CN102557590B - Ceramic powder for fuse, ceramic-based fuse and preparation methods for ceramic powder and ceramic-based fuse - Google Patents
Ceramic powder for fuse, ceramic-based fuse and preparation methods for ceramic powder and ceramic-based fuse Download PDFInfo
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Abstract
The invention relates to a ceramic powder for a fuse and a preparation method thereof. The ceramic powder comprises an admixture and ceramic components, wherein, the admixture is zirconium dioxide, doping content of the admixture is 0.5 to 25%, and the ceramic components comprise, by weight, 30 to 70% of borosilicate glass, 20 to 65% of silica and 0.1 to 10% of metal oxide. A ceramic matrix prepared from the ceramic powder for a fuse can inhibit diffusion of an inner electrode to the ceramic matrix when the ceramic matrix is co-fired with the inner electrode at a low temperature. The invention also relates to a fuse having the matrix prepared from the ceramic powder and a preparation method thereof. According to the invention, the fuse provided in the invention realizes reduction of a resistance value and energy consumption since diffusion of the inner electrode to the ceramic matrix is reduced; meanwhile, consistency of resistance values is improved, the yield rate of a product is increased, and cost is reduced.
Description
Technical field
The present invention relates to the fusible cut-out field, be specifically related to a kind of fusible cut-out with ceramic powder and preparation method thereof, with the LTCC base fusible cut-out with better electric energy of this ceramic powder making and the production method of this fusible cut-out
Background technology
Fusible cut-out is widely used in the overcurrent protection of various electronic devices and components.Utilize metallic conductor to be series in the circuit as melt, when circuit abnormal, after electric current surpassed prescribed value, the melt of fusible cut-out will melt automatically, reaches breaking circuits, the effect of protection electrical equipment.
Adopt wire, tinsel or metallic film as melt at present numerous overcurrent protection fusible cut-outs, these melts mainly are made up of metals such as silver, copper.By changing prescription, shape and the cross section of melt, can design the fusible cut-out of works better under different rated current, in case the electric current overrate; the heat that overcurrent produces can not in time conduct; will cause melt fusing, cut off circuit, in time play a protective role.The classification of fusible cut-out is a lot, for example according to the body material difference of fusible cut-out, can be divided into macromolecule matrix fusible cut-out, LTCC matrix fusible cut-out etc.Wherein for the fusible cut-out that uses LTCC as matrix, it should have following performance: (1) sintering temperature is lower than 950 ℃; (2) favorable mechanical performance; (3) lower thermal conductivity; (4) pottery does not have the interface reaction with interior electrode, and the two shrinks coupling; (5) good high-temperature arc extinction performance; (6) the stupalith prescription should be conducive to technical process.In actual production process, often find for LTCC matrix fusible cut-out, exist surface reaction particularly outstanding between ceramic matrix and the interior electrode: interior electrode for example silver can produce diffusion phenomena in the glass ceramic material in burning process altogether, and this phenomenon can influence the electrical property of product to a certain extent, consistence of resistive fuse size, electrical property etc. for example finally influences the operating chacteristics of fusible cut-out and production cost etc.Therefore the low-temperature co-burning ceramic material meaning that finds a kind of energy to suppress silver-colored diffusion is very big.
Low-temperature co-burning ceramic material mainly comprises devitrified glass system, glass-ceramic system and amorphous glass system, adopts liquid phase sintering mechanism to reach the densification of material.Especially, devitrified glass system and glass-ceramic system are the emphasis of people's research in recent years.For example bismuth borosilicate glass pottery (CN1304335C), trichroite series vitro-ceramic (CN101148323B), aluminium nitride-iolite-base LTCC (CN1935739A) and fluorine silicon aluminum doping glass-base low-temperature cofired pottery (CN101215157A).For improving the surface reaction between ceramic matrix and the interior electrode, except researching and developing new glass-ceramic system, various solutions are for example mixed etc., by continuous proposition mutually.
