JPH07286053A - Production of paper-base phenol resin laminate - Google Patents
Production of paper-base phenol resin laminateInfo
- Publication number
- JPH07286053A JPH07286053A JP6081608A JP8160894A JPH07286053A JP H07286053 A JPH07286053 A JP H07286053A JP 6081608 A JP6081608 A JP 6081608A JP 8160894 A JP8160894 A JP 8160894A JP H07286053 A JPH07286053 A JP H07286053A
- Authority
- JP
- Japan
- Prior art keywords
- polyether
- resin
- phenol resin
- phenolic resin
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は紙基材フェノール樹脂積
層板の製造方法に関する。FIELD OF THE INVENTION The present invention relates to a method for producing a paper-based phenolic resin laminate.
【０００２】[0002]
【従来の技術】民生用電子機器の小型高機能化が進み、
それに用いられる印刷配線板は高密度、微細配線化する
傾向にある。これに伴って、印刷配線板に用いられる銅
張積層板には、高密度実装が可能であることが要求され
ている。このため、はんだ耐熱性や銅箔引はがし強さに
対する要求レベルがより厳しいものになった。さらに最
近では安価な両面配線板として需要が増加している銀ス
ルーホール配線板には耐湿性、耐銀移行性、絶縁抵抗が
要求されるようになった。これらの問題点を解決するた
めに、さまざまな手法が取られてきたが、紙基材フェノ
ール樹脂積層板において良好な特性を得るためには、樹
脂の改良だけでなく、紙に十分樹脂を含浸させることが
必要であることが分かってきた。樹脂の含浸が不十分な
場合には、はんだ耐熱性や、絶縁抵抗が劣るようにな
る。これまで、樹脂の含浸性を向上させて、積層板の絶
縁抵抗を向上させる方法としては、特開平４−２４９５
４３号公報で提案されている、樹脂にステアリン酸エス
テルを添加する方法、特開平３−１４０３５５号公報で
提案されている、ポリオキシエチレン類を添加する方
法、特開平３−１９５７４３号公報、特開平３−１９５
７４４号公報で提案されている樹脂含浸時に紙基材を加
湿する方法などがある。2. Description of the Related Art Smaller and more sophisticated consumer electronic devices have been developed,
The printed wiring board used for this tends to have high density and fine wiring. Along with this, copper clad laminates used for printed wiring boards are required to be capable of high-density mounting. For this reason, the required levels for solder heat resistance and copper foil peeling strength have become more stringent. Furthermore, recently, demand for silver through-hole wiring boards, which has been increasing in demand as an inexpensive double-sided wiring board, is required to have moisture resistance, silver migration resistance, and insulation resistance. Various methods have been taken to solve these problems, but in order to obtain good properties in a paper-based phenolic resin laminate, not only improving the resin but also impregnating the paper with the resin is sufficient. It turns out that it is necessary to let them do. Insufficient resin impregnation results in poor solder heat resistance and insulation resistance. Hitherto, as a method for improving the impregnating property of a resin to improve the insulation resistance of a laminated plate, there is disclosed in Japanese Patent Laid-Open No. 4-2495 / 1992.
No. 43, a method of adding a stearic acid ester to a resin, a method of adding a polyoxyethylene compound proposed in JP-A-3-140355, a JP-A-3-195743, Kaihei 3-195
No. 744, there is a method of humidifying a paper base material during resin impregnation.
