CN104341109A - Preparation method of blade fuse arc-suppression slurry - Google Patents
Preparation method of blade fuse arc-suppression slurry Download PDFInfo
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- CN104341109A CN104341109A CN201310337210.5A CN201310337210A CN104341109A CN 104341109 A CN104341109 A CN 104341109A CN 201310337210 A CN201310337210 A CN 201310337210A CN 104341109 A CN104341109 A CN 104341109A
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
Abstract
The invention discloses a preparation method of a blade fuse arc-suppression slurry. The method comprises the following steps: (1) the following compounds are mixed according to the mass ratio: 15-30 parts of lead oxide, 15-30 parts of silicon oxide, 25-50 parts of boron oxide, 1-10 parts of zinc oxide, 0.5-2 parts of cobalt oxide, and 10-20 parts of antimony oxide; (2) the mixture is subjected to ball-milling and is dried under a temperature of 100 DEG C; (3) the dried raw material is subjected to high-temperature refining under a temperature of 1100 DEG C; the temperature is maintained for 30-60min, and a molten-state glass substance is quickly poured into deionized water for quenching; (4) the quenched and cooled glass substance is subjected to ball-milling, such that glass powder is obtained; and particle size, specific surface area and component analyses are carried out; and (5) silicon dioxide with a mass percentage of 10-60% of that of the glass powder is added into the glass powder; the mixture is fully mixed, and an organic carrier is added; and the mixture is rolled into slurry. The arc-suppression slurry provided by the invention can be used in a blade fuse (with a size smaller than 6.3*6.3mm), and can effectively suppress arc under voltage of 125V and current of 1A, 5A or 15A.
Description
Technical field
The invention belongs to the Application Areas pressing down arc material, particularly relate to the preparation method pressing down arc slurry used on small size chip fuse.
Background technology
From 20 century 70s, the development of surface mounting technology SMT (Surface Mount Technology) revolutionizes the Through-Hole Technology in traditional circuit, make electronic devices and components move towards lightweight and microminiaturization, also promote the develop rapidly of thick film and thin-film technique.Along with the application of the technology such as multi-layer wire substrate technology, micro-joining and interconnection technique unicircuit and microelectronics is thick, thin film hybrid integrated circuit; define the agent structure microelectronic product of high-density, high speed and high reliability; but such circuit requires to be equipped with high-quality protection class component especially, thus impel circuit protecting element also towards plate mini-type, high safety, high reliability, high precision future development.The numerous and confused development & production of circuit protecting element producer numerous in the world goes out the circuit protecting element of various characteristic; wherein high reliability overcurrent protection chip fuse has overwhelming superiority; chip fuse is generally on pottery or resin substrate, make single thin film or thick film metal fusing unit; then encapsulate with polymkeric substance or glass material; electrode adopts the low resistivity metal such as copper or silver, welds when re-plating nickel and tin lead are convenient to chip fuse application.
We know, fuse in the fusible cut-out that major part is traditional is generally fine silver or proof gold, to become band or thread, quartz sand is filled up as arc-extinguishing medium [1] Wang Jimei between fuse. high-voltage and current-limitation fuse [M]. Xi'an: press of Xi'an Communications University, 1991., when the fuse of fusible cut-out has electric current to pass through, its current density should meet Current continuity equation, to isotropy homogeneous solid, there is the situation of endogenous pyrogen and Unsteady Heat Transfer, [2] inscription on pottery select can be represented with the differential equation describing its temperature field. numerical heat transfer [M]. Xi'an: press of Xi'an Communications University, 1995. [3] Guo Kuanliang. numerical evaluation thermal conduction study [M]. Hefei: Anhui science tech publishing house, 1987. [4] ZHANG Juan, MA Zhi-ying.Mathematic model of two dimensional temperature field and its application in high voltage current limiting fuse-linx [J] .Power System Technology.1995, 19 (1Z): 24-26., obtain by solving current field mathematical model again, Finite Element Method [5] JIN Li-jun is generally adopted to solving of problems, Ma Zhi-ying, XUN Li-ming.The numerical analysis and research for prearcing time of high voltage current limiting fuse [J] .Proceedings of the CSEE, 2001, 19 (11): 55-58. [6] Xie Yunxiang. the research [D] of fusible cut-out breaking course arc mathematics model. Xi'an: Xi'an Communications University, 1991. [7] WANG Nian-chu.The general and visual calculating program of fuse prearcing characteristic [J] .Transactions of China Electro-technical Society, 2001, 16 (3): 44-48., the usual more complicated of process.Briefly, namely Metal Melting fracture of wire has certain resistance R, will produce I when an electric current passes through it
2the heat of Rt size, when the electric current passed through increases, the heat produced also increases thereupon, heat will absorb by fusible cut-out thus its temperature raised, a part for heat can reject heat in surrounding environment, but when electric current produce heat be greater than fusible cut-out pass to the heat of surrounding environment time, the temperature of fusible cut-out will raise, and when the temperature of fusible link reaches its fusing point, fusible link will fuse and produce electric arc, and good fusible cut-out must cancellation electric arc electric current is disconnected immediately at short notice.For the fusible cut-out that rated current is larger, if the area of arc extinguishing layer is too little or thickness is too thin, the electric arc produced during fusible link fusing all may burn encapsulated layer and can not effectively electric current be disconnected cancellation electric arc, this, by impaired for the sensitive components such as light, heat likely made in circuit, even can cause the paralysis of whole electronic circuit.