Patent US005173331A proposes a kind of by using ZrO
2
Or HfO
2
The glass-ceramic preparation method who mixes.This preparation method has studied the optimization of glass-ceramic fracture toughness property in great detail, weakens fragility by doping, has improved toughness.Patent CN1325412C has introduced a kind of preparation method of nano-multicrystal phase glass ceramics.Based on ZrO
2
, micro-oxide compound such as ZnO, through 1350～1650 ℃ of high temperature meltings, 700～1000 ℃ of technologies such as crystallization processing, can successfully reduce the cost of glass-ceramic and improve the mechanical property of material.The glass-ceramic of above method preparation all can be used on the fusible cut-out, and is conducive to the porcelain body intensity raising of fusible cut-out, but does not all make a search with the glass-ceramic surface reaction for metal electrode is for example silver-colored.
Document (Materials Science ﹠amp; Engieering B, 2001,152-157) studied the diffusion mechanism of Ag/Pd electrode in pottery, based on experimental data, having proposed can stupalith and the control sintering curre of sintering temperature and low improves the silver diffusion by using more.But in the fusible cut-out production process, to technology and production requirement height, so cost is higher.
Patent CN1181710C has proposed a kind of Ag of use as the glass-ceramic multilayer circuit board preparation method of electro-conductive material.Based on certain proportion, glass ingredient, ceramics component and some metal ingredient are mixed and made into the glass-ceramic insulating material, the glass-ceramic multilayer circuit board of superior strength and reliability can be obtained having, and the silver diffusion can be effectively suppressed.This method can well be improved dispersiveness and the consistence of fusible cut-out electrical property.But for fusible cut-out, its preparation technology is complicated, especially needs fabulous powder to disperse, otherwise very easily cause the fusible cut-out electrical property than great fluctuation process, therefore limited to it and further developed.
Patent CN101465251A proposes to be coated with glazing layer in interior electrode upper and lower surface, suppresses the fusible cut-out metallic film to the purpose of ceramic matrix infiltration thereby reach.Though this structure can be improved infiltration problem to a certain extent, improve the electrical property of fusible cut-out, improve consistence, but the fuse structure complex process, need be coated with glazing layer, in addition the glaze layer make and sintering after consistence internal electrode is connected the bigger influence of generation
Summary of the invention
Technical problem to be solved by this invention is that electrode silver spread in ceramic matrix in the ceramic base fusible cut-out that overcomes prior art produced when making, and influence the problem of fusible cut-out electrical property, provide a kind of improved for the ceramic powder of making the fusible cut-out ceramic matrix, and the method for preparing this ceramic powder.
Another object of the present invention provides utilizes above-mentioned fusible cut-out to make a kind of ceramic base fusible cut-out of ceramic matrix and the production method of this ceramic base fusible cut-out with ceramic powder.
For solving above technical problem, the present invention takes following technical scheme:
A kind of fusible cut-out ceramic powder comprises ceramic composition and additive, and wherein, described additive is zirconium dioxide; By weight, to account for described fusible cut-out be 0.5 ~ 25% with the doping content of ceramic powder to described additive; Described ceramic composition comprises 30 ~ 70% pyrexs, 20 ~ 65% silicon-dioxide, 0.1 ~ 10% metal oxide, and described metal oxide is one or more in aluminium sesquioxide, barium oxide, antimonous oxide, Vanadium Pentoxide in FLAKES, cobalt oxide, magnesium oxide, boron trioxide, Niobium Pentxoxide, strontium oxide and the zinc oxide.
Preferably, described zirconium dioxide is D
50
Nano level zirconium dioxide or the D of=10～25 nm
50
The micron order zirconium dioxide of=0.5～10 μ m.
Preferably, described pyrex is the mixture of fusing point high-melting-point pyrex between 701 ~ 850 ℃ at the low melting point pyrex between 600 ~ 700 ℃ and fusing point, and the weight ratio of described low melting point pyrex and described high-melting-point pyrex is 0.42 ~ 2.3.
Preferably, described fusible cut-out is controlled between 0.5～6 μ m with the particle diameter of ceramic powder.