【０００３】[0003]
【発明が解決しようとする課題】しかし樹脂にステアリ
ン酸エステルやポリオキシエチレン類を添加する方法
や、基材を加湿する方法では、はんだ耐熱性の低下が避
けられず、実用化に関しては不十分であった。 本発明
は、かかる状況に鑑みてなされたものであって、紙基材
に下処理用フェノール樹脂を含浸させ、乾燥させた後、
上塗り用フェノール樹脂を含浸させて乾燥して得られた
プリプレグを所定枚数重ねて加熱加圧して積層板を製造
する際に、下処理用フェノール樹脂と上塗り用フェノー
ル樹脂の一方又は両方にポリエーテル変性ジメチルポリ
シロキサン共重合物、ポリエーテル変性メチルアルキル
ポリシロキサン共重合物、ポリエーテル変性ジメチルポ
リシロキサン、ポリエステル変性ジメチルポリシロキサ
ンから選ばれる少なくとも１種類以上を配合することに
よって、はんだ耐熱性を低下させることなく、吸湿時の
絶縁抵抗に優れた紙基材フェノール樹脂積層板の製造方
法を提供することを目的とする。However, in the method of adding stearic acid ester or polyoxyethylene to the resin or the method of humidifying the base material, the decrease in solder heat resistance is unavoidable, and it is insufficient for practical use. Met. The present invention has been made in view of such circumstances, in which a paper base material is impregnated with a phenolic resin for pretreatment, and after drying,
When a predetermined number of prepregs impregnated with the topcoat phenolic resin and dried are stacked and heated and pressed to produce a laminate, one or both of the undercoating phenolic resin and the topcoating phenolic resin is modified with polyether. Reduction of solder heat resistance by blending at least one selected from dimethylpolysiloxane copolymer, polyether-modified methylalkylpolysiloxane copolymer, polyether-modified dimethylpolysiloxane, polyester-modified dimethylpolysiloxane It is an object of the present invention to provide a method for producing a paper-based phenolic resin laminate excellent in insulation resistance when absorbing moisture.
【０００４】[0004]
【課題を解決するための手段】本発明は、紙基材に下処
理用フェノール樹脂を含浸させ、乾燥させた後、上塗り
用フェノール樹脂を含浸させて乾燥して得られたプリプ
レグを所定枚数重ねて、加熱加圧して積層板を製造する
際に、下処理用フェノール樹脂と上塗り用フェノール樹
脂の一方又は両方にポリエーテル変性ジメチルポリシロ
キサン共重合物、ポリエーテル変性メチルアルキルポリ
シロキサン共重合物、ポリエーテル変性ジメチルポリシ
ロキサン、ポリエステル変性ジメチルポリシロキサンか
ら選ばれる少なくとも１種類以上を配合することによっ
て達成される。以下本発明を詳細に説明する。配合する
添加剤は、ポリエーテル変性ジメチルポリシロキサン共
重合物、ポリエーテル変性メチルアルキルポリシロキサ
ン共重合物、ポリエーテル変性ジメチルポリシロキサ
ン、ポリエステル変性ジメチルポリシロキサンから選ば
れる少なくとも１種類以上の単独または混合物である。
これら添加剤は、具体的にはＢＹＫ−３００、ＢＹＫ−
３０２、ＢＹＫ−３０６、ＢＹＫ−３０７、ＢＹＫ−３
１０、ＢＹＫ−３２０、ＢＹＫ−３２２、ＢＹＫ−３２
３、ＢＹＫ−３２４、ＢＹＫ−３２５、ＢＹＫ−３３
０、ＢＹＫ−３３１、ＢＹＫ−３３５、ＢＹＫ−３４４
（ビック・ケミー社製、商品名）などの市販品が挙げら
れ好適に使用できる。According to the present invention, a paper base material is impregnated with a phenolic resin for undertreatment, dried, and then impregnated with a phenolic resin for overcoat and dried to stack a predetermined number of prepregs. When producing a laminate by heating and pressing, one or both of the phenol resin for undertreatment and the phenol resin for overcoating, a polyether-modified dimethylpolysiloxane copolymer, a polyether-modified methylalkylpolysiloxane copolymer, It is achieved by blending at least one selected from polyether modified dimethylpolysiloxane and polyester modified dimethylpolysiloxane. The present invention will be described in detail below. The additive to be blended is at least one kind selected from the group consisting of polyether-modified dimethylpolysiloxane copolymer, polyether-modified methylalkylpolysiloxane copolymer, polyether-modified dimethylpolysiloxane and polyester-modified dimethylpolysiloxane, alone or in a mixture. Is.
