CN104349611A - Method for manufacturing modular inductor device - Google Patents
Method for manufacturing modular inductor device Download PDFInfo
- Publication number
- CN104349611A CN104349611A CN201310329613.5A CN201310329613A CN104349611A CN 104349611 A CN104349611 A CN 104349611A CN 201310329613 A CN201310329613 A CN 201310329613A CN 104349611 A CN104349611 A CN 104349611A
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- CN
- China
- Prior art keywords
- substrate
- iron core
- inductance device
- manufacture method
- storage tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Provided is a method for manufacturing a modular inductor device. The method comprises: (a) forming a substrate by using plastic injection, wherein the substrate comprises at least one recessed accommodating groove; (b) placing an iron core in the accommodating groove; (c) arranging two wired circuit layers on the top side of the substrate and two wired circuit layers on the bottom side of the substrate, and performing stitching, hole drilling, electroplating in the holes, and line etching in order to form an internal line and an external line; and (d) performing soldering prevention and junction processing on the external line in order to protect the external line and form a protection layer on the junction so as to obtain the modular inductor device. The substrate is formed by using a plastic injection manner and the iron core is directly placed in the accommodating groove of the substrate, and then subsequent processing programs are carried out. Thus, manufacture programs are greatly simplified, manufacture cost is reduced, and yield rate of final products is increased.
Description
Technical field
The present invention relates to a kind of manufacture method of electronic component, particularly relate to a kind of manufacture method of modularized inductance device.
Background technology
General inductance device, as inductor, transformer etc., is all by one or more coil winding on the iron core be made up of ferrimagnet (Ferromagnetic Material), and after this coil electricity with the generation effect mutually of this iron core.Manufacture in industry at current inductance device, for small-sized transformer, because the volume of its annular core is quite little, still is mostly adopt the mode of artificial coiling to be wound on this annular core by the enamelled wire of the default winding number of turns.But, adopt the mode of manual work to there is the shortcoming that processing procedure is consuming time and yield poorly.
In order to solve the problem, industry develops and iron core is embedded at printed circuit board (PCB) (Printed Circuit Boards, PCB) on, and to utilize in boring in printed circuit board (PCB) processing procedure, hole the steps such as plating, the structure as winding around is formed to iron core.General printed circuit board (PCB) laminates conjunction with the resin material layer of FR-4 grade to form, and in order to be embedded on printed circuit board (PCB) by iron core, comparatively conventional has two kinds of modes: iron core to be inserted in stacked resin material and carried out hot pressing by (1); (2) directly on printed circuit board (PCB), blind hole (industry is called blind dragging for) is processed to form, then be placed in blind hole by iron core.
But, in the process of pressing, the damage of core structure may be caused, and the high temperature of bonding processes may cause iron core to lose efficacy.In addition, because printed circuit board (PCB) is quite thin, be processed to form blind hole needs accurate procedure, and not only cost is high, and yield also not easily promotes.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method that can improve the modularized inductance device of yield.The manufacture method of modularized inductance device of the present invention, comprises the following step: (a), with injection-moulding plastic substrate, this substrate comprises at least one recessed storage tank; B one iron core is placed in this storage tank by (); C () respectively arranges the two-layer line layer connected up respectively in the upper and lower side of this substrate, and carry out electroplating in pressing, boring, hole, and circuit etching is to form internal layer circuit, outer-layer circuit; And (d) carries out anti-weldingly processing with contact on outer circuit, to protect outer-layer circuit and form protective layer on contact, and obtains modularized inductance device.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Preferably, these plastics are selected from thermoplastics, and at least bear the temperature of 220 DEG C.
Preferably, this thermoplastics is selected from polyphenylene sulfide, liquid crystal polyester, polycyclic hexanol diethylester, and their combination.
Preferably, these plastics are selected from thermoset plastics, and at least bear the temperature of 220 DEG C.
Preferably, this thermoset plastics is selected from phenolic resins, poly-o-dially phthalate, and their combination.
Preferably, in this step (b), this iron core does not protrude this storage tank.
