CN104346006B - Capacitance plate and its manufacturing method and the equipment with the capacitance plate - Google Patents
Capacitance plate and its manufacturing method and the equipment with the capacitance plate Download PDFInfo
- Publication number
- CN104346006B CN104346006B CN201310330302.0A CN201310330302A CN104346006B CN 104346006 B CN104346006 B CN 104346006B CN 201310330302 A CN201310330302 A CN 201310330302A CN 104346006 B CN104346006 B CN 104346006B
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- cabling
- ito film
- cablings
- glass plate
- capacitance plate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention discloses a kind of capacitance plate and its manufacturing methods, also disclose the equipment with the capacitance plate.The capacitance plate includes：Glass plate；Ito film, the ito film are set on the glass plates；Multiple first cablings, multiple first cablings are located in the ito film；With multiple second cablings, at least one of multiple described second cablings include first part and second part, the first part is located in the ito film, the second part is set on the glass plates, the first part of second cabling is connected with the second part, and the rest part in multiple second cablings is set on the glass plates.Capacitance plate according to embodiments of the present invention has many advantages, such as that manufacture border width at low cost, being occupied by cabling is small.
Description
Technical field
The present invention relates to a kind of capacitance plate and its manufacturing methods, further relate to a kind of equipment with the capacitance plate.
Background technology
The cabling of the edge of existing capacitance plate is all by silver paste silk-screen or the etching of metal-plated film layer (MoAlMo) yellow light
And it obtains.But silver paste silk-screen is there are the defects of line width and larger line spacing, can not be applied to that channel is more, frame requirement is relatively narrow
Capacitance plate on.Metal-plated film layer yellow light etching there are it is of high cost the defects of.
Invention content
The present invention is directed at least solve one of technical problem in the prior art.For this purpose, one object of the present invention
It is to propose a kind of capacitance plate.
It is another object of the present invention to propose a kind of manufacturing method of the capacitance plate.
A further object of the present invention is to propose a kind of equipment with the capacitance plate.
To achieve these goals, embodiment according to a first aspect of the present invention proposes a kind of capacitance plate, the capacitance plate
Including：Glass plate；Ito film, the ito film are set on the glass plates；Multiple first cablings, multiple first cablings are located at
In the ito film；With multiple second cablings, at least one of multiple second cablings include first part and second
Point, the first part is located in the ito film, and the second part is set on the glass plates, the institute of second cabling
It states first part with the second part to be connected, the rest part in multiple second cablings is set on the glass plates.
Capacitance plate according to embodiments of the present invention is by by described the first of at least one of multiple second cablings
Part is located in the ito film, so as to utilize the clear area opposite with the cabling area of the glass plate in the ito film
Domain.That is, by the first part of at least one of multiple second cablings be located in the ito film with institute
It states in the opposite white space in cabling area of glass plate, so as to reduce the overall width of the second cabling on the glass plate
（At least the overall width of second cabling on the glass plate can be reduced half）, it is possible thereby to reduce multiple described
The border width that two cablings occupy.Moreover, from another perspective, it can be in the frame that multiple second cablings is kept to occupy
In the case that width is constant, lower-cost method is utilized（Such as silver paste silk-screen）Manufacture multiple second cablings.Therefore, root
Have many advantages, such as that manufacture border width at low cost, being occupied by cabling is small according to the capacitance plate of the embodiment of the present invention.
In addition, capacitance plate according to embodiments of the present invention can also have following additional technical characteristic：
According to one embodiment of present invention, each second cabling includes first part and second part, Mei Gesuo
The first part for stating the second cabling is located in the ito film and the second part is set on the glass plates, wherein often
The first part of a second cabling is connected with the second part.It is possible thereby to further reduce multiple second cablings
400 border widths occupied.
According to one embodiment of present invention, the first part of each second cabling leads to the second part
Conduction element is crossed to be connected.It is possible thereby to make the part being located in the ito film of second cabling and set on the glass plates
Part more easily, steadily link together, so as to so that the capacitance plate structure more stablize, rationally.