Above-mentioned fusible cut-out comprises the steps: with the preparation method of ceramic powder
(1), take by weighing ceramic composition and additive by formula ratio, mix and with their and to be placed in the ball mill;
(2), to add weight in the mixture of step (1) be that ethanol and the weight of 2 ~ 4 times of mixture weight is the zirconium dioxide mill ball of 2 ~ 4 times of mixture weight, and mixture is carried out the ball milling first time; Rotational speed of ball-mill is 40 ~ 60rpm, and the ball milling time is 1 ~ 4 hour;
(3), the slurry oven dry of gained behind the ball milling for the first time, under 600 ~ 800 ℃, carry out sintering then, carry out drying again, obtain powder premix;
(4), add ethanol and zirconium dioxide mill ball in the Preblend of step (3) gained, carry out ball milling second time, make slurry behind the ball milling for the second time through drying, pulverize and sieving then, obtain described fusible cut-out ceramic powder.
Preferably, for the first time during ball milling the diameter of used zirconium dioxide mill ball be 5 millimeters.The selection meeting of mill ball size produces certain influence to grinding effect.
Preferably, the bake out temperature in step (3) and the step (4) is 90 ~ 150 ℃.
Preferably, the grit number excessively in the step (4) is 200 orders.Should make after sieving gained fusible cut-out with the particle diameter of ceramic powder between 0.5～6 μ m for well.
A kind of ceramic base fusible cut-out, comprise ceramic matrix, be arranged on the interior electrode in the described ceramic matrix, and be arranged on the end electrode that described ceramic matrix is outer and link to each other with interior electrode, wherein, described ceramic matrix is to utilize fusible cut-out of the present invention to be prepared from ceramic powder.
A kind of production method of ceramic base fusible cut-out is to utilize fusible cut-out of the present invention to prepare ceramic matrix with ceramic powder, specifically comprises the steps:
(1), the preparation of ceramic size:, fully stir with the binding agent that adds UV curable in the ceramic powder to fusible cut-out of the present invention, make solid content 65 ~ 80%, viscosity＜22kcps ceramic size;
(2), the preparation of electrode size: prepare electrode size, silver content is 65 ~ 80% in the control slurry;
(3), fusible cut-out green compact moulding: prepare ceramic matrix with the prepared ceramic size of step (1) by coating method, electrode in mode by silk screen printing is made in ceramic matrix of the prepared electrode size of step (2), through ultra-violet curing, make and have ceramic layer-inner electrode layer-the fusible cut-out green compact of the SMD structure of ceramic layer;
(4), fusible cut-out green compact cutting;
(5), fusible cut-out green compact binder removal: dump temperature is 300 ~ 450 ℃, and the binder removal time is 1 ~ 40 hour;
(6), fusible cut-out green sintering: sintering temperature is 600 ~ 900 ℃, and sintering time is 1 ~ 3 hour;
(7), upper end and plating: will connect silver-colored end electrode through the fusible cut-out green compact behind step (6) sintering, and power at silver-colored end electrode and to plate nickel dam and tin layer, and make described ceramic base fusible cut-out.
Because the enforcement of above technical scheme, the present invention compared with prior art has following advantage:
With the ceramic matrix that fusible cut-out of the present invention is prepared from ceramic powder, when low temperature co-fired with interior electrode, electrode spreads to ceramic matrix in can suppressing.
Fusible cut-out of the present invention is with the preparation method of ceramic powder, and is simple, and it is more even that each component is disperseed.
The fusible cut-out made from the ceramic matrix of ceramic powder preparation with fusible cut-out of the present invention, owing to reduced interior electrode to the diffusion of ceramic matrix, thereby possess following advantage: realize that 1) resistance value reduces, and reduces energy consumption; 2) improve the resistance value consistence, improve the product yield, reduce cost.
Description of drawings
The present invention will be further described in detail below in conjunction with accompanying drawing and concrete embodiment:
Fig. 1 is the resistance value normal distribution of 2 amperes of fusible cut-outs in the prior art;
Fig. 2 is the resistance value normal distribution of embodiment 1 obtained fusible cut-out;
Fig. 3 is the resistance value normal distribution of embodiment 2 obtained fusible cut-outs;
Fig. 4 is the resistance value normal distribution of 0.5 ampere of fusible cut-out in the prior art;
Fig. 5 is the resistance value normal distribution of embodiment 3 obtained fusible cut-outs.
Embodiment
The present invention will be further described in detail below in conjunction with specific embodiment, but be not limited to these embodiment.