Beneficial effect of the present invention is: by molding this substrate in the mode of injection-moulding plastic, this iron core is allowed directly to be placed in the storage tank of this substrate, carry out follow-up procedure again, significantly simplify production process and reduce manufacturing cost, also improving the yield of final finished.
Accompanying drawing explanation
Fig. 1 is flow chart, and the preferred embodiment of the manufacture method of modularized inductance device of the present invention is described;
Fig. 2 is vertical view, illustrates in this preferred embodiment, via the aspect of injection molding substrate;
Fig. 3 is stereogram, illustrates in this preferred embodiment, the structure of iron core;
Fig. 4 is exploded side figure, illustrates in this preferred embodiment, and the storage tank of this substrate is to should the shape of iron core;
Fig. 5 is vertical view, illustrates in this preferred embodiment, the aspect of different storage tank;
Fig. 6 is stereogram, and the shape of the iron core of the storage tank coordinating Fig. 5 is described;
Fig. 7,8 is all vertical view, illustrates in this preferred embodiment, the aspect of the iron core of the storage tank collocation different shape of different shape;
Fig. 9 is schematic diagram, illustrates in this preferred embodiment, arranges one deck line layer respectively in the upper and lower side of this substrate;
Figure 10 is schematic diagram, illustrates in this preferred embodiment, carries out the aspect of holing after this substrate and line layer pressing;
Figure 11 is vertical view, in aid illustration Figure 10, after holing, and the distributing position in hole;
Figure 12 is flow chart, illustrates and carries out circuit etching to form internal layer circuit;
Figure 13 is schematic diagram, and this substrate of aid illustration completes the aspect of outer circuit; And
Figure 14 to 16 is all schematic diagram, and illustrating to put has the substrate of the iron core of different shape to complete the aspect of outer circuit.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
First be noted that, the resin material of the FR-4 grade that printed circuit board (PCB) general at present uses, although there are many different kinds, be all add composite material done by glass fibre with epoxy resin substantially, therefore FR-4 material and injection molding processing procedure cannot be used for.
Therefore, the preferred embodiment of the manufacture method of modularized inductance device of the present invention, comprises following steps: as shown in Figure 1 and Figure 2, and in step 21, with injection-moulding plastic substrate 3, this substrate 3 comprises multiple recessed storage tank 32.These plastics are selected from thermoplastics or thermoset plastics, wherein, this thermoplastics is selected from polyphenylene sulfide (Polyphenylene Sulfide, PPS), liquid crystal polyester (Liquid crystal polyester, LCP), polycyclic hexanol diethylester (Polycarbonate hexandimethanol Terephthalate, and their combination PCT).And this thermoset plastics is selected from phenolic resins (being commonly called as bakelite), poly-o-dially phthalate (Poly (Diallyl phthalate), DAP) and their combination.Illustrate, above-mentioned selected plastics at least need bear the temperature of 220 DEG C.
As shown in Fig. 1, Fig. 3, Fig. 4, in step 22, multiple iron core 4 is placed in the storage tank 32 of this substrate 3 respectively.What illustrate is, the volume of usual iron core 4 is very little, therefore during this substrate 3 shaping, multiple storage tank 32 can be formed, cutting process is carried out again after machining, to improve the convenience of making and to save manufacturing cost, and the volume size that the quantity of described storage tank 32 can adapt to iron core 4 adjusts.In addition, consulting Fig. 2, Fig. 3, in the present embodiment, is be one group with small one and large one storage tank 32, respectively in order to put small one and large one iron core 4, but not as limit.Wherein, the metallic combination that the material of each iron core 4 is the most common is manganese and zinc (MnZn), and nickel and zinc (NiZn), to be easy to the metal be magnetized.As shown in Figure 3, Figure 4, in the present embodiment, each iron core 4 is hollow and annular, and the shape of the corresponding iron core 4 of each storage tank 32, certain visual actual demand changes the shape of iron core 4, and the corresponding shape changing storage tank 32 makes itself and iron core 4 in correspondence with each other simultaneously.Such as, each storage tank 32 can be form as shown in Figure 5, and can insert as shown in Figure 6 two in E shape and the iron core 4 faced one another.Or as shown in Figure 7, each storage tank 32 is strip, and can insert the iron core 4 in column.Or each storage tank 32 is forms as shown in Figure 8, and the general iron core 4 in W shape can be inserted, and in plate shaped iron core 4.In the following description, be illustrate with the form of storage tank 32 for the iron core 4 shown in Fig. 3, Fig. 4.