According to one embodiment of present invention, the conduction element is made of anisotropic conductive adhesive paste.It is possible thereby to make described
The part being located in the ito film of two cablings and the part set on the glass plates more easily, are steadily connected to
Together.
According to one embodiment of present invention, each first cabling is silk-screen silver paste cabling, and each described second walks
Line is silk-screen silver paste cabling.It is possible thereby to further reduce the manufacture cost of the capacitance plate.
According to one embodiment of present invention, each first cabling is emitter cabling, each second cabling
For receiving pole cabling.
Embodiment according to a second aspect of the present invention proposes a kind of system of the capacitance plate according to a first aspect of the present invention
Method is made, the manufacturing method includes the following steps：
Prepare the glass plate and the ito film；
Multiple first cablings are printed in the ito film；
The first part of at least one of multiple second cablings is printed in the ito film and by second part
Printing on the glass plates, and the first part of second cabling is connected with the second part, by multiple institutes
The rest part stated in the second cabling is printed on the glass plates；With
The glass plate and the ito film are combined together.
The capacitance plate is manufactured by using manufacturing method according to embodiments of the present invention, so as to reduce the electricity
The manufacture cost of Rong Ping, reduces the border width occupied by cabling.
According to one embodiment of present invention, the manufacturing method includes the following steps：
Glass plate supplied materials is provided, then ITO plated films is carried out to the glass plate supplied materials successively and ITO etchings is described to obtain
Glass plate；
Ito film supplied materials is provided, is then shunk successively to the ito film supplied materials and ITO etches to obtain the ITO
Film；
Silk-screen silver paste block and conduction element in the ito film carry out laser-induced thermal etching, to obtain multiple institutes to silver paste block
At least one first part in the first cabling and multiple second cablings is stated, in multiple second cablings
At least one first part be connected with conduction element；
Described at least one in silk-screen conduction element, multiple second cablings being connected with conduction element on the glass plates
Rest part in a second part and multiple second cablings；With
The ito film and the glass plate are fit together, and make the conduction element in the ito film and the glass plate
On conduction element be connected.
It is possible thereby to further reduce the manufacture cost of the capacitance plate.
Embodiment according to a third aspect of the present invention proposes a kind of equipment, and the equipment is included according to a first aspect of the present invention
The capacitance plate.
Have that manufacture border width that is at low cost, being occupied by cabling small etc. excellent thus according to the equipment of the embodiment of the present invention
Point.
According to one embodiment of present invention, the equipment is mobile phone.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Significantly and it is readily appreciated that, wherein：
Fig. 1 is the structure diagram of capacitance plate according to an embodiment of the invention；
Fig. 2 is the sectional view along A-A directions of Fig. 1；
Fig. 3 is the structure diagram of capacitance plate according to another embodiment of the invention；
Fig. 4 is the sectional view along B-B directions of Fig. 3；
Fig. 5 is the flow chart of the manufacturing method of capacitance plate according to embodiments of the present invention.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " on ", " under ",
The orientation or position relationship of the instructions such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description rather than instruction or dark
Show that signified device or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that right
The limitation of the present invention.In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint are opposite
Importance or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, " multiple " contain
Justice is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Capacitance plate 10 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 4.As Figure 1-Figure 4, according to this hair
The capacitance plate 10 of bright embodiment includes glass plate 100, ito film 200, multiple first cablings 300 and multiple second cablings 400.
Ito film 200 is located on glass plate 100.Multiple first cablings 300 are located in ito film 200.Multiple second cablings 400
At least one of include first part 410 and second part 420, first part 410 is located in ito film 200, second part
420 are located on glass plate 100, and the first part 410 of the second cabling 400 is connected with second part 420.In other words, for simultaneously
It is located at for the second cabling 400 in ito film 200 and on glass plate 100（Described at least one in i.e. multiple second cablings 400
It is a）, the first part 410 of one of them the second cabling 400 is connected with the second part 420 of second cabling 400.Multiple second
Rest part in cabling 400 is located on glass plate 100.