These additives are specifically BYK-300 and BYK-
302, BYK-306, BYK-307, BYK-3
10, BYK-320, BYK-322, BYK-32
3, BYK-324, BYK-325, BYK-33
0, BYK-331, BYK-335, BYK-344
Commercially available products such as (manufactured by BYK-Chemie, trade name) can be mentioned and can be preferably used.
【０００５】添加量は、下処理用フェノール樹脂に添加
する場合は、その固形分に対して０．０１〜１重量％が
好ましい。添加量が０．０１重量％以下では効果が少な
く、１重量％以上では、はんだ耐熱性が低下する。上塗
り用フェノール樹脂に添加する場合も添加量は、０．０
１〜１重量％が好ましい。添加量が０．０１重量％以下
では効果が少なく、１重量％以上では、はんだ耐熱性が
低下する。下処理用フェノール樹脂と上塗り用フェノー
ル樹脂の両方に添加するときは、両者の合計が、０．０
１〜１重量％になるようにする。添加量が０．０１重量
％以下では効果が少なく、１重量％以上では、はんだ耐
熱性が低下する。添加剤は、下処理用フェノール樹脂、
上塗り用フェノール樹脂の溶剤溶液に添加して使用する
のが好ましい。下処理用フェノール樹脂としては、積層
板の特性を良好に保つものであれば特に規定するもので
はなく、未変性レゾール型フェノール樹脂、メラミン変
性フェノール樹脂、植物油変性フェノール樹脂等のフェ
ノール樹脂を単独または混合して用いることができる。
上塗り用フェノール樹脂としては、積層板の特性を良好
に保つものであれば特に規定するものではないが、打抜
加工性を満足させるためには、桐油等の乾性植物油で変
性したフェノール樹脂が望ましい。When the phenol resin for pretreatment is added, the addition amount is preferably 0.01 to 1% by weight based on the solid content. If the addition amount is 0.01% by weight or less, the effect is small, and if the addition amount is 1% by weight or more, solder heat resistance decreases. When added to the top coat phenolic resin, the addition amount is 0.0
1 to 1% by weight is preferable. If the addition amount is 0.01% by weight or less, the effect is small, and if the addition amount is 1% by weight or more, solder heat resistance decreases. When added to both the phenolic resin for undertreatment and the phenolic resin for overcoating, the total of both is 0.0
It should be 1 to 1% by weight. If the addition amount is 0.01% by weight or less, the effect is small, and if the addition amount is 1% by weight or more, solder heat resistance decreases. Additives are phenolic resins for pretreatment,
It is preferably used by adding it to a solvent solution of a phenol resin for top coating. The pretreatment phenolic resin is not particularly specified as long as it maintains good properties of the laminated plate, unmodified resol type phenolic resin, melamine modified phenolic resin, vegetable oil modified phenolic resin such as phenolic resin alone or It can be mixed and used.
The topcoat phenolic resin is not particularly specified as long as it can maintain the properties of the laminate well, but in order to satisfy the punching processability, a phenolic resin modified with a dry vegetable oil such as tung oil is desirable. .
【０００６】クラフト紙、リンター紙のような紙基材
に、上記の添加剤を配合した下処理用フェノール樹脂を
含浸、乾燥させた後、上塗り用フェノール樹脂を含浸、
乾燥させ、所定の大きさに切断し、プリプレグとする。
下処理用フェノール樹脂、上塗り用フェノール樹脂の付
着量、乾燥条件は特に規定するものではない。このプリ
プレグを複数枚重ねて、接着剤付き銅箔と共に加熱加圧
成形することより、銅張積層板を得る。加熱加圧成形条
件については、特に限定するものではないが、５０〜２
００Kg/cm2の圧力で１５０〜１８０℃、６０〜１２０分
成形することが望ましい。Paper base materials such as kraft paper and linter paper are impregnated with a phenolic resin for pretreatment containing the above-mentioned additives and dried, and then impregnated with a phenolic resin for top coat.