As shown in Figure 9, in the present embodiment, each iron core 4 does not protrude corresponding storage tank 32, and certain described iron core 4 also may be slightly protrude described storage tank 32, is not limited with person disclosed by the present embodiment.Consult Fig. 1, Fig. 9 again, in step 23, be provided as the film 51 of bonding respectively in the upper and lower side of this substrate 3, and the line layer 52 connected up.Wherein, each line layer 52 is the Copper Foils connected up, and the quantity of certain described line layer 52 can adjust according to actual demand.Then, as shown in Figure 1, Figure 10 shows, pressing, boring supervisor is carried out.Carry out boring formation hole 33 according to the precalculated position of wiring during boring, and allow described hole 33 form size as shown in figure 11 and arrangement form.Then carry out after boring electroplating in hole in described hole 33, first clear up the burr on described hole 33 and the break flour in described hole 33 in the mode of severe brushing and high pressure washing, the glue slag on hole wall is removed again with liquor potassic permanganate, and allow on the hole wall cleaned out and adhere to tin palladium gelatinous layer, then be reduced into Metal Palladium.Then, the substrate 3 completing said procedure is soaked in copper solution, by the catalytic action of palladium metal, deposition of being reduced by copper ion in solution is attached on hole wall and forms through hole circuit, then the deposition layers of copper be attached on hole wall is thickeied in the mode of copper sulphate bath plating the thickness enough resisting following process and environment for use impact.
Next, as shown in Fig. 1, Figure 12, circuit etching is carried out.Consult Figure 12, circuit etching on the line layer 52 of upper and lower side, pastes dry-film resist 6 respectively carry out press mold, ultraviolet exposure mode is utilized to transfer on the copper face of described line layer 52 with egative film in the circuit on described line layer 52 after press mold, through developing machine, part not photosensitive on described dry-film resist 6 is removed, the unnecessary copper face of described line layer 52 is fallen in recycling etching machine engraving, again described dry-film resist 6 is removed and namely complete circuit etching and leave required circuit, form internal layer circuit.
Then, then repeat as shown in figs. 9 to 12 line layer, pressing, drill process are set, and again to carry out in hole the processes such as plating and circuit etching, and form outer-layer circuit as shown in figure 13.Be noted that in the present embodiment, in step 23, the upper and lower side of this substrate 3 is each respectively arranges two-layer line layer 52 to form internal layer circuit, outer-layer circuit, and when reality is implemented, the visual increase in demand of quantity of described line layer 52, not as limit.In addition, if select the combination of substrate as shown in Fig. 5 to Fig. 83 and iron core 4, after finally forming outer-layer circuit, be then form the form as shown in Figure 14 to Figure 16 respectively.Finally, as shown in Figure 1, in step 24, outer circuit carries out anti-weldingly to process with contact, to protect outer-layer circuit and form protective layer on contact, and obtain the finished product of modularized inductance device.Be noted that step 23,24 is the following process program of general industry to printed circuit board (PCB), this can understand for those skilled in the art, and thin portion flow process is not described in detail in detail in the above description.
What illustrate is, after undergoing the above-described steps, this modularized inductance device can carry out normal function, certainly depending on actual demand, the word needed for client, trade mark or piece mark can also be printed on this modularized inductance device in the mode of screen painting, then allow word paint ink harden in the mode of heat baking or Ultraviolet radiation.Then, carry out on demand cutting into appropriate size, and after carrying out electrical measurement, visual examination, can shipment be packed.