Capacitance plate 10 according to embodiments of the present invention is by by the first part of at least one of multiple second cablings 400
410 are located in ito film 200, so as to utilize the white space opposite with the cabling area of glass plate 100 in ito film 200.
That is, the first part 410 of at least one of multiple second cablings 400 is located in ito film 200 and glass plate
In the opposite white space in 100 cabling area, so as to reduce the overall width of the second cabling 400 on glass plate 100（At least
The overall width of the second cabling 400 on glass plate 100 can be reduced half）, accounted for it is possible thereby to reduce multiple second cablings 400
Border width.Moreover, from another perspective, the border width that multiple second cablings 400 occupy can kept constant
In the case of, utilize lower-cost method（Such as silver paste silk-screen）Manufacture multiple second cablings 400.Therefore, according to the present invention
The capacitance plate 10 of embodiment has many advantages, such as that manufacture border width at low cost, being occupied by cabling is small.
In order to preferably to " first part 410 of at least one of multiple second cablings 400 be located in ito film 200 and
At least one second part 420 in multiple second cablings 400 is located on glass plate 100 " it illustrates, name one
A specific example.For example, the second cabling 400 can be ten, each second cabling 400 can include first part 410
With second part 420.Wherein, six the second cablings 400 are all located on glass plate 100, and the of the second cabling of four additional 400
A part 410 can be located in ito film 200, and the second part 420 of this four the second cablings 400 can be located at glass plate 100
On.Moreover, the first part 410 of each in this four the second cablings 400 can be with second of second cabling 400
420 are divided to be connected.
First cabling 300 and the second cabling 400 can be relatively low with cost but lead to line width and the larger method of line spacing
Manufacture.
Specifically, each first cabling 300 can be silk-screen silver paste cabling, and each second cabling 400 can be silk-screen silver
Starch cabling.It is possible thereby to further reduce the manufacture cost of capacitance plate 10.
Each first cabling 300 can be emitter cabling, and each second cabling 400 can be receiving pole cabling.
The first ITO layer 110 can be equipped on glass plate 100, the second ITO layer 210 can be equipped in ito film 200.
As shown in Figure 3 and Figure 4, in some embodiments of the invention, each second cabling 400 can include first part
410 and second part 420, the first part 410 of each second cabling 400 can be located in ito film 200, and each second walks
The second part 420 of line 400 can be located on glass plate 100.Wherein, the first part 410 of each second cabling 400 can be with
Second part 420 is connected.It is possible thereby to further reduce the border width that multiple second cablings 400 occupy.
In order to preferably to " first part 410 of each second cabling 400 can be located in ito film 200, and each
The second part 420 of two cablings 400 can be located on glass plate 100.Wherein, the first part 410 of each second cabling 400 can
To be connected with second part 420 " it illustrates, below for a specific example.For example, the second cabling 400 can be ten,
Each second cabling 400 can include first part 410 and second part 420.Wherein, the of this ten the second cablings 400
A part 410 can be located in ito film 200, and the second part 420 of this ten the second cablings 400 can be located at glass
On plate 100.Moreover, the first part 410 of each in this ten the second cablings 400 can be with second cabling 400
Second part 420 is connected.
As shown in figures 1 and 3, in one embodiment of the invention, for being arranged on glass plate 100 and ito film 200
The second cabling 400 for, the first part 410 of each second cabling 400 and the second part 420 of second cabling 400 can
To be connected by conduction element 500.In other words, the part being located in ito film 200 of each second cabling 400 and second cabling
400 part being located on glass plate 100 can be connected by conduction element 500.It is possible thereby to make being located at for the second cabling 400
Part in ito film 200 and the part being located on glass plate 100 more easily, steadily link together, so as to so that
The structure of capacitance plate 10 is more stablized, rationally.
Advantageously, conduction element 500 can be by anisotropic conductive adhesive paste（ACP）It is made.It is possible thereby to make setting for the second cabling 400
Part in ito film 200 more easily, steadily links together with the part being located on glass plate 100.
Conduction element 500 can be multiple, and the quantity of conduction element 500 can be equal to the second cabling being located in ito film 200
400 quantity.Wherein, the part being located in ito film 200 of second cabling 400 and second cabling 400 are located at glass
Part on plate 100 can be connected by a conduction element 500.