Embodiment 1
The preparation method of present embodiment fusible cut-out is as follows:
1) with doping is the nano level D of 8 wt%
50
=20 nm ZrO
2
Join in a kind of glass-ceramic.This glass-ceramic contains 30～70 wt% low melting point pyrex and a kind of high-melting-point pyrex mixture, 20～65 wt% SiO
2
With the metal oxide of 0.1～10 wt%, and this metal oxide is Al
2
O
3
, BaO, Sb
2
O
3
, V
2
O
5
, CoO, MgO, B
2
O
3
, Nb
2
O
5
, among SrO and the ZnO one or more.All components is mixed the back to add in the ball mill.
2) placing the mixture adding weight in the ball mill to step 1) is the about 2 times ethanol of mixture weight, and weight is that the about 2 times diameter of mixture weight is the ZrO of 5mm
2
Mill ball.Rotational speed of ball-mill is set at 40 rpm, and the ball milling time is 2 hr.All mixtures should fully mix behind ball milling, additive ZrO
2
Evenly disperse, under 600 ~ 800 ℃, carry out pre-burning then, dry again.In the gained material, add ethanol and mill ball more afterwards, through secondary ball milling, particle diameter D
50
=2.02 μ m.Last material sieves by 120 ℃ of oven dry, pulverizing and 200 orders successively, obtains the low-temperature co-fired ceramic powder material.
3) to step 2) add the binding agent of UV curable in the low-temperature co-fired ceramic powder material that makes, fully stir and be prepared into ceramic size, the solid content of this ceramic size is 69.65 %, viscosity is 26.4 kcps.At the different series fusible cut-out, the silver content of electrode size should be controlled between 65～80%.What present embodiment was made is 2 amperes of fusible cut-outs, so the control of the silver content of electrode size is at 72.5 %.Then with reference to SMD fusible cut-out manufacture method (can with reference to disclosed technology contents among patent of invention US006034589A and the CN1147887C), finish following operation successively: 1. fusible cut-out green compact moulding: at first be coated with one deck LTCC slurry, the electrode size that has the uV curable binding agent then by screen printing mode printing one deck, then at this inner electrode layer surface coated one deck LTCC slurry, again through ultra-violet curing, obtain the molectron of low-temperature co-fired glass ceramic matrix and interior electrode, i.e. the fusible cut-out green compact; 2. fusible cut-out green compact cutting; 3. fusible cut-out green compact binder removal: finishing binder removal to remove binding agent composition wherein, specifically is that green compact are positioned in the binder removal stove, is warmed up to 355 ℃, is incubated 36 hr; 4. fusible cut-out green sintering: with the sample behind the binder removal at 910 ℃ of following densified sintering products of temperature, sintering time 30 min; 5. the upper end and electroplating process: will connect silver-colored end electrode after the sample chamfering behind the sintering, and plate nickel dam and tin layer at silver layer, finally finish the preparation of fusible cut-out.
The fusible cut-out that present embodiment is made and the electrical property of existing fusible cut-out compare result such as table 1, illustrated in figures 1 and 2.
Comparing result shows that the average electrical resistance of present embodiment fusible cut-out is compared with the average electrical resistance of existing fusible cut-out, is reduced to 0.0382 Ω from 0.0464, and it is little to consume energy; Resistance distributes and is tending towards concentrated simultaneously, and the resistance consistence is better.
The resistance value comparing result of the fusible cut-out that the existing 2 amperes of fusible cut-outs of table 1 and embodiment 1 make
Embodiment 2
The preparation method of present embodiment fusible cut-out is as follows:
1) with doping is the nano level D of 16 wt%
50
=20 nm ZrO
2
Join in a kind of glass-ceramic.This glass-ceramic contains 30～70 wt% low melting point pyrex and a kind of high-melting-point pyrex mixture, 20～65 wt% SiO
2
With the metal oxide of 0.1～10 wt%, and this metal oxide is Al
2
O
3
, BaO, Sb
2
O
3
, V
2
O
5
, CoO, MgO, B
2
O
3
, Nb
2
O
5
, among SrO and the ZnO one or more.All components is mixed the back to add in the ball mill.