After this modularized inductance device completes, need carry out follow-up by adhesive surface part (Surface Mount Component, SMC) the adhesive surface processing procedure (Surface Mount Technology, SMT) of this modularized inductance device is adhered to.And adhesive surface processing procedure carries out leadless process at present, lead-free tin cream/tin silk is namely selected to carry out the operation of print tin.Because lead-free tin cream/tin silk has different alloy compositions, and molten Xi Wendu can be variant according to alloying component difference, therefore the thermoplastics selected by the present invention or thermoset plastics at least need bear the temperature of 220 DEG C, are namely to make the high temperature carrying out adhesive surface operation that this substrate can not be allowed to produce the phenomenon of distortion or carbonization.
In sum, the present invention is by molding this substrate 3 in the mode of injection-moulding plastic, this substrate 3 is allowed directly to form the storage tank 32 put for iron core 4, replace tradition with stacked pressing to form the mode of this substrate 3, carry out follow-up procedure again, significantly simplify production process and reduce manufacturing cost, also improving the yield of final finished.
Claims (6)
1. a manufacture method for modularized inductance device, is characterized in that, comprises the following step:
A (), with injection-moulding plastic substrate, this substrate comprises at least one recessed storage tank;
B an iron core is placed in this storage tank by ();
C () respectively arranges the two-layer line layer connected up respectively in the upper and lower side of this substrate, and carry out electroplating in pressing, boring, hole, and circuit etching is to form internal layer circuit, outer-layer circuit; And
D () carries out anti-weldingly processing with contact on outer circuit, to protect outer-layer circuit and form protective layer on contact, and obtain modularized inductance device.
2. the manufacture method of modularized inductance device according to claim 1, it is characterized in that, these plastics are selected from thermoplastics, and at least bear the temperature of 220 DEG C.
3. the manufacture method of modularized inductance device according to claim 2, it is characterized in that, this thermoplastics is selected from polyphenylene sulfide, liquid crystal polyester, polycyclic hexanol diethylester, and their combination.
4. the manufacture method of modularized inductance device according to claim 1, it is characterized in that, these plastics are selected from thermoset plastics, and at least bear the temperature of 220 DEG C.
5. the manufacture method of modularized inductance device according to claim 4, is characterized in that, this thermoset plastics is selected from phenolic resins, poly-o-dially phthalate, and their combination.
6. the manufacture method of modularized inductance device according to claim 1, it is characterized in that, in this step (b), this iron core does not protrude this storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310329613.5A CN104349611A (en) | 2013-07-31 | 2013-07-31 | Method for manufacturing modular inductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310329613.5A CN104349611A (en) | 2013-07-31 | 2013-07-31 | Method for manufacturing modular inductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104349611A true CN104349611A (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310329613.5A Pending CN104349611A (en) | 2013-07-31 | 2013-07-31 | Method for manufacturing modular inductor device |
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| Country | Link |
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| CN (1) | CN104349611A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066011A (en) * | 1992-06-16 | 1994-01-14 | Tatsuta Electric Wire & Cable Co Ltd | Transfer printed circuit formed body |
| JP2006049537A (en) * | 2004-08-04 | 2006-02-16 | Sohki:Kk | Process for producing three-dimensional circuit board and electronic device |
| CN101815409A (en) * | 2010-04-23 | 2010-08-25 | 陈国富 | Method for manufacturing circuit board through injection molding |
| TW201216303A (en) * | 2010-10-06 | 2012-04-16 | Ajoho Entpr Co Ltd | Inductor structure |
-
2013
- 2013-07-31 CN CN201310329613.5A patent/CN104349611A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH066011A (en) * | 1992-06-16 | 1994-01-14 | Tatsuta Electric Wire & Cable Co Ltd | Transfer printed circuit formed body |
| JP2006049537A (en) * | 2004-08-04 | 2006-02-16 | Sohki:Kk | Process for producing three-dimensional circuit board and electronic device |
| CN101815409A (en) * | 2010-04-23 | 2010-08-25 | 陈国富 | Method for manufacturing circuit board through injection molding |
| TW201216303A (en) * | 2010-10-06 | 2012-04-16 | Ajoho Entpr Co Ltd | Inductor structure |
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Application publication date: 20150211 |