的方法、测量设备和光刻装置
JP2007242644A (ja) * 2006-03-02 2007-09-20 Fujitsu Ltd 半導体装置及びその製造方法
US20080265442A1 (en) * 2007-04-26 2008-10-30 Sony Corporation Semiconductor device, electronic device, and method of producing semiconductor device
CN101918898A (zh) * 2007-12-21 2010-12-15 Asml荷兰有限公司 光刻设备、用于调平物体的方法以及光刻投影方法
WO2012005294A1 (ja) * 2010-07-09 2012-01-12 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108292109A (zh) * 2015-12-15 2018-07-17 Asml荷兰有限公司 衬底保持器、光刻设备及制造器件的方法
CN108292109B (zh) * 2015-12-15 2020-05-12 Asml荷兰有限公司 衬底保持器、光刻设备及制造器件的方法
CN113571585A (zh) * 2021-07-07 2021-10-29 沈阳工业大学 低功耗双层阻挡接触式双向异或非门集成电路及制造方法
CN113571585B (zh) * 2021-07-07 2023-10-13 沈阳工业大学 低功耗双层阻挡接触式双向异或非门集成电路及制造方法

Also Published As

Publication number Publication date
US20150124234A1 (en) 2015-05-07
TWI507828B (zh) 2015-11-11
JP2015518659A (ja) 2015-07-02
WO2013156236A1 (en) 2013-10-24
EP2839342A1 (en) 2015-02-25
TW201348892A (zh) 2013-12-01
NL2010472A (en) 2013-10-23
KR20150016508A (ko) 2015-02-12

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Application publication date: 20150211