2) placing the mixture adding weight in the ball mill to step 1) is the about 2 times ethanol of mixture weight, and weight is that the about 2 times diameter of mixture weight is the ZrO of 5mm
2
Mill ball.Rotational speed of ball-mill is set at 40 rpm, and the ball milling time is 2 hr.All mixtures should fully mix behind ball milling, additive ZrO
2
Evenly disperse, under 600 ~ 800 ℃, carry out pre-burning then, dry again.In the gained material, add ethanol and mill ball more afterwards, through secondary ball milling, particle diameter D
50
=1.76 μ m.Last material sieves by 120 ℃ of oven dry, pulverizing and 200 orders successively, obtains the low-temperature co-fired ceramic powder material.
3) to step 2) add the binding agent of UV curable in the low-temperature co-fired ceramic powder material that makes, fully stir and be prepared into ceramic size, the solid content of this ceramic size is 69.65 %, viscosity is 19.4 kcps.At the different series fusible cut-out, the silver content of electrode size should be controlled between 65～80%.What present embodiment was made is 2 amperes of fusible cut-outs, so the control of the silver content of electrode size is at 72.5 %.Then with reference to SMD fusible cut-out manufacture method (can with reference to disclosed technology contents among patent of invention US006034589A and the CN1147887C), finish following operation successively: 1. fusible cut-out green compact moulding: at first be coated with one deck LTCC slurry, the electrode size that has the uV curable binding agent then by screen printing mode printing one deck, then at this inner electrode layer surface coated one deck LTCC slurry, again through ultra-violet curing, obtain the molectron of low-temperature co-fired glass ceramic matrix and interior electrode, i.e. the fusible cut-out green compact; 2. fusible cut-out green compact cutting; 3. fusible cut-out green compact binder removal: finishing binder removal to remove binding agent composition wherein, specifically is that green compact are positioned in the binder removal stove, is warmed up to 355 ℃, is incubated 36 hr; 4. fusible cut-out green sintering: with the sample behind the binder removal at 910 ℃ of following densified sintering products of temperature, sintering time 30 min; 5. the upper end and electroplating process: will connect silver-colored end electrode after the sample chamfering behind the sintering, and plate nickel dam and tin layer at silver layer, finally finish the preparation of fusible cut-out.
The fusible cut-out that present embodiment is made and the electrical property of existing fusible cut-out compare result such as table 2, Fig. 1 and shown in Figure 3.
Comparing result shows that the average electrical resistance of present embodiment fusible cut-out is compared with the average electrical resistance of existing fusible cut-out, is reduced to 0.0420 Ω from 0.0464, and it is little to consume energy; Resistance distributes and is tending towards concentrated simultaneously, and the resistance consistence is better.
The resistance value comparing result of the fusible cut-out that the existing 2 amperes of fusible cut-outs of table 2 and embodiment 2 make
Embodiment 3
1) with doping is the nano level D of 8 wt%
50
=20 nm ZrO
2
Join in a kind of glass-ceramic.This glass-ceramic contains 30～70 wt% low melting point pyrex and a kind of high-melting-point pyrex mixture, 20～65 wt% SiO
2
With the metal oxide of 0.1～10 wt%, and this metal oxide is Al
2
O
3
, BaO, Sb
2
O
3
, V
2
O
5
, CoO, MgO, B
2
O
3
, Nb
2
O
5
, among SrO and the ZnO one or more.All components is mixed the back to add in the ball mill.
2) placing the mixture adding weight in the ball mill to step 1) is the about 2 times ethanol of mixture weight, and weight is that the about 2 times diameter of mixture weight is the ZrO of 5mm
2
Mill ball.Rotational speed of ball-mill is set at 40 rpm, and the ball milling time is 2 hr.All mixtures should fully mix behind ball milling, additive ZrO
2
Evenly disperse, under 600 ~ 800 ℃, carry out pre-burning then, dry again.In the gained material, add ethanol and mill ball more afterwards, through secondary ball milling, particle diameter D
50
=2.02 μ m.Last material sieves by 120 ℃ of oven dry, pulverizing and 200 orders successively, obtains the low-temperature co-fired ceramic powder material.