It is dried and cut into a predetermined size to obtain a prepreg.
The adhesion amount of the phenol resin for undertreatment and the phenol resin for overcoat and the drying conditions are not particularly specified. A plurality of the prepregs are stacked and heat-pressed together with the copper foil with the adhesive to obtain a copper-clad laminate. The heating and pressurizing condition is not particularly limited, but is 50 to 2
It is desirable to mold at 150 to 180 ° C. for 60 to 120 minutes at a pressure of 00 kg / cm 2 .
【０００７】[0007]
【作用】紙基材フェノール樹脂積層板は、紙基材にフェ
ノール樹脂溶液を含浸し、乾燥させて得られたプリプレ
グを加圧加熱することにより製造される。クラフト紙、
リンター紙のような紙基材は、繊維素間及び繊維素自体
に微細空隙を有しておりフェノール樹脂溶液は、この空
隙を満たし、さらにプリプレグを加熱加圧するときは樹
脂を流動させて微細空隙をフェノール樹脂で満たす必要
が有る。所が一般には、フェノール樹脂溶液を紙基材に
含浸させる際に微細空隙にまでフェノール樹脂溶液が浸
入せず乾燥されてしまうため、紙基材中に微細空隙がと
り残されたプリプレグとなり、これを加熱加圧しても微
細空隙が残ってしまう。この結果、これらの空隙に水分
が浸入するために紙基材とフェノール樹脂との密着性に
劣り耐湿性、耐銀移行性、絶縁抵抗が劣化する原因にな
っている。The paper-based phenol resin laminate is manufactured by impregnating a paper substrate with a phenol resin solution and drying the resulting prepreg to heat under pressure. Kraft paper,
A paper base material such as linter paper has fine voids between the fibrous elements and in the fibrous element itself, and the phenol resin solution fills these voids, and when the prepreg is heated and pressed, the resin is made to flow to cause the fine voids. Needs to be filled with phenolic resin. In general, when the phenol resin solution is impregnated into the paper base material, the phenol resin solution does not penetrate into the fine voids and is dried, resulting in a prepreg in which the fine voids are left in the paper base material. Even if it is heated and pressed, fine voids remain. As a result, water penetrates into these voids, resulting in poor adhesion between the paper base material and the phenol resin, which causes deterioration in moisture resistance, silver migration resistance, and insulation resistance.
【０００８】本発明は、下処理用フェノール樹脂、上塗
り用フェノール樹脂の一方又は両方に、ポリエーテル変
性ジメチルポリシロキサン共重合物、ポリエーテル変性
メチルアルキルポリシロキサン共重合物、ポリエーテル
変性ジメチルポリシロキサン、ポリエステル変性ジメチ
ルポリシロキサンから選ばれる少なくとも１種類以上を
配合することにより、フェノール樹脂溶液又はフェノー
ル樹脂の表面張力を低下させるので、紙基材の微細空間
にまで樹脂が浸入できるようになる。表面張力を低下さ
せるので有れば、界面活性剤を添加すれば良いが、電気
用途であることや耐熱性が必要なことから制限される。
本発明の添加剤は、フェノール樹脂溶液又はフェノール
樹脂の表面張力を低下させ、電気的性質や耐熱性を劣化
させない。下塗り用フェノール樹脂に添加した場合は、
紙基材への含浸性は良好となり、また上塗り用フェノー
ル樹脂に添加した場合では、下塗用フェノール樹脂の付
着量が少ないため、塗残した紙基材や微細空間への含浸
性が良好となる。また上塗り、下塗の両者に添加した場
合は、それぞれの効果が現われてくる。またプリプレグ
となった状態では、フェノール樹脂の流動性を向上さ
せ、溶剤飛散による空隙や微細空間を埋めるようにな
る。この結果、紙基材フェノール積層板は、基板内に空
隙や微細空間がなくなり耐湿性、耐銀移行性、絶縁抵抗
が向上する。In the present invention, one or both of a phenol resin for undertreatment and a phenol resin for overcoating is provided with a polyether-modified dimethylpolysiloxane copolymer, a polyether-modified methylalkylpolysiloxane copolymer, and a polyether-modified dimethylpolysiloxane. By blending at least one selected from polyester-modified dimethylpolysiloxane, the surface tension of the phenol resin solution or the phenol resin is lowered, so that the resin can penetrate into the fine space of the paper substrate. If it can lower the surface tension, a surfactant may be added, but it is limited because it is used for electrical purposes and heat resistance is required.
