CN104341565A - Resin modifier - Google Patents

Abstract

A disclosed resin modifier is characterized in that the resin modifier is prepared from decarboxylated cashew nut shell oil through vacuum distillation. The resin modifier is a clear transparent liquid, has the chroma less than 8, the density of 0.9200-0.9600 g/cm<3> at 25 DEG C, the viscosity of 30-70 mpa*s at 25 DEG C, the pH value of 3-7, the water content less than 1% and the solid content larger than 99%. The temperature for vacuum distillation is 240-300 DEG C, and the vacuum degree is 250 P or less. The resin modifier is applied to a resin system of a copper clad laminate, and the prepared copper clad laminate is good in flexibility, low in water absorption rate, high in electrical insulating property after being immersed in water or moisturized, good in corrosion resistance and low in manufacturing cost.

Description

A kind of modifier

Technical field

The present invention relates to resin modified technical field, particularly a kind of modifier for the preparation of copper-clad plate resin property.

Background technology

Copper coated foil plate soaks electronic glass-fiber cloth or other strongthener with resin, one side or the two-sided a kind of board-like material made coated with Copper Foil and through hot pressing, be called as copper-clad laminate (Copper Clad Laminate, CCL), referred to as copper-clad plate.

Copper-clad plate is the extremely important base mateiral of printed circuit board, the printed circuit board of various multi-form, difference in functionality, be all carry out selectively processing in copper-clad plate, etch, hole and the operation such as copper facing, make different printed electronic circuits (one side, two-sided, multilayer).Baseplate material during copper-clad plate manufactures as printed circuit board, interconnection, insulation and support are mainly play a part to printed circuit board, the transmission speed of signal in circuit, power loss and natural impedance etc. are had a great impact, therefore, processibility, manufacture level, manufacturing cost and long-term reliability in the performance of printed circuit board, quality, manufacture and stability depend on copper-clad plate to a great extent.

The modified phenolic resins that existing copper-clad plate uses is tung oil-modified resol, its price is higher, in order to reduce costs, CN101265352B discloses one " method of Cardanol Modified PF Resin and production environmental-protection flame-retardant paper-based copper-coated board ", because tung oil is backbone, containing two double bonds in its molecular formula, and cardanol molecular structure is while be phenyl ring, only there is a double bond, therefore the reticulated structure formed after cardanol reaction is fewer than the reticulated structure formed after tung oil reaction, thus reduce hardness and the snappiness of product, easy to crack when causing obtained copper-clad plate punching, have a strong impact on quality product.Therefore foregoing invention adopts part cardanol to substitute the mode of tung oil, its method preparing resol is as follows: it is reacted under the effect of sour catalyst at cardanol, tung oil, phenol, then drop into formaldehyde, Nitrogen-containing Phenolic Resins reacts under alkali catalysis, then Dehydration obtains.The shortcoming of this kind of way is: during reaction, cardanol and tung oil add simultaneously, and the existence of sour catalyst can suppress the reaction of cardanol, makes cardanol not have effect, thus the product performance reduced, in order to improve performance, often need the consumption strengthening tung oil, product cost is difficult to reduce.

Summary of the invention

Technical problem to be solved by this invention is to overcome above-mentioned deficiency, there is provided a kind of production cost low, and the snappiness of obtained copper-clad plate is good, water-intake rate is low, soak or electrical insulation properties after making moist is high, the modifier of good corrosion resistance, low cost of manufacture.

Technical problem to be solved by this invention can be achieved through the following technical solutions:

A kind of modifier, it is characterized in that, obtained by the cashew nut shell oil after decarboxylation through vacuum distilling, wherein this modifier is clear liquid, and colourity < 8,25 DEG C of density are 0.9200-0.9600g/cm ³, 25 DEG C of viscosity 30-70mpas, pH value is 3-7, moisture < 1%, solid content > 99%; The temperature of described vacuum distilling 240 ~ 300 DEG C, below vacuum 250 handkerchief.

Modifier of the present invention is applied in the resin system of copper-clad plate, and the snappiness of obtained copper-clad plate is good, water-intake rate is low, soak or electrical insulation properties after making moist is high, good corrosion resistance, low cost of manufacture.

Embodiment

A kind of modifier, obtained through vacuum distilling by the cashew nut shell oil after decarboxylation, wherein this modifier is clear liquid, and colourity < 8,25 DEG C of density are 0.9200-0.9600g/cm ³, 25 DEG C of viscosity 30-70mpas, pH value is 3-7, moisture < 1%, solid content > 99%; The temperature of described vacuum distilling 240 ~ 300 DEG C, below vacuum 250 handkerchief.

The application example of this modifier is as follows:

Methyl alcohol 2800g is dropped in reactor, under agitation, be 99% dihydroxyphenyl propane 800g by purity, industrial one-level epoxy soybean oil 1000g, modifier 750g material drops in reactor in order, stir and start to heat up, temperature adds 10g imidazoles when being raised to 120 DEG C, continues to heat up, when temperature is raised to 175 DEG C, start to count the reaction times, at 175-185 DEG C of insulation 120min; After insulation terminates, viscosimetric is sampled when being cooled to below 120 DEG C, when viscosity is in 450-550cps (100 DEG C) scope, by in product suction reactor, also input phenol 1300g, formaldehyde 1800g, weight percent concentration are 23-25% ammoniacal liquor 70g, triethylamine 50g successively, start after stirring 10min to heat up, in 30-50min, be warmed up to 88 DEG C and start to count the reaction times, control temperature of reaction at 90-95 DEG C, when total reaction time reaches 90min, gel time is surveyed in sampling, when gel time reaches 120-160s/160 DEG C, start vacuum hydro-extraction; When the transparent rear temperature of vacuum hydro-extraction goes back up to 75 ~ 80 DEG C naturally, solvent is added stirring and dissolving 1-2h in reactor, sampling and testing, resin liquid outward appearance is reddish brown transparent, and gel time is 90-160 second (160 ± 2 DEG C), solids content 55-60%(150 DEG C, 1H).

Use indicated weight 135g/m ²wood pulp paper, soak with obtained resin liquid, drying makes the impregnation material that resin content is 44%-46%.Get 8 impregnation material and 1 25um adhesive coated foil is superimposed, at 100Kg/cm ², hot pressing 100 minutes under 160 DEG C of conditions, namely make the copper-clad laminate that thickness is 1.6mm.Resistance to dip solderability (260 DEG C) more than 15 seconds of sheet material, punching is 40-80 DEG C, and other performances reach CPFCP-04 technical requirement in GB4723-92 standard.

Claims (1)

1. a modifier, is characterized in that, is obtained through vacuum distilling by the cashew nut shell oil after decarboxylation, and wherein this modifier is clear liquid, and colourity < 8,25 DEG C of density are 0.9200-0.9600g/cm ³, 25 DEG C of viscosity 30-70mpas, pH value is 3-7, moisture < 1%, solid content > 99%; The temperature of described vacuum distilling 240 ~ 300 DEG C, below vacuum 250 handkerchief.