3) to step 2) add the binding agent of UV curable in the low-temperature co-fired ceramic powder material that makes, fully stir and be prepared into ceramic size, the solid content of this ceramic size is 69.65 %, viscosity is 26.4 kcps.At the different series fusible cut-out, the silver content of electrode size should be controlled between 65～80%.What present embodiment was made is 0.5 ampere of fusible cut-out, so the control of the silver content of electrode size is at 65 %.Then with reference to SMD fusible cut-out manufacture method (can with reference to disclosed technology contents among patent of invention US006034589A and the CN1147887C), finish following operation successively: 1. fusible cut-out green compact moulding: at first be coated with one deck LTCC slurry, the electrode size that has the uV curable binding agent then by screen printing mode printing one deck, then at this inner electrode layer surface coated one deck LTCC slurry, again through ultra-violet curing, obtain the molectron of low-temperature co-fired glass ceramic matrix and interior electrode, i.e. the fusible cut-out green compact; 2. fusible cut-out green compact cutting; 3. fusible cut-out green compact binder removal: finishing binder removal to remove binding agent composition wherein, specifically is that green compact are positioned in the binder removal stove, is warmed up to 355 ℃, is incubated 36 hr; 4. fusible cut-out green sintering: with the sample behind the binder removal at 910 ℃ of following densified sintering products of temperature, sintering time 30 min; 5. the upper end and electroplating process: will connect silver-colored end electrode after the sample chamfering behind the sintering, and plate nickel dam and tin layer at silver layer, finally finish the preparation of fusible cut-out.
The fusible cut-out that present embodiment is made and the electrical property of existing fusible cut-out compare result such as table 3, Fig. 4 and shown in Figure 5.
Comparing result shows that the average electrical resistance of present embodiment fusible cut-out is compared with the average electrical resistance of existing fusible cut-out, is reduced to 0.3031 Ω from 0.3970, and it is little to consume energy; Resistance distributes and is tending towards concentrated simultaneously, and the resistance consistence is better.
The resistance value comparing result of the fusible cut-out that the existing 0.5 ampere of fusible cut-out of table 3 and embodiment 3 make
More than the present invention has been done detailed description; its purpose is to allow the personage that is familiar with this art can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; the equivalence that all spirit according to the present invention are done changes or modifies, and all should be encompassed in protection scope of the present invention
Claims (9)
1. a fusible cut-out ceramic powder comprises ceramic composition and additive, it is characterized in that: described additive is zirconium dioxide; By weight, to account for described fusible cut-out be 0.5 ~ 25% with the doping content of ceramic powder to described additive; Described ceramic composition comprises 30 ~ 70% pyrexs, 20 ~ 65% silicon-dioxide, 0.1 ~ 10% metal oxide, described metal oxide is aluminium sesquioxide, barium oxide, antimonous oxide, Vanadium Pentoxide in FLAKES, cobalt oxide, magnesium oxide, boron trioxide, Niobium Pentxoxide, in strontium oxide and the zinc oxide one or more, described pyrex is the mixture of fusing point high-melting-point pyrex between 701 ~ 850 ℃ at the low melting point pyrex between 600 ~ 700 ℃ and fusing point, and the weight ratio of described low melting point pyrex and described high-melting-point pyrex is 0.42 ~ 2.3.
2. fusible cut-out ceramic powder according to claim 1, it is characterized in that: described zirconium dioxide is D
50Nano level zirconium dioxide or the D of=10～25 nm
50The micron order zirconium dioxide of=0.5～10 μ m.
3. fusible cut-out ceramic powder according to claim 1 is characterized in that: described fusible cut-out with the particle diameter control of ceramic powder between 0.5～6 μ m.
4. the fusible cut-out described in the claim 1 is characterized in that: comprise the steps: with the preparation method of ceramic powder
(1), take by weighing ceramic composition and additive by formula ratio, mix and with their and to be placed in the ball mill;
(2), to add weight in the mixture of step (1) be that ethanol and the weight of 2 ~ 4 times of mixture weight is the zirconium dioxide mill ball of 2 ~ 4 times of mixture weight, and mixture is carried out the ball milling first time; Rotational speed of ball-mill is 40 ~ 60rpm, and the ball milling time is 1 ~ 4 hour;
(3), the slurry oven dry of gained behind the ball milling for the first time, under 600 ~ 800 ℃, carry out sintering then, carry out drying again, obtain powder premix;
(4), add ethanol and zirconium dioxide mill ball in the Preblend of step (3) gained, carry out ball milling second time, make slurry behind the ball milling for the second time through drying, pulverize and sieving then, obtain described fusible cut-out ceramic powder.