The additive of the present invention lowers the surface tension of the phenol resin solution or the phenol resin and does not deteriorate the electrical properties and heat resistance. When added to the undercoat phenolic resin,
Impregnation into the paper base material is good, and when added to the phenol resin for the top coat, the amount of the phenol resin for the base coat attached is small, so the impregnability into the paper base and microspace left uncoated becomes good. . When added to both the top coat and the base coat, their respective effects will appear. Further, in the state of being a prepreg, the fluidity of the phenol resin is improved and the voids and fine spaces due to the scattering of the solvent are filled. As a result, the paper-based phenol laminate has no voids or microspaces in the substrate, and has improved moisture resistance, silver migration resistance, and insulation resistance.
【０００９】[0009]
【実施例】以下、本発明を実施例に基づき詳細に説明す
るが、本発明はこれに限定されるものではない。 （下処理用フェノール樹脂の合成）フェノール１０００
ｇ、３７％ホルムアルデヒド水溶液９６０ｇ、トリエチ
ルアミン２０ｇからなる混合物を８０℃で３時間反応さ
せ、次に減圧下で濃縮し、これにメタノール８００ｇを
加えて、樹脂分５０％の未変性フェノール樹脂ワニスを
得た。 （上塗り用フェノール樹脂の合成）フェノール１５００
ｇ、桐油１０００ｇ、パラトルエンスルホン酸３ｇから
なる混合物を９０℃で３時間反応させ、ついで８０％パ
ラホルムアルデヒド８００ｇ、２５％アンモニア水５０
ｇを加えて、７５℃で３時間反応させた。次に、減圧下
で濃縮し、トルエン−メタノール（１／１）の混合溶媒
で希釈し、樹脂分５０％の桐油変性フェノール樹脂ワニ
スを得た。EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto. (Synthesis of phenol resin for undertreatment) Phenol 1000
g, a mixture of 960 g of 37% aqueous formaldehyde and 20 g of triethylamine was reacted at 80 ° C. for 3 hours and then concentrated under reduced pressure, and 800 g of methanol was added thereto to obtain an unmodified phenol resin varnish having a resin content of 50%. It was (Synthesis of Phenolic Resin for Topcoat) Phenol 1500
g, tung oil 1000 g, and para-toluene sulfonic acid 3 g are reacted at 90 ° C. for 3 hours, and then 80% paraformaldehyde 800 g and 25% ammonia water 50
g was added and reacted at 75 ° C. for 3 hours. Next, it was concentrated under reduced pressure and diluted with a mixed solvent of toluene-methanol (1/1) to obtain a tung oil-modified phenol resin varnish having a resin content of 50%.
【００１０】実施例１〜９及び比較例１ 表１に示す添加剤を上記の下処理用フェノール樹脂ワニ
スに０．１重量％添加し、メタノール−水（１／１）の
混合溶剤に樹脂分が１２重量％になるように調整した。
これをクラフト紙に樹脂分が１５重量％になるように含
浸させ、１６０℃で５分乾燥後、上記の上塗り用フェノ
ール樹脂を樹脂分が５０重量％になるように含浸させ、
１５０℃で５分乾燥し、プリプレグを得た。このプリプ
レグ８枚と接着剤付き銅箔を重ねて積層体とし、ステン
レス鏡板に挟んで１６０℃、１００kg/cm2で６０分間加
熱加圧成形して銅張積層板を得た。この銅張積層板の特
性を表１に示す。Examples 1 to 9 and Comparative Example 1 0.1 wt% of the additives shown in Table 1 were added to the above-mentioned phenol resin varnish for pretreatment, and the resin component was added to a mixed solvent of methanol-water (1/1). Was adjusted to 12% by weight.