The manufacturing method of capacitance plate 10 according to embodiments of the present invention is described below with reference to Fig. 1-Fig. 5.Such as Fig. 1-Fig. 5 institutes
Show, the manufacturing method of capacitance plate 10 according to embodiments of the present invention includes the following steps：
Prepare glass plate 100 and ito film 200；
Multiple first cablings 300 are printed in ito film 200；
The first part 410 of at least one of multiple second cablings 400 is printed in ito film 200, and by multiple
At least one second part 420 in two cablings 400 is printed on glass plate 100, and will be in multiple second cablings 400
At least one first part 410 be connected with second part 420, by multiple second cablings 400 rest part print
System is on glass plate 100.In other words, by the second part being located in ito film 200 of cabling 400 and setting for second cabling 400
Part on glass plate 100 is connected.
Glass plate 100 and ito film 200 are combined together.
Capacitance plate 10 is manufactured by using manufacturing method according to embodiments of the present invention, so as to reduce capacitance plate 10
Manufacture cost, reduce the border width occupied by cabling.
Glass plate 100 sharp can by known method manufacture.Specifically, glass plate can be manufactured using following methods
100：Glass plate supplied materials is provided, then carries out ITO plated films and ITO etchings to the glass plate supplied materials successively to obtain glass plate
100.Further, it is also possible to silk-screen decorative layer is made on the glass plate supplied materials.
Ito film 200 sharp can by known method manufacture.Specifically, ito film 200 can be manufactured using following methods：
Ito film supplied materials is provided, is then shunk successively to the ito film supplied materials and ITO etches to obtain ito film 200.
Then can in ito film 200 silk-screen silver paste block and conduction element 500, to silver paste block carry out laser-induced thermal etching, with
At least one first part 410 in multiple first cablings 300 and multiple second cablings 400 is obtained, multiple second walk
At least one first part 410 in line 400 is connected with conduction element 500.That is, each second cabling 400
The part being located in ito film 200 can be connected with a conduction element 500.
On glass plate 100 in silk-screen conduction element 500, multiple second cablings 400 being connected with conduction element 500 described in extremely
Rest part in second part 420 and multiple second cablings 400 one few.In other words, the institute in multiple second cablings 400
State it is at least one in the part being located on glass plate 100 of each second cabling 400 can be connected with a conduction element 500.
Ito film 200 and glass plate 100 are fit together, and make the conduction element 500 and glass plate 100 in ito film 200
On conduction element 500 be connected.It is possible thereby to make in multiple second cablings 400 described at least one is located in ito film 200
Part is connected with the part being located on glass plate 100.
Specifically, sharp ito film 200 and glass plate 100 can be fit together by known method.
The present invention also provides a kind of equipment, equipment according to embodiments of the present invention includes the capacitance according to above-described embodiment
Screen 10.Have many advantages, such as that manufacture border width at low cost, being occupied by cabling is small thus according to the equipment of the embodiment of the present invention.
Specifically, the equipment can be mobile phone.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means to combine specific features, the knot that the embodiment or example describe
Structure, material or feature are contained at least one embodiment of the present invention or example.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner combine in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of being detached from the principle of the present invention and objective a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The range of invention is limited by claim and its equivalent.
Claims (9)
1. a kind of capacitance plate, which is characterized in that including：
Glass plate；
Ito film, the ito film are set on the glass plates；
Multiple first cablings, multiple first cablings are located in the ito film；With
At least one of multiple second cablings, multiple second cablings include first part and second part, described first
Part be located in the ito film, the second part is set on the glass plates, the first part of second cabling with
The second part is connected, and the rest part in multiple second cablings is set on the glass plates；
Wherein, each first cabling is silk-screen silver paste cabling, and each second cabling is silk-screen silver paste cabling.
2. capacitance plate according to claim 1, which is characterized in that each second cabling includes first part and second
Part, the first part of each second cabling is located in the ito film and the second part is located at the glass
On plate, wherein the first part of each second cabling is connected with the second part.