5. preparation method according to claim 4 is characterized in that: the diameter of used zirconium dioxide mill ball is 5 millimeters during ball milling for the first time.
6. preparation method according to claim 4, it is characterized in that: the bake out temperature in step (3) and the step (4) is 90 ~ 150 ℃.
7. preparation method according to claim 4 is characterized in that: in the step (4) to cross grit number be 200 orders.
8. ceramic base fusible cut-out, comprise ceramic matrix, be arranged on the interior electrode in the described ceramic matrix, and be arranged on the end electrode that described ceramic matrix is outer and link to each other with interior electrode, it is characterized in that: described ceramic matrix is to utilize that each described fusible cut-out is prepared from ceramic powder in the claim 1 ~ 3.
9. the production method of a ceramic base fusible cut-out utilizes that each described fusible cut-out prepares ceramic matrix with ceramic powder in the claim 1 ~ 3, specifically comprises the steps:
(1), the preparation of ceramic size:, fully stir with the binding agent that adds UV curable in the ceramic powder to described fusible cut-out, make solid content 65 ~ 80%, viscosity＜22kcps ceramic size;
(2), the preparation of electrode size: prepare electrode size, silver content is 65 ~ 80% in the control slurry;
(3), fusible cut-out green compact moulding: prepare ceramic matrix with the prepared ceramic size of step (1) by coating method, electrode in mode by silk screen printing is made in ceramic matrix of the prepared electrode size of step (2), through ultra-violet curing, make and have ceramic layer-inner electrode layer-the fusible cut-out green compact of the SMD structure of ceramic layer;
(4), fusible cut-out green compact cutting;
(5), fusible cut-out green compact binder removal: dump temperature is 300 ~ 450 ℃, and the binder removal time is 1 ~ 40 hour;
(6), fusible cut-out green sintering: sintering temperature is 600 ~ 900 ℃, and sintering time is 1 ~ 3 hour;
(7), upper end and plating: will connect silver-colored end electrode through the fusible cut-out green compact behind step (6) sintering, and power at silver-colored end electrode and to plate nickel dam and tin layer, and make described ceramic base fusible cut-out.
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| CN102898027B (en) * | 2012-10-17 | 2015-01-07 | 电子科技大学 | Ceramic powder for electronic component packaging material and production method for ceramic powder |
| CN104163571B (en) * | 2013-08-27 | 2018-02-13 | 芜湖东旭光电装备技术有限公司 | A kind of platinum channel coating material |
| CN107986774B (en) * | 2017-11-29 | 2021-04-13 | 电子科技大学 | Low-temperature sintered high-dielectric-constant microwave dielectric ceramic material and preparation method thereof |
| CN110171928B (en) * | 2019-01-04 | 2022-06-03 | 南京汇聚新材料科技有限公司 | Low-temperature co-fired ceramic glass powder |
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| JP2003297610A (en) * | 2002-04-03 | 2003-10-17 | Mitsubishi Electric Corp | Voltage-nonlinear resistance and manufacturing method thereof |
| CN100445226C (en) * | 2004-12-30 | 2008-12-24 | 电子科技大学 | Formula of a glass ceramic material and preparation method |
| CN100495622C (en) * | 2006-12-22 | 2009-06-03 | 南京萨特科技发展有限公司 | A surface paste fuse of nano carborundum-alumina porcelain base and its making method |
| KR101431001B1 (en) * | 2007-12-21 | 2014-08-19 | 재단법인 포항산업과학연구원 | Eco-friendly dielectric glass containing Ta2O5 and its synthetic method |
| CN101774765A (en) * | 2009-12-31 | 2010-07-14 | 上海长园维安电子线路保护股份有限公司 | Frit of fuse substrate in monolithic structure and manufacture method thereof |
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