The kraft paper was impregnated with this so as to have a resin content of 15% by weight, dried at 160 ° C. for 5 minutes, and then impregnated with the above-mentioned phenol resin for top coating so that the resin content was 50% by weight.
It was dried at 150 ° C for 5 minutes to obtain a prepreg. Eight pieces of this prepreg and a copper foil with an adhesive were laminated to form a laminate, which was sandwiched between stainless steel end plates and heat-pressed at 160 ° C. and 100 kg / cm 2 for 60 minutes to obtain a copper-clad laminate. The characteristics of this copper clad laminate are shown in Table 1.
【００１１】[0011]
【表１】 [Table 1]
【００１２】はんだ耐熱性、絶縁抵抗の測定はＪＩＳ
Ｃ６４８１に準拠して測定した。いずれの実施例も比較
例に比べて、絶縁抵抗性に優れ、はんだ耐熱性の低下も
見られない。JIS measures the solder heat resistance and insulation resistance.
It measured based on C6481. In each of the examples, the insulation resistance is superior to that of the comparative example, and the solder heat resistance is not deteriorated.
【００１３】[0013]
【発明の効果】本発明により製造される紙基材フェノー
ル樹脂積層板は、はんだ耐熱性を低下させることなく、
吸湿時における絶縁抵抗の低下を防止することができ
る。これは本発明が、樹脂の含浸性が優れていることを
示すものであり、耐湿性、耐銀移行性、絶縁抵抗に優れ
たものとなり、その工業的価値は極めて大である。EFFECT OF THE INVENTION The paper-based phenolic resin laminate produced according to the present invention can be produced without lowering the solder heat resistance.
It is possible to prevent the insulation resistance from decreasing when absorbing moisture. This shows that the present invention is excellent in resin impregnation property, and is excellent in moisture resistance, silver migration resistance and insulation resistance, and its industrial value is extremely large.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｋ 105:06 Ｂ２９Ｌ 9:00 (72)発明者 奈良部 嘉行 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location B29K 105: 06 B29L 9:00 (72) Inventor Yoshiyuki Narabe 1500 Ogawa, Ogawa, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory
Claims (3)
せ、乾燥させた後、上塗り用フェノール樹脂を含浸させ
て乾燥して得られたプリプレグを所定枚数重ねて加熱加
圧して積層板を製造する際に、下処理用フェノール樹脂
に、ポリエーテル変性ジメチルポリシロキサン共重合
物、ポリエーテル変性メチルアルキルポリシロキサン共
重合物、ポリエーテル変性ジメチルポリシロキサン、ポ
リエステル変性ジメチルポリシロキサンから選ばれる少
なくとも１種類以上を配合することを特徴とする紙基材
フェノール樹脂積層板の製造方法。1. A laminated sheet is prepared by impregnating a paper base material with a phenolic resin for undertreatment, drying it, impregnating it with a phenolic resin for overcoating, and drying it, stacking a predetermined number of prepregs, heating and pressing. At the time of production, at least one selected from the polyether-modified dimethylpolysiloxane copolymer, the polyether-modified methylalkylpolysiloxane copolymer, the polyether-modified dimethylpolysiloxane, and the polyester-modified dimethylpolysiloxane as the pretreatment phenol resin. A method for producing a paper-based phenolic resin laminate, which comprises blending more than one kind.