Chip fuse adopts individual layer fuse element to design mostly; the surface of fuse element closely fusible cut-out; this design and structurally require that fusible cut-out fuse volume is little, energy density is large; this also will ensure the maximum loaded current suitable with conventional fuse and voltage rating while just causing arc quenching protection layer design comparison thin.But press down arc glass for general, when overcurrent is larger, protective layer easily punctures by electric arc, does not reach arc extinguishing requirement.Therefore chip fuse will advance, need to mate the extraordinary glass material of a kind of arc quenching effect, when chip fuse is by big current, the moment of fusing not only can absorb metal vapors and heat rapidly, can also cancellation electric arc fast, the arc duration of generation is shortened greatly, and after open circuit, resistance is larger, namely cool in the middle of fuse without metal vapors after fusing, prevent fusible cut-out from repeatedly connecting.
Highly reliable chip fuse is a class key components of country's urgent need at present, is mainly used on spacecraft, while the maximum loaded current of guarantee and voltage rating, must absolutely ensure good arc quenching effect.Present stage, only have AEM Corp. of the U.S. and schurter company of Switzerland to have such highly reliable fusible cut-out abroad, and highly reliable chip fuse is embargoed to China.In order to break external blockade, we in the urgent need to the core material of chip fuse and fuse slurry with press down segment slurry and carry out independent research and production.
Summary of the invention
The present invention is directed to the deficiency pressing down arc material of chip fuse, a kind of thick film is provided to press down the preparation method of arc slurry, the invention solves a key problem: prepare a kind of thick film and press down arc slurry, at 600 DEG C, a kind of glass state material is burnt till after this slurry is dried by silk screen printing, this glass has and very strong presses down arc ability, the absorption of energy when can solve fuse blows in little space and the cut-out problem of electric arc.
The present invention starts with from following key issue,
(1) find out the sticking power of lead borosilicate glass powder, softening temperature, press down arc performance and the corresponding relation between microtexture and composition of raw material, thus be conducive in short period, developing high-quality glass powder: can soften first at a lower temperature, there is certain plastic deformation ability, for the metal vapors produced in fusing process provides a space to absorb; Secondly the sticking power and between substrate is very large, makes fuse and press down arc glass can stand the high energy impact events and can not being blown up of moment and even burn.
(2) additive pressed down in arc material is the key factor of fusible cut-out arc extinguishing, arc quenching material has a variety of, but need the arc quenching material selecting to mate with lead borosilicate glass powder, and set forth its arc extinguishing mechanism, accurately choose arc extinguishing additive and ensure that chip fuse possesses outstanding arc quenching effect, namely fuse can be cut off at the electric arc produced in a flash of fusing, thus be repeatedly communicated with again after avoiding fuse to be fused, produce very large noise, spark, steam, finally cause whole fusible cut-out to be destroyed, also feed through to whole electronic circuit.
(3) component and the formula of organic carrier is determined, wherein to comprise viscosity, volatility, fusing point, boiling point etc. all most important for the physical property of each component, can formulate under the allotment of organic carrier and press down the special oven dry sintering schedule of arc slurry, and a large amount of Microfocus X-ray tube can be left in the oven dry and sintering process of organic carrier, thus ensure the release of chip fuse in fusing process huge energy as far as possible.