3. capacitance plate according to claim 2, which is characterized in that the first part and institute of each second cabling
Second part is stated by conduction element to be connected.
4. capacitance plate according to claim 3, which is characterized in that the conduction element is made of anisotropic conductive adhesive paste.
5. capacitance plate according to claim 1, which is characterized in that each first cabling is emitter cabling, each
Second cabling is receiving pole cabling.
6. a kind of manufacturing method of capacitance plate according to any one of claims 1-5, which is characterized in that including following step
Suddenly：
Prepare the glass plate and the ito film；
Multiple first cablings are printed in the ito film；
The first part of at least one of multiple second cablings is printed in the ito film and prints second part
On the glass plates, and by the first part of second cabling it is connected with the second part, by multiple described
Rest part printing in two cablings is on the glass plates；With
The glass plate and the ito film are combined together.
7. manufacturing method according to claim 6, which is characterized in that include the following steps：
Glass plate supplied materials is provided, then carries out ITO plated films and ITO etchings to the glass plate supplied materials successively to obtain the glass
Plate；
Ito film supplied materials is provided, is then shunk successively to the ito film supplied materials and ITO etches to obtain the ito film；
Silk-screen silver paste block and conduction element in the ito film carry out laser-induced thermal etching to silver paste block, to obtain multiple described the
At least one first part in one cabling and multiple second cablings, the institute in multiple second cablings
At least one first part is stated with conduction element to be connected；
It is described at least one in silk-screen conduction element, multiple second cablings being connected with conduction element on the glass plates
Rest part in the second part and multiple second cablings；With
The ito film and the glass plate are fit together, and made on conduction element and the glass plate in the ito film
Conduction element is connected.
8. a kind of equipment, which is characterized in that including capacitance plate according to any one of claims 1-5.
9. equipment according to claim 8, which is characterized in that the equipment is mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330302.0A CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330302.0A CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
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| CN104346006A CN104346006A (en) | 2015-02-11 |
| CN104346006B true CN104346006B (en) | 2018-06-15 |
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| CN201310330302.0A Active CN104346006B (en) | 2013-07-31 | 2013-07-31 | Capacitance plate and its manufacturing method and the equipment with the capacitance plate |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107219957B (en) * | 2017-06-20 | 2020-08-18 | 厦门天马微电子有限公司 | Array substrate and display panel |
| WO2020227978A1 (en) * | 2019-05-15 | 2020-11-19 | 深圳市柔宇科技有限公司 | Electronic device and manufacturing method for electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096533A (en) * | 2009-12-15 | 2011-06-15 | 索尼公司 | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
| CN102929576A (en) * | 2011-08-11 | 2013-02-13 | 乐金显示有限公司 | Display device integrated with touch panel |
| CN202795287U (en) * | 2012-04-17 | 2013-03-13 | 厦门市宝龙达光电技术有限公司 | Touch screen with narrow frame |
| CN203038254U (en) * | 2012-12-30 | 2013-07-03 | 金龙机电（东莞）有限公司 | Touch screen with narrow frame |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8716932B2 (en) * | 2011-02-28 | 2014-05-06 | Apple Inc. | Displays with minimized borders |
-
2013
- 2013-07-31 CN CN201310330302.0A patent/CN104346006B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096533A (en) * | 2009-12-15 | 2011-06-15 | 索尼公司 | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
| CN102929576A (en) * | 2011-08-11 | 2013-02-13 | 乐金显示有限公司 | Display device integrated with touch panel |
| CN202795287U (en) * | 2012-04-17 | 2013-03-13 | 厦门市宝龙达光电技术有限公司 | Touch screen with narrow frame |
| CN203038254U (en) * | 2012-12-30 | 2013-07-03 | 金龙机电（东莞）有限公司 | Touch screen with narrow frame |
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| CN104346006A (en) | 2015-02-11 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150908 |
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Effective date of registration: 20150908 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Applicant after: Shenzhen BYD Electronic Component Co., Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Applicant before: Biyadi Co., Ltd. |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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