せ、乾燥させた後、上塗り用フェノール樹脂を含浸させ
て乾燥して得られたプリプレグを所定枚数重ねて加熱加
圧して積層板を製造する際に、上塗り用フェノール樹脂
に、ポリエーテル変性ジメチルポリシロキサン共重合
物、ポリエーテル変性メチルアルキルポリシロキサン共
重合物、ポリエーテル変性ジメチルポリシロキサン、ポ
リエステル変性ジメチルポリシロキサンから選ばれる少
なくとも１種類以上を配合することを特徴とする紙基材
フェノール樹脂積層板の製造方法。2. A laminate is prepared by impregnating a paper base material with a phenolic resin for undertreatment, drying the same, impregnating a phenolic resin for an overcoat and drying it, stacking a predetermined number of prepregs, heating and pressing the prepreg. At the time of production, at least one kind selected from a polyether-modified dimethylpolysiloxane copolymer, a polyether-modified methylalkylpolysiloxane copolymer, a polyether-modified dimethylpolysiloxane, and a polyester-modified dimethylpolysiloxane as the topcoat phenolic resin. A method for producing a paper-based phenolic resin laminate, which comprises blending the above.
せ、乾燥させた後、上塗り用フェノール樹脂を含浸させ
て乾燥して得られたプリプレグを所定枚数重ねて加熱加
圧して積層板を製造する際に、下処理用フェノール樹脂
と上塗り用フェノール樹脂に、ポリエーテル変性ジメチ
ルポリシロキサン共重合物、ポリエーテル変性メチルア
ルキルポリシロキサン共重合物、ポリエーテル変性ジメ
チルポリシロキサン、ポリエステル変性ジメチルポリシ
ロキサンから選ばれる少なくとも１種類以上を配合する
ことを特徴とする紙基材フェノール樹脂積層板の製造方
法。3. A laminate is prepared by impregnating a paper base material with a phenolic resin for pretreatment, drying it, impregnating it with a phenolic resin for overcoating, and drying it, stacking a predetermined number of prepregs, heating and pressing. During production, a polyether resin-modified dimethylpolysiloxane copolymer, a polyether-modified methylalkylpolysiloxane copolymer, a polyether-modified dimethylpolysiloxane, and a polyester-modified dimethylpolysiloxane are added to a phenol resin for undertreatment and a phenol resin for overcoating. A method for producing a paper-based phenolic resin laminate, which comprises blending at least one selected from the group consisting of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6081608A JPH07286053A (en) | 1994-04-20 | 1994-04-20 | Production of paper-base phenol resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6081608A JPH07286053A (en) | 1994-04-20 | 1994-04-20 | Production of paper-base phenol resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07286053A true JPH07286053A (en) | 1995-10-31 |
Family
ID=13751041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6081608A Pending JPH07286053A (en) | 1994-04-20 | 1994-04-20 | Production of paper-base phenol resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07286053A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009130767A1 (en) * | 2008-04-23 | 2009-10-29 | ディーエイチ・マテリアル株式会社 | Radical-polymerizable composition |
| JP2010229370A (en) * | 2009-03-30 | 2010-10-14 | Dh Material Kk | Radically polymerizable composition |
| JP2013234286A (en) * | 2012-05-10 | 2013-11-21 | Sekisui Chem Co Ltd | Thermosetting furan resin composition, furan resin cured material, and production method for the same |
| US9376543B2 (en) | 2012-03-26 | 2016-06-28 | Sekisui Chemical Co., Ltd. | Thermosetting furan resin composition and furan resin laminated body using the same |
-
1994
- 1994-04-20 JP JP6081608A patent/JPH07286053A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009130767A1 (en) * | 2008-04-23 | 2009-10-29 | ディーエイチ・マテリアル株式会社 | Radical-polymerizable composition |
| JP4355754B1 (en) * | 2008-04-23 | 2009-11-04 | ディーエイチ・マテリアル株式会社 | Radical polymerizable composition |
| JP2010229370A (en) * | 2009-03-30 | 2010-10-14 | Dh Material Kk | Radically polymerizable composition |
| US9376543B2 (en) | 2012-03-26 | 2016-06-28 | Sekisui Chemical Co., Ltd. | Thermosetting furan resin composition and furan resin laminated body using the same |
| JP2013234286A (en) * | 2012-05-10 | 2013-11-21 | Sekisui Chem Co Ltd | Thermosetting furan resin composition, furan resin cured material, and production method for the same |
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