Chip fuse presses down a preparation method for arc slurry, and following raw material, according to weight ratio, comprises the following steps:
Step (1), 15 ~ 30 parts, plumbous oxide, silicon oxide 15 ~ 30 parts, boron oxide 25 ~ 50 parts, 1 ~ 10 part, zinc oxide, cobalt oxide 0.5 ~ 2 part, weisspiessglanz 10 ~ 20 parts is mixing fully, then adds deionized water, material ratio is: agate ball: oxide compound compound: deionized water is 2: 1: 1, planetary ball mill 2h, rotating speed 387rpm, the ball-milled mixtures obtained is 100 DEG C of dry for standby;
Step (2), preparation presses down arc glass powder, comprises following sub-step,
Step (2.1), the raw material of step 1 being dried after 30 ~ 60 minutes, pours the glass substance of molten state into deionization quenching-in water 1100 DEG C of insulations rapidly;
Step (2.2), carries out step 2.1 gained glass substance, with agate tank (ball: material: water is 2: 1: 1) planetary ball mill 4h, rotating speed 387rpm, then filter and 100 DEG C of oven dry, pulverize for subsequent use;
Step (3), rolling presses down arc slurry, comprises following sub-step,
Step (3.1), glass powder step 2.2 obtained and the silicon-dioxide of sizing mixing carry out granularity, specific surface area and composition analysis;
Step (3.2), takes the glass powder of 100 parts, adds the silicon-dioxide of its massfraction 10% ~ 60%, fully mixes, then adds 15% ~ 30% organic carrier of total solid content quality, utilizes three-high mill to roll slurry.
The described main functionality material pressing down arc slurry is the lead borosilicate glass powder being mixed with zinc, cobalt.
Further, be mixed with zinc, the lead borosilicate glass powder of cobalt when preparing is quenching after the raw material of drying is incubated 30 ~ 60 minutes at 1100 DEG C.
Further, before rolling slurry, in main functionality material glass powder, add the silicon dioxide powder of its quality 10% ~ 60%.
Further, apply this press down arc slurry time optimum burning temperature-forming be 600 DEG C.
Further, the slurry that the silicon-dioxide adding glass powder quality 40% obtains pressing down arc has good over-all properties, slurry burns till that postadhesion power is strong, fuse blows time arcing distance shorter.
Embodiment
The present invention is directed to the deficiency pressing down arc material of chip fuse, a kind of thick film is provided to press down the preparation method of arc slurry, the invention solves a key problem: prepare a kind of thick film and press down arc slurry, at 600 DEG C, a kind of glass state material is burnt till after this slurry is dried by silk screen printing, this glass has and very strong presses down arc ability, the absorption of energy when can solve fuse blows in little space and the cut-out problem of electric arc.
Embodiment 1: prepare a kind of chip fuse and press down arc slurry main functionality material used, the mass ratio of its each raw material used is:
| Plumbous oxide (PbO) | 24 |
| Silicon oxide (SiO 2) | 18 |
| Boron oxide (B 2O 3) | 37 |
| Zinc oxide (ZnO) | 8 |
| Cobalt oxide (Co 2O 3) | 1 |
| Weisspiessglanz (Sb 2O 3) | 12 |
According to above-mentioned formula all kinds of oxide source materials mixed and carry out clipping the ball mill, starting material are 100 DEG C of oven dry, 1100 DEG C of insulation 30min ~ 60min carry out quenching and can obtain frit, frit is pulverized also ball milling, oven dry and obtain glass powder, after carrying out size ratio surface-area, composition test, add the organic carrier of the silicon dioxide powder of glass powder quality 40%, glass powder quality 30%, three-high mill mixes through rolling, obtains chip fuse after testing size indices is qualified and press down arc slurry finished product.
Embodiment 2: prepare a kind of chip fuse and press down arc slurry main functionality material used, the mass ratio of its each raw material used is:
| Plumbous oxide (PbO) | 28 |
[0030]
| Silicon oxide (SiO 2) | 20 |
| Boron oxide (B 2O 3) | 32 |
| Zinc oxide (ZnO) | 5.5 |
| Cobalt oxide (Co 2O 3) | 1.5 |
| Weisspiessglanz (Sb 2O 3) | 13 |
According to above-mentioned formula all kinds of oxide source materials mixed and carry out clipping the ball mill, starting material are 100 DEG C of oven dry, 1100 DEG C of insulation 30min ~ 60min carry out quenching and can obtain frit, frit is pulverized also ball milling, oven dry and obtain glass powder, after carrying out size ratio surface-area, composition test, add the organic carrier of the silicon dioxide powder of glass powder quality 40%, glass powder quality 30%, three-high mill mixes through rolling, obtains chip fuse after testing size indices is qualified and press down arc slurry finished product.
Above content the present invention is said to the further description done in conjunction with optimum implementation, can not assert that specific embodiment of the invention is only limited to these explanations.It should be appreciated by those skilled in the art, when do not depart from be defined by the appended claims, various amendment can be carried out in detail, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. chip fuse presses down a preparation method for arc slurry, and following raw material, according to weight ratio, is characterized in that, comprises the following steps:
Step (1), 15 ~ 30 parts, plumbous oxide, silicon oxide 15 ~ 30 parts, boron oxide 25 ~ 50 parts, 1 ~ 10 part, zinc oxide, cobalt oxide 0.5 ~ 2 part, weisspiessglanz 10 ~ 20 parts is mixing fully, then adds deionized water, material ratio is: agate ball: oxide compound compound: deionized water is 2: 1: 1, planetary ball mill 2h, rotating speed 387rpm, the ball-milled mixtures obtained is 100 DEG C of dry for standby;
Step (2), preparation presses down arc glass powder, comprises following sub-step,
Step (2.1), the raw material of step 1 being dried after 30 ~ 60 minutes, pours the glass substance of molten state into deionization quenching-in water 1100 DEG C of insulations rapidly;
Step (2.2), carries out step 2.1 gained glass substance, with agate tank (ball: material: water is 2: 1: 1) planetary ball mill 4h, rotating speed 387rpm, then filter and 100 DEG C of oven dry, pulverize for subsequent use;
Step (3), rolling presses down arc slurry, comprises following sub-step,
Step (3.1), glass powder step 2.2 obtained and the silicon-dioxide of sizing mixing carry out granularity, specific surface area and composition analysis;
Step (3.2), takes 100 parts of glass powder, adds the silicon-dioxide of its massfraction 10% ~ 60%, fully mix, then adds 15% ~ 30% organic carrier of total solid content quality, utilizes three-high mill to roll slurry.
Can material be the lead borosilicate glass powder being mixed with zinc, cobalt.
2. a kind of chip fuse according to claim 1 presses down the preparation method of arc slurry, it is characterized in that, is mixed with zinc, the lead borosilicate glass powder of cobalt when preparing is quenching after the raw material of drying is incubated 30 ~ 60 minutes at 1100 DEG C.
3. a kind of chip fuse according to claim 1 presses down the preparation method of arc slurry, it is characterized in that, before rolling slurry, adds the silicon dioxide powder of its quality 10% ~ 60% in main functionality material glass powder.
4. a kind of chip fuse according to claim 1 presses down the preparation method of arc slurry, it is characterized in that, the optimum burning temperature-forming applied when this presses down arc slurry is 600 DEG C.
5. a kind of chip fuse according to claim 1 presses down the preparation method of arc slurry, it is characterized in that, the slurry that the silicon-dioxide adding glass powder quality 40% obtains pressing down arc has good over-all properties, slurry burns till that postadhesion power is strong, fuse blows time arcing distance shorter.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104860539A (en) * | 2015-04-16 | 2015-08-26 | 南京众力盛强新材料科技有限公司 | Mesoporous silicon oxide ceramic composite material and preparation method thereof |
| CN106504963A (en) * | 2016-10-06 | 2017-03-15 | 常州市鼎升环保科技有限公司 | A kind of preparation method of high-tension fuse with new aerogenesis arc quenching material |
| CN112735930A (en) * | 2020-12-18 | 2021-04-30 | 中国振华集团云科电子有限公司 | Arc suppression material for improving breaking capacity of fuse and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4520115A (en) * | 1982-08-02 | 1985-05-28 | Schott Glaswerke | High absorbance Pb-containing glass for cathode ray tube picture screen |
| CN102070302A (en) * | 2010-11-22 | 2011-05-25 | 珠海彩珠实业有限公司 | Transparent low-melting point glass powder for dielectric paste and preparation method thereof |
| CN102503149A (en) * | 2011-09-22 | 2012-06-20 | 上海交通大学 | Low-lead glass powder for silver paste of anode of solar cell and preparation method of low-lead glass powder |
-
2013
- 2013-07-30 CN CN201310337210.5A patent/CN104341109B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4520115A (en) * | 1982-08-02 | 1985-05-28 | Schott Glaswerke | High absorbance Pb-containing glass for cathode ray tube picture screen |
| CN102070302A (en) * | 2010-11-22 | 2011-05-25 | 珠海彩珠实业有限公司 | Transparent low-melting point glass powder for dielectric paste and preparation method thereof |
| CN102503149A (en) * | 2011-09-22 | 2012-06-20 | 上海交通大学 | Low-lead glass powder for silver paste of anode of solar cell and preparation method of low-lead glass powder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104860539A (en) * | 2015-04-16 | 2015-08-26 | 南京众力盛强新材料科技有限公司 | Mesoporous silicon oxide ceramic composite material and preparation method thereof |
| CN106504963A (en) * | 2016-10-06 | 2017-03-15 | 常州市鼎升环保科技有限公司 | A kind of preparation method of high-tension fuse with new aerogenesis arc quenching material |
| CN106504963B (en) * | 2016-10-06 | 2018-11-16 | 新昌县宝锋知识产权咨询服务有限公司 | A kind of high-tension fuse preparation method for producing gas arc quenching material |
| CN112735930A (en) * | 2020-12-18 | 2021-04-30 | 中国振华集团云科电子有限公司 | Arc suppression material for improving breaking capacity of fuse and preparation method thereof |
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| CN104341109B (en) | 2017-08-25 |
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